JP4247922B2 - 電気・電子機器用銅合金板材およびその製造方法 - Google Patents
電気・電子機器用銅合金板材およびその製造方法 Download PDFInfo
- Publication number
- JP4247922B2 JP4247922B2 JP2007236003A JP2007236003A JP4247922B2 JP 4247922 B2 JP4247922 B2 JP 4247922B2 JP 2007236003 A JP2007236003 A JP 2007236003A JP 2007236003 A JP2007236003 A JP 2007236003A JP 4247922 B2 JP4247922 B2 JP 4247922B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- compound
- alloy sheet
- mass
- intermetallic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007236003A JP4247922B2 (ja) | 2006-09-12 | 2007-09-11 | 電気・電子機器用銅合金板材およびその製造方法 |
| PCT/JP2007/067730 WO2008032738A1 (fr) | 2006-09-12 | 2007-09-12 | Matériau de plaque en alliage de cuivre pour un équipement électrique/électronique et procédé pour produire celui-ci |
| CN2007800412673A CN101535511B (zh) | 2006-09-12 | 2007-09-12 | 用于电气电子设备的铜合金板材及其制造方法 |
| TW096134000A TWI349714B (en) | 2006-09-12 | 2007-09-12 | Copper alloy sheet material for electric and electronic instruments and method of producing the same |
| US12/310,910 US7947133B2 (en) | 2006-09-12 | 2007-09-12 | Copper alloy strip material for electrical/electronic equipment and process for producing the same |
| MYPI20090906A MY144826A (en) | 2006-09-12 | 2007-09-12 | Copper alloy strip material for electrical or electronic part and method for manufacturing the same |
| KR1020097004769A KR101027840B1 (ko) | 2006-09-12 | 2007-09-12 | 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006246961 | 2006-09-12 | ||
| JP2007236003A JP4247922B2 (ja) | 2006-09-12 | 2007-09-11 | 電気・電子機器用銅合金板材およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008095185A JP2008095185A (ja) | 2008-04-24 |
| JP2008095185A5 JP2008095185A5 (enExample) | 2008-10-02 |
| JP4247922B2 true JP4247922B2 (ja) | 2009-04-02 |
Family
ID=39183794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007236003A Active JP4247922B2 (ja) | 2006-09-12 | 2007-09-11 | 電気・電子機器用銅合金板材およびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7947133B2 (enExample) |
| JP (1) | JP4247922B2 (enExample) |
| KR (1) | KR101027840B1 (enExample) |
| CN (1) | CN101535511B (enExample) |
| MY (1) | MY144826A (enExample) |
| TW (1) | TWI349714B (enExample) |
| WO (1) | WO2008032738A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017010854A1 (de) | 2016-11-25 | 2018-05-30 | Fanuc Corporation | Spritzgieß-Verwaltungssystem |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5367999B2 (ja) * | 2008-03-31 | 2013-12-11 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si系合金 |
| JP4837697B2 (ja) * | 2008-03-31 | 2011-12-14 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
| JP5225787B2 (ja) * | 2008-05-29 | 2013-07-03 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si系合金板又は条 |
| JP4615628B2 (ja) * | 2008-10-22 | 2011-01-19 | 古河電気工業株式会社 | 銅合金材料、電気電子部品および銅合金材料の製造方法 |
| KR101331339B1 (ko) | 2008-12-01 | 2013-11-19 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 전자 재료용 Cu-Ni-Si-Co 계 구리 합금 및 그 제조 방법 |
| CN102257170A (zh) * | 2008-12-19 | 2011-11-23 | 古河电气工业株式会社 | 用于电气电子部件的铜合金材料及其制造方法 |
| JP5604882B2 (ja) * | 2009-03-10 | 2014-10-15 | 日立金属株式会社 | 半軟化温度の低い銅荒引線の製造方法、銅線の製造方法及び銅線 |
| KR101419145B1 (ko) * | 2009-12-02 | 2014-07-11 | 후루카와 덴키 고교 가부시키가이샤 | 구리합금 판재, 이를 이용한 커넥터, 및 이를 제조하는 구리합금 판재의 제조방법 |
| JP5654571B2 (ja) * | 2010-04-02 | 2015-01-14 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si系合金 |
| JP4672804B1 (ja) | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系銅合金及びその製造方法 |
| JP4834781B1 (ja) | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系合金 |
| CN102021359B (zh) * | 2010-11-03 | 2013-01-02 | 西安理工大学 | 高Ni、Si含量的Cu-Ni-Si合金的制备方法 |
| JP5192536B2 (ja) * | 2010-12-10 | 2013-05-08 | 三菱伸銅株式会社 | 深絞り加工性及び耐疲労特性に優れたCu−Ni−Si系銅合金板及びその製造方法 |
| JP5522692B2 (ja) * | 2011-02-16 | 2014-06-18 | 株式会社日本製鋼所 | 高強度銅合金鍛造材 |
