JP4823262B2 - 回路基板を用いたジョイントボックス - Google Patents
回路基板を用いたジョイントボックス Download PDFInfo
- Publication number
- JP4823262B2 JP4823262B2 JP2008073718A JP2008073718A JP4823262B2 JP 4823262 B2 JP4823262 B2 JP 4823262B2 JP 2008073718 A JP2008073718 A JP 2008073718A JP 2008073718 A JP2008073718 A JP 2008073718A JP 4823262 B2 JP4823262 B2 JP 4823262B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- terminal
- foil
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/24—Terminal blocks
- H01R9/2458—Electrical interconnections between terminal blocks
- H01R9/2466—Electrical interconnections between terminal blocks using a planar conductive structure, e.g. printed circuit board
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Connection Or Junction Boxes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
図1は本発明に係る回路基板を用いたジョイントボックスの実施例の分解斜視図であり、上ケース11、回路ユニット12、下ケース13を相互に組み付けることにより、ボックス形状のジョイントボックスが得られる。つまり、上ケース11、下ケース13間に回路ユニット12が収納され、ケース11、13同士が接合されると、回路ユニット12を収容した状態で上ケース11、下ケース13に設けられたロック部14a、14bによりロックされる。
15 挿入端子
16 ブロック体
19、91 回路基板
20、92 樹脂プレート
20c、92b 端子挿通孔
21、93 箔回路
22 受端子
23 角型電線
41 銅箔
49、55 打ち抜きプレス
49a、55a ビク刃
55b 吸着パット
71 角型電線材
95 受リング
96 接続端子
Claims (6)
- 三次元的に成型した合成樹脂材から成る樹脂プレート上に金属箔から成る回路パターンを固定した複数枚の回路基板をこれらの回路基板の面同士を密着すると共に凹凸部により部分的に嵌合して積層したジョイントボックスであって、前記回路基板は、前記樹脂プレートに設けた回路パターン固定用アンカピンを前記回路パターンに設けたピン孔に挿入し、その先端を溶融して前記回路パターンを前記樹脂プレート上に固定すると共に、前記樹脂プレートの所定個所に各層で共通の端子挿通孔を形成し、前記任意の層の回路基板の前記端子挿通孔に金属製の略円筒状の受端子をその上部に設けたフランジ部により固定し、前記受端子の下端を前記端子挿入孔内に位置させ、前記フランジ部の一部から側方に延出したタブを前記回路パターンの一部に接続し、前記共通の端子挿通孔にピン状の挿入端を有する挿入端子を挿通し、前記挿入端子を前記受端子を介して該当の前記回路基板の回路パターンと電気的に導通させ、前記回路基板上の前記受端子を上層の前記回路基板の下面に設けた凹部内に嵌め込むことを特徴とする回路基板を用いたジョイントボックス。
- 前記挿入端子は下部を前記挿入端とし、上部を他の接続端子と嵌合する接続端としたことを特徴とする請求項1に記載の回路基板を用いたジョイントボックス。
- 前記挿入端は断面角型としたことを特徴とする請求項1又は2に記載の回路基板を用いたジョイントボックス。
- 前記タブと前記回路パターンの接続は、前記タブを前記回路パターンの一部に重ね、表側の前記タブに接触した電極と前記回路基板の裏側に設けた溶着用孔部から挿入して前記回路パターンの裏側に接触した電極とを用いて、前記回路パターンに前記タブを溶着したことを特徴とする請求項1〜3の何れか1つの請求項に記載の回路基板を用いたジョイントボックス。
- 複数の前記挿入端子の前記挿入端と前記接続端との間の中間部を合成樹脂ブロックに固定し、前記挿入端を前記回路基板の端子挿通孔にまとめて挿入することを特徴とする請求項2に記載の回路基板を用いたジョイントボックス。
- 前記合成樹脂ブロックの底部に下方を向く回路基板固定用アンカピンを形成し、該回路基板固定用アンカピンを複数枚の前記回路基板に設けたアンカピン用孔部に挿通し、前記回路基板の積層体の反対側に突出した前記回路基板固定用アンカピンの端部を溶融することにより前記回路基板同士を固定することを特徴とする請求項5に記載の回路基板を用いたジョイントボックス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008073718A JP4823262B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板を用いたジョイントボックス |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004105997 | 2004-03-31 | ||
JP2004105997 | 2004-03-31 | ||
JP2004239707 | 2004-08-19 | ||
JP2004239707 | 2004-08-19 | ||
JP2004381266 | 2004-12-28 | ||
JP2004381266 | 2004-12-28 | ||
JP2008073718A JP4823262B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板を用いたジョイントボックス |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006511657A Division JPWO2005096683A1 (ja) | 2004-03-31 | 2005-03-29 | 回路基板及びその製造方法及び回路基板を用いたジョイントボックス |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009097640A Division JP4938046B2 (ja) | 2004-03-31 | 2009-04-14 | 回路基板を用いたジョイントボックス |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008220165A JP2008220165A (ja) | 2008-09-18 |
