EP1681597B1 - Lithografische Vorrichtung und Herstellungsverfahren - Google Patents

Lithografische Vorrichtung und Herstellungsverfahren Download PDF

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Publication number
EP1681597B1
EP1681597B1 EP06250137A EP06250137A EP1681597B1 EP 1681597 B1 EP1681597 B1 EP 1681597B1 EP 06250137 A EP06250137 A EP 06250137A EP 06250137 A EP06250137 A EP 06250137A EP 1681597 B1 EP1681597 B1 EP 1681597B1
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EP
European Patent Office
Prior art keywords
recess
pressure source
substrate
liquid
gas
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Not-in-force
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EP06250137A
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English (en)
French (fr)
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EP1681597A3 (de
EP1681597A2 (de
Inventor
Nicolaas Rudolf Kemper
Sjoerd Nicolaas Lambertus Donders
Christiaan Alexander Hoogendam
Nicolaas Ten Kate
Frits Van Der Meulen
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ASML Netherlands BV
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ASML Netherlands BV
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Publication of EP1681597A3 publication Critical patent/EP1681597A3/de
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature

Definitions

  • the present invention relates to a lithographic apparatus and a method for manufacturing a device.
  • a lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate.
  • a lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs).
  • a patterning device which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC.
  • This pattern can be transferred onto a target portion (e.g. comprising part of, one, or several dies) on a substrate (e.g. a silicon wafer). Transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate.
  • resist radiation-sensitive material
  • a single substrate will contain a network of adjacent target portions that are successively patterned.
  • lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at one time, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the "scanning"-direction) while synchronously scanning the substrate parallel or anti-parallel to this direction. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.
  • liquid supply system to provide liquid on only a localized area of the substrate and in between the final element of the projection system and the substrate using a liquid confinement system (the substrate generally has a larger surface area than the final element of the projection system).
  • a liquid confinement system the substrate generally has a larger surface area than the final element of the projection system.
  • liquid is supplied by at least one inlet IN onto the substrate, preferably along the direction of movement of the substrate relative to the final element, and is removed by at least one outlet OUT after having passed under the projection system.
  • Figure 2 shows the arrangement schematically in which liquid is supplied via inlet IN and is taken up on the other side of the element by outlet OUT which is connected to a low pressure source.
  • the liquid is supplied along the direction of movement of the substrate relative to the final element, though this does not need to be the case.
  • Figure 3 Various orientations and numbers of in- and out-lets positioned around the final element are possible, one example is illustrated in Figure 3 in which four sets of an inlet with an outlet on either side are provided in a regular pattern around the final element.
  • FIG. 4 Another solution which has been proposed is to provide the liquid supply system with a seal member which extends along at least a part of a boundary of the space between the final element of the projection system and the substrate table.
  • the seal member is substantially stationary relative to the projection system in the XY plane though there may be some relative movement in the Z direction (in the direction of the optical axis).
  • a seal is formed between the seal member and the surface of the substrate.
  • the reservoir 10 forms a contactless seal to the substrate around the image field of the projection system so that liquid is confined to fill a space between the substrate surface and the final element of the projection system.
  • the reservoir is formed by a seal member 12 positioned below and surrounding the final element of the projection system PL. Liquid is brought into the space below the projection system and within the seal member 12.
  • the seal member 12 extends a little above the final element of the projection system and the liquid level rises above the final element so that a buffer of liquid is provided.
  • the seal member 12 has an inner periphery that at the upper end preferably closely conforms to the shape of the projection system or the final element thereof and may, e.g., be round. At the bottom, the inner periphery closely conforms to the shape of the image field, e.g., rectangular though this need not be the case.
  • the liquid is confined in the reservoir by a gas seal 16 between the bottom of the seal member 12 and the surface of the substrate W.
  • the gas seal is formed by gas, e.g. air or synthetic air but preferably N 2 or another inert gas, provided under pressure via inlet 15 to the gap between seal member 12 and substrate and extracted via first outlet 14.
  • gas e.g. air or synthetic air but preferably N 2 or another inert gas
  • the overpressure on the gas inlet 15, vacuum level on the first outlet 14 and geometry of the gap are arranged so that there is a high-velocity air flow inwards that confines the liquid.
  • US 2004/0207824 discloses a lithographic projection apparatus in accordance with the pre-characterizing section of claim 1.
  • a lithographic projection apparatus arranged to project a pattern from a patterning device onto a substrate using a projection system and having a liquid supply system arranged to supply immersion liquid to a space between the final element of the projection system and the substrate; said liquid supply system comprising:
  • a device manufacturing method comprising projecting a patterned beam of radiation onto a substrate using a projection system whilst supplying an immersion liquid to a space between a final element of said projection system and said substrate, and further comprising:
