CN1240772C - 含磷的环氧树脂组合物及其应用 - Google Patents

含磷的环氧树脂组合物及其应用 Download PDF

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Publication number
CN1240772C
CN1240772C CNB001373110A CN00137311A CN1240772C CN 1240772 C CN1240772 C CN 1240772C CN B001373110 A CNB001373110 A CN B001373110A CN 00137311 A CN00137311 A CN 00137311A CN 1240772 C CN1240772 C CN 1240772C
Authority
CN
China
Prior art keywords
epoxy resin
phosphorus
resin composition
containing epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB001373110A
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English (en)
Chinese (zh)
Other versions
CN1316463A (zh
Inventor
相乐隆
高田俊治
井原清晓
垣内秀隆
石原一男
浅野千明
军司雅男
佐藤洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Tohto Kasei Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohto Kasei Co Ltd, Matsushita Electric Works Ltd filed Critical Tohto Kasei Co Ltd
Publication of CN1316463A publication Critical patent/CN1316463A/zh
Application granted granted Critical
Publication of CN1240772C publication Critical patent/CN1240772C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Fireproofing Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CNB001373110A 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用 Expired - Lifetime CN1240772C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000104284A JP4588834B2 (ja) 2000-04-06 2000-04-06 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
JP104284/2000 2000-04-06
JP104284/00 2000-04-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100999100A Division CN100432130C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用

Publications (2)

Publication Number Publication Date
CN1316463A CN1316463A (zh) 2001-10-10
CN1240772C true CN1240772C (zh) 2006-02-08

Family

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Family Applications (2)

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CNB001373110A Expired - Lifetime CN1240772C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用
CNB2005100999100A Expired - Lifetime CN100432130C (zh) 2000-04-06 2000-11-30 含磷的环氧树脂组合物及其应用

Family Applications After (1)

Application Number Title Priority Date Filing Date
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Country Status (9)

Country Link
US (2) US6524709B1 (enExample)
EP (1) EP1142921B1 (enExample)
JP (1) JP4588834B2 (enExample)
KR (1) KR100564814B1 (enExample)
CN (2) CN1240772C (enExample)
AT (1) ATE376565T1 (enExample)
DE (1) DE60036856T2 (enExample)
DK (1) DK1142921T3 (enExample)
TW (1) TW555809B (enExample)

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JP5441477B2 (ja) * 2009-04-01 2014-03-12 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
WO2011152412A1 (ja) * 2010-05-31 2011-12-08 日立化成工業株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板
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CN103059265A (zh) * 2013-01-20 2013-04-24 安徽善孚新材料科技有限公司 一种含萘环结构无卤阻燃环氧树脂及其制备方法
CN105358624B (zh) * 2013-07-04 2017-06-06 松下知识产权经营株式会社 树脂组合物、预浸料和层压板
TWI667276B (zh) 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
JPWO2016121758A1 (ja) * 2015-01-29 2017-11-09 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、樹脂シート及びプリプレグ
CN104987664B (zh) * 2015-06-26 2018-02-09 四川东材科技集团股份有限公司 一种特高压直流输变电用绝缘层、模压结构件及其制备方法
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
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JP2020122034A (ja) 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
CN114302907B (zh) 2019-09-06 2024-07-16 松下知识产权经营株式会社 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔、覆金属层压体和印刷线路板
TW202340312A (zh) 2022-02-22 2023-10-16 日商松下知識產權經營股份有限公司 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板
JPWO2024195732A1 (enExample) 2023-03-22 2024-09-26

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Also Published As

Publication number Publication date
TW555809B (en) 2003-10-01
ATE376565T1 (de) 2007-11-15
DE60036856T2 (de) 2008-07-31
CN100432130C (zh) 2008-11-12
DK1142921T3 (da) 2008-01-28
KR20010096506A (ko) 2001-11-07
US6933050B2 (en) 2005-08-23
US6524709B1 (en) 2003-02-25
CN1316463A (zh) 2001-10-10
DE60036856D1 (de) 2007-12-06
EP1142921B1 (en) 2007-10-24
US20030162935A1 (en) 2003-08-28
JP2001288247A (ja) 2001-10-16
EP1142921A1 (en) 2001-10-10
HK1040410A1 (en) 2002-06-07
CN1737056A (zh) 2006-02-22
KR100564814B1 (ko) 2006-03-27
JP4588834B2 (ja) 2010-12-01

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