JP2008220165A - 回路基板を用いたジョイントボックス - Google Patents
回路基板を用いたジョイントボックス Download PDFInfo
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- JP2008220165A JP2008220165A JP2008073718A JP2008073718A JP2008220165A JP 2008220165 A JP2008220165 A JP 2008220165A JP 2008073718 A JP2008073718 A JP 2008073718A JP 2008073718 A JP2008073718 A JP 2008073718A JP 2008220165 A JP2008220165 A JP 2008220165A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
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- H01R9/22—Bases, e.g. strip, block, panel
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- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
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- H05K2201/03—Conductive materials
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y10T29/49002—Electrical device making
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- Y10T29/49155—Manufacturing circuit on or in base
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Abstract
【解決手段】 上ケース11、回路ユニット12、下ケース13を相互に組み付けることにより、ジョイントボックスが形成される。
回路ユニット12の上面には、回路パターンが形成されていると共に、複数個の挿入端子15を取り付けた合成樹脂製のブロック体16が配置されている。ブロック体16は上ケース11に区画された枠部17に嵌合され、ブロック体16上に突出した挿入端子15の平刃端15a、受端15b、ピン端15cなどの接続部が枠部17内に位置している。回路ユニット12は例えば5枚の回路基板19が積層され、各回路基板19は例えば射出成型により成型された樹脂プレート20上に、パターンの箔回路21が載置されている。箔回路21は銅箔から成り、積層された回路基板19ごとに異なるパターンに区画されている。
【選択図】図1
Description
図1は本発明に係る回路基板を用いたジョイントボックスの実施例の分解斜視図であり、上ケース11、回路ユニット12、下ケース13を相互に組み付けることにより、ボックス形状のジョイントボックスが得られる。つまり、上ケース11、下ケース13間に回路ユニット12が収納され、ケース11、13同士が接合されると、回路ユニット12を収容した状態で上ケース11、下ケース13に設けられたロック部14a、14bによりロックされる。
15 挿入端子
16 ブロック体
19、91 回路基板
20、92 樹脂プレート
20c、92b 端子挿通孔
21、93 箔回路
22 受端子
23 角型電線
41 銅箔
49、55 打ち抜きプレス
49a、55a ビク刃
55b 吸着パット
71 角型電線材
95 受リング
96 接続端子
Claims (8)
- 三次元的に成型した合成樹脂材から成る樹脂プレート上に金属箔から成る回路パターンを載置した複数枚の回路基板を積層し、これらの回路基板の所定個所に前記積層した回路基板に共通の端子挿通孔を形成し、前記任意の層の回路基板の前記端子挿通孔に金属製の略円筒状の受端子を取り付け、該受端子に付設したタブを当該回路基板の前記回路パターンに接続し、前記共通の端子挿通孔にピン状の挿入端を有する挿入端子を挿通し、前記受端子を介して該当の前記回路基板の各層の前記回路パターンを電気的に導通することを特徴とする回路基板を用いたジョイントボックス。
- 前記受端子のタブは前記回路パターンに溶着により接続した請求項1に記載の回路基板を用いたジョイントボックス。
- 三次元的に成型した合成樹脂材から成る樹脂プレート上の必要個所に端子挿通孔を形成し、前記樹脂プレート上に所定形状に打ち抜いた金属箔から成る回路パターンを載置し、前記端子挿通孔に該当する前記回路パターンにピン状の挿入端を挿し込むための切込部を設けると共に、対応する前記端子挿通孔に金属製の略円筒状の受端子を嵌合した複数枚の回路基板を積層し、前記端子挿通孔に前記挿入端を挿通し、前記受端子を介して前記挿入端と前記回路基板の各層の前記回路パターンとを電気的に導通することを特徴とする回路基板を用いたジョイントボックス。
- 前記積層した回路基板同士は互いに嵌合し得る凹凸部を有することを特徴とする請求項項1又は3に記載の回路基板を用いたジョイントボックス。
- 前記挿入端子は下部を前記挿入端とし、上部を他の接続端子と嵌合する接続端としたことを特徴とする請求項1又は3に記載の回路基板を用いたジョイントボックス。
- 前記挿入端は断面角型としたことを特徴とする請求項5に記載の回路基板を用いたジョイントボックス。
