JP4497551B2 - リソグラフィ装置及びデバイス製造方法 - Google Patents
リソグラフィ装置及びデバイス製造方法 Download PDFInfo
- Publication number
- JP4497551B2 JP4497551B2 JP2006516054A JP2006516054A JP4497551B2 JP 4497551 B2 JP4497551 B2 JP 4497551B2 JP 2006516054 A JP2006516054 A JP 2006516054A JP 2006516054 A JP2006516054 A JP 2006516054A JP 4497551 B2 JP4497551 B2 JP 4497551B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- radiation
- projection
- projection system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000007788 liquid Substances 0.000 claims description 108
- 239000000758 substrate Substances 0.000 claims description 96
- 230000005855 radiation Effects 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 18
- 238000000059 patterning Methods 0.000 claims description 12
- 230000002209 hydrophobic effect Effects 0.000 claims description 7
- 230000005661 hydrophobic surface Effects 0.000 claims description 6
- 230000005660 hydrophilic surface Effects 0.000 claims description 5
- 230000006870 function Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- 239000007787 solid Substances 0.000 description 8
- 238000007654 immersion Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000001527 near-field phase shift lithography Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Microscoopes, Condenser (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03254116A EP1491956B1 (de) | 2003-06-27 | 2003-06-27 | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
PCT/EP2004/006875 WO2005001572A2 (en) | 2003-06-27 | 2004-06-25 | Lithographic apparatus and device manufacturing method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010057575A Division JP5017402B2 (ja) | 2003-06-27 | 2010-03-15 | リソグラフィ投影装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009514183A JP2009514183A (ja) | 2009-04-02 |
JP4497551B2 true JP4497551B2 (ja) | 2010-07-07 |
Family
ID=33396023
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006516054A Expired - Fee Related JP4497551B2 (ja) | 2003-06-27 | 2004-06-25 | リソグラフィ装置及びデバイス製造方法 |
JP2010057575A Expired - Fee Related JP5017402B2 (ja) | 2003-06-27 | 2010-03-15 | リソグラフィ投影装置 |
JP2011278754A Pending JP2012070000A (ja) | 2003-06-27 | 2011-12-20 | リソグラフィ投影装置 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010057575A Expired - Fee Related JP5017402B2 (ja) | 2003-06-27 | 2010-03-15 | リソグラフィ投影装置 |
JP2011278754A Pending JP2012070000A (ja) | 2003-06-27 | 2011-12-20 | リソグラフィ投影装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7012673B2 (de) |
EP (1) | EP1491956B1 (de) |
JP (3) | JP4497551B2 (de) |
DE (1) | DE60308161T2 (de) |
TW (1) | TWI252380B (de) |
WO (1) | WO2005001572A2 (de) |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332112A1 (de) * | 2003-07-09 | 2005-01-27 | Carl Zeiss Smt Ag | Projektionsbelichtungsverfahren und Projektionsbelichtungssystem |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP3953460B2 (ja) * | 2002-11-12 | 2007-08-08 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ投影装置 |
KR101036114B1 (ko) * | 2002-12-10 | 2011-05-23 | 가부시키가이샤 니콘 | 노광장치 및 노광방법, 디바이스 제조방법 |
DE10261775A1 (de) | 2002-12-20 | 2004-07-01 | Carl Zeiss Smt Ag | Vorrichtung zur optischen Vermessung eines Abbildungssystems |
KR101562447B1 (ko) * | 2003-02-26 | 2015-10-21 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
DE602004020200D1 (de) | 2003-04-07 | 2009-05-07 | Nippon Kogaku Kk | Belichtungsgerät und verfahren zur herstellung einer vorrichtung |
