JP4588834B2 - リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板 - Google Patents

リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板 Download PDF

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Publication number
JP4588834B2
JP4588834B2 JP2000104284A JP2000104284A JP4588834B2 JP 4588834 B2 JP4588834 B2 JP 4588834B2 JP 2000104284 A JP2000104284 A JP 2000104284A JP 2000104284 A JP2000104284 A JP 2000104284A JP 4588834 B2 JP4588834 B2 JP 4588834B2
Authority
JP
Japan
Prior art keywords
epoxy resin
phosphorus
resin composition
weight
containing epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000104284A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001288247A5 (enExample
JP2001288247A (ja
Inventor
隆 相楽
俊治 高田
清暁 井原
秀隆 垣内
一男 石原
千明 浅野
雅男 軍司
洋 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Electric Works Co Ltd
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Panasonic Corp
Nippon Steel Chemical Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Nippon Steel Chemical Co Ltd, Matsushita Electric Works Ltd filed Critical Panasonic Corp
Priority to JP2000104284A priority Critical patent/JP4588834B2/ja
Priority to TW089121178A priority patent/TW555809B/zh
Priority to US09/688,033 priority patent/US6524709B1/en
Priority to KR1020000069395A priority patent/KR100564814B1/ko
Priority to CNB001373110A priority patent/CN1240772C/zh
Priority to CNB2005100999100A priority patent/CN100432130C/zh
Priority to AT00126572T priority patent/ATE376565T1/de
Priority to DE60036856T priority patent/DE60036856T2/de
Priority to DK00126572T priority patent/DK1142921T3/da
Priority to EP00126572A priority patent/EP1142921B1/en
Publication of JP2001288247A publication Critical patent/JP2001288247A/ja
Priority to HK02101848.0A priority patent/HK1040410B/xx
Priority to US10/359,205 priority patent/US6933050B2/en
Publication of JP2001288247A5 publication Critical patent/JP2001288247A5/ja
Application granted granted Critical
Publication of JP4588834B2 publication Critical patent/JP4588834B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Fireproofing Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2000104284A 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板 Expired - Lifetime JP4588834B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
TW089121178A TW555809B (en) 2000-04-06 2000-10-11 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board
US09/688,033 US6524709B1 (en) 2000-04-06 2000-10-12 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
KR1020000069395A KR100564814B1 (ko) 2000-04-06 2000-11-22 인 함유 에폭시 수지조성물 및 그 인 함유 에폭시 수지를사용하는 난연성 수지시트, 수지부착 금속박, 프리프레그및 적층판, 다층판
CNB2005100999100A CN100432130C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用
CNB001373110A CN1240772C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用
AT00126572T ATE376565T1 (de) 2000-04-06 2000-12-12 Phosphor enthaltende epoxidharzzusammensetzung, verbundfolie die diese enthält, mehrschichtwerkstoff aus metall, prepreg und laminierte platte, mehrschichtplatte
DE60036856T DE60036856T2 (de) 2000-04-06 2000-12-12 Phosphor enthaltende Epoxidharzzusammensetzung, Verbundfolie die diese enthält, Mehrschichtwerkstoff aus Metall, Prepreg und laminierte Platte, Mehrschichtplatte
DK00126572T DK1142921T3 (da) 2000-04-06 2000-12-12 Phosphorholdige epoxyharpikspræparater, flammehæmmende harpiksark eller bane under anvendelse af den phosphorholdige epoxyharpiks, harpiksbelagt metalfolie, prepreg og lamineret plade, flerlagsplade
EP00126572A EP1142921B1 (en) 2000-04-06 2000-12-12 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
HK02101848.0A HK1040410B (en) 2000-04-06 2002-03-11 Epoxy resin compositions containing phosphorus and the uses thereof
US10/359,205 US6933050B2 (en) 2000-04-06 2003-02-06 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Publications (3)

Publication Number Publication Date
JP2001288247A JP2001288247A (ja) 2001-10-16
JP2001288247A5 JP2001288247A5 (enExample) 2007-02-22
JP4588834B2 true JP4588834B2 (ja) 2010-12-01

Family

ID=18617859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000104284A Expired - Lifetime JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板

Country Status (9)

