CN101128915A - 加工设备直接装载 - Google Patents
加工设备直接装载 Download PDFInfo
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- CN101128915A CN101128915A CNA2006800061206A CN200680006120A CN101128915A CN 101128915 A CN101128915 A CN 101128915A CN A2006800061206 A CNA2006800061206 A CN A2006800061206A CN 200680006120 A CN200680006120 A CN 200680006120A CN 101128915 A CN101128915 A CN 101128915A
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- foup
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/064,880 US7410340B2 (en) | 2005-02-24 | 2005-02-24 | Direct tool loading |
US11/064,880 | 2005-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101128915A true CN101128915A (zh) | 2008-02-20 |
CN100590786C CN100590786C (zh) | 2010-02-17 |
Family
ID=36407943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680006120A Expired - Fee Related CN100590786C (zh) | 2005-02-24 | 2006-02-17 | 加工设备直接装载 |
Country Status (5)
Country | Link |
---|---|
US (4) | US7410340B2 (zh) |
JP (1) | JP4470225B2 (zh) |
KR (1) | KR100967357B1 (zh) |
CN (1) | CN100590786C (zh) |
WO (1) | WO2006091593A2 (zh) |
Cited By (11)
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CN102945818A (zh) * | 2011-08-15 | 2013-02-27 | 上海微电子装备有限公司 | 硅片传输系统片库设备 |
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CN110406871A (zh) * | 2018-04-27 | 2019-11-05 | 株式会社大福 | 物品搬运设备 |
CN110406872A (zh) * | 2018-04-27 | 2019-11-05 | 株式会社大福 | 物品搬运装置及物品搬运设备 |
CN111661550A (zh) * | 2019-06-24 | 2020-09-15 | 灵动科技(北京)有限公司 | 自动运输装置、及适用于物流场景下自动运输装置的拣货信息获取及显示方法 |
CN112520330A (zh) * | 2019-09-17 | 2021-03-19 | 株式会社大福 | 物品搬运装置 |
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Also Published As
Publication number | Publication date |
---|---|
US20080267742A1 (en) | 2008-10-30 |
KR100967357B1 (ko) | 2010-07-05 |
KR20070116027A (ko) | 2007-12-06 |
US7445415B2 (en) | 2008-11-04 |
US20060188360A1 (en) | 2006-08-24 |
US7651307B2 (en) | 2010-01-26 |
US7410340B2 (en) | 2008-08-12 |
CN100590786C (zh) | 2010-02-17 |
JP4470225B2 (ja) | 2010-06-02 |
JP2008532288A (ja) | 2008-08-14 |
US20060188358A1 (en) | 2006-08-24 |
WO2006091593A3 (en) | 2006-12-28 |
WO2006091593A2 (en) | 2006-08-31 |
US20090028673A1 (en) | 2009-01-29 |
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