KR101178756B1 (ko) * | 2003-04-11 | 2012-08-31 | 가부시키가이샤 니콘 | 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침액체를 유지하는 장치 및 방법 |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101729866B1 (ko) * | 2003-06-13 | 2017-04-24 | 가부시키가이샤 니콘 | 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법 |
US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
EP2216685B1 (de) * | 2003-06-19 | 2012-06-27 | Nikon Corporation | Belichtungsapparat und Verfahren zur Herstellung einer Vorrichtung |
US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
US7236232B2 (en) * | 2003-07-01 | 2007-06-26 | Nikon Corporation | Using isotopically specified fluids as optical elements |
EP2264531B1 (de) | 2003-07-09 | 2013-01-16 | Nikon Corporation | Belichtungsgerät und Verfahren zur Herstellung einer Vorrichtung |
KR101296501B1 (ko) | 2003-07-09 | 2013-08-13 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
WO2005006416A1 (ja) * | 2003-07-09 | 2005-01-20 | Nikon Corporation | 結合装置、露光装置、及びデバイス製造方法 |
WO2005010960A1 (ja) * | 2003-07-25 | 2005-02-03 | Nikon Corporation | 投影光学系の検査方法および検査装置、ならびに投影光学系の製造方法 |
US7326522B2 (en) | 2004-02-11 | 2008-02-05 | Asml Netherlands B.V. | Device manufacturing method and a substrate |
US7175968B2 (en) | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
EP1503244A1 (de) | 2003-07-28 | 2005-02-02 | ASML Netherlands B.V. | Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung |
EP2264535B1 (de) * | 2003-07-28 | 2013-02-13 | Nikon Corporation | Belichtungsapparat, Verfahren zur Herstellung einer Vorrichtung, und Verfahren zur Steuerung des Apparats |
US7779781B2 (en) | 2003-07-31 | 2010-08-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI263859B (en) | 2003-08-29 | 2006-10-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1670039B1 (de) | 2003-08-29 | 2014-06-04 | Nikon Corporation | Belichtungsvorrichtung und bauelemente-herstellungsverfahren |
EP3223074A1 (de) | 2003-09-03 | 2017-09-27 | Nikon Corporation | Vorrichtung und verfahren für immersionslithographie zur rückgewinnung eines fluids |
JP4444920B2 (ja) * | 2003-09-19 | 2010-03-31 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
KR20170058458A (ko) | 2003-09-29 | 2017-05-26 | 가부시키가이샤 니콘 | 노광장치, 노광방법 및 디바이스 제조방법 |
EP1672682A4 (de) | 2003-10-08 | 2008-10-15 | Zao Nikon Co Ltd | Substrat-transport-vorrichtung und -verfahren, belichtungs-vorrichtung und -verfahren und bauelementherstellungsverfahren |
JP2005136364A (ja) * | 2003-10-08 | 2005-05-26 | Zao Nikon Co Ltd | 基板搬送装置、露光装置、並びにデバイス製造方法 |
KR101319109B1 (ko) | 2003-10-08 | 2013-10-17 | 가부시키가이샤 자오 니콘 | 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광 방법, 디바이스 제조 방법 |
TWI598934B (zh) | 2003-10-09 | 2017-09-11 | Nippon Kogaku Kk | Exposure apparatus, exposure method, and device manufacturing method |
US7528929B2 (en) | 2003-11-14 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI530762B (zh) | 2003-12-03 | 2016-04-21 | 尼康股份有限公司 | Exposure apparatus, exposure method, and device manufacturing method |
WO2005057635A1 (ja) * | 2003-12-15 | 2005-06-23 | Nikon Corporation | 投影露光装置及びステージ装置、並びに露光方法 |
KR101119813B1 (ko) * | 2003-12-15 | 2012-03-06 | 가부시키가이샤 니콘 | 스테이지 장치, 노광 장치, 및 노광 방법 |
US20070081133A1 (en) * | 2004-12-14 | 2007-04-12 | Niikon Corporation | Projection exposure apparatus and stage unit, and exposure method |
KR100965330B1 (ko) | 2003-12-15 | 2010-06-22 | 칼 짜이스 에스엠티 아게 | 적어도 한 개의 액체 렌즈를 가진 마이크로리소그래피 투사대물렌즈로서의 대물렌즈 |
