DE602004020200D1 - Belichtungsgerät und verfahren zur herstellung einer vorrichtung - Google Patents

Belichtungsgerät und verfahren zur herstellung einer vorrichtung

Info

Publication number
DE602004020200D1
DE602004020200D1 DE602004020200T DE602004020200T DE602004020200D1 DE 602004020200 D1 DE602004020200 D1 DE 602004020200D1 DE 602004020200 T DE602004020200 T DE 602004020200T DE 602004020200 T DE602004020200 T DE 602004020200T DE 602004020200 D1 DE602004020200 D1 DE 602004020200D1
Authority
DE
Germany
Prior art keywords
substrate
liquid
optical system
projection optical
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004020200T
Other languages
English (en)
Inventor
Hideaki Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33156817&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602004020200(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Publication of DE602004020200D1 publication Critical patent/DE602004020200D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00Photographic printing apparatus
    • G03B27/32Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Liquid Crystal (AREA)
DE602004020200T 2003-04-07 2004-04-06 Belichtungsgerät und verfahren zur herstellung einer vorrichtung Expired - Fee Related DE602004020200D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003103145 2003-04-07
PCT/JP2004/004969 WO2004090956A1 (ja) 2003-04-07 2004-04-06 露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
DE602004020200D1 true DE602004020200D1 (de) 2009-05-07

Family

ID=33156817

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004020200T Expired - Fee Related DE602004020200D1 (de) 2003-04-07 2004-04-06 Belichtungsgerät und verfahren zur herstellung einer vorrichtung

Country Status (8)

Country Link
US (4) US7480029B2 (de)
EP (1) EP1612850B1 (de)
JP (2) JP4902201B2 (de)
KR (1) KR101176817B1 (de)
AT (1) ATE426914T1 (de)
DE (1) DE602004020200D1 (de)
TW (1) TWI385706B (de)
WO (1) WO2004090956A1 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004090956A1 (ja) * 2003-04-07 2004-10-21 Nikon Corporation 露光装置及びデバイス製造方法
KR101163435B1 (ko) 2003-04-09 2012-07-13 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
KR101177330B1 (ko) * 2003-04-10 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 장치
SG141425A1 (en) 2003-04-10 2008-04-28 Nikon Corp Environmental system including vacuum scavange for an immersion lithography apparatus
JP4315198B2 (ja) 2003-04-11 2009-08-19 株式会社ニコン 液浸液体を光学アセンブリ下に維持するリソグラフィ装置及び液浸液体維持方法並びにそれらを用いるデバイス製造方法
US7684008B2 (en) * 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101146962B1 (ko) 2003-06-19 2012-05-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조방법
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
EP2264531B1 (de) 2003-07-09 2013-01-16 Nikon Corporation Belichtungsgerät und Verfahren zur Herstellung einer Vorrichtung
US7370659B2 (en) 2003-08-06 2008-05-13 Micron Technology, Inc. Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR101748923B1 (ko) * 2003-09-03 2017-06-19 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
TW201834020A (zh) 2003-10-28 2018-09-16 日商尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
JP4295712B2 (ja) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置及び装置製造方法
TWI512335B (zh) 2003-11-20 2015-12-11 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
JP4323946B2 (ja) * 2003-12-19 2009-09-02 キヤノン株式会社 露光装置
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
TWI412067B (zh) 2004-02-06 2013-10-11 尼康股份有限公司 偏光變換元件、光學照明裝置、曝光裝置以及曝光方法
CN100592210C (zh) * 2004-02-13 2010-02-24 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
TWI402893B (zh) 2004-03-25 2013-07-21 尼康股份有限公司 曝光方法
EP2490248A3 (de) * 2004-04-19 2018-01-03 Nikon Corporation Belichtungsvorrichtung und Vorrichtungsherstellungsverfahren
EP1747499A2 (de) 2004-05-04 2007-01-31 Nikon Corporation Vorrichtung und verfahren zur bereitstellung eines fluids für die immersionslithographie
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) * 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161654B2 (en) * 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1821337B1 (de) * 2004-12-06 2016-05-11 Nikon Corporation Wartungsverfahren
US7180571B2 (en) * 2004-12-08 2007-02-20 Asml Netherlands B.V. Lithographic projection apparatus and actuator
SG124351A1 (en) * 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
EP2506289A3 (de) 2005-01-31 2013-05-22 Nikon Corporation Belichtungsvorrichtung und Verfahren zur Herstellung einer Vorrichtung
US8859188B2 (en) 2005-02-10 2014-10-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3232270A3 (de) 2005-05-12 2017-12-13 Nikon Corporation Optisches projektionssystem, belichtungsvorrichtung und belichtungsverfahren
DE102005024163A1 (de) 2005-05-23 2006-11-30 Carl Zeiss Smt Ag Optisches System einer mikrolithographischen Projektionsbelichtungsanlage
US7583358B2 (en) 2005-07-25 2009-09-01 Micron Technology, Inc. Systems and methods for retrieving residual liquid during immersion lens photolithography
US7456928B2 (en) * 2005-08-29 2008-11-25 Micron Technology, Inc. Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography
JP2007088339A (ja) * 2005-09-26 2007-04-05 Nikon Corp 露光装置、及びデバイス製造方法
JPWO2007055237A1 (ja) * 2005-11-09 2009-04-30 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
WO2007055199A1 (ja) 2005-11-09 2007-05-18 Nikon Corporation 露光装置及び方法、並びにデバイス製造方法
US20070127002A1 (en) * 2005-11-09 2007-06-07 Nikon Corporation Exposure apparatus and method, and device manufacturing method
JPWO2007055373A1 (ja) 2005-11-14 2009-04-30 株式会社ニコン 液体回収部材、露光装置、露光方法、及びデバイス製造方法
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
KR20080071552A (ko) 2005-12-06 2008-08-04 가부시키가이샤 니콘 노광 방법, 노광 장치 및 디바이스 제조 방법
US8472004B2 (en) 2006-01-18 2013-06-25 Micron Technology, Inc. Immersion photolithography scanner
JP4889331B2 (ja) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179329A1 (de) 2007-10-16 2010-04-28 Nikon Corporation Optisches beleuchtungssystem, belichtungsgerät und geräteherstellungsverfahren
WO2009050976A1 (en) 2007-10-16 2009-04-23 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
WO2009145048A1 (ja) 2008-05-28 2009-12-03 株式会社ニコン 空間光変調器の検査装置および検査方法、照明光学系、照明光学系の調整方法、露光装置、およびデバイス製造方法
DE102008050868A1 (de) * 2008-09-30 2010-04-08 M+W Zander Products Gmbh Einrichtung zur Temperaturstabilisierung von Flüssigkeiten, vorzugsweise von ultrareinem Wasser, bei der Herstellung von Chips sowie Verfahren zur Temperaturstabilisierung von Flüssigkeiten zur Anwendung bei der Herstellung von Chips
US20110153387A1 (en) * 2009-12-17 2011-06-23 Google Inc. Customizing surveys
WO2015189875A1 (ja) * 2014-06-12 2015-12-17 富士電機株式会社 不純物添加装置、不純物添加方法及び半導体素子の製造方法

