JP4247922B2 - 電気・電子機器用銅合金板材およびその製造方法 - Google Patents

電気・電子機器用銅合金板材およびその製造方法 Download PDF

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Publication number
JP4247922B2
JP4247922B2 JP2007236003A JP2007236003A JP4247922B2 JP 4247922 B2 JP4247922 B2 JP 4247922B2 JP 2007236003 A JP2007236003 A JP 2007236003A JP 2007236003 A JP2007236003 A JP 2007236003A JP 4247922 B2 JP4247922 B2 JP 4247922B2
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Japan
Prior art keywords
copper alloy
compound
alloy sheet
mass
intermetallic compound
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JP2007236003A
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English (en)
Japanese (ja)
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JP2008095185A (ja
JP2008095185A5 (enExample
Inventor
邦照 三原
立彦 江口
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to JP2007236003A priority Critical patent/JP4247922B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to US12/310,910 priority patent/US7947133B2/en
Priority to PCT/JP2007/067730 priority patent/WO2008032738A1/ja
Priority to CN2007800412673A priority patent/CN101535511B/zh
Priority to TW096134000A priority patent/TWI349714B/zh
Priority to MYPI20090906A priority patent/MY144826A/en
Priority to KR1020097004769A priority patent/KR101027840B1/ko
Publication of JP2008095185A publication Critical patent/JP2008095185A/ja
Publication of JP2008095185A5 publication Critical patent/JP2008095185A5/ja
Application granted granted Critical
Publication of JP4247922B2 publication Critical patent/JP4247922B2/ja
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/10Alloys based on copper with silicon as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
JP2007236003A 2006-09-12 2007-09-11 電気・電子機器用銅合金板材およびその製造方法 Active JP4247922B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007236003A JP4247922B2 (ja) 2006-09-12 2007-09-11 電気・電子機器用銅合金板材およびその製造方法
PCT/JP2007/067730 WO2008032738A1 (fr) 2006-09-12 2007-09-12 Matériau de plaque en alliage de cuivre pour un équipement électrique/électronique et procédé pour produire celui-ci
CN2007800412673A CN101535511B (zh) 2006-09-12 2007-09-12 用于电气电子设备的铜合金板材及其制造方法
TW096134000A TWI349714B (en) 2006-09-12 2007-09-12 Copper alloy sheet material for electric and electronic instruments and method of producing the same
US12/310,910 US7947133B2 (en) 2006-09-12 2007-09-12 Copper alloy strip material for electrical/electronic equipment and process for producing the same
MYPI20090906A MY144826A (en) 2006-09-12 2007-09-12 Copper alloy strip material for electrical or electronic part and method for manufacturing the same
KR1020097004769A KR101027840B1 (ko) 2006-09-12 2007-09-12 전기ㆍ전자기기용 동합금 판재 및 그 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006246961 2006-09-12
JP2007236003A JP4247922B2 (ja) 2006-09-12 2007-09-11 電気・電子機器用銅合金板材およびその製造方法

Publications (3)

Publication Number Publication Date
JP2008095185A JP2008095185A (ja) 2008-04-24
JP2008095185A5 JP2008095185A5 (enExample) 2008-10-02
JP4247922B2 true JP4247922B2 (ja) 2009-04-02

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Family Applications (1)

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JP2007236003A Active JP4247922B2 (ja) 2006-09-12 2007-09-11 電気・電子機器用銅合金板材およびその製造方法

Country Status (7)

Country Link
US (1) US7947133B2 (enExample)
JP (1) JP4247922B2 (enExample)
KR (1) KR101027840B1 (enExample)
CN (1) CN101535511B (enExample)
MY (1) MY144826A (enExample)
TW (1) TWI349714B (enExample)
WO (1) WO2008032738A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017010854A1 (de) 2016-11-25 2018-05-30 Fanuc Corporation Spritzgieß-Verwaltungssystem