US7324274B2 (en) * | 2003-12-24 | 2008-01-29 | Nikon Corporation | Microscope and immersion objective lens |
US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
JP4506674B2 (ja) | 2004-02-03 | 2010-07-21 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
US7050146B2 (en) * | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1714192A1 (de) * | 2004-02-13 | 2006-10-25 | Carl Zeiss SMT AG | Projektionsobjektiv für eine mikrolithographische projektionsbelichtungsvorrichtung |
CN100592210C (zh) * | 2004-02-13 | 2010-02-24 | 卡尔蔡司Smt股份公司 | 微平版印刷投影曝光装置的投影物镜 |
KR101330370B1 (ko) * | 2004-04-19 | 2013-11-15 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
EP1747499A2 (de) * | 2004-05-04 | 2007-01-31 | Nikon Corporation | Vorrichtung und verfahren zur bereitstellung eines fluids für die immersionslithographie |
EP1768169B9 (de) * | 2004-06-04 | 2013-03-06 | Nikon Corporation | Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung eines bauelementes |
CN100594430C (zh) | 2004-06-04 | 2010-03-17 | 卡尔蔡司Smt股份公司 | 用于测量光学成像系统的图像质量的系统 |
US8605257B2 (en) * | 2004-06-04 | 2013-12-10 | Carl Zeiss Smt Gmbh | Projection system with compensation of intensity variations and compensation element therefor |
US7463330B2 (en) | 2004-07-07 | 2008-12-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101202230B1 (ko) * | 2004-07-12 | 2012-11-16 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20060044533A1 (en) * | 2004-08-27 | 2006-03-02 | Asmlholding N.V. | System and method for reducing disturbances caused by movement in an immersion lithography system |
US7397533B2 (en) * | 2004-12-07 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1681597B1 (de) * | 2005-01-14 | 2010-03-10 | ASML Netherlands B.V. | Lithografische Vorrichtung und Herstellungsverfahren |
US20090262316A1 (en) | 2005-01-31 | 2009-10-22 | Nikon Corporation | Exposure apparatus and method for producing device |
US8692973B2 (en) * | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
US7282701B2 (en) * | 2005-02-28 | 2007-10-16 | Asml Netherlands B.V. | Sensor for use in a lithographic apparatus |
JP4262252B2 (ja) * | 2005-03-02 | 2009-05-13 | キヤノン株式会社 | 露光装置 |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US20060232753A1 (en) * | 2005-04-19 | 2006-10-19 | Asml Holding N.V. | Liquid immersion lithography system with tilted liquid flow |
US20070004182A1 (en) * | 2005-06-30 | 2007-01-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and system for inhibiting immersion lithography defect formation |
JP2007012954A (ja) * | 2005-07-01 | 2007-01-18 | Canon Inc | 露光装置 |
US7773195B2 (en) * | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US20070124987A1 (en) * | 2005-12-05 | 2007-06-07 | Brown Jeffrey K | Electronic pest control apparatus |
US7649611B2 (en) * | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JPWO2007094470A1 (ja) * | 2006-02-16 | 2009-07-09 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
US20070200276A1 (en) * | 2006-02-24 | 2007-08-30 | Micron Technology, Inc. | Method for rapid printing of near-field and imprint lithographic features |
CN100590173C (zh) * | 2006-03-24 | 2010-02-17 | 北京有色金属研究总院 | 一种荧光粉及其制造方法和所制成的电光源 |
US20070238261A1 (en) * | 2006-04-05 | 2007-10-11 | Asml Netherlands B.V. | Device, lithographic apparatus and device manufacturing method |
WO2008008408A2 (en) * | 2006-07-12 | 2008-01-17 | Spectrarep | System and method for managing emergency notifications over a network |
US7973910B2 (en) | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
US9176393B2 (en) * | 2008-05-28 | 2015-11-03 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
GB2470049B (en) | 2009-05-07 | 2011-03-23 | Zeiss Carl Smt Ag | Optical imaging with reduced immersion liquid evaporation effects |
JP5470007B2 (ja) * | 2009-11-25 | 2014-04-16 | 株式会社日立ハイテクノロジーズ | 測定装置および全反射蛍光測定装置 |
JP2014513869A (ja) * | 2011-04-22 | 2014-06-05 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | ウェーハのようなターゲットを処理するためのリソグラフィシステム、及びウェーハのようなターゲットを処理するためのリソグラフィシステムを動作させる方法 |
EP2699967B1 (de) | 2011-04-22 | 2023-09-13 | ASML Netherlands B.V. | Positionsbestimmung in einem lithografiesystem mit einem substrat mit teilweise reflektierender druckmarke |
US9383662B2 (en) | 2011-05-13 | 2016-07-05 | Mapper Lithography Ip B.V. | Lithography system for processing at least a part of a target |
KR102236200B1 (ko) * | 2011-06-30 | 2021-04-06 | 에이에스엠엘 네델란즈 비.브이. | 용량성 측정 시스템을 위한 능동 실드 |
JP6384252B2 (ja) * | 2014-10-07 | 2018-09-05 | 株式会社ニコン | パターン露光装置 |
JP6384372B2 (ja) * | 2015-03-20 | 2018-09-05 | 株式会社ニコン | 湿式処理装置 |
Family Cites Families (138)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE242880C (de) | ||||
US3243321A (en) | 1962-11-02 | 1966-03-29 | Atlas Copco Ab | Method of teflon coating of metals |
GB1242527A (en) | 1967-10-20 | 1971-08-11 | Kodak Ltd | Optical instruments |
US3573975A (en) | 1968-07-10 | 1971-04-06 | Ibm | Photochemical fabrication process |
EP0023231B1 (de) | 1979-07-27 | 1982-08-11 | Tabarelli, Werner, Dr. | Optisches Lithographieverfahren und Einrichtung zum Kopieren eines Musters auf eine Halbleiterscheibe |
FR2474708B1 (fr) | 1980-01-24 | 1987-02-20 | Dme | Procede de microphotolithographie a haute resolution de traits |
JPS5754317A (en) | 1980-09-19 | 1982-03-31 | Hitachi Ltd | Method and device for forming pattern |
US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
US4346164A (en) | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
US4390273A (en) | 1981-02-17 | 1983-06-28 | Censor Patent-Und Versuchsanstalt | Projection mask as well as a method and apparatus for the embedding thereof and projection printing system |
JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
US4405701A (en) | 1981-07-29 | 1983-09-20 | Western Electric Co. | Methods of fabricating a photomask |
JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
DD206607A1 (de) | 1982-06-16 | 1984-02-01 | Mikroelektronik Zt Forsch Tech | Verfahren und vorrichtung zur beseitigung von interferenzeffekten |
DD242880A1 (de) | 1983-01-31 | 1987-02-11 | Kuch Karl Heinz | Einrichtung zur fotolithografischen strukturuebertragung |
DD221563A1 (de) | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
JPS6265326A (ja) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
JPS62121417A (ja) | 1985-11-22 | 1987-06-02 | Hitachi Ltd | 液浸対物レンズ装置 |
JPS63157419A (ja) | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
US5040020A (en) | 1988-03-31 | 1991-08-13 | Cornell Research Foundation, Inc. | Self-aligned, high resolution resonant dielectric lithography |
JPH03209479A (ja) | 1989-09-06 | 1991-09-12 | Sanee Giken Kk | 露光方法 |
US5121256A (en) | 1991-03-14 | 1992-06-09 | The Board Of Trustees Of The Leland Stanford Junior University | Lithography system employing a solid immersion lens |
JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JP3203698B2 (ja) | 1991-09-02 | 2001-08-27 | 株式会社ニコン | 顕微鏡の液浸対物レンズ及び防水キャップ |
JPH06124873A (ja) | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
JP2753930B2 (ja) | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
JP2520833B2 (ja) | 1992-12-21 | 1996-07-31 | 東京エレクトロン株式会社 | 浸漬式の液処理装置 |
JPH06208058A (ja) | 1993-01-13 | 1994-07-26 | Olympus Optical Co Ltd | 顕微鏡対物レンズ |
JP3747951B2 (ja) | 1994-11-07 | 2006-02-22 | 株式会社ニコン | 反射屈折光学系 |
JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
JPH08316124A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
KR100417567B1 (ko) * | 1995-06-07 | 2004-02-05 | 제이콥 엔 올스테드터 | 3차원 영상화 시스템으로 화면의 영상을 생성하는 카메라 |
WO1998009278A1 (en) | 1996-08-26 | 1998-03-05 | Digital Papyrus Technologies | Method and apparatus for coupling an optical lens to a disk through a coupling medium having a relatively high index of refraction |
US5825043A (en) | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
JP3612920B2 (ja) | 1997-02-14 | 2005-01-26 | ソニー株式会社 | 光学記録媒体の原盤作製用露光装置 |
JPH10255319A (ja) * | 1997-03-12 | 1998-09-25 | Hitachi Maxell Ltd | 原盤露光装置及び方法 |
JP3747566B2 (ja) * | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
JP3817836B2 (ja) * | 1997-06-10 | 2006-09-06 | 株式会社ニコン | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
US5900354A (en) * | 1997-07-03 | 1999-05-04 | Batchelder; John Samuel | Method for optical inspection and lithography |
JPH11176727A (ja) | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
WO1999031717A1 (fr) | 1997-12-12 | 1999-06-24 | Nikon Corporation | Procede d'exposition par projection et graveur a projection |
AU2747999A (en) * | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
JP2000012453A (ja) | 1998-06-18 | 2000-01-14 | Nikon Corp | 露光装置及びその使用方法、露光方法、並びにマスクの製造方法 |
JP2000058436A (ja) | 1998-08-11 | 2000-02-25 | Nikon Corp | 投影露光装置及び露光方法 |
TWI242111B (en) | 1999-04-19 | 2005-10-21 | Asml Netherlands Bv | Gas bearings for use in vacuum chambers and their application in lithographic projection apparatus |
JP2000347005A (ja) * | 1999-06-02 | 2000-12-15 | Canon Inc | 可変焦点レンズ装置 |
JP4504479B2 (ja) | 1999-09-21 | 2010-07-14 | オリンパス株式会社 | 顕微鏡用液浸対物レンズ |
JP2001272604A (ja) | 2000-03-27 | 2001-10-05 | Olympus Optical Co Ltd | 液浸対物レンズおよびそれを用いた光学装置 |
JP2002033271A (ja) | 2000-05-12 | 2002-01-31 | Nikon Corp | 投影露光方法、それを用いたデバイス製造方法、及び投影露光装置 |
TW591653B (en) | 2000-08-08 | 2004-06-11 | Koninkl Philips Electronics Nv | Method of manufacturing an optically scannable information carrier |
KR100866818B1 (ko) | 2000-12-11 | 2008-11-04 | 가부시키가이샤 니콘 | 투영광학계 및 이 투영광학계를 구비한 노광장치 |
WO2002091078A1 (en) | 2001-05-07 | 2002-11-14 | Massachusetts Institute Of Technology | Methods and apparatus employing an index matching medium |
US6545815B2 (en) * | 2001-09-13 | 2003-04-08 | Lucent Technologies Inc. | Tunable liquid microlens with lubrication assisted electrowetting |
US6600547B2 (en) | 2001-09-24 | 2003-07-29 | Nikon Corporation | Sliding seal |
CN1791839A (zh) | 2001-11-07 | 2006-06-21 | 应用材料有限公司 | 光点格栅阵列光刻机 |
DE10210899A1 (de) | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refraktives Projektionsobjektiv für Immersions-Lithographie |
US7092069B2 (en) | 2002-03-08 | 2006-08-15 | Carl Zeiss Smt Ag | Projection exposure method and projection exposure system |
DE10229818A1 (de) | 2002-06-28 | 2004-01-15 | Carl Zeiss Smt Ag | Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem |
JP4117530B2 (ja) | 2002-04-04 | 2008-07-16 | セイコーエプソン株式会社 | 液量判定装置、露光装置、および液量判定方法 |
JP2004053952A (ja) | 2002-07-19 | 2004-02-19 | Ricoh Co Ltd | 中間転写ベルト |
US7362508B2 (en) | 2002-08-23 | 2008-04-22 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
US6788477B2 (en) | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1429188B1 (de) * | 2002-11-12 | 2013-06-19 | ASML Netherlands B.V. | Lithographischer Projektionsapparat |
DE10253679A1 (de) | 2002-11-18 | 2004-06-03 | Infineon Technologies Ag | Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren |
DE10258718A1 (de) | 2002-12-09 | 2004-06-24 | Carl Zeiss Smt Ag | Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives |
JP4352874B2 (ja) | 2002-12-10 | 2009-10-28 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
AU2003289272A1 (en) | 2002-12-10 | 2004-06-30 | Nikon Corporation | Surface position detection apparatus, exposure method, and device porducing method |
DE10257766A1 (de) | 2002-12-10 | 2004-07-15 | Carl Zeiss Smt Ag | Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage |
SG150388A1 (en) | 2002-12-10 | 2009-03-30 | Nikon Corp | Exposure apparatus and method for producing device |
US7948604B2 (en) | 2002-12-10 | 2011-05-24 | Nikon Corporation | Exposure apparatus and method for producing device |
KR101036114B1 (ko) | 2002-12-10 | 2011-05-23 | 가부시키가이샤 니콘 | 노광장치 및 노광방법, 디바이스 제조방법 |
JP4232449B2 (ja) | 2002-12-10 | 2009-03-04 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
WO2004053952A1 (ja) | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
TW200421444A (en) | 2002-12-10 | 2004-10-16 | Nippon Kogaku Kk | Optical device and projecting exposure apparatus using such optical device |
SG152063A1 (en) | 2002-12-10 | 2009-05-29 | Nikon Corp | Exposure apparatus and method for producing device |
KR101157002B1 (ko) | 2002-12-10 | 2012-06-21 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
KR20110086130A (ko) | 2002-12-10 | 2011-07-27 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
JP4595320B2 (ja) * | 2002-12-10 | 2010-12-08 | 株式会社ニコン | 露光装置、及びデバイス製造方法 |
EP1429190B1 (de) | 2002-12-10 | 2012-05-09 | Canon Kabushiki Kaisha | Belichtungsapparat und -verfahren |
WO2004053951A1 (ja) | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光方法及び露光装置並びにデバイス製造方法 |
EP1573730B1 (de) | 2002-12-13 | 2009-02-25 | Koninklijke Philips Electronics N.V. | Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht |
EP1579435B1 (de) | 2002-12-19 | 2007-06-27 | Koninklijke Philips Electronics N.V. | Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts |
US7010958B2 (en) | 2002-12-19 | 2006-03-14 | Asml Holding N.V. | High-resolution gas gauge proximity sensor |
EP1732075A3 (de) | 2002-12-19 | 2007-02-21 | Koninklijke Philips Electronics N.V. | Verfahren und Vorrichtung zur Punktbestrahlung auf einer Schicht |
DE10261775A1 (de) | 2002-12-20 | 2004-07-01 | Carl Zeiss Smt Ag | Vorrichtung zur optischen Vermessung eines Abbildungssystems |
US6781670B2 (en) | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
KR101562447B1 (ko) | 2003-02-26 | 2015-10-21 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
KR101181688B1 (ko) | 2003-03-25 | 2012-09-19 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
DE602004020200D1 (de) | 2003-04-07 | 2009-05-07 | Nippon Kogaku Kk | Belichtungsgerät und verfahren zur herstellung einer vorrichtung |
JP4488004B2 (ja) | 2003-04-09 | 2010-06-23 | 株式会社ニコン | 液浸リソグラフィ流体制御システム |
KR20170064003A (ko) | 2003-04-10 | 2017-06-08 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템 |
KR101129213B1 (ko) | 2003-04-10 | 2012-03-27 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 액체를 수집하는 런-오프 경로 |
