JP5610285B2 - 配線構造体及びそれを備えたジョイントボックス - Google Patents
配線構造体及びそれを備えたジョイントボックス Download PDFInfo
- Publication number
- JP5610285B2 JP5610285B2 JP2010218632A JP2010218632A JP5610285B2 JP 5610285 B2 JP5610285 B2 JP 5610285B2 JP 2010218632 A JP2010218632 A JP 2010218632A JP 2010218632 A JP2010218632 A JP 2010218632A JP 5610285 B2 JP5610285 B2 JP 5610285B2
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- Prior art keywords
- wiring
- pin terminal
- pin
- terminal
- terminal insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003780 insertion Methods 0.000 claims description 89
- 230000037431 insertion Effects 0.000 claims description 89
- 239000000758 substrate Substances 0.000 claims description 87
- 239000002184 metal Substances 0.000 claims description 61
- 229910052751 metal Inorganic materials 0.000 claims description 61
- 239000011888 foil Substances 0.000 claims description 52
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 10
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
- H05K2201/10833—Flat leads having a curved or folded cross-section
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
各々、絶縁基板上に金属箔配線が設けられた複数の配線基板が積層されて構成されると共に、該複数の配線基板のそれぞれに形成された貫通孔が基板厚さ方向に連なって構成されたピン端子挿通孔が形成された基板積層体と、
上記基板積層体の上記ピン端子挿通孔に挿通されたピン端子と、
を備え、
上記ピン端子挿通孔には、上記複数の配線基板のうちいずれかの該ピン端子挿通孔を構成する貫通孔に、該配線基板の金属箔配線と導通すると共に該ピン端子挿通孔に挿通された上記ピン端子を外嵌保持する端子接続部が設けられている一方、その他の配線基板の該ピン端子挿通孔を構成する貫通孔に、該ピン端子挿通孔に挿通された該ピン端子の該その他の配線基板への接触を規制する絶縁スリーブが内嵌めされており、
上記ピン端子を突出させて上記基板積層体を挟持するように設けられた上側及び下側保護部材をさらに備え、
上記絶縁スリーブは、上記上側及び/又は下側保護部材に一体に設けられている。
本発明の配線構造体が、上記ピン端子が突出するように筐体に収容され、該筐体の外側に、該筐体から突出した該ピン端子を含むコネクタ取付部が設けられている。
10 配線構造体
11 基板積層体
12 ピン端子
13 配線基板
14 絶縁基板
15c 端子保持部分
16 金属箔配線
17a,17b 端子挿通貫通孔
18 ピン端子挿通孔
19 絶縁スリーブ
20 筐体
23 コネクタ取付部
Claims (3)
- 各々、絶縁基板上に金属箔配線が設けられた複数の配線基板が積層されて構成されると共に、該複数の配線基板のそれぞれに形成された貫通孔が基板厚さ方向に連なって構成されたピン端子挿通孔が形成された基板積層体と、
上記基板積層体の上記ピン端子挿通孔に挿通されたピン端子と、
を備え、
上記ピン端子挿通孔には、上記複数の配線基板のうちいずれかの該ピン端子挿通孔を構成する貫通孔に、該配線基板の金属箔配線と導通すると共に該ピン端子挿通孔に挿通された上記ピン端子を外嵌保持する端子接続部が設けられている一方、その他の配線基板の該ピン端子挿通孔を構成する貫通孔に、該ピン端子挿通孔に挿通された該ピン端子の該その他の配線基板への接触を規制する絶縁スリーブが内嵌めされており、
上記ピン端子を突出させて上記基板積層体を挟持するように設けられた上側及び下側保護部材をさらに備え、
上記絶縁スリーブは、上記上側及び/又は下側保護部材に一体に設けられている配線構造体。 - 請求項1に記載された配線構造体において、
上記ピン端子は、上記複数の配線基板のうちいずれかの金属箔配線とのみ導通している配線構造体。 - 請求項1又は2に記載された配線構造体が、上記ピン端子が突出するように筐体に収容され、該筐体の外側に、該筐体から突出した該ピン端子を含むコネクタ取付部が設けられたジョイントボックス。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010218632A JP5610285B2 (ja) | 2010-09-29 | 2010-09-29 | 配線構造体及びそれを備えたジョイントボックス |
CN201110265537.7A CN102448241B (zh) | 2010-09-29 | 2011-09-08 | 布线构造体及包括其的接线盒 |
US13/233,160 US8366457B2 (en) | 2010-09-29 | 2011-09-15 | Wiring structure having a plurality of circuit boards with an insulating sleeve in a terminal insertion hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010218632A JP5610285B2 (ja) | 2010-09-29 | 2010-09-29 | 配線構造体及びそれを備えたジョイントボックス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012074563A JP2012074563A (ja) | 2012-04-12 |
