SG11201900141UA - Slurry composition and method of selective silica polishing - Google Patents
Slurry composition and method of selective silica polishingInfo
- Publication number
- SG11201900141UA SG11201900141UA SG11201900141UA SG11201900141UA SG11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- polishing
- slurry composition
- suite
- english
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 11111111111111111111111111111111111111111111111111111111111111111111111111111 Organization 0 International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/038885 Al 01 March 2018 (01.03.2018) W I P0 I P C T (51) International Patent Classification: CO9G 1/02 (2006.01) B24B 1/00 (2006.01) C09K 3/14 (2006.01) (21) International Application Number: PCT/US2017/045066 (22) International Filing Date: 02 August 2017 (02.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/379,916 26 August 2016 (26.08.2016) US (71) Applicant: FERRO CORPORATION [US/US]; 6060 Parkland Boulevard, Suite 350, Mayfield Heights, OH 44124 (US). (72) Inventor: URBAN, Nathaniel, D.; 427 North Main Street, Apt. 5, Canandaigua, NY 14424 (US). Agent: KORFF, Christopher, J ; Rankin, Hill & Clark (74) LLP, 23755 Lorain Road, Suite 200, North Olmsted, Ohio — = 44070 (US). Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (81) = _ __ _ HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, — KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. = = Designated States (unless otherwise indicated, for every (84) kind of regional protection available): ARIPO (BW, GH, = _ _ GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, = UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, = TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, = EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, = MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, — TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). = — Published: ,- 1 — kin cc cc cc M © with international search report (Art. 21(3)) CO\" (54) Title: SLURRY COMPOSITION AND METHOD OF SELECTIVE SILICA POLISHING 1-1 0 (57) : An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic ei polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polishing selec- C: tivity of silica over crystalline silicon of at least 100.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662379916P | 2016-08-26 | 2016-08-26 | |
PCT/US2017/045066 WO2018038885A1 (en) | 2016-08-26 | 2017-08-02 | Slurry composition and method of selective silica polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201900141UA true SG11201900141UA (en) | 2019-03-28 |
Family
ID=61246233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201900141UA SG11201900141UA (en) | 2016-08-26 | 2017-08-02 | Slurry composition and method of selective silica polishing |
Country Status (7)
Country | Link |
---|---|
US (1) | US11193044B2 (en) |
JP (1) | JP6723440B2 (en) |
KR (1) | KR102226055B1 (en) |
CN (1) | CN109476954B (en) |
SG (1) | SG11201900141UA (en) |
TW (1) | TWI646162B (en) |
WO (1) | WO2018038885A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023056324A1 (en) * | 2021-10-01 | 2023-04-06 | Versum Materials Us, Llc | Tri azole- and/or tri azoli um-based polymers and copolymers as additives for chemical mechanical planarization slurries |
Family Cites Families (40)
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FR2414071A1 (en) | 1978-01-05 | 1979-08-03 | Essilor Int | POLISHING MATERIAL, ESPECIALLY FOR OPHTHALMIC LENSES IN ORGANIC MATTER |
CA2263241C (en) | 1996-09-30 | 2004-11-16 | Masato Yoshida | Cerium oxide abrasive and method of abrading substrates |
US6303506B1 (en) * | 1999-09-30 | 2001-10-16 | Infineon Technologies Ag | Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process |
US6491843B1 (en) | 1999-12-08 | 2002-12-10 | Eastman Kodak Company | Slurry for chemical mechanical polishing silicon dioxide |
US6468910B1 (en) | 1999-12-08 | 2002-10-22 | Ramanathan Srinivasan | Slurry for chemical mechanical polishing silicon dioxide |
US6443811B1 (en) * | 2000-06-20 | 2002-09-03 | Infineon Technologies Ag | Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing |
US6508953B1 (en) | 2000-10-19 | 2003-01-21 | Ferro Corporation | Slurry for chemical-mechanical polishing copper damascene structures |
US6702954B1 (en) | 2000-10-19 | 2004-03-09 | Ferro Corporation | Chemical-mechanical polishing slurry and method |
JP3768401B2 (en) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
US7666239B2 (en) | 2001-11-16 | 2010-02-23 | Ferro Corporation | Hydrothermal synthesis of cerium-titanium oxide for use in CMP |
US6596042B1 (en) | 2001-11-16 | 2003-07-22 | Ferro Corporation | Method of forming particles for use in chemical-mechanical polishing slurries and the particles formed by the process |