CN104597717B (zh) | 2003-04-10 | 2017-09-05 | 株式会社尼康 | 包括用于沉浸光刻装置的真空清除的环境系统 |
JP4656057B2 (ja) | 2003-04-10 | 2011-03-23 | 株式会社ニコン | 液浸リソグラフィ装置用電気浸透素子 |
KR101178756B1 (ko) | 2003-04-11 | 2012-08-31 | 가부시키가이샤 니콘 | 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침액체를 유지하는 장치 및 방법 |
JP4582089B2 (ja) | 2003-04-11 | 2010-11-17 | 株式会社ニコン | 液浸リソグラフィ用の液体噴射回収システム |
KR101508810B1 (ko) | 2003-04-11 | 2015-04-14 | 가부시키가이샤 니콘 | 액침 리소그래피에 의한 광학기기의 세정방법 |
JP2006523958A (ja) | 2003-04-17 | 2006-10-19 | 株式会社ニコン | 液浸リソグラフィで使用するためのオートフォーカス素子の光学的構造 |
TWI237307B (en) | 2003-05-01 | 2005-08-01 | Nikon Corp | Optical projection system, light exposing apparatus and light exposing method |
WO2004107011A1 (ja) | 2003-05-06 | 2004-12-09 | Nikon Corporation | 投影光学系、露光装置及び露光方法 |
TWI295414B (en) | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
CN100437358C (zh) | 2003-05-15 | 2008-11-26 | 株式会社尼康 | 曝光装置及器件制造方法 |
TWI503865B (zh) | 2003-05-23 | 2015-10-11 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
TW201415536A (zh) | 2003-05-23 | 2014-04-16 | 尼康股份有限公司 | 曝光方法及曝光裝置以及元件製造方法 |
EP1480065A3 (de) | 2003-05-23 | 2006-05-10 | Canon Kabushiki Kaisha | Optisches Projektionssystem, Belichtungsapparat, und Verfahren zur Herstellung einer Vorrichtung |
JP2005277363A (ja) * | 2003-05-23 | 2005-10-06 | Nikon Corp | 露光装置及びデバイス製造方法 |
US7274472B2 (en) | 2003-05-28 | 2007-09-25 | Timbre Technologies, Inc. | Resolution enhanced optical metrology |
KR20060009956A (ko) | 2003-05-28 | 2006-02-01 | 가부시키가이샤 니콘 | 노광 방법, 노광 장치, 및 디바이스 제조 방법 |
TWI442694B (zh) | 2003-05-30 | 2014-06-21 | Asml Netherlands Bv | 微影裝置及元件製造方法 |
KR101729866B1 (ko) | 2003-06-13 | 2017-04-24 | 가부시키가이샤 니콘 | 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법 |
EP2216685B1 (de) | 2003-06-19 | 2012-06-27 | Nikon Corporation | Belichtungsapparat und Verfahren zur Herstellung einer Vorrichtung |
US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
JP3862678B2 (ja) | 2003-06-27 | 2006-12-27 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
EP1498778A1 (de) | 2003-06-27 | 2005-01-19 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
EP1975721A1 (de) | 2003-06-30 | 2008-10-01 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
EP1494074A1 (de) | 2003-06-30 | 2005-01-05 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
EP2264531B1 (de) | 2003-07-09 | 2013-01-16 | Nikon Corporation | Belichtungsgerät und Verfahren zur Herstellung einer Vorrichtung |
WO2005015315A2 (de) | 2003-07-24 | 2005-02-17 | Carl Zeiss Smt Ag | Mikrolithographische projektionsbelichtungsanlage sowie verfahren zum einbringen einer immersionsflüssigkeit in einem immersionsraum |
US7006209B2 (en) | 2003-07-25 | 2006-02-28 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
EP1503244A1 (de) | 2003-07-28 | 2005-02-02 | ASML Netherlands B.V. | Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung |
US7579135B2 (en) | 2003-08-11 | 2009-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus for manufacture of integrated circuits |
US7700267B2 (en) | 2003-08-11 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
US7061578B2 (en) | 2003-08-11 | 2006-06-13 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
US6844206B1 (en) | 2003-08-21 | 2005-01-18 | Advanced Micro Devices, Llp | Refractive index system monitor and control for immersion lithography |
TWI263859B (en) | 2003-08-29 | 2006-10-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