  • Figure 1 schematically depicts a lithographic apparatus according to one embodiment of the invention.
  • the apparatus comprises:
  • the illumination system may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.
  • optical components such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.
  • the support structure supports, i.e. bears the weight of, the patterning device. It holds the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment.
  • the support structure can use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device.
  • the support structure may be a frame or a table, for example, which may be fixed or movable as required.
  • the support structure may ensure that the patterning device is at a desired position, for example with respect to the projection system. Any use of the terms "reticle” or “mask” herein may be considered synonymous with the more general term "patterning device.”
  • patterning device used herein should be broadly interpreted as referring to any device that can be used to impart a radiation beam with a pattern in its cross-section such as to create a pattern in a target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern includes phase-shifting features or so called assist features. Generally, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit.
  • the patterning device may be transmissive or reflective.
  • Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels.
  • Masks are well known in lithography, and include mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types.
  • An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted so as to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in a radiation beam which is reflected by the mirror matrix.
  • projection system used herein should be broadly interpreted as encompassing any type of projection system, including refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system”.
  • the apparatus is of a transmissive type (e.g. employing a transmissive mask).
  • the apparatus may be of a reflective type (e.g. employing a programmable mirror array of a type as referred to above, or employing a reflective mask).
  • the lithographic apparatus may be of a type having two (dual stage) or more substrate tables (and/or two or more mask tables). In such "multiple stage” machines the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposure.
  • the illuminator IL receives a radiation beam from a radiation source SO.
  • the source and the lithographic apparatus may be separate entities, for example when the source is an excimer laser. In such cases, the source is not considered to form part of the lithographic apparatus and the radiation beam is passed from the source SO to the illuminator IL with the aid of a beam delivery system BD comprising, for example, suitable directing mirrors and/or a beam expander. In other cases the source may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp.
  • the source SO and the illuminator IL, together with the beam delivery system BD if required, may be referred to as a radiation system.
  • the illuminator IL may comprise an adjuster AD for adjusting the angular intensity distribution of the radiation beam.
  • an adjuster AD for adjusting the angular intensity distribution of the radiation beam.
  • the illuminator IL may comprise various other components, such as an integrator IN and a condenser CO.
  • the illuminator may be used to condition the radiation beam, to have a desired uniformity and intensity distribution in its cross-section.
  • the radiation beam B is incident on the patterning device (e.g., mask MA), which is held on the support structure (e.g., mask table MT), and is patterned by the patterning device. Having traversed the mask MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W.
  • An immersion hood IH which is described further below, supplies immersion liquid to a space between the final element of the projection system PL and the substrate W.
  • the substrate table WT can be moved accurately, e.g. so as to position different target portions C in the path of the radiation beam B.
  • the first positioner PM and another position sensor (which is not explicitly depicted in Figure 1 ) can be used to accurately position the mask MA with respect to the path of the radiation beam B, e.g. after mechanical retrieval from a mask library, or during a scan.
  • movement of the mask table MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioner PM.
  • movement of the substrate table WT may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW.
  • the mask table MT may be connected to a short-stroke actuator only, or may be fixed.
  • Mask MA and substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2.
  • the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks).
  • the mask alignment marks may be located between the dies.
  • the depicted apparatus could be used in at least one of the following modes:
  • FIG. 6 shows a water removal device 31 such as the one disclosed in USSN 10/921,348 in a seal member 12 of an immersion hood IH, according to a particular embodiment of the invention.
  • the liquid removal device 31 comprises a chamber which is maintained at a slight underpressure p c and is filled with the immersion liquid.
  • the lower surface of the chamber is formed of a thin plate 20 having a large number of small holes, e.g. of diameter d hole in the range of 5 to 50 ⁇ m, and is maintained at a height h gap in the range of 50 to 300 ⁇ m above a surface from which liquid is to be removed, e.g. the surface of a substrate W.
  • Perforated plate 20 should be at least slightly hydrophilic, i.e.
  • the liquid removal device 31 is designed substantially for single phase (liquid) extraction.
  • Figure 6 is a cross-sectional view of one side of the seal member 12, which forms a ring around the exposure field of the projection system PL (not shown in Figure 6 ).
  • the liquid removal device is formed by a ring-shaped chamber 31 near the innermost edge of the underside of the seal member 12.
  • the lower surface of the chamber 31 is formed by a porous plate 30, as described in the above patent application.
  • Ring-shaped chamber 31 is connected to a suitable pump or pumps to remove liquid from the chamber and maintain the desired underpressure. In use, the chamber 31 is full of liquid but is shown empty for clarity.
