JPS58106971U - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JPS58106971U JPS58106971U JP1982004144U JP414482U JPS58106971U JP S58106971 U JPS58106971 U JP S58106971U JP 1982004144 U JP1982004144 U JP 1982004144U JP 414482 U JP414482 U JP 414482U JP S58106971 U JPS58106971 U JP S58106971U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal
- bonded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
- Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
率1図は本考案の両面配線板のスルホール部′の拡大断
面図、第2−図は超音波庄接装置の説明図、6第3図は
箔状金属部晶を基板に坂付けた状態の断面図、第4図は
従来例の断面図である。 ,1・・晶・基板、2・・・・・・導電パターン、,4
・・曲バトメ、8・・曲金属部品。゛,
面図、第2−図は超音波庄接装置の説明図、6第3図は
箔状金属部晶を基板に坂付けた状態の断面図、第4図は
従来例の断面図である。 ,1・・晶・基板、2・・・・・・導電パターン、,4
・・曲バトメ、8・・曲金属部品。゛,
Claims (1)
- 【実用新案登録請求の範囲】 ■プリント配線基板の両薗又は片面に導電パターン2を
施し、基板1′の表裏番千貫通する孔3番と金属部品一
を挿入し、両面又は片面の導電バタ・一ン2と含属部品
8とを金属結合さ−@−七いるこ′とを特徴とするプリ
ント配線基板。?、■9余属部品8、はハトメ、箔テー
プ、ワイヤ体の.内何れかのものである実用新案番録請
求の範囲第1項に記載のプリン.ト配線基板。゛,、■
金属部品8は超音波圧接によって導電パター,レ2に金
属結合してりる実用新案登録請求の範囲第1項又は第2
項比記載のプリント配線基板。 ■釡属部品8は抵抗圧接に占って導電パターンー 2に金属結合tている実用、新案登録請求一囲第1項又
は第?項に記!のプリント配線基板。 ■金属部品8はk−ザ溶接によつ−て金属結合し、てい
る実用新案登録請求め範囲第阜項又は第2項番と記載の
プリント配線基板。′
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982004144U JPS58106971U (ja) | 1982-01-14 | 1982-01-14 | プリント配線基板 |
DE3300549A DE3300549C2 (de) | 1982-01-14 | 1983-01-10 | Gedruckte Schaltungsplatine und Verfahren zu ihrer Herstellung |
US06/457,684 US4545119A (en) | 1982-01-14 | 1983-01-13 | Method of manufacturing a printed circuit board |
KR1019830000096A KR860001486B1 (ko) | 1982-01-14 | 1983-01-13 | 프린트 배선기판의 제법 |
GB08300836A GB2115985B (en) | 1982-01-14 | 1983-01-13 | Making conductive through-holes in printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982004144U JPS58106971U (ja) | 1982-01-14 | 1982-01-14 | プリント配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58106971U true JPS58106971U (ja) | 1983-07-21 |
Family
ID=11576577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982004144U Pending JPS58106971U (ja) | 1982-01-14 | 1982-01-14 | プリント配線基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4545119A (ja) |
JP (1) | JPS58106971U (ja) |
DE (1) | DE3300549C2 (ja) |
GB (1) | GB2115985B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59114890A (ja) * | 1982-12-21 | 1984-07-03 | 棚沢 日佐司 | プリント配線基板の製造法 |
JPH0519926U (ja) * | 1991-08-27 | 1993-03-12 | 松下電工株式会社 | 熱線式検知器 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2142478A (en) * | 1983-07-01 | 1985-01-16 | Welwyn Electronics Ltd | Printed circuit boards |
JPH0834340B2 (ja) * | 1988-12-09 | 1996-03-29 | 日立化成工業株式会社 | 配線板およびその製造法 |
DE4012981A1 (de) * | 1990-04-24 | 1991-05-29 | Wolfgang Prof Dr Ing Nerreter | Vorrichtung zur durchkontaktierung von leiterplatten |
DE4125018A1 (de) * | 1991-07-27 | 1993-01-28 | Prokopp Manfred | Elektrische verbindung, insbesondere durchkontaktierung bei einer leiterplatte |
US5596178A (en) * | 1995-10-12 | 1997-01-21 | Christian; Suzanne | single replacement pad with perforated shaft for the repair of printed circuit boards |
US6083340A (en) * | 1997-02-28 | 2000-07-04 | Hokuriku Electric Industry Co., Ltd. | Process for manufacturing a multi-layer circuit board |
JP3625986B2 (ja) * | 1997-04-11 | 2005-03-02 | ローム株式会社 | 放熱板を具備する半導体装置、及び放熱板の超音波接合方法 |
US6056185A (en) * | 1998-03-18 | 2000-05-02 | Ga-Tek Inc. | Method of connecting batteries to electronic circuits |