TWI245163B (en) | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1670039B1 (de) | 2003-08-29 | 2014-06-04 | Nikon Corporation | Belichtungsvorrichtung und bauelemente-herstellungsverfahren |
US7070915B2 (en) | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
US7014966B2 (en) | 2003-09-02 | 2006-03-21 | Advanced Micro Devices, Inc. | Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems |
EP1672682A4 (de) | 2003-10-08 | 2008-10-15 | Zao Nikon Co Ltd | Substrat-transport-vorrichtung und -verfahren, belichtungs-vorrichtung und -verfahren und bauelementherstellungsverfahren |
US7528929B2 (en) | 2003-11-14 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4323946B2 (ja) | 2003-12-19 | 2009-09-02 | キヤノン株式会社 | 露光装置 |
JP2005268700A (ja) * | 2004-03-22 | 2005-09-29 | Nikon Corp | ステージ装置及び露光装置 |
US20050231695A1 (en) | 2004-04-15 | 2005-10-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for immersion lithography using high PH immersion fluid |
-
2003
- 2003-06-27 DE DE60308161T patent/DE60308161T2/de not_active Expired - Lifetime
- 2003-06-27 EP EP03254116A patent/EP1491956B1/de not_active Expired - Lifetime
-
2004
- 2004-06-14 US US10/866,077 patent/US7012673B2/en not_active Expired - Lifetime
- 2004-06-17 TW TW093117515A patent/TWI252380B/zh not_active IP Right Cessation
- 2004-06-25 JP JP2006516054A patent/JP4497551B2/ja not_active Expired - Fee Related
- 2004-06-25 WO PCT/EP2004/006875 patent/WO2005001572A2/en active Application Filing
-
2008
- 2008-03-11 US US12/073,908 patent/USRE42741E1/en not_active Expired - Fee Related
-
2010
- 2010-03-15 JP JP2010057575A patent/JP5017402B2/ja not_active Expired - Fee Related
-
2011
- 2011-12-20 JP JP2011278754A patent/JP2012070000A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1491956A1 (de) | 2004-12-29 |
DE60308161T2 (de) | 2007-08-09 |
DE60308161D1 (de) | 2006-10-19 |
USRE42741E1 (en) | 2011-09-27 |
WO2005001572A2 (en) | 2005-01-06 |
US7012673B2 (en) | 2006-03-14 |
JP2012070000A (ja) | 2012-04-05 |
WO2005001572A3 (en) | 2005-04-21 |
TWI252380B (en) | 2006-04-01 |
JP2009514183A (ja) | 2009-04-02 |
JP5017402B2 (ja) | 2012-09-05 |
EP1491956B1 (de) | 2006-09-06 |
US20050002004A1 (en) | 2005-01-06 |
JP2010141357A (ja) | 2010-06-24 |
TW200525301A (en) | 2005-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4497551B2 (ja) | リソグラフィ装置及びデバイス製造方法 | |
JP3954017B2 (ja) | リソグラフィ装置及びデバイス製造方法 | |
JP3978421B2 (ja) | リソグラフ装置およびデバイス製造方法 | |
JP4340613B2 (ja) | リソグラフィック装置及びデバイス製造方法 | |
JP4463843B2 (ja) | リソグラフィ装置及びデバイス製造方法 | |
JP5881786B2 (ja) | リソグラフィ装置 | |
JP4372095B2 (ja) | リソグラフィ装置およびデバイス製造方法 | |
JP5300945B2 (ja) | リソグラフィック装置及びデバイス製造方法 | |
JP4383993B2 (ja) | リソグラフィ装置 | |
JP4502993B2 (ja) | リソグラフィ装置およびデバイス製造方法 | |
JP4347282B2 (ja) | リソグラフィ装置及びデバイス製造方法 | |
JP2009016871A (ja) | リソグラフィック装置及びデバイス製造方法 | |
JP5286431B2 (ja) | リソグラフィ装置 | |
KR100699567B1 (ko) | 리소그래피 장치 및 디바이스 제조방법 | |
JP2011023749A (ja) | リソグラフィ装置およびデバイス製造方法 | |
JP4565915B2 (ja) | リソグラフィ投影装置及び物品保持器 | |
KR100817269B1 (ko) | 리소그래피장치, 디바이스 제조방법 및 그에 따라 제조된 디바이스 | |
JP2005072604A (ja) | リソグラフィック装置、デバイス製造方法及びスライド・アセンブリ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091216 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100315 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100408 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100412 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130423 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |