KR101027840B1 - 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 - Google Patents

전기ㆍ전자기기용 동합금 판재 및 그 제조방법 Download PDF

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Publication number
KR101027840B1
KR101027840B1 KR1020097004769A KR20097004769A KR101027840B1 KR 101027840 B1 KR101027840 B1 KR 101027840B1 KR 1020097004769 A KR1020097004769 A KR 1020097004769A KR 20097004769 A KR20097004769 A KR 20097004769A KR 101027840 B1 KR101027840 B1 KR 101027840B1
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copper alloy
compound
alloy sheet
mass
intermetallic compound
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KR20090051077A (ko
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구니테루 미하라
다쓰히코 에구치
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후루카와 덴키 고교 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
KR1020097004769A 2006-09-12 2007-09-12 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 Active KR101027840B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006246961 2006-09-12
JPJP-P-2006-246961 2006-09-12
JP2007236003A JP4247922B2 (ja) 2006-09-12 2007-09-11 電気・電子機器用銅合金板材およびその製造方法
JPJP-P-2007-236003 2007-09-11

Publications (2)

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KR20090051077A KR20090051077A (ko) 2009-05-20
KR101027840B1 true KR101027840B1 (ko) 2011-04-07

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Country Status (7)

Country Link
US (1) US7947133B2 (enExample)
JP (1) JP4247922B2 (enExample)
KR (1) KR101027840B1 (enExample)
CN (1) CN101535511B (enExample)
MY (1) MY144826A (enExample)
TW (1) TWI349714B (enExample)
WO (1) WO2008032738A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200002779A (ko) * 2017-04-26 2020-01-08 후루카와 덴키 고교 가부시키가이샤 구리 합금 판재 및 그 제조 방법

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367999B2 (ja) * 2008-03-31 2013-12-11 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金
JP4837697B2 (ja) * 2008-03-31 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5225787B2 (ja) * 2008-05-29 2013-07-03 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条
JP4615628B2 (ja) * 2008-10-22 2011-01-19 古河電気工業株式会社 銅合金材料、電気電子部品および銅合金材料の製造方法
KR101331339B1 (ko) 2008-12-01 2013-11-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ 계 구리 합금 및 그 제조 방법
CN102257170A (zh) * 2008-12-19 2011-11-23 古河电气工业株式会社 用于电气电子部件的铜合金材料及其制造方法
JP5604882B2 (ja) * 2009-03-10 2014-10-15 日立金属株式会社 半軟化温度の低い銅荒引線の製造方法、銅線の製造方法及び銅線
KR101419145B1 (ko) * 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 구리합금 판재, 이를 이용한 커넥터, 및 이를 제조하는 구리합금 판재의 제조방법
JP5654571B2 (ja) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金
JP4672804B1 (ja) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4834781B1 (ja) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
CN102021359B (zh) * 2010-11-03 2013-01-02 西安理工大学 高Ni、Si含量的Cu-Ni-Si合金的制备方法
JP5192536B2 (ja) * 2010-12-10 2013-05-08 三菱伸銅株式会社 深絞り加工性及び耐疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP5522692B2 (ja) * 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
KR101715532B1 (ko) * 2012-07-26 2017-03-10 엔지케이 인슐레이터 엘티디 구리 합금 및 그의 제조 방법
WO2014115307A1 (ja) * 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
KR102292610B1 (ko) * 2013-04-23 2021-08-24 마테리온 코포레이션 고인성을 갖는 구리-니켈-주석 합금
JP6445895B2 (ja) * 2014-03-04 2018-12-26 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
WO2016059707A1 (ja) * 2014-10-16 2016-04-21 三菱電機株式会社 Ｃｕ－Ｎｉ－Ｓｉ合金及びその製造方法
JP6085633B2 (ja) 2015-03-30 2017-02-22 Ｊｘ金属株式会社 銅合金板および、それを備えるプレス成形品
CN105316523A (zh) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 一种磨削机调节器用耐用电阻合金
CN106101960A (zh) * 2016-07-21 2016-11-09 瑞声科技(新加坡)有限公司 铜合金、应用所述铜合金的柔性电路板及微型发声器
JP6342975B2 (ja) 2016-11-25 2018-06-13 ファナック株式会社 射出成形管理システム
JP6440760B2 (ja) 2017-03-21 2018-12-19 Ｊｘ金属株式会社 プレス加工後の寸法精度を改善した銅合金条
JP6670277B2 (ja) 2017-09-14 2020-03-18 Ｊｘ金属株式会社 金型摩耗性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
CN113215439A (zh) * 2021-04-16 2021-08-06 安徽绿能技术研究院有限公司 一种高强度铜合金板材及其生产工艺
CN114293065A (zh) * 2021-12-31 2022-04-08 镇江市镇特合金材料有限公司 一种具有高强度的铜合金板材
CN116065053B (zh) * 2023-04-03 2023-07-11 凯美龙精密铜板带（河南）有限公司 一种铜合金及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10219374A (ja) 1997-02-10 1998-08-18 Kobe Steel Ltd 剪断加工性に優れる高強度銅合金
JP2005307223A (ja) 2004-04-16 2005-11-04 Nikko Metal Manufacturing Co Ltd 高強度高導電性銅合金

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594221A (en) 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
JP3334157B2 (ja) * 1992-03-30 2002-10-15 三菱伸銅株式会社 スタンピング金型を摩耗させることの少ない銅合金条材
JPH06184680A (ja) 1992-12-21 1994-07-05 Kobe Steel Ltd 曲げ加工性が優れた銅合金
JP3550233B2 (ja) * 1995-10-09 2004-08-04 同和鉱業株式会社 高強度高導電性銅基合金の製造法
JPH10265874A (ja) * 1997-03-25 1998-10-06 Kobe Steel Ltd 電気・電子部品用銅合金及びその製造方法
JP2898627B2 (ja) * 1997-03-27 1999-06-02 日鉱金属株式会社 銅合金箔
JP4188440B2 (ja) * 1997-10-17 2008-11-26 大豊工業株式会社 摺動特性及び被削性に優れた銅系焼結摺動材料
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
US6436206B1 (en) * 1999-04-01 2002-08-20 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
JP3383615B2 (ja) 1999-08-05 2003-03-04 日鉱金属株式会社 電子材料用銅合金及びその製造方法
JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4664584B2 (ja) * 2003-09-18 2011-04-06 株式会社神戸製鋼所 高強度銅合金板および高強度銅合金板の製造方法
JP4020881B2 (ja) 2004-04-13 2007-12-12 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
JP4959141B2 (ja) * 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 高強度銅合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10219374A (ja) 1997-02-10 1998-08-18 Kobe Steel Ltd 剪断加工性に優れる高強度銅合金
JP2005307223A (ja) 2004-04-16 2005-11-04 Nikko Metal Manufacturing Co Ltd 高強度高導電性銅合金

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200002779A (ko) * 2017-04-26 2020-01-08 후루카와 덴키 고교 가부시키가이샤 구리 합금 판재 및 그 제조 방법
KR102499442B1 (ko) 2017-04-26 2023-02-13 후루카와 덴키 고교 가부시키가이샤 구리 합금 판재 및 그 제조 방법

Also Published As

Publication number Publication date
KR20090051077A (ko) 2009-05-20
US20090257909A1 (en) 2009-10-15
JP4247922B2 (ja) 2009-04-02
WO2008032738A1 (fr) 2008-03-20
MY144826A (en) 2011-11-15
TWI349714B (en) 2011-10-01
TW200821394A (en) 2008-05-16
JP2008095185A (ja) 2008-04-24
CN101535511B (zh) 2011-09-21
US7947133B2 (en) 2011-05-24
CN101535511A (zh) 2009-09-16

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