US6616514B1 (en) | 2002-06-03 | 2003-09-09 | Ferro Corporation | High selectivity CMP slurry |
KR100497608B1 (en) * | 2002-08-05 | 2005-07-01 | 삼성전자주식회사 | A slurry composition, a method for manufacturing the same and a method for polishing using the same |
US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
US7300478B2 (en) | 2003-05-22 | 2007-11-27 | Ferro Corporation | Slurry composition and method of use |
US20050028450A1 (en) * | 2003-08-07 | 2005-02-10 | Wen-Qing Xu | CMP slurry |
KR100611064B1 (en) * | 2004-07-15 | 2006-08-10 | 삼성전자주식회사 | Slurry composition used for a chemical mechanical polishing process, Chemical mechanical polishing method using the slurry composition and Method of forming a gate pattern using the method |
US7390748B2 (en) * | 2004-08-05 | 2008-06-24 | International Business Machines Corporation | Method of forming a polishing inhibiting layer using a slurry having an additive |
US8449652B2 (en) | 2004-08-05 | 2013-05-28 | University Of Wyoming | Poly(ionic liquid)s as new materials for CO2 separation and other applications |
US20060163083A1 (en) * | 2005-01-21 | 2006-07-27 | International Business Machines Corporation | Method and composition for electro-chemical-mechanical polishing |
US7294044B2 (en) | 2005-04-08 | 2007-11-13 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
US7687401B2 (en) | 2006-05-01 | 2010-03-30 | Ferro Corporation | Substantially spherical composite ceria/titania particles |
JP2008117807A (en) * | 2006-10-31 | 2008-05-22 | Fujimi Inc | Polishing composition, and polishing method |
JP5094139B2 (en) | 2007-01-23 | 2012-12-12 | 富士フイルム株式会社 | Polishing liquid |
JP5322455B2 (en) * | 2007-02-26 | 2013-10-23 | 富士フイルム株式会社 | Polishing liquid and polishing method |
CN101109115B (en) * | 2007-08-17 | 2010-05-19 | 东华大学 | Method of preparing protein modified polyacrylonitrile fibre |
JP2009081200A (en) * | 2007-09-25 | 2009-04-16 | Fujifilm Corp | Polishing liquid |
JP5164541B2 (en) | 2007-11-29 | 2013-03-21 | 富士フイルム株式会社 | Polishing liquid and polishing method |
CN101463225A (en) * | 2007-12-21 | 2009-06-24 | 安集微电子(上海)有限公司 | Chemico-mechanical polishing solution for barrier layer |
JP2009289885A (en) * | 2008-05-28 | 2009-12-10 | Fujifilm Corp | Polishing liquid and polishing method |
JP5314329B2 (en) * | 2008-06-12 | 2013-10-16 | 富士フイルム株式会社 | Polishing liquid |
KR20100004181A (en) * | 2008-07-03 | 2010-01-13 | 삼성전자주식회사 | Slurry composition for a chemical mechanical polishing, method of preparing the slurry composition and method of polishing an object using the slurry composition |
KR101443063B1 (en) * | 2008-07-17 | 2014-09-24 | 삼성전자주식회사 | Method of forming a ferroelectric layer and method of manufacturing a semiconductor device using the same |
JP2010067681A (en) * | 2008-09-09 | 2010-03-25 | Fujifilm Corp | Polishing solution and polishing method |
KR101603361B1 (en) | 2008-09-12 | 2016-03-14 | 페로 코포레이션 | Chemical-mechanical polishing compositions and methods of making and using the same |
CN102355983B (en) | 2009-01-30 | 2014-10-08 | Pcw控股有限责任公司 | Compositions and methods for restoring plastic covers and lenses |
KR20140059216A (en) | 2011-08-01 | 2014-05-15 | 바스프 에스이 | A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or si_1 x ge x material in the presence of a cmp composition comprising a specific organic compound |
US9850402B2 (en) * | 2013-12-09 | 2017-12-26 | Cabot Microelectronics Corporation | CMP compositions and methods for selective removal of silicon nitride |
CN103805069B (en) | 2014-01-27 | 2016-03-02 | 欧普康视科技股份有限公司 | A kind of contact lens polishing fluid and preparation method thereof |
WO2017030710A1 (en) | 2015-08-19 | 2017-02-23 | Ferro Corporation | Slurry composition and method of use |
-
2017
- 2017-08-02 WO PCT/US2017/045066 patent/WO2018038885A1/en active Application Filing
- 2017-08-02 KR KR1020197001742A patent/KR102226055B1/en active IP Right Grant
- 2017-08-02 US US16/305,114 patent/US11193044B2/en active Active
- 2017-08-02 CN CN201780044152.3A patent/CN109476954B/en active Active
- 2017-08-02 SG SG11201900141UA patent/SG11201900141UA/en unknown
- 2017-08-02 JP JP2019511621A patent/JP6723440B2/en not_active Expired - Fee Related
- 2017-08-25 TW TW106129008A patent/TWI646162B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2019532133A (en) | 2019-11-07 |
CN109476954B (en) | 2021-07-23 |
KR102226055B1 (en) | 2021-03-10 |
WO2018038885A1 (en) | 2018-03-01 |
US20200079975A1 (en) | 2020-03-12 |
JP6723440B2 (en) | 2020-07-15 |
US11193044B2 (en) | 2021-12-07 |
TWI646162B (en) | 2019-01-01 |
CN109476954A (en) | 2019-03-15 |
TW201811945A (en) | 2018-04-01 |
KR20190019183A (en) | 2019-02-26 |
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