  • the gas supply ring 33 is a chamber with a narrow slit in its lower part and is supplied with gas, e.g. air, artificial air or flushing gas, at a pressure such that the gas escaping out of the slit forms a gas knife 34.
  • gas e.g. air, artificial air or flushing gas
  • the gas forming the gas (or air) knife is extracted by suitable vacuum pumps connected to the gas extraction ring 32 described below so that the resulting gas flow drives any residual liquid inwardly where it can be removed by the liquid removal device and/or the vacuum pumps, which should be able to tolerate vapor of the immersion liquid and/or small liquid droplets.
  • the liquid removal system can remove most of the immersion liquid whilst at a height of 10 ⁇ m to 1mm, or 50 to 300 ⁇ m above the surface of the substrate W or the substrate table WT, less onerous requirements are put on the seal member vertical position than when an air bearing is used to confine the immersion liquid.
  • the seal member can be positioned vertically with a simpler actuation and control system. It also means that the requirements on the flatness of the substrate table and substrate are reduced, making it easier to construct devices such as sensors which need to be provided in the upper surface of the substrate table WT.
  • the seal member 12 can either be constructed to be fixed relative to the projection system PL or can be arranged to be moveable in the direction of the optical axis and rotatable about the directions perpendicular to the optical axis.
  • One way of arranging for this is for the seal member 12 to bear on the substrate W such that its weight is carried by the substrate W. This can be arranged, for example, by arranging for the gas flow 34 of the air knife to create a force equal and opposite in direction to the force of gravity on the seal member 12.
  • the force exerted by the negative pressure in the extraction zone of the recess 32 could increase faster than the force exerted by the positive pressure in the gas knife 32 (because the area is bigger) so that the seal member 12 would be driven down towards the substrate W.
  • This can be mitigated by providing, as well as an extraction port 50 which is connected to a low pressure source, an ambient port 40 which is open to a relatively higher pressure source such as the ambient atmosphere. In this way gas enters through the port 40 to take the place of gas and/or liquid which exits through extraction port 50.
  • there is always a flow of gas through the ambient port 40 so that pressure fluctuations, which change with the distance between the seal member 12 and substrate W, are reduced.
  • the water removal device 31 and the relative pressures of gas in chamber 33 and recess 32 are adjusted to prevent the immersion liquid 11 meniscus being dragged radially inwardly towards the exposure field (on the left hand side of Figure 6 ) by movement of the substrate W. Indeed, it is preferred that the liquid removal system 31 removes only liquid and no gas such that the meniscus of the liquid 11 is positioned under the recess 32. To arrange for this flow restrictions or other means can be used to adjust the relative pressures of the gas source to which the ambient port 40 is connected and the pressure of the relative low pressure source o which the extraction port 50 is connected.
  • a level of-20 to -10 mbar gauge in the recess 32 has been found to be optimal though a range of from -50 to +100 mbar gauge is a possible working range. If the relative low pressure source is at a pressure in the range from - 50 to -500 mbar gauge or -50 to -200 mbar gauge, the ambient port may be open to the atmosphere to achieve the desired pressure in the recess 32.
  • the ambient port 40 and extraction port 50 may be circular grooves (in the same way that recess 32 is a circular or other loop shaped shape) or those ports may be a plurality of discreet holes in the top surface of the recess 32.
  • the gas in chamber 33 is at a pressure of about 800 mbar and is humidified gas thereby to minimize evaporation and thereby cooling of the substrate W though the gas is not necessarily humidified.
  • a typical gas flow rate of 100 litre/min is used and again the gas knife 34 may be provided through an annular continuous cavity or through a plurality of discreet holes.
  • a gas flow rate of about 50 litre/min through the extraction port 50 is envisaged and a gap between the bottom of the seal member 12 and the substrate W is approximately 100 ⁇ m (preferably in the range 80 to 130 ⁇ m).
  • lithographic apparatus in the manufacture of ICs
  • the lithographic apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc.
  • LCDs liquid-crystal displays
  • any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or "target portion”, respectively.
  • the substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.
  • UV radiation e.g. having a wavelength of or about 365, 248, 193, 157 or 126 nm.
  • lens may refer to any one or combination of various types of optical components, including refractive and reflective optical components.
  • the invention may take the form of a computer program containing one or more sequences of machine-readable instructions describing a method as disclosed above, or a data storage medium (e.g. semiconductor memory, magnetic or optical disk) having such a computer program stored therein.
  • a data storage medium e.g. semiconductor memory, magnetic or optical disk
  • the present invention can be applied to any immersion lithography apparatus, in particular, but not exclusively, those types mentioned above.
  • the immersion liquid used in the apparatus may have different compositions, according to the desired properties and the wavelength of exposure radiation used. For exposure wavelength of 193nm, ultra pure water or water-based compositions may be used and for this reason the immersion liquid is sometimes referred to as water and water-related terms such as hydrophilic, hydrophobic, humidity, etc. may be sued. However it is to be understood that the present invention may be used with other types of liquid in which case such water-related terms should be considered replaced by equivalent terms relating to the immersion fluid used.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Sealing Devices (AREA)

Claims (18)

  1. Ein lithographisches Projektionsgerät, das eingerichtet ist, um ein Muster von einer Musteraufbringungsvorrichtung (MA) unter Verwendung eines Projektionssystems (PS) auf ein Substrat (W) zu projizieren, und ein Flüssigkeitsversorgungssystem (IH) aufweist, das eingerichtet ist, um einen Raum zwischen dem letzten Element des Projektionssystems und dem Substrat mit Immersionsflüssigkeit zu versorgen, wobei das Flüssigkeitsversorgungssystem Folgendes beinhaltet:
    ein Abdichtungsteil (12) zum Bilden einer Abdichtung zwischen seiner unteren Oberfläche und dem Substrat, um dadurch im Wesentlichen die Flüssigkeit in dem Raum zurückzuhalten, wobei eine Aussparung (32) in der unteren Oberfläche zur Entnahme von Flüssigkeit und/oder Gas einer ersten Druckquelle gegenüber geöffnet ist und die Aussparung ebenfalls einer zweiten Druckquelle gegenüber geöffnet ist, wobei sich die erste Druckquelle unter niedrigerem Druck befindet als die zweite Druckquelle, so dass ein Gasfluss von der zweiten Druckquelle in die erste Druckquelle besteht,
    dadurch gekennzeichnet, dass
    ein Einlass (50) der ersten Druckquelle in die Aussparung radial außerhalb eines Einlasses (40) der zweiten Druckquelle in die Aussparung positioniert ist.
  2. Gerät gemäß Anspruch 1, wobei das Abdichtungsteil (12) den Raum umgibt.
  3. Gerät gemäß Anspruch 2, wobei die Aussparung (32) eine geschlossene Schleife um den Raum herum bildet.
  4. Gerät gemäß Anspruch 1, 2 oder 3, wobei radial außerhalb der Aussparung ein Gasstrahl (34) positioniert ist.
  5. Gerät gemäß Anspruch 4, wobei der Gasstrahl (34) zwischen dem Abdichtungsteil (12) und dem Substrat (W) radial nach innen in die Aussparung (32) einen Gasfluss schafft.
  6. Gerät gemäß Anspruch 4 oder 5, wobei der Gasstrahl (34) dadurch produziert wird, dass ermöglicht wird, dass Gas aus einer Kammer (33), in der Gas unter von 200 bis 2000 mbar (Relativdruck) enthalten ist, austritt.
  7. Gerät gemäß einem der Ansprüche 4-6, wobei der Gasstrahl (34) durch einen Schlitz mit einer ersten Fläche in einer unteren Oberfläche des Abdichtungsteils aus dem Abdichtungsteil (12) austritt, wobei der erste Bereich kleiner ist als ein Bereich der Aussparung (32) in der unteren Oberfläche.
  8. Gerät gemäß einem der vorhergehenden Ansprüche, wobei eine Flüssigkeitsentfernungsvorrichtung radial innerhalb der Aussparung positioniert ist.
  9. Gerät gemäß Anspruch 8, wobei die Flüssigkeitsentfernungsvorrichtung eingerichtet ist, um im Wesentlichen lediglich Flüssigkeit zu entfernen.
  10. Gerät gemäß einem der vorhergehenden Ansprüche, wobei die erste Druckquelle und die zweite Druckquelle in der Aussparung gegenüber der Öffnung der Aussparung in der unteren Oberfläche positioniert sind.
  11. Gerät gemäß einem der vorhergehenden Ansprüche, wobei Gas in der Aussparung eingerichtet ist, um einen Druck in dem Bereich von +100 bis -50 mbar (Relativdruck) aufzuweisen.
  12. Gerät gemäß einem der vorhergehenden Ansprüche, wobei Gas in der ersten Druckquelle einen Druck von -50 bis -500 mbar (Relativdruck) aufweist.
  13. Gerät gemäß Anspruch 1 oder 2, wobei der Raum in der Draufsicht eine kleinere Fläche aufweist als das Substrat (W).
  14. Gerät gemäß einem der vorhergehenden Ansprüche, wobei der Einlass (50) der ersten Druckquelle und/oder der Einlass (40) der zweiten Druckquelle eine Vielzahl von separaten Löchern ist/sind.
  15. Gerät gemäß einem der vorhergehenden Ansprüche, wobei die zweite Druckquelle Umgebungsdruck aufweist.
  16. Gerät gemäß einem der vorhergehenden Ansprüche, wobei sich die Einlässe (40, 50) der Druckquellen in die Aussparung in einer oberen Oberfläche der Aussparung befinden.
  17. Gerät gemäß einem der vorhergehenden Ansprüche, das ferner ein Mittel zum Einstellen der relativen Drücke der ersten Druckquelle und/oder der zweiten Druckquelle beinhaltet.
  18. Ein Vorrichtungsherstellungsverfahren, das das Projizieren eines gemusterten Strahlungsstrahls (PB) auf ein Substrat (W) unter Verwendung eines Projektionssystems (PS) beinhaltet, während ein Raum zwischen einem letzten Element des Projektionssystems und dem Substrat mit einer Immersionsflüssigkeit versorgt wird, und das ferner Folgendes beinhaltet:
    Bereitstellen eines Abdichtungsteils (12), um durch Entfernen von Flüssigkeit und/oder Gas zwischen einer unteren Oberfläche des Abdichtungsteils und des Substrats durch eine Aussparung (32) in der unteren Oberfläche Flüssigkeit in dem Raum zurückzuhalten, wobei die Aussparung (32) gegenüber einer ersten und zweiten Druckquelle geöffnet ist, wobei die erste Druckquelle einen niedrigeren Druck aufweist als die zweite Druckquelle,
    dadurch gekennzeichnet, dass
    ein Einlass (50) der ersten Druckquelle in die Aussparung radial außerhalb eines Einlasses (40) der zweiten Druckquelle in die Aussparung positioniert ist.
EP06250137A 2005-01-14 2006-01-11 Lithografische Vorrichtung und Herstellungsverfahren Not-in-force EP1681597B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64362605P 2005-01-14 2005-01-14

Publications (3)

Publication Number Publication Date
EP1681597A2 EP1681597A2 (de) 2006-07-19
EP1681597A3 EP1681597A3 (de) 2007-04-18
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US9817321B2 (en) 2017-11-14

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