JP2008220165A5 JP2008220165A5 (ja) | 2010-05-06 |
JP4823262B2 true JP4823262B2 (ja) | 2011-11-24 |
Family
ID=35064168
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006511657A Pending JPWO2005096683A1 (ja) | 2004-03-31 | 2005-03-29 | 回路基板及びその製造方法及び回路基板を用いたジョイントボックス |
JP2008073717A Expired - Fee Related JP4719759B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板の製造方法 |
JP2008073718A Expired - Fee Related JP4823262B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板を用いたジョイントボックス |
JP2009097640A Expired - Fee Related JP4938046B2 (ja) | 2004-03-31 | 2009-04-14 | 回路基板を用いたジョイントボックス |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006511657A Pending JPWO2005096683A1 (ja) | 2004-03-31 | 2005-03-29 | 回路基板及びその製造方法及び回路基板を用いたジョイントボックス |
JP2008073717A Expired - Fee Related JP4719759B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009097640A Expired - Fee Related JP4938046B2 (ja) | 2004-03-31 | 2009-04-14 | 回路基板を用いたジョイントボックス |
Country Status (6)
Country | Link |
---|---|
US (3) | US7943859B2 (ja) |
EP (1) | EP1737282A4 (ja) |
JP (4) | JPWO2005096683A1 (ja) |
KR (3) | KR101183336B1 (ja) |
CN (2) | CN100594757C (ja) |
WO (1) | WO2005096683A1 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005096683A1 (ja) * | 2004-03-31 | 2005-10-13 | Mitsubishi Cable Industries, Ltd. | 回路基板及びその製造方法及び回路基板を用いたジョイントボックス |
DE102007028511A1 (de) * | 2007-06-21 | 2008-12-24 | Robert Bosch Gmbh | Elektronisches Gerät mit mindestens einem elektrischen Anschlusselement und Verfahren zur Herstellung eines Anschlusselements |
DE102008008278A1 (de) * | 2008-02-07 | 2009-08-13 | Dr. Johannes Heidenhain Gmbh | Winkelmesseinrichtung |
JP2010027957A (ja) * | 2008-07-23 | 2010-02-04 | Mitsubishi Cable Ind Ltd | 回路構造体、ジョイントボックス、及び、回路構造体の製造方法 |
JP5255365B2 (ja) | 2008-08-09 | 2013-08-07 | 古河電気工業株式会社 | 中継端子部材及びそれを備えた回路構造体、並びに電子ユニット |
JP5497389B2 (ja) * | 2009-09-17 | 2014-05-21 | 三菱マテリアル株式会社 | 電気接続箱 |
JP5758584B2 (ja) | 2010-03-18 | 2015-08-05 | 本田技研工業株式会社 | ジャンクションボックス |
CN101958521A (zh) * | 2010-09-19 | 2011-01-26 | 淮南润成科技有限公司 | 矿用本安电路用分线盒 |
JP5610285B2 (ja) | 2010-09-29 | 2014-10-22 | 本田技研工業株式会社 | 配線構造体及びそれを備えたジョイントボックス |
DE102011102484B4 (de) | 2011-05-24 | 2020-03-05 | Jumatech Gmbh | Leiterplatte mit Formteil und Verfahren zu dessen Herstellung |
US8491315B1 (en) * | 2011-11-29 | 2013-07-23 | Plastronics Socket Partners, Ltd. | Micro via adapter socket |
US9536798B2 (en) * | 2012-02-22 | 2017-01-03 | Cyntec Co., Ltd. | Package structure and the method to fabricate thereof |
JP5952039B2 (ja) * | 2012-03-15 | 2016-07-13 | 住友精密工業株式会社 | 放電セル及びオゾンガス発生装置 |
DE102012009651A1 (de) * | 2012-05-14 | 2013-11-14 | Robert Bosch Gmbh | Anschlusseinrichtung für Antriebseinrichtung |
DE202012010075U1 (de) * | 2012-10-22 | 2012-11-13 | Truma Gerätetechnik GmbH & Co. KG | Zentraleinheit für Rangierantrieb |
JP2015049053A (ja) * | 2013-08-29 | 2015-03-16 | アルプス・グリーンデバイス株式会社 | 電流検出装置 |
CN104953011B (zh) * | 2015-06-26 | 2016-05-11 | 深圳市峻泽科技有限公司 | 一种具有金属层的基板及其制造方法 |