US6641027B2 (en) | 2001-12-18 | 2003-11-04 | Ngk Spark Plug Co., Ltd. | Method of connecting electric leads to battery tabs |
JP3799270B2 (ja) * | 2001-12-21 | 2006-07-19 | 株式会社日立製作所 | 自動車の駆動状態を切り換える為の制御装置 |
KR101183336B1 (ko) * | 2004-03-31 | 2012-09-14 | 미츠비시 덴센 고교 가부시키가이샤 | 회로기판을 이용한 조인트 박스 |
CN112584628A (zh) * | 2019-09-27 | 2021-03-30 | 宁波言成电子科技有限公司 | 一种铆合焊盘印刷电路板的制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US15364A (en) * | 1856-07-15 | Laud-lamp | ||
US2958926A (en) * | 1956-10-22 | 1960-11-08 | Lenkurt Electric Co Inc | Electrical circuit structure and method for manufacturing same |
US3436005A (en) * | 1962-02-13 | 1969-04-01 | Philips Corp | Welding apparatus provided with a vibrating contact tip |
US3334395A (en) * | 1962-11-26 | 1967-08-08 | Northrop Corp | Method of making a metal printed circuit board |
US3264524A (en) * | 1963-05-17 | 1966-08-02 | Electro Mechanisms Inc | Bonding of printed circuit components and the like |
US3380150A (en) * | 1963-12-09 | 1968-04-30 | Philips Corp | Method and device for ultrasonic welding |
US3321570A (en) * | 1966-01-19 | 1967-05-23 | James E Webb | Printed circuit board with bellows rivet connection |
US3446908A (en) * | 1966-11-01 | 1969-05-27 | Sanders Associates Inc | Printed circuit terminations and methods of making the same |
US3698075A (en) * | 1969-11-05 | 1972-10-17 | Motorola Inc | Ultrasonic metallic sheet-frame bonding |
US4015328A (en) * | 1975-06-02 | 1977-04-05 | Mcdonough Cletus G | Multilayered circuit assembly including an eyelet for making weldable connections and a method of making said assembly |
JPS5236756A (en) * | 1975-09-18 | 1977-03-22 | Matsushita Electric Ind Co Ltd | Bothhside printed circuit substrate |
US4027370A (en) * | 1976-10-21 | 1977-06-07 | Branson Ultrasonics Corporation | High frequency vibration insertion apparatus |
US4088257A (en) * | 1977-02-14 | 1978-05-09 | Christiana Metals Corporation | Ultrasonic spot welder |
JPS5667121A (en) * | 1979-11-07 | 1981-06-06 | Tanaka Precious Metal Ind | Method of manufacturing electric contactor |
DE3021896A1 (de) * | 1980-06-06 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur herstellung von gedruckten schaltungen |
US4389268A (en) * | 1980-08-06 | 1983-06-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Production of laminate for receiving chemical plating |
US4327126A (en) * | 1980-11-10 | 1982-04-27 | Ralph Ogden | Method of making printed circuit boards |
-
1982
- 1982-01-14 JP JP1982004144U patent/JPS58106971U/ja active Pending
-
1983
- 1983-01-10 DE DE3300549A patent/DE3300549C2/de not_active Expired
- 1983-01-13 US US06/457,684 patent/US4545119A/en not_active Expired - Fee Related
- 1983-01-13 GB GB08300836A patent/GB2115985B/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59114890A (ja) * | 1982-12-21 | 1984-07-03 | 棚沢 日佐司 | プリント配線基板の製造法 |
JPH0519926U (ja) * | 1991-08-27 | 1993-03-12 | 松下電工株式会社 | 熱線式検知器 |
Also Published As
Publication number | Publication date |
---|---|
US4545119A (en) | 1985-10-08 |
DE3300549C2 (de) | 1985-01-17 |
GB2115985B (en) | 1985-12-18 |
GB8300836D0 (en) | 1983-02-16 |
GB2115985A (en) | 1983-09-14 |
DE3300549A1 (de) | 1983-07-21 |
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