JP2015530030A - 汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ - Google Patents
汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ Download PDFInfo
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- JP2015530030A JP2015530030A JP2015526706A JP2015526706A JP2015530030A JP 2015530030 A JP2015530030 A JP 2015530030A JP 2015526706 A JP2015526706 A JP 2015526706A JP 2015526706 A JP2015526706 A JP 2015526706A JP 2015530030 A JP2015530030 A JP 2015530030A
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- Prior art keywords
- barrier
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- integrated circuit
- microphone assembly
- assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
- H04R1/086—Protective screens, e.g. all weather or wind screens
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
Description
本特許は、2012年8月10日に出願された「汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ」という名称の米国特許仮出願第61/681685号に対して合衆国法典第35編第119条(e)に基づく利益を主張するものであり、この仮特許出願の内容はその全体が引用により本明細書に組み入れられる。
103 空気経路
104 蓋部
106 ポート
108 微小電気機械システム(MEMS)装置
110 集積回路
112 バリア
116 導電パッド
118 バイア
152 第1の半田マスク
154 第1の金属層
156 第1のコア層
158 第2の金属層
160 誘電層
162 第3の金属層
164 第4の金属層
165 接着層
166 第2のコア層
167 接着層
168 第5の金属層
170 第2の半田マスク
Claims (24)
- カバーと、
前記カバーに結合された底部と、
前記底部上に配置された微小電気機械システム(MEMS)デバイスと、
前記底部内の開口部と、
を備え、前記MEMSデバイスは、前記開口部上に配置され、前記底部は、前記開口部全体に広がって音を通過させるバリアで構成され、前記底部の残り部分は、前記開口部全体に広がらない、
ことを特徴とするマイクアセンブリ。 - 前記バリアは、前記底部に埋め込まれる、
ことを特徴とする請求項1に記載のマイクアセンブリ。 - 前記MEMSデバイスに結合された集積回路をさらに備える、
ことを特徴とする請求項1に記載のマイクアセンブリ。 - 前記集積回路は、特定用途向け集積回路(ASIC)である、
ことを特徴とする請求項3に記載のマイクアセンブリ。 - 前記底部は、前記開口部と連通するキャビティを含み、前記バリアは、該キャビティ内に配置される、
ことを特徴とする請求項1に記載のマイクアセンブリ。 - 前記底部は、複数の材料層を含み、前記バリアは、該複数の材料層の1つを含む、
ことを特徴とする請求項1に記載のマイクアセンブリ。 - 前記バリアは、パターン化したフレックスプリント基板(PCB)を含む、
ことを特徴とする請求項1に記載のマイクアセンブリ。 - 前記パターン化したフレックスPCBは、ポリイミド薄膜を含む、
ことを特徴とする請求項7に記載のマイクアセンブリ。 - 前記バリアは、前記開口部を覆って前記底部の底面に結合される、
ことを特徴とする請求項1に記載のマイクアセンブリ。 - 前記底部は膜を含む、
ことを特徴とする請求項9に記載のマイクアセンブリ。 - カバーと、
前記カバーに取り付けられた底部と、
前記底部上に配置された微小電気機械システム(MEMS)デバイスと、
を備え、前記底部は、上方に前記MEMSデバイスが配置された第1の開口部と、チャネルと、前記アセンブリの外部と連通する第2の開口部とを含み、前記チャネルは、前記第1の開口部及び前記第2の開口部と連通して、前記アセンブリの外部から前記MEMSデバイスへの音響経路をもたらす、
ことを特徴とするマイクアセンブリ。 - 前記第1の開口部と前記第2の開口部は位置合わせされていない、
ことを特徴とする請求項11に記載のマイクアセンブリ。 - 前記第1の開口部と前記第2の開口部は位置合わせされる、
ことを特徴とする請求項11に記載のマイクアセンブリ。 - カバーと、
前記カバーに取り付けられた底部と、
前記底部上に配置された微小電気機械システム(MEMS)デバイスと、
を備え、前記底部は、上方に前記MEMSデバイスが配置された第1の開口部と、前記アセンブリの外部と連通する第2の開口部とを含み、前記チャネルは、前記第1の開口部及び前記第2の開口部と連通して、前記アセンブリの外部から前記MEMSデバイスへの音響経路をもたらし、前記第1の開口部は前記第2の開口部と位置合わせされ、前記アセンブリは、前記MEMSデバイス内の前記底部上に配置されたバリアをさらに備え、前記バリアは音を通過させる、
ことを特徴とするマイクアセンブリ。 - 前記バリアは、前記アセンブリの外部から前記MEMSデバイスに音が通り抜ける中空経路を含む、
ことを特徴とする請求項14に記載のマイクアセンブリ。 - 前記バリアに、前記MEMSデバイスと連通する第1のトレンチ、前記アセンブリの外部と連通する第2のトレンチ、並びに前記第1のトレンチ及び前記第2のトレンチと連通するチャネルが形成される、
ことを特徴とする請求項14に記載のアセンブリ。 - 前記バリアに、前記MEMSデバイスと連通する第1のトレンチ、及び前記アセンブリの外部と連通する第2のトレンチが形成され、前記第1のトレンチと前記第2のトレンチは互いに連通する、
ことを特徴とする請求項14に記載のアセンブリ。 - 前記バリアは固体片である、
ことを特徴とする請求項14に記載のアセンブリ。 - カバーと、
前記カバーに取り付けられた底部と、
前記底部上に配置された微小電気機械システム(MEMS)デバイスと、
を備え、前記カバーは、多孔性部分及び非多孔性部分を含み、前記多孔性部分は、音を通過させるが微粒子を通過させない、
ことを特徴とするマイクアセンブリ。 - 前記MEMSデバイスに結合された集積回路をさらに備える、
ことを特徴とする請求項19に記載のマイクアセンブリ。 - 前記集積回路は、特定用途向け集積回路(ASIC)である、
ことを特徴とする請求項19に記載のマイクアセンブリ。 - 前記カバーは金属を含む、
ことを特徴とする請求項19に記載のマイクアセンブリ。 - 前記多孔性部分は金属メッシュを含む、
ことを特徴とする請求項19に記載のマイクアセンブリ。 - 前記多孔性部分は、部分的溶融金属又は焼結金属を含む、
ことを特徴とする請求項19に記載のマイクアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201261681685P | 2012-08-10 | 2012-08-10 | |
US61/681,685 | 2012-08-10 | ||
PCT/US2013/054139 WO2014026002A1 (en) | 2012-08-10 | 2013-08-08 | Microphone assembly with barrier to prevent contaminant infiltration |
Publications (1)
Publication Number | Publication Date |
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JP2015530030A true JP2015530030A (ja) | 2015-10-08 |
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Family Applications (1)
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JP2015526706A Pending JP2015530030A (ja) | 2012-08-10 | 2013-08-08 | 汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ |
Country Status (6)
Country | Link |
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US (2) | US9078063B2 (ja) |
EP (1) | EP2883365A4 (ja) |
JP (1) | JP2015530030A (ja) |
KR (1) | KR20150042803A (ja) |
CN (2) | CN110312176B (ja) |
WO (1) | WO2014026002A1 (ja) |
Cited By (2)
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JP2019145934A (ja) * | 2018-02-19 | 2019-08-29 | 新日本無線株式会社 | Memsトランスデューサ装置及びその製造方法 |
WO2023074113A1 (ja) * | 2021-10-29 | 2023-05-04 | 株式会社村田製作所 | 音響デバイスおよびこれを備えるモジュール |
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Also Published As
Publication number | Publication date |
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CN104854880B (zh) | 2020-03-20 |
US9479854B2 (en) | 2016-10-25 |
CN110312176B (zh) | 2021-08-06 |
WO2014026002A1 (en) | 2014-02-13 |
KR20150042803A (ko) | 2015-04-21 |
US20150304753A1 (en) | 2015-10-22 |
CN110312176A (zh) | 2019-10-08 |
US20140044297A1 (en) | 2014-02-13 |
CN104854880A (zh) | 2015-08-19 |
US9078063B2 (en) | 2015-07-07 |
EP2883365A1 (en) | 2015-06-17 |
EP2883365A4 (en) | 2016-03-30 |
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