SG11201900141UA - Slurry composition and method of selective silica polishing - Google Patents

Slurry composition and method of selective silica polishing

Info

Publication number
SG11201900141UA
SG11201900141UA SG11201900141UA SG11201900141UA SG11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA SG 11201900141U A SG11201900141U A SG 11201900141UA
Authority
SG
Singapore
Prior art keywords
international
polishing
slurry composition
suite
english
Prior art date
Application number
SG11201900141UA
Inventor
Nathaniel Urban
Original Assignee
Ferro Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferro Corp filed Critical Ferro Corp
Publication of SG11201900141UA publication Critical patent/SG11201900141UA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 11111111111111111111111111111111111111111111111111111111111111111111111111111 Organization 0 International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/038885 Al 01 March 2018 (01.03.2018) W I P0 I P C T (51) International Patent Classification: CO9G 1/02 (2006.01) B24B 1/00 (2006.01) C09K 3/14 (2006.01) (21) International Application Number: PCT/US2017/045066 (22) International Filing Date: 02 August 2017 (02.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/379,916 26 August 2016 (26.08.2016) US (71) Applicant: FERRO CORPORATION [US/US]; 6060 Parkland Boulevard, Suite 350, Mayfield Heights, OH 44124 (US). (72) Inventor: URBAN, Nathaniel, D.; 427 North Main Street, Apt. 5, Canandaigua, NY 14424 (US). Agent: KORFF, Christopher, J ; Rankin, Hill & Clark (74) LLP, 23755 Lorain Road, Suite 200, North Olmsted, Ohio — = 44070 (US). Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (81) = _ __ _ HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, — KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. = = Designated States (unless otherwise indicated, for every (84) kind of regional protection available): ARIPO (BW, GH, = _ _ GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, = UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, = TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, = EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, = MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, — TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). = — Published: ,- 1 — kin cc cc cc M © with international search report (Art. 21(3)) CO\" (54) Title: SLURRY COMPOSITION AND METHOD OF SELECTIVE SILICA POLISHING 1-1 0 (57) : An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic ei polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polishing selec- C: tivity of silica over crystalline silicon of at least 100.
SG11201900141UA 2016-08-26 2017-08-02 Slurry composition and method of selective silica polishing SG11201900141UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662379916P 2016-08-26 2016-08-26
PCT/US2017/045066 WO2018038885A1 (en) 2016-08-26 2017-08-02 Slurry composition and method of selective silica polishing

Publications (1)

Publication Number Publication Date
SG11201900141UA true SG11201900141UA (en) 2019-03-28

Family

ID=61246233

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900141UA SG11201900141UA (en) 2016-08-26 2017-08-02 Slurry composition and method of selective silica polishing

Country Status (7)

Country Link
US (1) US11193044B2 (en)
JP (1) JP6723440B2 (en)
KR (1) KR102226055B1 (en)
CN (1) CN109476954B (en)
SG (1) SG11201900141UA (en)
TW (1) TWI646162B (en)
WO (1) WO2018038885A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023056324A1 (en) * 2021-10-01 2023-04-06 Versum Materials Us, Llc Tri azole- and/or tri azoli um-based polymers and copolymers as additives for chemical mechanical planarization slurries

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2414071A1 (en) 1978-01-05 1979-08-03 Essilor Int POLISHING MATERIAL, ESPECIALLY FOR OPHTHALMIC LENSES IN ORGANIC MATTER
CA2263241C (en) 1996-09-30 2004-11-16 Masato Yoshida Cerium oxide abrasive and method of abrading substrates
US6303506B1 (en) * 1999-09-30 2001-10-16 Infineon Technologies Ag Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process
US6491843B1 (en) 1999-12-08 2002-12-10 Eastman Kodak Company Slurry for chemical mechanical polishing silicon dioxide
US6468910B1 (en) 1999-12-08 2002-10-22 Ramanathan Srinivasan Slurry for chemical mechanical polishing silicon dioxide
US6443811B1 (en) * 2000-06-20 2002-09-03 Infineon Technologies Ag Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing
US6508953B1 (en) 2000-10-19 2003-01-21 Ferro Corporation Slurry for chemical-mechanical polishing copper damascene structures
US6702954B1 (en) 2000-10-19 2004-03-09 Ferro Corporation Chemical-mechanical polishing slurry and method
JP3768401B2 (en) * 2000-11-24 2006-04-19 Necエレクトロニクス株式会社 Chemical mechanical polishing slurry
US7666239B2 (en) 2001-11-16 2010-02-23 Ferro Corporation Hydrothermal synthesis of cerium-titanium oxide for use in CMP
US6596042B1 (en) 2001-11-16 2003-07-22 Ferro Corporation Method of forming particles for use in chemical-mechanical polishing slurries and the particles formed by the process
US6616514B1 (en) 2002-06-03 2003-09-09 Ferro Corporation High selectivity CMP slurry
KR100497608B1 (en) * 2002-08-05 2005-07-01 삼성전자주식회사 A slurry composition, a method for manufacturing the same and a method for polishing using the same
US7071105B2 (en) * 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
US7300478B2 (en) 2003-05-22 2007-11-27 Ferro Corporation Slurry composition and method of use
US20050028450A1 (en) * 2003-08-07 2005-02-10 Wen-Qing Xu CMP slurry
KR100611064B1 (en) * 2004-07-15 2006-08-10 삼성전자주식회사 Slurry composition used for a chemical mechanical polishing process, Chemical mechanical polishing method using the slurry composition and Method of forming a gate pattern using the method
US7390748B2 (en) * 2004-08-05 2008-06-24 International Business Machines Corporation Method of forming a polishing inhibiting layer using a slurry having an additive
US8449652B2 (en) 2004-08-05 2013-05-28 University Of Wyoming Poly(ionic liquid)s as new materials for CO2 separation and other applications
US20060163083A1 (en) * 2005-01-21 2006-07-27 International Business Machines Corporation Method and composition for electro-chemical-mechanical polishing
US7294044B2 (en) 2005-04-08 2007-11-13 Ferro Corporation Slurry composition and method for polishing organic polymer-based ophthalmic substrates
US7687401B2 (en) 2006-05-01 2010-03-30 Ferro Corporation Substantially spherical composite ceria/titania particles
JP2008117807A (en) * 2006-10-31 2008-05-22 Fujimi Inc Polishing composition, and polishing method
JP5094139B2 (en) 2007-01-23 2012-12-12 富士フイルム株式会社 Polishing liquid
JP5322455B2 (en) * 2007-02-26 2013-10-23 富士フイルム株式会社 Polishing liquid and polishing method
CN101109115B (en) * 2007-08-17 2010-05-19 东华大学 Method of preparing protein modified polyacrylonitrile fibre
JP2009081200A (en) * 2007-09-25 2009-04-16 Fujifilm Corp Polishing liquid
JP5164541B2 (en) 2007-11-29 2013-03-21 富士フイルム株式会社 Polishing liquid and polishing method
CN101463225A (en) * 2007-12-21 2009-06-24 安集微电子(上海)有限公司 Chemico-mechanical polishing solution for barrier layer
JP2009289885A (en) * 2008-05-28 2009-12-10 Fujifilm Corp Polishing liquid and polishing method
JP5314329B2 (en) * 2008-06-12 2013-10-16 富士フイルム株式会社 Polishing liquid
KR20100004181A (en) * 2008-07-03 2010-01-13 삼성전자주식회사 Slurry composition for a chemical mechanical polishing, method of preparing the slurry composition and method of polishing an object using the slurry composition
KR101443063B1 (en) * 2008-07-17 2014-09-24 삼성전자주식회사 Method of forming a ferroelectric layer and method of manufacturing a semiconductor device using the same
JP2010067681A (en) * 2008-09-09 2010-03-25 Fujifilm Corp Polishing solution and polishing method
KR101603361B1 (en) 2008-09-12 2016-03-14 페로 코포레이션 Chemical-mechanical polishing compositions and methods of making and using the same
CN102355983B (en) 2009-01-30 2014-10-08 Pcw控股有限责任公司 Compositions and methods for restoring plastic covers and lenses
KR20140059216A (en) 2011-08-01 2014-05-15 바스프 에스이 A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or si_1 x ge x material in the presence of a cmp composition comprising a specific organic compound
US9850402B2 (en) * 2013-12-09 2017-12-26 Cabot Microelectronics Corporation CMP compositions and methods for selective removal of silicon nitride
CN103805069B (en) 2014-01-27 2016-03-02 欧普康视科技股份有限公司 A kind of contact lens polishing fluid and preparation method thereof
WO2017030710A1 (en) 2015-08-19 2017-02-23 Ferro Corporation Slurry composition and method of use

Also Published As

Publication number Publication date
JP2019532133A (en) 2019-11-07
CN109476954B (en) 2021-07-23
KR102226055B1 (en) 2021-03-10
WO2018038885A1 (en) 2018-03-01
US20200079975A1 (en) 2020-03-12
JP6723440B2 (en) 2020-07-15
US11193044B2 (en) 2021-12-07
TWI646162B (en) 2019-01-01
CN109476954A (en) 2019-03-15
TW201811945A (en) 2018-04-01
KR20190019183A (en) 2019-02-26

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