| JP6205105B2 (ja) * | 2011-04-18 | 2017-09-27 | Jx金属株式会社 | 電子材料用Cu−Ni−Si系合金、Cu−Co−Si系合金及びその製造方法 |
| KR101715532B1 (ko) * | 2012-07-26 | 2017-03-10 | 엔지케이 인슐레이터 엘티디 | 구리 합금 및 그의 제조 방법 |
| WO2014115307A1 (ja) * | 2013-01-25 | 2014-07-31 | 三菱伸銅株式会社 | 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法 |
| KR102292610B1 (ko) * | 2013-04-23 | 2021-08-24 | 마테리온 코포레이션 | 고인성을 갖는 구리-니켈-주석 합금 |
| JP6445895B2 (ja) * | 2014-03-04 | 2018-12-26 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
| WO2016059707A1 (ja) * | 2014-10-16 | 2016-04-21 | 三菱電機株式会社 | Cu-Ni-Si合金及びその製造方法 |
| JP6085633B2 (ja) | 2015-03-30 | 2017-02-22 | Jx金属株式会社 | 銅合金板および、それを備えるプレス成形品 |
| CN105316523A (zh) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | 一种磨削机调节器用耐用电阻合金 |
| CN106101960A (zh) * | 2016-07-21 | 2016-11-09 | 瑞声科技(新加坡)有限公司 | 铜合金、应用所述铜合金的柔性电路板及微型发声器 |
| JP6440760B2 (ja) | 2017-03-21 | 2018-12-19 | Jx金属株式会社 | プレス加工後の寸法精度を改善した銅合金条 |
| CN110573635B (zh) * | 2017-04-26 | 2021-08-03 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
| JP6670277B2 (ja) | 2017-09-14 | 2020-03-18 | Jx金属株式会社 | 金型摩耗性に優れたCu−Ni−Si系銅合金 |
| CN113215439A (zh) * | 2021-04-16 | 2021-08-06 | 安徽绿能技术研究院有限公司 | 一种高强度铜合金板材及其生产工艺 |
| CN114293065A (zh) * | 2021-12-31 | 2022-04-08 | 镇江市镇特合金材料有限公司 | 一种具有高强度的铜合金板材 |
| CN116065053B (zh) * | 2023-04-03 | 2023-07-11 | 凯美龙精密铜板带(河南)有限公司 | 一种铜合金及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4594221A (en) | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
| JP3334157B2 (ja) * | 1992-03-30 | 2002-10-15 | 三菱伸銅株式会社 | スタンピング金型を摩耗させることの少ない銅合金条材 |
| JPH06184680A (ja) | 1992-12-21 | 1994-07-05 | Kobe Steel Ltd | 曲げ加工性が優れた銅合金 |
| JP3550233B2 (ja) * | 1995-10-09 | 2004-08-04 | 同和鉱業株式会社 | 高強度高導電性銅基合金の製造法 |
| JP3797736B2 (ja) * | 1997-02-10 | 2006-07-19 | 株式会社神戸製鋼所 | 剪断加工性に優れる高強度銅合金 |
| JPH10265874A (ja) * | 1997-03-25 | 1998-10-06 | Kobe Steel Ltd | 電気・電子部品用銅合金及びその製造方法 |
| JP2898627B2 (ja) * | 1997-03-27 | 1999-06-02 | 日鉱金属株式会社 | 銅合金箔 |
| JP4188440B2 (ja) * | 1997-10-17 | 2008-11-26 | 大豊工業株式会社 | 摺動特性及び被削性に優れた銅系焼結摺動材料 |
| JP3739214B2 (ja) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | 電子部品用銅合金板 |
| US6436206B1 (en) * | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| JP3383615B2 (ja) | 1999-08-05 | 2003-03-04 | 日鉱金属株式会社 | 電子材料用銅合金及びその製造方法 |
| JP4255330B2 (ja) * | 2003-07-31 | 2009-04-15 | 日鉱金属株式会社 | 疲労特性に優れたCu−Ni−Si系合金部材 |
| JP4664584B2 (ja) * | 2003-09-18 | 2011-04-06 | 株式会社神戸製鋼所 | 高強度銅合金板および高強度銅合金板の製造方法 |
| JP4020881B2 (ja) | 2004-04-13 | 2007-12-12 | 日鉱金属株式会社 | Cu−Ni−Si−Mg系銅合金条 |
| JP4100629B2 (ja) * | 2004-04-16 | 2008-06-11 | 日鉱金属株式会社 | 高強度高導電性銅合金 |
| JP4959141B2 (ja) * | 2005-02-28 | 2012-06-20 | Dowaホールディングス株式会社 | 高強度銅合金 |
-
2007
- 2007-09-11 JP JP2007236003A patent/JP4247922B2/ja active Active
- 2007-09-12 TW TW096134000A patent/TWI349714B/zh active
- 2007-09-12 CN CN2007800412673A patent/CN101535511B/zh not_active Expired - Fee Related
- 2007-09-12 KR KR1020097004769A patent/KR101027840B1/ko active Active
- 2007-09-12 WO PCT/JP2007/067730 patent/WO2008032738A1/ja not_active Ceased
- 2007-09-12 MY MYPI20090906A patent/MY144826A/en unknown
- 2007-09-12 US US12/310,910 patent/US7947133B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017010854A1 (de) | 2016-11-25 | 2018-05-30 | Fanuc Corporation | Spritzgieß-Verwaltungssystem |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090051077A (ko) | 2009-05-20 |
| US20090257909A1 (en) | 2009-10-15 |
| KR101027840B1 (ko) | 2011-04-07 |
| WO2008032738A1 (fr) | 2008-03-20 |
| MY144826A (en) | 2011-11-15 |
| TWI349714B (en) | 2011-10-01 |
| TW200821394A (en) | 2008-05-16 |
| JP2008095185A (ja) | 2008-04-24 |
| CN101535511B (zh) | 2011-09-21 |
| US7947133B2 (en) | 2011-05-24 |
| CN101535511A (zh) | 2009-09-16 |
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