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JP5367999B2 (ja) * 2008-03-31 2013-12-11 Jx日鉱日石金属株式会社 電子材料用Cu−Ni−Si系合金
JP4837697B2 (ja) * 2008-03-31 2011-12-14 Jx日鉱日石金属株式会社 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法
JP5225787B2 (ja) * 2008-05-29 2013-07-03 Jx日鉱日石金属株式会社 電子材料用Cu−Ni−Si系合金板又は条
JP4615628B2 (ja) * 2008-10-22 2011-01-19 古河電気工業株式会社 銅合金材料、電気電子部品および銅合金材料の製造方法
KR101331339B1 (ko) 2008-12-01 2013-11-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Cu-Ni-Si-Co 계 구리 합금 및 그 제조 방법
CN102257170A (zh) * 2008-12-19 2011-11-23 古河电气工业株式会社 用于电气电子部件的铜合金材料及其制造方法
JP5604882B2 (ja) * 2009-03-10 2014-10-15 日立金属株式会社 半軟化温度の低い銅荒引線の製造方法、銅線の製造方法及び銅線
KR101419145B1 (ko) * 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 구리합금 판재, 이를 이용한 커넥터, 및 이를 제조하는 구리합금 판재의 제조방법
JP5654571B2 (ja) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 電子材料用Cu−Ni−Si系合金
JP4672804B1 (ja) 2010-05-31 2011-04-20 Jx日鉱日石金属株式会社 電子材料用Cu−Co−Si系銅合金及びその製造方法
JP4834781B1 (ja) 2010-08-24 2011-12-14 Jx日鉱日石金属株式会社 電子材料用Cu−Co−Si系合金
CN102021359B (zh) * 2010-11-03 2013-01-02 西安理工大学 高Ni、Si含量的Cu-Ni-Si合金的制备方法
JP5192536B2 (ja) * 2010-12-10 2013-05-08 三菱伸銅株式会社 深絞り加工性及び耐疲労特性に優れたCu−Ni−Si系銅合金板及びその製造方法
JP5522692B2 (ja) * 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Jx金属株式会社 電子材料用Cu−Ni−Si系合金、Cu−Co−Si系合金及びその製造方法
KR101715532B1 (ko) * 2012-07-26 2017-03-10 엔지케이 인슐레이터 엘티디 구리 합금 및 그의 제조 방법
WO2014115307A1 (ja) * 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
KR102292610B1 (ko) * 2013-04-23 2021-08-24 마테리온 코포레이션 고인성을 갖는 구리-니켈-주석 합금
JP6445895B2 (ja) * 2014-03-04 2018-12-26 Dowaメタルテック株式会社 Snめっき材およびその製造方法
WO2016059707A1 (ja) * 2014-10-16 2016-04-21 三菱電機株式会社 Cu-Ni-Si合金及びその製造方法
JP6085633B2 (ja) 2015-03-30 2017-02-22 Jx金属株式会社 銅合金板および、それを備えるプレス成形品
CN105316523A (zh) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 一种磨削机调节器用耐用电阻合金
CN106101960A (zh) * 2016-07-21 2016-11-09 瑞声科技(新加坡)有限公司 铜合金、应用所述铜合金的柔性电路板及微型发声器
JP6440760B2 (ja) 2017-03-21 2018-12-19 Jx金属株式会社 プレス加工後の寸法精度を改善した銅合金条
CN110573635B (zh) * 2017-04-26 2021-08-03 古河电气工业株式会社 铜合金板材及其制造方法
JP6670277B2 (ja) 2017-09-14 2020-03-18 Jx金属株式会社 金型摩耗性に優れたCu−Ni−Si系銅合金
CN113215439A (zh) * 2021-04-16 2021-08-06 安徽绿能技术研究院有限公司 一种高强度铜合金板材及其生产工艺
CN114293065A (zh) * 2021-12-31 2022-04-08 镇江市镇特合金材料有限公司 一种具有高强度的铜合金板材
CN116065053B (zh) * 2023-04-03 2023-07-11 凯美龙精密铜板带(河南)有限公司 一种铜合金及其制备方法

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JP3334157B2 (ja) * 1992-03-30 2002-10-15 三菱伸銅株式会社 スタンピング金型を摩耗させることの少ない銅合金条材
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JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたCu−Ni−Si系合金部材
JP4664584B2 (ja) * 2003-09-18 2011-04-06 株式会社神戸製鋼所 高強度銅合金板および高強度銅合金板の製造方法
JP4020881B2 (ja) 2004-04-13 2007-12-12 日鉱金属株式会社 Cu−Ni−Si−Mg系銅合金条
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017010854A1 (de) 2016-11-25 2018-05-30 Fanuc Corporation Spritzgieß-Verwaltungssystem

Also Published As

Publication number Publication date
KR20090051077A (ko) 2009-05-20
US20090257909A1 (en) 2009-10-15
KR101027840B1 (ko) 2011-04-07
WO2008032738A1 (fr) 2008-03-20
MY144826A (en) 2011-11-15
TWI349714B (en) 2011-10-01
TW200821394A (en) 2008-05-16
JP2008095185A (ja) 2008-04-24
CN101535511B (zh) 2011-09-21
US7947133B2 (en) 2011-05-24
CN101535511A (zh) 2009-09-16

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