- 前記挿入端子は取付孔を有する合成樹脂ブロックに取り付け、前記挿入端子の挿入端と接続端との間の中間部を合成樹脂ブロックに固定し、前記挿入端を前記回路基板の端子挿通孔にまとめて挿入することを特徴とする回路基板を用いた請求項5に記載の回路基板を用いたジョイントボックス。
- 前記合成樹脂ブロックの底部に下方を向くアンカピンを形成し、該アンカピンを前記回路基板の積層体に設けたアンカピン用孔部に挿通し、前記積層体の反対側に突出した端部を溶融することにより前記積層体を固定することを特徴とする請求項7に記載の回路基板を用いたジョイントボックス。
Priority Applications (1)
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JP2008073718A JP4823262B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板を用いたジョイントボックス |
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JP2004381266 | 2004-12-28 | ||
JP2004381266 | 2004-12-28 | ||
JP2008073718A JP4823262B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板を用いたジョイントボックス |
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JP2008073718A Expired - Fee Related JP4823262B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板を用いたジョイントボックス |
JP2008073717A Expired - Fee Related JP4719759B2 (ja) | 2004-03-31 | 2008-03-21 | 回路基板の製造方法 |
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EP (1) | EP1737282A4 (ja) |
JP (4) | JPWO2005096683A1 (ja) |
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JP2011067019A (ja) * | 2009-09-17 | 2011-03-31 | Mitsubishi Materials Corp | 電気接続箱 |
US8929093B2 (en) | 2010-03-18 | 2015-01-06 | Honda Motor Co., Ltd. | Junction box |
JP2012074563A (ja) * | 2010-09-29 | 2012-04-12 | Honda Motor Co Ltd | 配線構造体及びそれを備えたジョイントボックス |
JP2015049053A (ja) * | 2013-08-29 | 2015-03-16 | アルプス・グリーンデバイス株式会社 | 電流検出装置 |
JP2020174432A (ja) * | 2019-04-08 | 2020-10-22 | 矢崎エナジーシステム株式会社 | ジョイントボックス |
JP7289706B2 (ja) | 2019-04-08 | 2023-06-12 | 矢崎エナジーシステム株式会社 | ジョイントボックス |
Also Published As
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US20110116248A1 (en) | 2011-05-19 |
KR101183336B1 (ko) | 2012-09-14 |
JP4823262B2 (ja) | 2011-11-24 |
US20110120756A1 (en) | 2011-05-26 |
CN101568227B (zh) | 2011-09-28 |
JP2009164632A (ja) | 2009-07-23 |
KR101208823B1 (ko) | 2012-12-06 |
CN101568227A (zh) | 2009-10-28 |
WO2005096683A1 (ja) | 2005-10-13 |
JPWO2005096683A1 (ja) | 2008-02-21 |
JP4938046B2 (ja) | 2012-05-23 |
US8362366B2 (en) | 2013-01-29 |
KR20070034460A (ko) | 2007-03-28 |
JP2008160156A (ja) | 2008-07-10 |
US20070218257A1 (en) | 2007-09-20 |
EP1737282A1 (en) | 2006-12-27 |
KR20120003481A (ko) | 2012-01-10 |
CN1939101A (zh) | 2007-03-28 |
US7943859B2 (en) | 2011-05-17 |
KR101208751B1 (ko) | 2012-12-05 |
KR20110129490A (ko) | 2011-12-01 |
JP4719759B2 (ja) | 2011-07-06 |
EP1737282A4 (en) | 2010-05-05 |
CN100594757C (zh) | 2010-03-17 |
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