Country Link
US (2) US6524709B1 (enExample)
EP (1) EP1142921B1 (enExample)
JP (1) JP4588834B2 (enExample)
KR (1) KR100564814B1 (enExample)
CN (2) CN1240772C (enExample)
AT (1) ATE376565T1 (enExample)
DE (1) DE60036856T2 (enExample)
DK (1) DK1142921T3 (enExample)
TW (1) TW555809B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150031237A (ko) 2012-06-15 2015-03-23 신닛테츠 수미킨 가가쿠 가부시키가이샤 인 함유 에폭시 수지 및 그 에폭시 수지를 필수성분으로 하는 조성물, 경화물
KR20250160125A (ko) 2023-03-22 2025-11-11 파나소닉 아이피 매니지먼트 가부시키가이샤 수지 조성물, 프리프레그, 수지 부가 필름, 수지 부가 금속박, 금속 클래드 적층판, 및 프린트 배선판

Families Citing this family (45)

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JP2002003702A (ja) * 2000-06-21 2002-01-09 Matsushita Electric Works Ltd エポキシ樹脂組成物、絶縁フィルム、樹脂付き金属箔及び多層プリント配線板
CN1392883A (zh) * 2000-09-12 2003-01-22 三井化学株式会社 含磷环氧树脂,含该树脂的阻燃性高耐热环氧树脂组合物及层压板
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP4837175B2 (ja) * 2001-02-23 2011-12-14 新日鐵化学株式会社 リン含有エポキシ樹脂組成物
JP2003281940A (ja) * 2002-03-25 2003-10-03 Hitachi Chem Co Ltd 絶縁樹脂組成物，銅箔付き絶縁材および銅張積層板
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CN100384932C (zh) * 2004-10-11 2008-04-30 广东生益科技股份有限公司 一种热固性树脂组合物以及使用它的预浸料、印刷电路用层压板
JP2008517136A (ja) * 2004-11-26 2008-05-22 エルジー・ケム・リミテッド 非ハロゲン難燃性エポキシ樹脂組成物、ならびにそれを用いたプレプレッグおよび銅クラッドラミネート
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
JP2006342217A (ja) * 2005-06-07 2006-12-21 Sanko Kk リン含有難燃性ビスフェノール型エポキシ樹脂の製造方法並びにリン含有難燃性ビスフェノール型エポキシ樹脂及びリン含有難燃性ビスフェノール型エポキシ樹脂組成物
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JP4244975B2 (ja) * 2005-08-26 2009-03-25 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
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JP5334373B2 (ja) * 2007-03-05 2013-11-06 新日鉄住金化学株式会社 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物
TWI342322B (en) * 2007-03-28 2011-05-21 Grand Tek Advance Material Science Co Ltd Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad laminate
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
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KR100877342B1 (ko) * 2007-09-13 2009-01-07 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
US20110201724A1 (en) * 2008-10-29 2011-08-18 Levchik Sergei V Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof
JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
RU2420547C2 (ru) * 2009-03-26 2011-06-10 Общество с ограниченной ответственностью "Научно-технологический испытательный центр АпАТэК-Дубна" (ООО "НТИЦ АпАТэК-Дубна") Способ получения связующего для препрега (варианты), связующее для препрега (варианты), препрег и изделие
KR101276590B1 (ko) * 2009-03-26 2013-06-19 파나소닉 주식회사 에폭시 수지 조성물, 프리프레그, 수지 부착 금속박, 수지 시트, 적층판, 및 다층판
JP5441477B2 (ja) * 2009-04-01 2014-03-12 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
WO2011152412A1 (ja) * 2010-05-31 2011-12-08 日立化成工業株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板
JP5579008B2 (ja) * 2010-09-29 2014-08-27 新日鉄住金化学株式会社 リン含有エポキシ樹脂
TWI408143B (zh) * 2010-11-03 2013-09-11 Univ Nat Chunghsing 具有不對稱磷系雙酚結構之化合物、其環氧樹脂半固化物衍生物及其一鍋化製造方法
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JP5786839B2 (ja) * 2012-12-05 2015-09-30 株式会社デンソー エポキシ樹脂組成物および接着構造体の製造方法
CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
CN105358624B (zh) * 2013-07-04 2017-06-06 松下知识产权经营株式会社 树脂组合物、预浸料和层压板
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