JP5610285B2 true JP5610285B2 (ja) | 2014-10-22 |
Family
ID=45871090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010218632A Active JP5610285B2 (ja) | 2010-09-29 | 2010-09-29 | 配線構造体及びそれを備えたジョイントボックス |
Country Status (3)
Country | Link |
---|---|
US (1) | US8366457B2 (ja) |
JP (1) | JP5610285B2 (ja) |
CN (1) | CN102448241B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011006392A1 (de) * | 2011-03-30 | 2012-10-04 | Robert Bosch Gmbh | Anschlusselement und Verfahren zur Herstellung eines Anschlusselements |
JP6630190B2 (ja) * | 2016-03-02 | 2020-01-15 | 矢崎総業株式会社 | コネクタ付きケースおよびコネクタ付きケースの製造方法 |
KR20180068017A (ko) * | 2016-12-13 | 2018-06-21 | 현대자동차주식회사 | 전력 변환장치 |
DK3555981T3 (da) * | 2016-12-19 | 2021-04-06 | Abb Schweiz Ag | Flerfaset samleskinne til at lede elektrisk energi og fremgangsmåde til fremstilling af denne |
US10608356B2 (en) * | 2018-08-30 | 2020-03-31 | L-3 Technologies, Inc. | Multiple node bus bar contacts for high-power electronic assemblies |
JP7248453B2 (ja) * | 2019-02-28 | 2023-03-29 | 矢崎総業株式会社 | ジョイントコネクタ |
JP2021064738A (ja) * | 2019-10-16 | 2021-04-22 | 株式会社ディスコ | 配線基板 |
TWI834116B (zh) * | 2021-03-09 | 2024-03-01 | 陳松佑 | 導電端子組件與導電端子 |
CN117356001A (zh) | 2021-06-11 | 2024-01-05 | 杜普力克有限责任公司 | 用于自动组装或拆卸层压电路的套件 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3162500A (en) * | 1962-04-16 | 1964-12-22 | Ind Electric Hardware Corp | Multiple-circuit pin for multilayer circuitry |
JPH0660923A (ja) * | 1992-08-07 | 1994-03-04 | Fujitsu Ltd | 金属ベースプリント板のリード端子実装構造 |
JPH0870187A (ja) * | 1994-08-30 | 1996-03-12 | Furukawa Electric Co Ltd:The | 高耐圧大電流配線板 |
JP3808665B2 (ja) * | 1999-07-01 | 2006-08-16 | 住友電装株式会社 | 電気接続箱 |
JP4120198B2 (ja) * | 2001-10-24 | 2008-07-16 | モレックス インコーポレーテッド | 基板用コネクタ |
JP3983146B2 (ja) * | 2002-09-17 | 2007-09-26 | Necエレクトロニクス株式会社 | 多層配線基板の製造方法 |
US7943859B2 (en) | 2004-03-31 | 2011-05-17 | Mitsubishi Cable Industries, Ltd. | Circuit board, its manufacturing method, and joint box using circuit board |
CN100591193C (zh) * | 2005-07-15 | 2010-02-17 | 松下电器产业株式会社 | 布线基板、布线材料、覆铜层压板以及布线基板的制造方法 |
JP4385058B2 (ja) * | 2007-05-07 | 2009-12-16 | 三菱電機株式会社 | 電子制御装置 |
TWM383837U (en) * | 2009-09-10 | 2010-07-01 | D & C Technology Co Ltd | Laser device for manufacturing process of acoustooptic modulation curve of panel conductive film |
-
2010
- 2010-09-29 JP JP2010218632A patent/JP5610285B2/ja active Active
-
2011
- 2011-09-08 CN CN201110265537.7A patent/CN102448241B/zh active Active
- 2011-09-15 US US13/233,160 patent/US8366457B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8366457B2 (en) | 2013-02-05 |
JP2012074563A (ja) | 2012-04-12 |
CN102448241B (zh) | 2016-03-30 |
US20120077359A1 (en) | 2012-03-29 |
CN102448241A (zh) | 2012-05-09 |
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