CN103756573A - Low-scratch diamond grinding fluid - Google Patents
Low-scratch diamond grinding fluid Download PDFInfo
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- CN103756573A CN103756573A CN201410032237.8A CN201410032237A CN103756573A CN 103756573 A CN103756573 A CN 103756573A CN 201410032237 A CN201410032237 A CN 201410032237A CN 103756573 A CN103756573 A CN 103756573A
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Abstract
The invention provides low-scratch diamond grinding fluid. The low-scratch diamond grinding fluid is prepared by mixing the following components by weight percent: 78-83% of alkane, 1-5% of dispersing thixotropic agent, 9-11% of surfactant, 2-5% of lubricating agent, 2-5% of pH regulator and 0.1-1% of diamond micropowder. The low-scratch diamond grinding fluid has the beneficial effects that the low-scratch diamond grinding fluid can reduce scratches under the condition of the same grinding material grain size, effectively improve the roughness of a chip surface, reduce the product processing procedures and reduce the processing cost, and can be widely used for grinding and polishing LED (light emitting diode) chips, LED display screens, optical crystals, silicon wafers, compound crystals, liquid crystal display panels, gems, ceramics, germanium wafers, metal workpieces and the like.
Description
Technical field
The present invention relates to a kind of lapping liquid, particularly, relate to a kind of low scuffing diamond grinding liquid.
Background technology
In semiconductor fabrication processes, initial semiconductor chip need to carry out polishing, polishing process adopts lapping liquid to carry out conventionally, lapping liquid is scattered in medium by abrasive particle and is prepared from, be a kind of abrasive product with excellent chemical mechanical property, can be used for the grinding and polishing of silicon chip, compound crystal, precision optics, liquid crystal panel, jewel, metal works etc.Abrasive particle is the key factor of lapping liquid mechanical effect, and different sorts, varigrained abrasive particle ground effect difference, be suitable for different processing requests.Abrasive hardness is higher in general, particle is larger, and its grinding efficiency is higher, processed surface smoothness is lower; Contrary abrasive hardness is lower, particle is less, and its grinding efficiency is lower, processed surface smoothness is higher.
The addition of lapping liquid decides according to water quality and generation cutting swarf, the hard cutting output of water quality is many, the addition of lapping liquid should be some more, after lapping liquid splashes on a small quantity and is stirred evenly by water in cylinder, when polishing, can stick to the surface of part and abrasive material, its effect is as follows: 1. ramollescence: i.e. the chemical action to metal oxide film surface, makes it softening, be easy to remove from surface grinding, to improve mill efficiency; 2. lubrication: as grinding lubricating oil, lubricate between grinding block and metal parts, thus obtain bright and clean surface; 3. cleaning function: as washing composition, can remove the greasy dirt on metal parts surface; 4. rust inhibition: the part after attrition process, does not have certain rust inhibition before not cleaning at short notice; 5. shock absorption: in polishing processing running, stir together with water, can alleviate the mutual shock between part.
Lapping liquid is divided into finish and aqua two classes substantially.Finish lapping liquid, by aviation spirit, kerosene, transformer oil and each vegetable oil, animal oil and hydro carbons, is equipped with some additives and forms.Aqua lapping liquid is formulated by water and various soap agent.Finish is mainly viscosity, lubricated and good antirust property, and cleaning must be equipped with organic solvent, has the shortcomings such as environmental pollution and expense are higher.Aqua antirust ability is poor.Lapping liquid can be divided into according to the difference of abrasive material: diamond grinding fluid, silicon-dioxide lapping liquid, cerium oxide abrasive liquid etc., wherein, diamond grinding fluid is prepared from the abundant mixed dispersion liquid of diamond abrasive grain, diamond grinding fluid can be divided into single-crystal diamond lapping liquid again, polycrystalline diamond lapping liquid and Nano diamond lapping liquid.Single-crystal diamond lapping liquid is scattered in medium by single-crystalline diamond and forms, single-crystal diamond lapping liquid has good cutting force, tooling cost is relatively low, be widely used in the grinding and polishing of the mechanically resistant materials such as superhard material, Wimet, both can improve removal rates, the amount of heat producing in grinding process can be drained rapidly again, thereby avoid workpiece surface to be burnt.Polycrystalline diamond lapping liquid is scattered in medium by polycrystalline diamond stone granulate and forms, polycrystalline diamond lapping liquid utilizes the toughness that polycrystalline diamond is good, in grinding and polishing process, can keep being difficult for producing scuffing in high grinding force, for follow-up accurate polishing provides good condition, be widely used in grinding and the polishing of the various mechanically resistant materials such as optical crystal, pottery, superhard alloy.Nano diamond lapping liquid is by detonation diadust dispersed forming in water, has good dispersion stabilization, is widely used in Ultraprecise polished.Because opticglass and jewel have high requirement to the precision of processing, Nano diamond lapping liquid can, when keeping higher removal to cut speed, form high-quality finished surface.
But, the phenomenon that at present conventional diamond grinding liquid ubiquity obviously scratches, as Chinese patent application document, (publication number is CN1392179A, open day on 01 22nd, 2003) a kind of high suspension force water soluble anti-rust grinding liquid is disclosed, it is comprised of suspension agent, flocculation agent, rust-preventive agent, lubricant etc.This lapping liquid provides a kind of abrasive material to various different compositions and different-grain diameter to have the gel waterborne anti-rust lapping liquid of higher suspension, dispersive ability, its outstanding shortcoming is exactly to have in use obvious scuffing, affect the quality of processing object, reduced converted products qualification rate.Therefore be necessary to develop a kind of novel diamond grinding liquid.
Summary of the invention
The object of the invention is to overcome the defect of above-mentioned prior art existence and a kind of low scuffing diamond grinding liquid is provided, the present invention can reduce scuffing, effectively improves the roughness of chip surface, reduces product manufacturing procedure, cuts down finished cost.
Object of the present invention is achieved through the following technical solutions, and a kind of low scuffing diamond grinding liquid is mixed and formed by the component of following weight percent:
Preferably, described low scuffing diamond grinding liquid is mixed and is formed by the component of following weight percent:
Preferred, described low scuffing diamond grinding liquid is mixed and is formed by the component of following weight percent:
Preferably, one or more mixtures in described alkane is straight chain undecane, dodecane or tridecane.
Preferably, described dispersion thixotropic agent is one or more mixtures in polyvinyl alcohol, Vinyl Ether or polyoxyethylene nonyl phenyl.
Preferably, described tensio-active agent is one or both mixtures in polyoxyethylene ethyl phenolic ether or epoxy the third hydrocarbon.
Preferably, described lubricant is one or more mixtures in silicone oil, silicon ester or phosphoric acid ester.
Preferably, described pH adjusting agent is a kind of in thanomin, trolamine, hydrochloric acid or phosphoric acid.
Preferably, described diadust is that particle diameter is the diadust of 1～10 μ m.
Compared with prior art, the present invention has following beneficial effect: the present invention is the in the situation that of same particle size, clearance is constant, effectively improve the surfaceness after polishing, reduce polishing program and activity duration, cut down finished cost, can be widely used in the grinding and polishing of LED chip, LED display, optical crystal, silicon chip, compound crystal, liquid crystal panel, jewel, pottery, germanium wafer, metal works etc.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art further to understand the present invention, but not limit in any form the present invention.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, can also make some distortion and improvement.These all belong to protection scope of the present invention.
embodiment 1, a kind of low scuffing diamond grinding liquid preparation
(1) lapping liquid formulation selection:
(2) preparation method: according to the above ratio by alkane, disperse thixotropic agent, tensio-active agent, that lubricant is put into agitator is fully fused, obtain fused liquid, then by particle diameter, be that the diadust of 1～10 μ m is put into described fused liquid and stirred according to the above ratio, use again ultrasonic (500 watts) to disperse 10 minutes, obtain dispersion liquid, finally add above-mentioned pH adjusting agent to adjust the pH value of described dispersion liquid, obtain.
(3) scratch detection: use the above-mentioned lapping liquid preparing as polishing fluid 2 inches of 5 sapphire sheet of polishing on special glazing machine, polishing front surface roughness is in 0.05 μ m left and right, polish pressure is 40kg, polishing disk rotating speed is 80rpm, polishing fluid flow is 2mL/min, polishing time is 10min, and polishing speed is 1.8 μ m/min; After polishing, sapphire sheet surfaceness becomes 0.008 μ m, and glazed surface is without obvious cut.
embodiment 2, a kind of low scuffing diamond grinding liquid preparation
(1) lapping liquid formulation selection:
(2) preparation method: according to the above ratio by alkane, disperse thixotropic agent, tensio-active agent, that lubricant is put into agitator is fully fused, obtain fused liquid, then by particle diameter, be that the diadust of 1～10 μ m is put into described fused liquid and stirred according to the above ratio, use again ultrasonic (500 watts) to disperse 10 minutes, obtain dispersion liquid, finally add above-mentioned pH adjusting agent to adjust the pH value of described dispersion liquid, obtain.
(3) scratch detection: use the above-mentioned lapping liquid preparing as polishing fluid 2 inches of 5 sapphire sheet of polishing on special glazing machine, polishing front surface roughness is in 0.05 μ m left and right, polish pressure is 40kg, polishing disk rotating speed is 80rpm, polishing fluid flow is 2mL/min, polishing time is 10min, and polishing speed is 1.8 μ m/min; After polishing, sapphire sheet surfaceness becomes 0.008 μ m, and glazed surface is without obvious cut.
embodiment 3, a kind of low scuffing diamond grinding liquid preparation
(1) lapping liquid formulation selection:
(2) preparation method: according to the above ratio by alkane, disperse thixotropic agent, tensio-active agent, that lubricant is put into agitator is fully fused, obtain fused liquid, then by particle diameter, be that the diadust of 1～10 μ m is put into described fused liquid and stirred according to the above ratio, use again ultrasonic (500 watts) to disperse 10 minutes, obtain dispersion liquid, finally add above-mentioned pH adjusting agent to adjust the pH value of described dispersion liquid, obtain.
(3) scratch detection: use the above-mentioned lapping liquid preparing as polishing fluid 2 inches of 5 sapphire sheet of polishing on special glazing machine, polishing front surface roughness is in 0.05 μ m left and right, polish pressure is 40kg, polishing disk rotating speed is 80rpm, polishing fluid flow is 2mL/min, polishing time is 10min, and polishing speed is 1.8 μ m/min; After polishing, sapphire sheet surfaceness becomes 0.008 μ m, and glazed surface is without obvious cut.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or modification within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (9)
1. a low scuffing diamond grinding liquid, is characterized in that, by the component of following weight percent, is mixed and is formed:
2. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, by the component of following weight percent, is mixed and is formed:
3. low scuffing diamond grinding liquid as claimed in claim 2, is characterized in that, by the component of following weight percent, is mixed and is formed:
4. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, one or more mixtures in the undecane that described alkane is straight chain, dodecane or tridecane.
5. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, described dispersion thixotropic agent is one or more mixtures in polyvinyl alcohol, Vinyl Ether or polyoxyethylene nonyl phenyl.
6. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, described tensio-active agent is one or both mixtures in polyoxyethylene ethyl phenolic ether or epoxy the third hydrocarbon.
7. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, described lubricant is one or more mixtures in silicone oil, silicon ester or phosphoric acid ester.
8. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, described pH adjusting agent is a kind of in thanomin, trolamine, hydrochloric acid or phosphoric acid.
9. low scuffing diamond grinding liquid as claimed in claim 1, is characterized in that, described diadust is that particle diameter is the diadust of 1～10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410032237.8A CN103756573A (en) | 2014-01-23 | 2014-01-23 | Low-scratch diamond grinding fluid |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410032237.8A CN103756573A (en) | 2014-01-23 | 2014-01-23 | Low-scratch diamond grinding fluid |
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| CN103756573A true CN103756573A (en) | 2014-04-30 |
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| CN201410032237.8A Pending CN103756573A (en) | 2014-01-23 | 2014-01-23 | Low-scratch diamond grinding fluid |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105038605A (en) * | 2015-06-16 | 2015-11-11 | 东莞市中微纳米科技有限公司 | Sapphire coarse grinding fluid |
| CN105273638A (en) * | 2015-10-14 | 2016-01-27 | 盐城工学院 | Anti-cleavage suspended grinding fluid for gallium oxide wafer and preparation method thereof |
| CN105368324A (en) * | 2015-12-07 | 2016-03-02 | 苏州博洋化学股份有限公司 | Oily diamond grinding lubricant |
| CN106566417A (en) * | 2016-10-28 | 2017-04-19 | 扬州翠佛堂珠宝有限公司 | Grinding liquid for crystal |
| CN109648404A (en) * | 2017-10-11 | 2019-04-19 | 蓝思科技（长沙）有限公司 | A kind of rough polishing light technology of ceramic product |
| CN115926747A (en) * | 2022-12-08 | 2023-04-07 | 郑州磨料磨具磨削研究所有限公司 | Concentrated aqueous grinding aid and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1417278A (en) * | 2002-12-13 | 2003-05-14 | 清华大学 | Polishing slurry for disk base sheet of memory hard disk |
| CN102268225A (en) * | 2011-05-30 | 2011-12-07 | 上海百兰朵电子科技有限公司 | Permanent-suspension diamond grinding liquid |
-
2014
- 2014-01-23 CN CN201410032237.8A patent/CN103756573A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1417278A (en) * | 2002-12-13 | 2003-05-14 | 清华大学 | Polishing slurry for disk base sheet of memory hard disk |
| CN102268225A (en) * | 2011-05-30 | 2011-12-07 | 上海百兰朵电子科技有限公司 | Permanent-suspension diamond grinding liquid |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105038605A (en) * | 2015-06-16 | 2015-11-11 | 东莞市中微纳米科技有限公司 | Sapphire coarse grinding fluid |
| CN105273638A (en) * | 2015-10-14 | 2016-01-27 | 盐城工学院 | Anti-cleavage suspended grinding fluid for gallium oxide wafer and preparation method thereof |
| CN105368324A (en) * | 2015-12-07 | 2016-03-02 | 苏州博洋化学股份有限公司 | Oily diamond grinding lubricant |
| CN106566417A (en) * | 2016-10-28 | 2017-04-19 | 扬州翠佛堂珠宝有限公司 | Grinding liquid for crystal |
| CN109648404A (en) * | 2017-10-11 | 2019-04-19 | 蓝思科技（长沙）有限公司 | A kind of rough polishing light technology of ceramic product |
| CN115926747A (en) * | 2022-12-08 | 2023-04-07 | 郑州磨料磨具磨削研究所有限公司 | Concentrated aqueous grinding aid and preparation method thereof |
| CN115926747B (en) * | 2022-12-08 | 2024-05-28 | 郑州磨料磨具磨削研究所有限公司 | Concentrated aqueous grinding aid and preparation method thereof |
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Application publication date: 20140430 |