US10104784B2 (en) * | 2015-11-06 | 2018-10-16 | Nxp B.V. | Method for making an electronic product with flexible substrate |
US9994407B2 (en) | 2015-11-06 | 2018-06-12 | Nxp B.V. | System and method for processing a flexible substrate |
US20170223816A1 (en) * | 2016-02-01 | 2017-08-03 | Ibiden Co., Ltd. | Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board |
WO2018114683A1 (en) * | 2016-12-19 | 2018-06-28 | Abb Schweiz Ag | Multi-phase busbar for conducting electric energy, method of manufactoring the same and switch board cabinet including such a busbar |
JP2019029535A (ja) * | 2017-07-31 | 2019-02-21 | イビデン株式会社 | フレキシブルプリント配線板、フレキシブルプリント配線板を備える電子デバイス、及び、フレキシブルプリント配線板を備える電子デバイスの製造方法 |
GB2566943B (en) * | 2017-09-25 | 2020-09-02 | Ge Aviat Systems Ltd | Surface mount connector and method of forming a printed circuit board |
JP6666320B2 (ja) * | 2017-11-21 | 2020-03-13 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
JP7094619B2 (ja) | 2018-01-29 | 2022-07-04 | 矢崎総業株式会社 | 配索構造および配索方法 |
CN108901134B (zh) * | 2018-07-12 | 2023-07-25 | 深圳智慧者机器人科技有限公司 | 铜板组装装置 |
JP7289706B2 (ja) * | 2019-04-08 | 2023-06-12 | 矢崎エナジーシステム株式会社 | ジョイントボックス |
US11374366B2 (en) | 2020-06-19 | 2022-06-28 | Lear Corporation | System and method for providing an electrical ground connection for a circuit assembly |
US11646514B2 (en) | 2020-08-10 | 2023-05-09 | Lear Corporation | Surface mount technology terminal header and method for providing an electrical connection to a printed circuit board |
US11706867B2 (en) | 2021-01-27 | 2023-07-18 | Lear Corporation | System and method for providing an electrical ground connection for a circuit assembly |
CN113161948B (zh) * | 2021-02-09 | 2022-12-09 | 国网福建省电力有限公司明溪县供电公司 | 一种挤压式自密封型接线盒 |
Family Cites Families (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3674914A (en) * | 1968-02-09 | 1972-07-04 | Photocircuits Corp | Wire scribed circuit boards and method of manufacture |
US3688248A (en) * | 1968-08-13 | 1972-08-29 | Henry John Modrey | Roller metal pin for use as electric connector or fastener |
FR2217906B3 (ja) * | 1973-02-15 | 1976-02-13 | Radiall Fr | |
JPS5575294A (en) * | 1978-12-02 | 1980-06-06 | Sumitomo Electric Industries | Method of connecting back and front surfaces of bothhside printed circuit board |
US4333233A (en) * | 1979-02-19 | 1982-06-08 | Guardall Limited | Machines and method applicable to the manufacture of electrical and like devices |
US4435741A (en) * | 1980-09-03 | 1984-03-06 | Canon Kabushiki Kaisha | Electrical circuit elements combination |
JPS58106971U (ja) * | 1982-01-14 | 1983-07-21 | 棚沢 日佐司 | プリント配線基板 |
US4487463A (en) * | 1983-02-22 | 1984-12-11 | Gulf & Western Manufacturing Company | Multiple contact header assembly |
JPS59230741A (ja) * | 1983-06-15 | 1984-12-25 | 株式会社日立製作所 | 形状記憶複合材料 |
JPS618960U (ja) * | 1984-06-22 | 1986-01-20 | 日本航空電子工業株式会社 | 圧入用弾性ピン |
US4641426A (en) * | 1985-06-21 | 1987-02-10 | Associated Enterprises, Inc. | Surface mount compatible connector system with mechanical integrity |