Family Cites Families (155)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE416412A (de) * 1935-07-08
US2552414A (en) * 1948-06-08 1951-05-08 Hazeltine Research Inc Electrical connector for solid dielectric type coaxial lines
US3243321A (en) 1962-11-02 1966-03-29 Atlas Copco Ab Method of teflon coating of metals
US3398391A (en) * 1967-08-10 1968-08-20 Alexander R. Brishka Hermetically sealed connectors
GB1242527A (en) 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US3678447A (en) * 1970-06-17 1972-07-18 Amp Inc Coaxial cable connector sub-assembly
US3633051A (en) * 1971-02-16 1972-01-04 Gte Sylvania Inc Transistorized load control circuit
US4372112A (en) * 1980-07-01 1983-02-08 Ford Motor Company Thin-walled exhaust gas manifold casting
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
US5059287A (en) 1989-06-16 1991-10-22 Charles W. Harkey, Sr. Portable water distiller
JPH03209479A (ja) 1989-09-06 1991-09-12 Sanee Giken Kk 露光方法
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JP3203698B2 (ja) * 1991-09-02 2001-08-27 株式会社ニコン 顕微鏡の液浸対物レンズ及び防水キャップ
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるlsi製造縮小投影露光装置の光学系
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JPH06208058A (ja) * 1993-01-13 1994-07-26 Olympus Optical Co Ltd 顕微鏡対物レンズ
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
WO1998028665A1 (en) 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) * 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
US6083040A (en) * 1997-07-25 2000-07-04 Itt Manufacturing Enterprises, Inc. Connector with releasable mounting flange
US6058666A (en) * 1997-08-31 2000-05-09 Lin; Wei-Hwang Twin-axis prestressed single-tee beam with lower flange and process of construction
JP4026943B2 (ja) * 1997-09-04 2007-12-26 キヤノン株式会社 露光装置およびデバイス製造方法
AU2747999A (en) * 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000012453A (ja) * 1998-06-18 2000-01-14 Nikon Corp 露光装置及びその使用方法、露光方法、並びにマスクの製造方法
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
JP2002083766A (ja) * 2000-06-19 2002-03-22 Nikon Corp 投影光学系、該光学系の製造方法、及び前記光学系を備えた投影露光装置
KR100866818B1 (ko) * 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
JP2002305138A (ja) * 2001-04-05 2002-10-18 Nikon Corp 露光装置および露光方法
US20020163629A1 (en) * 2001-05-07 2002-11-07 Michael Switkes Methods and apparatus employing an index matching medium
DE10123027B4 (de) * 2001-05-11 2005-07-21 Evotec Oai Ag Vorrichtung zur Untersuchung chemischer und/oder biologischer Proben
US6666732B1 (en) * 2001-05-21 2003-12-23 John E. Endacott Terminal connector
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (de) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
US6581579B1 (en) * 2002-06-19 2003-06-24 Walbro Engine Management, L.L.C. Vapor separator for a fuel pump assembly
US7362508B2 (en) 2002-08-23 2008-04-22 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
CN100568101C (zh) 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
CN101424881B (zh) 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (de) 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
US6679726B1 (en) * 2002-11-26 2004-01-20 Molex Incorporated Panel mounted electrical connector
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
EP1429190B1 (de) 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Belichtungsapparat und -verfahren
JP4184346B2 (ja) 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 層上のスポットを照射するための方法及び装置における液体除去
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
DE60307322T2 (de) 2002-12-19 2007-10-18 Koninklijke Philips Electronics N.V. Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
KR100971440B1 (ko) 2002-12-19 2010-07-21 코닌클리케 필립스 일렉트로닉스 엔.브이. 레이어 상의 스폿을 조사하기 위한 방법 및 장치
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
JP4449310B2 (ja) * 2003-02-27 2010-04-14 株式会社寺岡精工 計量印字装置
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
WO2004090956A1 (ja) 2003-04-07 2004-10-21 Nikon Corporation 露光装置及びデバイス製造方法
KR101177331B1 (ko) 2003-04-09 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 유체 제어 시스템
SG141425A1 (en) 2003-04-10 2008-04-28 Nikon Corp Environmental system including vacuum scavange for an immersion lithography apparatus
EP2921905B1 (de) 2003-04-10 2017-12-27 Nikon Corporation Ablaufweg zum sammeln von flüssigkeiten für eine immersionslithografievorrichtung
KR101177330B1 (ko) 2003-04-10 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 장치
WO2004090633A2 (en) 2003-04-10 2004-10-21 Nikon Corporation An electro-osmotic element for an immersion lithography apparatus
KR101508809B1 (ko) 2003-04-11 2015-04-06 가부시키가이샤 니콘 액침 리소그래피에 의한 광학기기의 세정방법
JP4315198B2 (ja) 2003-04-11 2009-08-19 株式会社ニコン 液浸液体を光学アセンブリ下に維持するリソグラフィ装置及び液浸液体維持方法並びにそれらを用いるデバイス製造方法
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
JP2006523958A (ja) 2003-04-17 2006-10-19 株式会社ニコン 液浸リソグラフィで使用するためのオートフォーカス素子の光学的構造
JP4025683B2 (ja) 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
JP4146755B2 (ja) 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
JP4054285B2 (ja) 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
JP4084710B2 (ja) 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4029064B2 (ja) 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP4084712B2 (ja) 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
SG110100A1 (en) 2003-06-27 2005-04-28 Asml Holding Nv Immersion photolithography system and method using inverted wafer-projection optics interface
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) * 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1639391A4 (de) 2003-07-01 2009-04-29 Nikon Corp Verwendung isotopisch spezifizierter fluide als optische elemente
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US20050045554A1 (en) * 2003-08-28 2005-03-03 Gambro Lundia Ab Membrane unit element, semipermeable membrane, filtration device, and processes for manufacturing the same
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR101748923B1 (ko) 2003-09-03 2017-06-19 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
JP2007525824A (ja) 2003-11-05 2007-09-06 ディーエスエム アイピー アセッツ ビー.ブイ. マイクロチップを製造するための方法および装置
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005054953A2 (en) 2003-11-24 2005-06-16 Carl-Zeiss Smt Ag Holding device for an optical element in an objective
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
US7106415B2 (en) * 2003-12-09 2006-09-12 Anvik Corporation Illumination compensator for curved surface lithography
WO2005059654A1 (en) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Objective as a microlithography projection objective with at least one liquid lens
KR101200654B1 (ko) 2003-12-15 2012-11-12 칼 짜이스 에스엠티 게엠베하 고 개구율 및 평평한 단부면을 가진 투사 대물렌즈
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (ja) 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4253592B2 (ja) * 2004-01-06 2009-04-15 オリンパス株式会社 液浸対物レンズ、蛍光分析装置および倒立型顕微鏡。
JP4429023B2 (ja) 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
CN102169226B (zh) 2004-01-14 2014-04-23 卡尔蔡司Smt有限责任公司 反射折射投影物镜
US8279524B2 (en) 2004-01-16 2012-10-02 Carl Zeiss Smt Gmbh Polarization-modulating optical element
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
EP1706793B1 (de) 2004-01-20 2010-03-03 Carl Zeiss SMT AG Belichtungsvorrichtung und messeinrichtung für eine projektionslinse
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
EP1723467A2 (de) 2004-02-03 2006-11-22 Rochester Institute of Technology Ein fluid verwendendes photolithographieverfahren und system dafür
EP1716454A1 (de) 2004-02-09 2006-11-02 Carl Zeiss SMT AG Projektionsobjektiv für eine mikrolithographische projektionsbelichtungsvorrichtung
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007522508A (ja) 2004-02-13 2007-08-09 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィック投影露光装置のための投影対物レンズ
CN100592210C (zh) 2004-02-13 2010-02-24 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
WO2005081030A1 (en) 2004-02-18 2005-09-01 Corning Incorporated Catadioptric imaging system for high numerical aperture imaging with deep ultraviolet light
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
US8537331B2 (en) 2013-09-17
JP4902201B2 (ja) 2012-03-21
EP1612850B1 (de) 2009-03-25
JP2010183109A (ja) 2010-08-19
US7480029B2 (en) 2009-01-20
JP5287791B2 (ja) 2013-09-11
US20070064209A1 (en) 2007-03-22
KR101176817B1 (ko) 2012-08-24
US8111375B2 (en) 2012-02-07
JPWO2004090956A1 (ja) 2006-07-06
TW200503071A (en) 2005-01-16
US20080291410A1 (en) 2008-11-27
TWI385706B (zh) 2013-02-11
ATE426914T1 (de) 2009-04-15
EP1612850A4 (de) 2008-01-09
US20060023188A1 (en) 2006-02-02
US20060033901A1 (en) 2006-02-16
EP1612850A1 (de) 2006-01-04
WO2004090956A1 (ja) 2004-10-21
KR20050118721A (ko) 2005-12-19

Similar Documents

Publication Publication Date Title
ATE426914T1 (de) Belichtungsgerat und verfahren zur herstellung einer vorrichtung
EP1670039A4 (de) Belichtungsvorrichtung und bauelemente-herstellungsverfahren
TW200611082A (en) Exposure system and device production method
ATE462991T1 (de) Belichtungsapparat und verfahren zur herstellung einer vorrichtung
TW201612951A (en) Exposure apparatus, exposure method, and device producing method
ATE489724T1 (de) Belichtungsvorrichtung und verfahren zur bauelementherstellung
EP2199859A3 (de) Belichtungsvorrichtung, Belichtungsverfahren und Vorrichtungsherstellungsverfahren
EP2466617A3 (de) Belichtungsvorrichtung und Verfahren zur Vorrichtungsherstellung
TW200520053A (en) Immersion lithographic process using a conforming immersion medium
EP1624481A4 (de) Belichtungsvorrichtung und verfahren zur bauelementeherstellung
DE602005002782D1 (de) Eine Vorrichtung und ein Verfahren um ein Fluidmeniskus herzustellen
EP1630612A3 (de) Verfahren zur Herstellung einer Mikrostruktur, Belichtungsvorrichtung und elektronischer Apparat
SG10201809095SA (en) Exposure apparatus, exposure method, and method for producing device
EP1699072A4 (de) Belichtungsvorrichtung, belichtungsverfahren, bauelementeherstellverfahren und optische komponente
TW200511388A (en) Exposure method, substrate stage, exposure apparatus and method for manufacturing device
EP1571698A4 (de) Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung von bauelementen
SG150388A1 (en) Exposure apparatus and method for producing device
EP1653501A4 (de) Belichtungsvorrichtung, bauelemente-herstellungsverfahren und steuerverfahren für eine belichtungsvorrichtung
HK1087782A1 (en) Apparatus and method for maintaining immersion fluid under a lithographic projection lens
ATE509367T1 (de) Belichtungsgerät, substrattrageverfahren, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
ATE493754T1 (de) Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
TW200515106A (en) Method for exposing a substrate and lithographic projection apparatus
EP1632810A3 (de) Belichtungsgerät und Belichtungsverfahren
TW200518903A (en) A method of manufacturing a mould for producing an optical surface, a method of producing a contact lens and a device for use with these methods
DK0733951T3 (da) Fremgangsmåde og indretning til fremstilling af en trykskabelon

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee