JP4470225B2 - 物品を格納する容器を処理ツールに差出すためのシステム、半導体製造装置 - Google Patents

物品を格納する容器を処理ツールに差出すためのシステム、半導体製造装置 Download PDF

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JP4470225B2
JP4470225B2 JP2007557103A JP2007557103A JP4470225B2 JP 4470225 B2 JP4470225 B2 JP 4470225B2 JP 2007557103 A JP2007557103 A JP 2007557103A JP 2007557103 A JP2007557103 A JP 2007557103A JP 4470225 B2 JP4470225 B2 JP 4470225B2
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support structure
container
conveyor
foup
rail
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JP2008532288A5 (https=
JP2008532288A (ja
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アンソニー シー ボノラ
マイケル クロラック
ロジャー ジー ハイン
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Muratec Automation Co Ltd
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Muratec Automation Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
JP2007557103A 2005-02-24 2006-02-17 物品を格納する容器を処理ツールに差出すためのシステム、半導体製造装置 Expired - Fee Related JP4470225B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/064,880 US7410340B2 (en) 2005-02-24 2005-02-24 Direct tool loading
PCT/US2006/006103 WO2006091593A2 (en) 2005-02-24 2006-02-17 Direct tool loading

Publications (3)

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JP2008532288A JP2008532288A (ja) 2008-08-14
JP2008532288A5 JP2008532288A5 (https=) 2008-11-27
JP4470225B2 true JP4470225B2 (ja) 2010-06-02

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Country Status (5)

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US (4) US7410340B2 (https=)
JP (1) JP4470225B2 (https=)
KR (1) KR100967357B1 (https=)
CN (1) CN100590786C (https=)
WO (1) WO2006091593A2 (https=)

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