EP0225400B1 (en) * | 1985-12-11 | 1991-02-27 | Burndy Electra N.V. | Contact pin |
JPS63127222U (ja) * | 1987-02-09 | 1988-08-19 | ||
JPS63229897A (ja) * | 1987-03-19 | 1988-09-26 | 古河電気工業株式会社 | リジツド型多層プリント回路板の製造方法 |
US4937932A (en) * | 1987-04-10 | 1990-07-03 | Ishii Hyoki Co., Ltd. | Membrane panel switch |
US4769907A (en) * | 1987-07-27 | 1988-09-13 | Northern Telecom Limited | Method of making a circuit board pin |
US4948375A (en) * | 1987-08-25 | 1990-08-14 | Howard Lawrence | Adaptor assembly for circuit boards |
US4867691A (en) * | 1987-10-29 | 1989-09-19 | E. I. Du Pont De Nemours And Company | Connector having expansible barrel with a layer of reflowable solder material thereon |
JP2582142B2 (ja) * | 1988-04-27 | 1997-02-19 | 日本電信電話株式会社 | マトリクススイッチボ−ド及びマトリクススイッチボ−ド用接続ピン及びマトリクスボ−ドの製造方法 |
US4950170A (en) * | 1988-06-23 | 1990-08-21 | Ltv Aerospace & Defense Company | Minimal space printed circuit board and electrical connector system |
US4996629A (en) * | 1988-11-14 | 1991-02-26 | International Business Machines Corporation | Circuit board with self-supporting connection between sides |
JPH02239684A (ja) * | 1989-03-14 | 1990-09-21 | Yazaki Corp | 樹脂成形体上への回路パターンの形成法 |
JPH0744041Y2 (ja) * | 1990-04-30 | 1995-10-09 | 古河電気工業株式会社 | 大電流用プリント配線板 |
JP2573531B2 (ja) | 1991-05-22 | 1997-01-22 | 三菱電機株式会社 | 大電流配線基板 |
JP2827621B2 (ja) * | 1991-10-23 | 1998-11-25 | 三菱電機株式会社 | 大電流基板及びその製造方法 |
JPH05167207A (ja) * | 1991-12-13 | 1993-07-02 | Okuma Mach Works Ltd | パワー回路配線用プリント基板及びその製造方法 |
US5373626A (en) * | 1993-01-06 | 1994-12-20 | Elco Corporation | Removable pin carrier |
JP2849888B2 (ja) * | 1993-02-02 | 1999-01-27 | 矢崎総業株式会社 | 配線接続箱 |
JP3163592B2 (ja) * | 1993-04-01 | 2001-05-08 | 矢崎総業株式会社 | 複合回路基板 |
US6031349A (en) * | 1993-08-25 | 2000-02-29 | Con-X Corporation | Cross-connect method and apparatus |
US5456608A (en) * | 1993-08-25 | 1995-10-10 | Conx Corporation | Cross-connect system |
JPH07122825A (ja) * | 1993-10-22 | 1995-05-12 | Sharp Corp | 立体成形回路基板及びその製造方法 |
JP3170124B2 (ja) * | 1993-12-07 | 2001-05-28 | 矢崎総業株式会社 | 回路体の多層接続構造、及び回路体の多層接続方法 |
WO1995015919A1 (en) * | 1993-12-08 | 1995-06-15 | Massachusetts Institute Of Technology | Casting tooling |
US5836582A (en) * | 1994-04-04 | 1998-11-17 | Canon Kabushiki Kaisha | Sheet feeding device with air injectors for separating sheets |
EP0708046A1 (de) * | 1994-10-21 | 1996-04-24 | Maschinenfabrik Gietz Ag | Registereinzugsvorrichtung |
JPH08153425A (ja) * | 1994-11-28 | 1996-06-11 | Furukawa Electric Co Ltd:The | フラット回路体の製造方法 |
US5788513A (en) * | 1995-01-11 | 1998-08-04 | Enplas Corporation | IC socket |
JPH08222825A (ja) * | 1995-02-13 | 1996-08-30 | Nec Corp | プリント基板の接続構造 |
JP2953335B2 (ja) * | 1995-02-14 | 1999-09-27 | 住友電装株式会社 | 分岐接続箱 |
JPH08322127A (ja) * | 1995-05-23 | 1996-12-03 | Sumitomo Wiring Syst Ltd | 電気接続箱に収容するバスバーと絶縁板の積層構造 |
JPH09153516A (ja) | 1995-11-30 | 1997-06-10 | Sumitomo Bakelite Co Ltd | 半導体装置及びicチップの検査方法 |
JPH09163516A (ja) * | 1995-12-06 | 1997-06-20 | Yazaki Corp | 配線板およびその製造方法 |
US5914534A (en) * | 1996-05-03 | 1999-06-22 | Ford Motor Company | Three-dimensional multi-layer molded electronic device and method for manufacturing same |
JPH10243526A (ja) * | 1997-02-21 | 1998-09-11 | Ryosei Denso Kk | ジョイントボックス |
DE19707709C1 (de) * | 1997-02-26 | 1998-04-16 | Siemens Ag | Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel |
DE19709551A1 (de) * | 1997-03-07 | 1998-09-10 | Wuerth Elektronik Gmbh & Co Kg | Leiterplatte und Verfahren zum Verbinden einer Leiterplatte |
JP3201516B2 (ja) * | 1997-07-18 | 2001-08-20 | ユーエイチティー株式会社 | 穿孔装置 |
JP2001127242A (ja) * | 1999-10-22 | 2001-05-11 | Seiko Epson Corp | 半導体チップ、マルチチップパッケージ、半導体装置、並びに電子機器、およびそれらの製造方法 |
US6483041B1 (en) * | 1999-11-12 | 2002-11-19 | Emc Corporation | Micro soldered connection |
JP2001145241A (ja) | 1999-11-15 | 2001-05-25 | Sumitomo Wiring Syst Ltd | 配線板組立体 |
FR2806249B1 (fr) * | 2000-03-13 | 2002-05-10 | Axo Scintex Cie Equip Automobi | Montage des circuits decoupes sur des supports de lampes |
JP2001264276A (ja) * | 2000-03-21 | 2001-09-26 | Polyplastics Co | 金属箔転写により形成された回路を有するセンサー |
JP2001307795A (ja) * | 2000-04-18 | 2001-11-02 | Yazaki Corp | 配線ユニット及び電気接続箱 |
JP2001343906A (ja) * | 2000-05-31 | 2001-12-14 | Internatl Business Mach Corp <Ibm> | 表示装置、液晶表示装置、液晶表示装置の製造方法および接続方法 |
JP2001359222A (ja) * | 2000-06-13 | 2001-12-26 | Yazaki Corp | 電気接続箱 |
JP2002034126A (ja) | 2000-07-19 | 2002-01-31 | Yazaki Corp | 配線ユニット |
JP2002374049A (ja) * | 2001-06-13 | 2002-12-26 | Densei Lambda Kk | 電源装置の実装構造 |
JP2003017163A (ja) * | 2001-06-27 | 2003-01-17 | Gunma Denki Kk | サブ基板搭載用多ピンコネクタ及びプリント基板の部品実装方法 |
JP3884931B2 (ja) * | 2001-08-31 | 2007-02-21 | アルプス電気株式会社 | 電子機器のfpc接続構造 |
JP2003142178A (ja) * | 2001-11-07 | 2003-05-16 | Matsushita Electric Ind Co Ltd | プリント配線板 |
JP2003249755A (ja) * | 2002-02-22 | 2003-09-05 | Kyocera Corp | セラミック多層配線基板の製造方法、並びにセラミック多層配線基板 |
JP4345082B2 (ja) * | 2002-05-13 | 2009-10-14 | 東レ・ファインケミカル株式会社 | 高純度ジメチルスルホキシドと、ジメチルスルホキシドとアミン類の混合物の精製方法 |
JP2004030936A (ja) * | 2002-06-21 | 2004-01-29 | Mitsubishi Cable Ind Ltd | フラット配線体の製法及び導体箔打ち抜き装置 |
JP3976627B2 (ja) * | 2002-06-25 | 2007-09-19 | 矢崎総業株式会社 | 電気接続箱の製造方法 |
JP4141213B2 (ja) * | 2002-09-17 | 2008-08-27 | アルプス電気株式会社 | 電気部品およびその実装構造 |
US7099155B2 (en) * | 2003-02-14 | 2006-08-29 | Autonetworks Technologies, Ltd. | Distribution unit and electric connection box including the same |
WO2005096683A1 (ja) * | 2004-03-31 | 2005-10-13 | Mitsubishi Cable Industries, Ltd. | 回路基板及びその製造方法及び回路基板を用いたジョイントボックス |
-
2005
- 2005-03-29 WO PCT/JP2005/005811 patent/WO2005096683A1/ja active Application Filing
- 2005-03-29 US US10/593,796 patent/US7943859B2/en not_active Expired - Fee Related
- 2005-03-29 CN CN200580009958A patent/CN100594757C/zh not_active Expired - Fee Related
- 2005-03-29 KR KR1020067019950A patent/KR101183336B1/ko not_active IP Right Cessation
- 2005-03-29 CN CN2009101404406A patent/CN101568227B/zh not_active Expired - Fee Related
- 2005-03-29 KR KR1020117026550A patent/KR101208823B1/ko not_active IP Right Cessation
- 2005-03-29 JP JP2006511657A patent/JPWO2005096683A1/ja active Pending
- 2005-03-29 EP EP05727833A patent/EP1737282A4/en not_active Withdrawn
- 2005-03-29 KR KR1020117026551A patent/KR101208751B1/ko not_active IP Right Cessation
-
2008
- 2008-03-21 JP JP2008073717A patent/JP4719759B2/ja not_active Expired - Fee Related
- 2008-03-21 JP JP2008073718A patent/JP4823262B2/ja not_active Expired - Fee Related
-
2009
- 2009-04-14 JP JP2009097640A patent/JP4938046B2/ja not_active Expired - Fee Related
-
2011
- 2011-01-13 US US13/006,122 patent/US20110120756A1/en not_active Abandoned
- 2011-01-13 US US13/006,222 patent/US8362366B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101568227A (zh) | 2009-10-28 |
KR101183336B1 (ko) | 2012-09-14 |
JP4938046B2 (ja) | 2012-05-23 |
EP1737282A1 (en) | 2006-12-27 |
KR20070034460A (ko) | 2007-03-28 |
CN101568227B (zh) | 2011-09-28 |
KR101208823B1 (ko) | 2012-12-06 |
JPWO2005096683A1 (ja) | 2008-02-21 |
WO2005096683A1 (ja) | 2005-10-13 |
CN100594757C (zh) | 2010-03-17 |
US7943859B2 (en) | 2011-05-17 |
EP1737282A4 (en) | 2010-05-05 |
CN1939101A (zh) | 2007-03-28 |
JP4719759B2 (ja) | 2011-07-06 |
JP2009164632A (ja) | 2009-07-23 |
US20110120756A1 (en) | 2011-05-26 |
KR20120003481A (ko) | 2012-01-10 |
KR20110129490A (ko) | 2011-12-01 |
US8362366B2 (en) | 2013-01-29 |
US20070218257A1 (en) | 2007-09-20 |
US20110116248A1 (en) | 2011-05-19 |
JP2008160156A (ja) | 2008-07-10 |
JP2008220165A (ja) | 2008-09-18 |
KR101208751B1 (ko) | 2012-12-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4823262B2 (ja) | 回路基板を用いたジョイントボックス | |
US5434749A (en) | Hybrid printed circuit board | |
JP6966046B2 (ja) | バッテリーモジュール用fpcb組立体、その製造方法及びそれを含むバッテリーモジュール | |
CN107371340B (zh) | 一种刚挠结合板 | |
US20180145391A1 (en) | Multilayer substrate | |
JP5945801B2 (ja) | フレキシブルプリント配線板及びフレキシブルプリント配線板の製造方法 | |
EP0348954A2 (en) | Electrical connection arrangement for flat cable | |
JP4578843B2 (ja) | 回路基板用接続端子 | |
JP4939634B2 (ja) | 回路基板用接続端子 | |
CN117156694B (zh) | 集成电路小间距引脚器件封装兼容方法、柔性电路带 | |
JP3124813U (ja) | フレキシブルフラットケーブル | |
JP3303801B2 (ja) | 回路板、該回路板を備えた電気接続箱および回路板の製造方法 | |
JPH0423494A (ja) | フレキシブルプリント配線板 | |
JP5365420B2 (ja) | 積層型電子部品 | |
JP4604656B2 (ja) | 積層部品の実装構造 | |
JPH0137875B2 (ja) | ||
JPH09199329A (ja) | 積層シ−トコイルおよびその製造方法 | |
JP2019003775A (ja) | フレキシブルフラットケーブルおよびその製造方法 | |
JPH0550708U (ja) | シートコイル装置 | |
JP2004159432A (ja) | 電子部品内蔵の電気接続箱 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100205 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100318 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100706 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100825 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110118 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110316 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110816 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110906 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140916 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140916 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140916 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |