JP2014209625A - イメージセンサ用の2つ組又は4つ組のシリコンナノワイヤを備えるフルカラー単一ピクセル - Google Patents
イメージセンサ用の2つ組又は4つ組のシリコンナノワイヤを備えるフルカラー単一ピクセル Download PDFInfo
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 4
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 claims description 4
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035209—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
- H01L31/035227—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum wires, or nanorods
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Abstract
【解決手段】イメージセンサ100は、基板110及びその上にある一又は複数のピクセル150を備える。ピクセル150の各々は、異なる色の光への露出に敏感なナノワイヤ151a,152aを備えるサブピクセル151、152を有する。ナノワイヤは、自らが敏感な色の光りを電気信号に変換することができる。
【選択図】図1A
Description
本出願は、米国特許出願第12/204,686号(米国特許第7,646,943号)、第12/648,942号、第12/270,233号、第12/472,264号、第12/472,271号、第12/478,598号、第12/573,582号、第12/575,221号、第12/633,323号、第12/633,318号、第12/633,313号、第12/633,305号、第12/621,497号、第12/633,297号、第61/266,064号、第61/357,429号、第61/306,421号、第61/306,421号、第12/945,492号、第12/910,664号、第12/966,514号、第12/966,535号及び第12/966,573号に関連する。これらの特許出願の開示内容は、参照により全体として本明細書に組み込まれる。
が85度から90度の間にあることを意味する。本明細書における「ナノワイヤ」という語は、2次元方向における寸法が最大でも1000nmに制限されるが、残りの次元における寸法には制限がない構造を意味する。
はこれらの変化が含まれる。
て基板上に垂直に投影された面積を意味する。
実施例
図1Aは、一実施形態におけるイメージセンサの概略的な部分断面図を示す。イメージセンサ100は、基板110及び一又は複数のピクセル150を備える。少なくとも1つのピクセル150は、クラッド140及び当該クラッド140に埋め込まれた複数のサブピクセルを備える。図1Aにおいては、サブピクセル151及び152を例示している。サブピクセルの各々は、基板110から本質的に垂直に延びるナノワイヤ(例えば、サブ
ピクセル151内のナノワイヤ151a、及びサブピクセル152内のナノワイヤ152a)を備える。ピクセル間の空間は、好ましくは、物質160によって満たされている。各ピクセル150は、基板110とナノワイヤ151a及び152aとの間に、一又は複数のフォトダイオード120をさらに備えていてもよい。
物質260は、二酸化ケイ素等の任意の好適な物質を含む。物質260の屈折率は、好ましくは、クラッド240の屈折率よりも小さい。
々な直径及び/又は材料を有する。1つのピクセル250における各ナノワイヤは、同じピクセルの隣接するナノワイヤまで、好ましくは少なくとも100nm、好ましくは少なくとも200nmだけ離れている。クラッド240内のナノワイヤは、クラッド240内の任意の位置に配置することができる。ナノワイヤは、表面不動態化層を備えていてもよい。これらのナノワイヤは、水銀カドミウムテルル等の他の好適な物質を含んでもよい。これらのナノワイヤは、10nmから250nmの間の他の好適な半径を有していてもよい。
1つの具体例において、各ピクセル250は、3つのサブピクセル251、252及び253を備える。
ように、ピクセル250は、異なる向きを有し、入射光の方向の影響を減少させ又は除去する。
イメージを検出する方法は、レンズや鏡等の任意の好適な光学系を用いて当該イメージをセンサ100又は200に投影すること、好適な回路を用いて各ピクセル内の各サブピクセルにおけるナノワイヤからの電気信号を検知すること、各ピクセル内の当該サブピクセルからの電気信号に基づいて当該各ピクセルの色を計算すること、を含む。
Claims (20)
- 基板及びその上にある一又は複数のピクセルを備え、前記ピクセルの各々は、第1のサブピクセル及び第2のサブピクセルを備え、当該第1のサブピクセルは、第1のナノワイヤを備え、当該第2のサブピクセルは、第2のナノワイヤを備え、前記第1及び第2のナノワイヤは、前記基板に対して本質的に垂直に延び、前記ピクセルの各々は、一又は複数のフォトダイオードをさらに備える、イメージセンサ。
- 前記基板は、ケイ素、酸化ケイ素、窒化ケイ素、サファイア、ダイヤモンド、炭化ケイ素、窒化ガリウム、ゲルマニウム、インジウムガリウムヒ化物、硫化鉛、及び/又はこれらの混合物を含む、請求項1に記載のイメージセンサ。
- 前記イメージセンサの少なくとも1つのピクセルはクラッドを備え、前記第1のサブピクセル及び前記第2のサブピクセルが当該クラッドに埋め込まれる、請求項1に記載のイメージセンサ。
- 前記クラッドは可視光に対して実質的に透明である、請求項3に記載のイメージセンサ。
- 前記イメージセンサは、前記ピクセルの各々の上にカプラを備え、当該カプラは、凸状の表面を有し、衝突してきた可視光の実質的に全てを前記クラッドに集める、請求項3に記載のイメージセンサ。
- 前記第1のナノワイヤ及び前記第2のナノワイヤは、異なる吸収スペクトルを有する、請求項1に記載のイメージセンサ。
- 前記第1のナノワイヤ及び前記第2のナノワイヤの各々は、pn接合又はpin接合を有する請求項1に記載のイメージセンサ。
- 衝突してくる可視光の少なくとも50%を吸収するように動作する、請求項1に記載のイメージセンサ。
- 前記第1及び第2のナノワイヤによって生成された電気信号を検知するように動作する電子回路をさらに備える、請求項1に記載のイメージセンサ。
- 前記ピクセルは異なる方向を有する、請求項1に記載のイメージセンサ。
- ドライエッチング又はVLS成長法を行うイメージセンサの製造方法であって、前記イメージセンサは、基板及び前記基板上にある一又は複数のピクセルを備え、前記ピクセルの各々は、第1のサブピクセル及び第2のサブピクセルを備え、当該第1のサブピクセルは、第1のナノワイヤを備え、当該第2のサブピクセルは、第2のナノワイヤを備え、前記第1及び第2のナノワイヤは、前記基板に対して、本質的に垂直に延び、前記ピクセルの各々は、一又は複数のフォトダイオードをさらに備える、
イメージセンサの製造方法。 - 前記ピクセルの各々は、第3のサブピクセルを有し、当該第3のサブピクセルは、前記第1及び第2の波長とは異なる第3の波長への露出により電気信号を生成するように動作する第3のナノワイヤを備え、当該第3のナノワイヤは前記基板から本質的に垂直に延びている、請求項11に記載の方法。
- 前記ピクセルの各々は、第4のサブピクセルを有し、当該第4のサブピクセルは、前記第1、第2及び第3の波長とは異なる第4の波長への露出により電気信号を生成するように動作する第4のナノワイヤを備え、当該第4のナノワイヤは前記基板から本質的に垂直に延びている、請求項12に記載の方法。
- 前記フォトダイオードは、前記第1及び第2のナノワイヤの吸収スペクトルとは異なる吸収スペクトルを有する、請求項11に記載の方法。
- 赤外線が前記ピクセルに到達しないように動作する赤外線フィルタをさらに備える、請求項11に記載の方法。
- イメージセンサにイメージを投影し、前記イメージセンサは、基板及び前記基板上にある一又は複数のピクセルを備え、前記ピクセルの各々は、第1のサブピクセル及び第2のサブピクセルを備え、当該第1のサブピクセルは、第1のナノワイヤを備え、当該第2のサブピクセルは、第2のナノワイヤを備え、前記第1及び第2のナノワイヤは、前記基板に対して、本質的に垂直に延び、前記ピクセルの各々は、一又は複数のフォトダイオードをさらに備えており、
前記第1のナノワイヤ及び前記第2のナノワイヤからの電気信号を検出し、前記電気信号に基づいて当該各ピクセルの色を計算する、
イメージ検出方法。 - 前記第1のナノワイヤ及び/又は前記第2のナノワイヤは、その内部に又はその表面にトランジスタを備える、請求項16に記載の方法。
- 前記第1及び第2のナノワイヤは赤外光(IR)を吸収するように構成される、請求項16に記載の方法。
- 前記一又は複数のピクセルのうちの異なるピクセルが、空間的に隔離されたクラッドを備える、請求項16に記載の方法。
- 前記一又は複数のフォトダイオードが、前記基板と前記第1及び第2のナノワイヤの間に配置される、請求項16に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US12/967,880 | 2010-12-14 | ||
US12/967,880 US8748799B2 (en) | 2010-12-14 | 2010-12-14 | Full color single pixel including doublet or quadruplet si nanowires for image sensors |
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JP2013544690A Division JP5540161B2 (ja) | 2010-12-14 | 2011-12-13 | イメージセンサ用の2つ組又は4つ組のシリコンナノワイヤを備えるフルカラー単一ピクセル |
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Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8299472B2 (en) | 2009-12-08 | 2012-10-30 | Young-June Yu | Active pixel sensor with nanowire structured photodetectors |
US9343490B2 (en) | 2013-08-09 | 2016-05-17 | Zena Technologies, Inc. | Nanowire structured color filter arrays and fabrication method of the same |
US9406709B2 (en) | 2010-06-22 | 2016-08-02 | President And Fellows Of Harvard College | Methods for fabricating and using nanowires |
US8866065B2 (en) | 2010-12-13 | 2014-10-21 | Zena Technologies, Inc. | Nanowire arrays comprising fluorescent nanowires |
US9515218B2 (en) | 2008-09-04 | 2016-12-06 | Zena Technologies, Inc. | Vertical pillar structured photovoltaic devices with mirrors and optical claddings |
US9478685B2 (en) | 2014-06-23 | 2016-10-25 | Zena Technologies, Inc. | Vertical pillar structured infrared detector and fabrication method for the same |
US9299866B2 (en) | 2010-12-30 | 2016-03-29 | Zena Technologies, Inc. | Nanowire array based solar energy harvesting device |
US9000353B2 (en) | 2010-06-22 | 2015-04-07 | President And Fellows Of Harvard College | Light absorption and filtering properties of vertically oriented semiconductor nano wires |
US8748799B2 (en) * | 2010-12-14 | 2014-06-10 | Zena Technologies, Inc. | Full color single pixel including doublet or quadruplet si nanowires for image sensors |
US8274039B2 (en) | 2008-11-13 | 2012-09-25 | Zena Technologies, Inc. | Vertical waveguides with various functionality on integrated circuits |
US9800805B2 (en) * | 2011-02-02 | 2017-10-24 | The Boeing Company | Frequency selective imaging system |
CN104221149B (zh) * | 2012-03-28 | 2016-08-24 | 富士胶片株式会社 | 摄像元件以及摄像装置 |
US10603493B2 (en) | 2012-08-02 | 2020-03-31 | The Regents Of The University Of California | Integrated nanowire array devices for detecting and/or applying electrical signals to tissue |
CN104969000A (zh) * | 2012-08-13 | 2015-10-07 | 哈佛大学校长及研究员协会 | 使用硅纳米线的多光谱成像 |
US9112087B2 (en) * | 2012-09-16 | 2015-08-18 | Shalom Wretsberger | Waveguide-based energy converters, and energy conversion cells using same |
US9425341B2 (en) | 2012-10-08 | 2016-08-23 | Agency For Science, Technology And Research | P-I-N photodiode with dopant diffusion barrier layer |
FR3008546B1 (fr) * | 2013-07-12 | 2015-08-07 | Commissariat Energie Atomique | Photodetecteur semi-transparent a jonction p-n structuree |
JP2015065270A (ja) * | 2013-09-25 | 2015-04-09 | ソニー株式会社 | 固体撮像装置およびその製造方法、並びに電子機器 |
US10031260B2 (en) | 2013-12-19 | 2018-07-24 | 3M Innovative Properties Company | Object sensor |
EP3099081B1 (en) | 2015-05-28 | 2020-04-29 | Samsung Electronics Co., Ltd. | Display apparatus and control method thereof |
US10431624B2 (en) | 2015-07-08 | 2019-10-01 | Samsung Electronics Co., Ltd. | Method of manufacturing image sensor including nanostructure color filter |
KR101834049B1 (ko) * | 2015-12-29 | 2018-04-13 | 전자부품연구원 | 나노와이어를 이용한 이미지 센서 및 그의 제조방법 |
WO2020147580A1 (zh) * | 2019-01-18 | 2020-07-23 | 欧普照明股份有限公司 | 光源参数测量方法、装置、照明系统和终端设备 |
CN110061022B (zh) * | 2019-04-30 | 2021-04-13 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
CN110047861B (zh) * | 2019-04-30 | 2021-05-07 | 德淮半导体有限公司 | 图像传感器及其形成方法和操作方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004193527A (ja) * | 2002-12-13 | 2004-07-08 | Canon Inc | 半導体デバイスアレイ及びその製造方法 |
JP2005328135A (ja) * | 2004-05-12 | 2005-11-24 | Sony Corp | Ad変換方法および物理量分布検知の半導体装置 |
JP2007184566A (ja) * | 2005-12-06 | 2007-07-19 | Canon Inc | 半導体ナノワイヤを用いた半導体素子、それを用いた表示装置及び撮像装置 |
JP2007184560A (ja) * | 2006-01-05 | 2007-07-19 | Korea Advanced Inst Of Sci Technol | Cmosイメージセンサ及びその製造方法 |
JP2009236914A (ja) * | 2008-03-26 | 2009-10-15 | Samsung Electronics Co Ltd | 距離測定センサ及びそれを備えた立体カラーイメージセンサ |
US20100127153A1 (en) * | 2007-05-07 | 2010-05-27 | Nxp B.V. | Photosensitive device and a method of manufacturing a photosensitive device |
US20100193017A1 (en) * | 2007-07-12 | 2010-08-05 | Huth Gerald C | Solar photovoltaic structure comprising quantized interaction sensitive nanocells |
US20100308214A1 (en) * | 2009-06-04 | 2010-12-09 | Zena Technologies, Inc. | Array of nanowires in a single cavity with anti-reflective coating on substrate |
Family Cites Families (497)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1918848A (en) | 1929-04-26 | 1933-07-18 | Norwich Res Inc | Polarizing refracting bodies |
US3903427A (en) | 1973-12-28 | 1975-09-02 | Hughes Aircraft Co | Solar cell connections |
US4017332A (en) | 1975-02-27 | 1977-04-12 | Varian Associates | Solar cells employing stacked opposite conductivity layers |
US4292512A (en) | 1978-06-19 | 1981-09-29 | Bell Telephone Laboratories, Incorporated | Optical monitoring photodiode system |
US4357415A (en) | 1980-03-06 | 1982-11-02 | Eastman Kodak Company | Method of making a solid-state color imaging device having a color filter array using a photocrosslinkable barrier |
US4316048A (en) | 1980-06-20 | 1982-02-16 | International Business Machines Corporation | Energy conversion |
FR2495412A1 (fr) | 1980-12-02 | 1982-06-04 | Thomson Csf | Systeme de transmission d'informations a modulation directe de la lumiere a liaison optique a bande passante etendue vers les frequences basses et le continu |
US4394571A (en) | 1981-05-18 | 1983-07-19 | Honeywell Inc. | Optically enhanced Schottky barrier IR detector |
US4400221A (en) | 1981-07-08 | 1983-08-23 | The United States Of America As Represented By The Secretary Of The Air Force | Fabrication of gallium arsenide-germanium heteroface junction device |
US4387265A (en) | 1981-07-17 | 1983-06-07 | University Of Delaware | Tandem junction amorphous semiconductor photovoltaic cell |
US5696863A (en) | 1982-08-06 | 1997-12-09 | Kleinerman; Marcos Y. | Distributed fiber optic temperature sensors and systems |
US5247349A (en) | 1982-11-16 | 1993-09-21 | Stauffer Chemical Company | Passivation and insulation of III-V devices with pnictides, particularly amorphous pnictides having a layer-like structure |
US4531055A (en) | 1983-01-05 | 1985-07-23 | The United States Of America As Represented By The Secretary Of The Air Force | Self-guarding Schottky barrier infrared detector array |
US4678772A (en) | 1983-02-28 | 1987-07-07 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Compositions containing glycyrrhizin |
US4513168A (en) | 1984-04-19 | 1985-04-23 | Varian Associates, Inc. | Three-terminal solar cell circuit |
US4620237A (en) | 1984-10-22 | 1986-10-28 | Xerox Corporation | Fast scan jitter measuring system for raster scanners |
US4638484A (en) | 1984-11-20 | 1987-01-20 | Hughes Aircraft Company | Solid state laser employing diamond having color centers as a laser active material |
JPS61250605A (ja) | 1985-04-27 | 1986-11-07 | Power Reactor & Nuclear Fuel Dev Corp | 導光路付きイメ−ジフアイバ |
US4827335A (en) | 1986-08-29 | 1989-05-02 | Kabushiki Kaisha Toshiba | Color image reading apparatus with two color separation filters each having two filter elements |
EP0275063A3 (en) | 1987-01-12 | 1992-05-27 | Sumitomo Electric Industries Limited | Light emitting element comprising diamond and method for producing the same |
JPH0721562B2 (ja) | 1987-05-14 | 1995-03-08 | 凸版印刷株式会社 | カラ−フイルタ |
US4857973A (en) | 1987-05-14 | 1989-08-15 | The United States Of America As Represented By The Secretary Of The Air Force | Silicon waveguide with monolithically integrated Schottky barrier photodetector |
US4876586A (en) | 1987-12-21 | 1989-10-24 | Sangamo-Weston, Incorporated | Grooved Schottky barrier photodiode for infrared sensing |
US5071490A (en) | 1988-03-18 | 1991-12-10 | Sharp Kabushiki Kaisha | Tandem stacked amorphous solar cell device |
JPH0288498A (ja) | 1988-06-13 | 1990-03-28 | Sumitomo Electric Ind Ltd | ダイヤモンドレーザ結晶およびその作製方法 |
FR2633101B1 (fr) | 1988-06-16 | 1992-02-07 | Commissariat Energie Atomique | Photodiode et matrice de photodiodes sur hgcdte et leurs procedes de fabrication |
US5081049A (en) | 1988-07-18 | 1992-01-14 | Unisearch Limited | Sculpted solar cell surfaces |
US5311047A (en) | 1988-11-16 | 1994-05-10 | National Science Council | Amorphous SI/SIC heterojunction color-sensitive phototransistor |
US4990988A (en) | 1989-06-09 | 1991-02-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Laterally stacked Schottky diodes for infrared sensor applications |
US5124543A (en) | 1989-08-09 | 1992-06-23 | Ricoh Company, Ltd. | Light emitting element, image sensor and light receiving element with linearly varying waveguide index |
US5401968A (en) | 1989-12-29 | 1995-03-28 | Honeywell Inc. | Binary optical microlens detector array |
US4971928A (en) | 1990-01-16 | 1990-11-20 | General Motors Corporation | Method of making a light emitting semiconductor having a rear reflecting surface |
US5362972A (en) | 1990-04-20 | 1994-11-08 | Hitachi, Ltd. | Semiconductor device using whiskers |
JP2809826B2 (ja) | 1990-06-29 | 1998-10-15 | 三菱電機株式会社 | 半導体装置の製造方法 |
US5096520A (en) | 1990-08-01 | 1992-03-17 | Faris Sades M | Method for producing high efficiency polarizing filters |
GB9025837D0 (en) | 1990-11-28 | 1991-01-09 | De Beers Ind Diamond | Light emitting diamond device |
US5272518A (en) | 1990-12-17 | 1993-12-21 | Hewlett-Packard Company | Colorimeter and calibration system |
US5374841A (en) | 1991-12-18 | 1994-12-20 | Texas Instruments Incorporated | HgCdTe S-I-S two color infrared detector |
US5356488A (en) | 1991-12-27 | 1994-10-18 | Rudolf Hezel | Solar cell and method for its manufacture |
US5391896A (en) | 1992-09-02 | 1995-02-21 | Midwest Research Institute | Monolithic multi-color light emission/detection device |
SG50569A1 (en) | 1993-02-17 | 2001-02-20 | Rolic Ag | Optical component |
US5468652A (en) | 1993-07-14 | 1995-11-21 | Sandia Corporation | Method of making a back contacted solar cell |
US5471515A (en) | 1994-01-28 | 1995-11-28 | California Institute Of Technology | Active pixel sensor with intra-pixel charge transfer |
US5625210A (en) | 1995-04-13 | 1997-04-29 | Eastman Kodak Company | Active pixel sensor integrated with a pinned photodiode |
US5747796A (en) | 1995-07-13 | 1998-05-05 | Sharp Kabushiki Kaisha | Waveguide type compact optical scanner and manufacturing method thereof |
JP3079969B2 (ja) | 1995-09-14 | 2000-08-21 | 日本電気株式会社 | 完全密着型イメージセンサ及びその製造方法 |
US5767507A (en) | 1996-07-15 | 1998-06-16 | Trustees Of Boston University | Polarization sensitive photodetectors and detector arrays |
US5671914A (en) | 1995-11-06 | 1997-09-30 | Spire Corporation | Multi-band spectroscopic photodetector array |
US6033582A (en) | 1996-01-22 | 2000-03-07 | Etex Corporation | Surface modification of medical implants |
US5723945A (en) | 1996-04-09 | 1998-03-03 | Electro Plasma, Inc. | Flat-panel display |
US5853446A (en) | 1996-04-16 | 1998-12-29 | Corning Incorporated | Method for forming glass rib structures |
GB2312524A (en) | 1996-04-24 | 1997-10-29 | Northern Telecom Ltd | Planar optical waveguide cladding by PECVD method |
US6074892A (en) | 1996-05-07 | 2000-06-13 | Ciena Corporation | Semiconductor hetero-interface photodetector |
US5986297A (en) | 1996-05-22 | 1999-11-16 | Eastman Kodak Company | Color active pixel sensor with electronic shuttering, anti-blooming and low cross-talk |
US5612780A (en) | 1996-06-05 | 1997-03-18 | Harris Corporation | Device for detecting light emission from optical fiber |
US5943463A (en) | 1996-06-17 | 1999-08-24 | Sharp Kabushiki Kaisha | Color image sensor and a production method of an optical waveguide array for use therein |
JP2917920B2 (ja) | 1996-06-27 | 1999-07-12 | 日本電気株式会社 | 固体撮像装置およびその製造方法 |
AUPO281896A0 (en) | 1996-10-04 | 1996-10-31 | Unisearch Limited | Reactive ion etching of silica structures for integrated optics applications |
US6388648B1 (en) | 1996-11-05 | 2002-05-14 | Clarity Visual Systems, Inc. | Color gamut and luminance matching techniques for image display systems |
US5798535A (en) | 1996-12-20 | 1998-08-25 | Motorola, Inc. | Monolithic integration of complementary transistors and an LED array |
ES2184249T3 (es) | 1997-04-17 | 2003-04-01 | De Beers Ind Diamond | Procedimiento de sinterizado de diamantes y desarrollo de cristales de diamante. |
GB9710062D0 (en) | 1997-05-16 | 1997-07-09 | British Tech Group | Optical devices and methods of fabrication thereof |
US5968528A (en) | 1997-05-23 | 1999-10-19 | The Procter & Gamble Company | Skin care compositions |
US5857053A (en) | 1997-06-17 | 1999-01-05 | Lucent Technologies Inc. | Optical fiber filter |
US6013871A (en) | 1997-07-02 | 2000-01-11 | Curtin; Lawrence F. | Method of preparing a photovoltaic device |
US5900623A (en) | 1997-08-11 | 1999-05-04 | Chrontel, Inc. | Active pixel sensor using CMOS technology with reverse biased photodiodes |
US6046466A (en) | 1997-09-12 | 2000-04-04 | Nikon Corporation | Solid-state imaging device |
KR100250448B1 (ko) | 1997-11-06 | 2000-05-01 | 정선종 | 실리콘나이트라이드 막을 이용한 실리콘 나노 구조의형성 방법 |
US5880495A (en) | 1998-01-08 | 1999-03-09 | Omnivision Technologies, Inc. | Active pixel with a pinned photodiode |
EP1051752A2 (en) | 1998-02-02 | 2000-11-15 | Uniax Corporation | Image sensors made from organic semiconductors |
US6771314B1 (en) | 1998-03-31 | 2004-08-03 | Intel Corporation | Orange-green-blue (OGB) color system for digital image sensor applications |
US6301420B1 (en) | 1998-05-01 | 2001-10-09 | The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Multicore optical fibre |
TW417383B (en) | 1998-07-01 | 2001-01-01 | Cmos Sensor Inc | Silicon butting contact image sensor chip with line transfer and pixel readout (LTPR) structure |
US6463204B1 (en) | 1998-12-18 | 2002-10-08 | Fujitsu Network Communications, Inc. | Modular lightpipe system |
US6326649B1 (en) | 1999-01-13 | 2001-12-04 | Agere Systems, Inc. | Pin photodiode having a wide bandwidth |
AU3511400A (en) | 1999-03-01 | 2000-09-21 | Photobit Corporation | Active pixel sensor with fully-depleted buried photoreceptor |
GB2348399A (en) | 1999-03-31 | 2000-10-04 | Univ Glasgow | Reactive ion etching with control of etch gas flow rate, pressure and rf power |
JP4242510B2 (ja) | 1999-05-06 | 2009-03-25 | オリンパス株式会社 | 固体撮像素子およびその駆動方法 |
US20020071468A1 (en) | 1999-09-27 | 2002-06-13 | Sandstrom Richard L. | Injection seeded F2 laser with pre-injection filter |
JP3706527B2 (ja) | 1999-06-30 | 2005-10-12 | Hoya株式会社 | 電子線描画用マスクブランクス、電子線描画用マスクおよび電子線描画用マスクの製造方法 |
US6124167A (en) | 1999-08-06 | 2000-09-26 | Micron Technology, Inc. | Method for forming an etch mask during the manufacture of a semiconductor device |
US6407439B1 (en) | 1999-08-19 | 2002-06-18 | Epitaxial Technologies, Llc | Programmable multi-wavelength detector array |
US6805139B1 (en) | 1999-10-20 | 2004-10-19 | Mattson Technology, Inc. | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing |
US6465824B1 (en) | 2000-03-09 | 2002-10-15 | General Electric Company | Imager structure |
US6610351B2 (en) | 2000-04-12 | 2003-08-26 | Quantag Systems, Inc. | Raman-active taggants and their recognition |
US20020020846A1 (en) | 2000-04-20 | 2002-02-21 | Bo Pi | Backside illuminated photodiode array |
JP2002057359A (ja) | 2000-06-01 | 2002-02-22 | Sharp Corp | 積層型太陽電池 |
US7555333B2 (en) | 2000-06-19 | 2009-06-30 | University Of Washington | Integrated optical scanning image acquisition and display |
US7132668B2 (en) | 2000-06-26 | 2006-11-07 | University Of Maryland | MgZnO based UV detectors |
JP2004503799A (ja) | 2000-07-10 | 2004-02-05 | マサチューセッツ インスティテュート オブ テクノロジー | グレーデッドインデックス導波路 |
ATE342767T1 (de) | 2000-08-11 | 2006-11-15 | Bellataire Internat Llc | Hochdruck und hochtemperaturherstellung von diamanten |
US7301199B2 (en) | 2000-08-22 | 2007-11-27 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
KR100995457B1 (ko) | 2000-08-22 | 2010-11-18 | 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 | 나노센서 제조 방법 |
US20060175601A1 (en) | 2000-08-22 | 2006-08-10 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
US6542231B1 (en) | 2000-08-22 | 2003-04-01 | Thermo Finnegan Llc | Fiber-coupled liquid sample analyzer with liquid flow cell |
JP2002151715A (ja) | 2000-11-08 | 2002-05-24 | Sharp Corp | 薄膜太陽電池 |
US6800870B2 (en) | 2000-12-20 | 2004-10-05 | Michel Sayag | Light stimulating and collecting methods and apparatus for storage-phosphor image plates |
WO2002051130A1 (de) | 2000-12-21 | 2002-06-27 | Stmicroelectronics Nv | Bildensoreinrichtung mit zentralverschluss |
JP2002220300A (ja) | 2001-01-18 | 2002-08-09 | Vision Arts Kk | ナノファイバーおよびナノファイバーの作製方法 |
KR100831291B1 (ko) | 2001-01-31 | 2008-05-22 | 신에쯔 한도타이 가부시키가이샤 | 태양전지 및 태양전지의 제조방법 |
US6815736B2 (en) | 2001-02-09 | 2004-11-09 | Midwest Research Institute | Isoelectronic co-doping |
JP3809342B2 (ja) | 2001-02-13 | 2006-08-16 | 喜萬 中山 | 受発光プローブ及び受発光プローブ装置 |
EP1367819A1 (en) | 2001-02-28 | 2003-12-03 | Sony Corporation | Image input device |
JP2004532133A (ja) | 2001-03-30 | 2004-10-21 | ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・カリフォルニア | ナノ構造及びナノワイヤーの組立方法並びにそれらから組立てられた装置 |
US6563995B2 (en) | 2001-04-02 | 2003-05-13 | Lightwave Electronics | Optical wavelength filtering apparatus with depressed-index claddings |
US20040058407A1 (en) | 2001-04-10 | 2004-03-25 | Miller Scott E. | Reactor systems having a light-interacting component |
US20030006363A1 (en) | 2001-04-27 | 2003-01-09 | Campbell Scott Patrick | Optimization of alignment between elements in an image sensor |
US6709929B2 (en) | 2001-06-25 | 2004-03-23 | North Carolina State University | Methods of forming nano-scale electronic and optoelectronic devices using non-photolithographically defined nano-channel templates |
US6846565B2 (en) | 2001-07-02 | 2005-01-25 | Board Of Regents, The University Of Texas System | Light-emitting nanoparticles and method of making same |
US8816443B2 (en) | 2001-10-12 | 2014-08-26 | Quantum Semiconductor Llc | Method of fabricating heterojunction photodiodes with CMOS |
US7109517B2 (en) | 2001-11-16 | 2006-09-19 | Zaidi Saleem H | Method of making an enhanced optical absorption and radiation tolerance in thin-film solar cells and photodetectors |
FR2832995B1 (fr) | 2001-12-04 | 2004-02-27 | Thales Sa | Procede de croissance catalytique de nanotubes ou nanofibres comprenant une barriere de diffusion de type alliage nisi |
US6987258B2 (en) | 2001-12-19 | 2006-01-17 | Intel Corporation | Integrated circuit-based compound eye image sensor using a light pipe bundle |
US6720594B2 (en) | 2002-01-07 | 2004-04-13 | Xerox Corporation | Image sensor array with reduced pixel crosstalk |
US6566723B1 (en) | 2002-01-10 | 2003-05-20 | Agilent Technologies, Inc. | Digital color image sensor with elevated two-color photo-detector and related circuitry |
RU2317395C2 (ru) | 2002-01-14 | 2008-02-20 | Чайна Петролеум Энд Кемикал Корпорейшн | Приводимое в движение флюидом ударное устройство и его применение |
US7078296B2 (en) | 2002-01-16 | 2006-07-18 | Fairchild Semiconductor Corporation | Self-aligned trench MOSFETs and methods for making the same |
US7192533B2 (en) | 2002-03-28 | 2007-03-20 | Koninklijke Philips Electronics N.V. | Method of manufacturing nanowires and electronic device |
US20040026684A1 (en) | 2002-04-02 | 2004-02-12 | Nanosys, Inc. | Nanowire heterostructures for encoding information |
US20030189202A1 (en) | 2002-04-05 | 2003-10-09 | Jun Li | Nanowire devices and methods of fabrication |
US6852619B2 (en) | 2002-05-31 | 2005-02-08 | Sharp Kabushiki Kaisha | Dual damascene semiconductor devices |
US6660930B1 (en) | 2002-06-12 | 2003-12-09 | Rwe Schott Solar, Inc. | Solar cell modules with improved backskin |
US7311889B2 (en) | 2002-06-19 | 2007-12-25 | Fujitsu Limited | Carbon nanotubes, process for their production, and catalyst for production of carbon nanotubes |
US7253017B1 (en) | 2002-06-22 | 2007-08-07 | Nanosolar, Inc. | Molding technique for fabrication of optoelectronic devices |
DE60318848T2 (de) | 2002-06-25 | 2009-02-05 | Commissariat à l'Energie Atomique | Abbildungsvorrichtung |
US7335908B2 (en) | 2002-07-08 | 2008-02-26 | Qunano Ab | Nanostructures and methods for manufacturing the same |
US6794671B2 (en) | 2002-07-17 | 2004-09-21 | Particle Sizing Systems, Inc. | Sensors and methods for high-sensitivity optical particle counting and sizing |
WO2004010552A1 (en) | 2002-07-19 | 2004-01-29 | President And Fellows Of Harvard College | Nanoscale coherent optical components |
US6781171B2 (en) | 2002-07-19 | 2004-08-24 | Dongbu Electronics Co., Ltd. | Pinned photodiode for a CMOS image sensor and fabricating method thereof |
WO2004017125A1 (en) | 2002-08-19 | 2004-02-26 | Massachusetts Institute Of Technology | Method of efficient carrier generation in silicon waveguide systems for switching/modulating purposes using parallel pump signal waveguides |
US7068898B2 (en) | 2002-09-05 | 2006-06-27 | Nanosys, Inc. | Nanocomposites |
JP3672900B2 (ja) | 2002-09-11 | 2005-07-20 | 松下電器産業株式会社 | パターン形成方法 |
US8120079B2 (en) | 2002-09-19 | 2012-02-21 | Quantum Semiconductor Llc | Light-sensing device for multi-spectral imaging |
JP2004128060A (ja) | 2002-09-30 | 2004-04-22 | Canon Inc | シリコン膜の成長方法、太陽電池の製造方法、半導体基板及び太陽電池 |
US7067867B2 (en) | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
US7135728B2 (en) | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
US20040124366A1 (en) | 2002-10-02 | 2004-07-01 | Haishan Zeng | Apparatus and methods relating to high speed spectroscopy and excitation-emission matrices |
US7507293B2 (en) | 2002-10-28 | 2009-03-24 | Hewlett-Packard Development Company, L.P. | Photonic crystals with nanowire-based fabrication |
DE60333715D1 (de) | 2002-10-30 | 2010-09-23 | Hitachi Ltd | Verfahren zur Herstellung funktioneller Substrate, die kolumnare Mikrosäulen aufweisen |
GB0227261D0 (en) | 2002-11-21 | 2002-12-31 | Element Six Ltd | Optical quality diamond material |
US7163659B2 (en) | 2002-12-03 | 2007-01-16 | Hewlett-Packard Development Company, L.P. | Free-standing nanowire sensor and method for detecting an analyte in a fluid |
JP4723860B2 (ja) | 2002-12-09 | 2011-07-13 | クォンタム セミコンダクター リミテッド ライアビリティ カンパニー | Cmos画像センサー |
US6969897B2 (en) | 2002-12-10 | 2005-11-29 | Kim Ii John | Optoelectronic devices employing fibers for light collection and emission |
TWI236767B (en) | 2002-12-13 | 2005-07-21 | Sony Corp | Solid-state image pickup device and its manufacturing method |
US6837212B2 (en) | 2002-12-19 | 2005-01-04 | Caterpillar Inc. | Fuel allocation at idle or light engine load |
FR2850882B1 (fr) | 2003-02-11 | 2005-03-18 | Eurecat Sa | Passivation de catalyseur d'hydroconversion sulfure |
CA2419704A1 (en) | 2003-02-24 | 2004-08-24 | Ignis Innovation Inc. | Method of manufacturing a pixel with organic light-emitting diode |
JP4144378B2 (ja) | 2003-02-28 | 2008-09-03 | ソニー株式会社 | 画像処理装置および方法、記録媒体、並びにプログラム |
US7061028B2 (en) | 2003-03-12 | 2006-06-13 | Taiwan Semiconductor Manufacturing, Co., Ltd. | Image sensor device and method to form image sensor device |
US7050660B2 (en) | 2003-04-07 | 2006-05-23 | Eksigent Technologies Llc | Microfluidic detection device having reduced dispersion and method for making same |
US7388147B2 (en) | 2003-04-10 | 2008-06-17 | Sunpower Corporation | Metal contact structure for solar cell and method of manufacture |
US7339110B1 (en) | 2003-04-10 | 2008-03-04 | Sunpower Corporation | Solar cell and method of manufacture |
US6888974B2 (en) | 2003-04-23 | 2005-05-03 | Intel Corporation | On-chip optical signal routing |
US8212138B2 (en) | 2003-05-16 | 2012-07-03 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Reverse bias protected solar array with integrated bypass battery |
US7462774B2 (en) | 2003-05-21 | 2008-12-09 | Nanosolar, Inc. | Photovoltaic devices fabricated from insulating nanostructured template |
US7465661B2 (en) | 2003-05-28 | 2008-12-16 | The United States Of America As Represented By The Secretary Of The Navy | High aspect ratio microelectrode arrays |
WO2004113957A2 (en) | 2003-06-16 | 2004-12-29 | The Regents Of The University Of California | Apparatus for optical measurements on low-index non-solid materials based on arrow waveguides |
US7265037B2 (en) | 2003-06-20 | 2007-09-04 | The Regents Of The University Of California | Nanowire array and nanowire solar cells and methods for forming the same |
WO2005014784A2 (en) | 2003-06-20 | 2005-02-17 | Tumer Tumay O | System for molecular imaging |
US7416911B2 (en) | 2003-06-24 | 2008-08-26 | California Institute Of Technology | Electrochemical method for attaching molecular and biomolecular structures to semiconductor microstructures and nanostructures |
US7560750B2 (en) | 2003-06-26 | 2009-07-14 | Kyocera Corporation | Solar cell device |
US7170001B2 (en) | 2003-06-26 | 2007-01-30 | Advent Solar, Inc. | Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias |
US7649141B2 (en) | 2003-06-30 | 2010-01-19 | Advent Solar, Inc. | Emitter wrap-through back contact solar cells on thin silicon wafers |
TWI320235B (en) | 2003-06-30 | 2010-02-01 | Emitter wrap-through back contact solar cells on thin silicon wafers | |
US7148528B2 (en) | 2003-07-02 | 2006-12-12 | Micron Technology, Inc. | Pinned photodiode structure and method of formation |
US7335259B2 (en) | 2003-07-08 | 2008-02-26 | Brian A. Korgel | Growth of single crystal nanowires |
US6927432B2 (en) | 2003-08-13 | 2005-08-09 | Motorola, Inc. | Vertically integrated photosensor for CMOS imagers |
US7330404B2 (en) | 2003-10-10 | 2008-02-12 | Seagate Technology Llc | Near-field optical transducers for thermal assisted magnetic and optical data storage |
US6960526B1 (en) | 2003-10-10 | 2005-11-01 | The United States Of America As Represented By The Secretary Of The Army | Method of fabricating sub-100 nanometer field emitter tips comprising group III-nitride semiconductors |
US7019402B2 (en) | 2003-10-17 | 2006-03-28 | International Business Machines Corporation | Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor |
US7823783B2 (en) | 2003-10-24 | 2010-11-02 | Cognex Technology And Investment Corporation | Light pipe illumination system and method |
JP2005142268A (ja) | 2003-11-05 | 2005-06-02 | Canon Inc | 光起電力素子およびその製造方法 |
US20050116271A1 (en) | 2003-12-02 | 2005-06-02 | Yoshiaki Kato | Solid-state imaging device and manufacturing method thereof |
US6969899B2 (en) | 2003-12-08 | 2005-11-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor with light guides |
US7208094B2 (en) | 2003-12-17 | 2007-04-24 | Hewlett-Packard Development Company, L.P. | Methods of bridging lateral nanowires and device using same |
DE10360274A1 (de) | 2003-12-18 | 2005-06-02 | Tesa Ag | Optischer Datenspeicher |
WO2005064337A1 (en) | 2003-12-22 | 2005-07-14 | Koninklijke Philips Electronics N.V. | Optical nanowire biosensor based on energy transfer |
KR20060121225A (ko) | 2003-12-22 | 2006-11-28 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 반도체 나노와이어의 세트를 제조하는 방법, 전기 장치 및그 제조 방법, 광 유도 에칭을 위한 장치 |
KR20060135701A (ko) | 2003-12-23 | 2006-12-29 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 전기 소자 및 pn 이형 접합 형성 방법 |
EP1700336A1 (en) * | 2003-12-23 | 2006-09-13 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a heterojunction |
US7647695B2 (en) | 2003-12-30 | 2010-01-19 | Lockheed Martin Corporation | Method of matching harnesses of conductors with apertures in connectors |
TWI228782B (en) | 2004-01-19 | 2005-03-01 | Toppoly Optoelectronics Corp | Method of fabricating display panel |
US7052927B1 (en) | 2004-01-27 | 2006-05-30 | Raytheon Company | Pin detector apparatus and method of fabrication |
US6969568B2 (en) | 2004-01-28 | 2005-11-29 | Freescale Semiconductor, Inc. | Method for etching a quartz layer in a photoresistless semiconductor mask |
US6927145B1 (en) | 2004-02-02 | 2005-08-09 | Advanced Micro Devices, Inc. | Bitline hard mask spacer flow for memory cell scaling |
JP2005252210A (ja) | 2004-02-03 | 2005-09-15 | Sharp Corp | 太陽電池 |
US7254287B2 (en) | 2004-02-12 | 2007-08-07 | Panorama Labs, Pty Ltd. | Apparatus, method, and computer program product for transverse waveguided display system |
JP2005251804A (ja) | 2004-03-01 | 2005-09-15 | Canon Inc | 撮像素子 |
US7471428B2 (en) | 2004-03-12 | 2008-12-30 | Seiko Epson Corporation | Contact image sensor module and image reading device equipped with the same |
US7106938B2 (en) | 2004-03-16 | 2006-09-12 | Regents Of The University Of Minnesota | Self assembled three-dimensional photonic crystal |
EP1735844B1 (en) | 2004-03-18 | 2019-06-19 | Phoseon Technology, Inc. | Use of a high-density light emitting diode array comprising micro-reflectors for curing applications |
US7115971B2 (en) | 2004-03-23 | 2006-10-03 | Nanosys, Inc. | Nanowire varactor diode and methods of making same |
US7223641B2 (en) | 2004-03-26 | 2007-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing the same, liquid crystal television and EL television |
US7019391B2 (en) | 2004-04-06 | 2006-03-28 | Bao Tran | NANO IC packaging |
TWI244159B (en) | 2004-04-16 | 2005-11-21 | Ind Tech Res Inst | Metal nanoline process and its application on aligned growth of carbon nanotube or silicon nanowire |
US7061106B2 (en) | 2004-04-28 | 2006-06-13 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
CA2564220A1 (en) | 2004-04-30 | 2005-12-15 | Nanosys, Inc. | Systems and methods for nanowire growth and harvesting |
US8280214B2 (en) | 2004-05-13 | 2012-10-02 | The Regents Of The University Of California | Nanowires and nanoribbons as subwavelength optical waveguides and their use as components in photonic circuits and devices |
JP2008502151A (ja) | 2004-06-04 | 2008-01-24 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 印刷可能半導体素子を製造して組み立てるための方法及びデバイス |
JP2006013403A (ja) | 2004-06-29 | 2006-01-12 | Sanyo Electric Co Ltd | 太陽電池、太陽電池モジュール、その製造方法およびその修復方法 |
US8035142B2 (en) | 2004-07-08 | 2011-10-11 | Micron Technology, Inc. | Deuterated structures for image sensors and methods for forming the same |
US7427798B2 (en) | 2004-07-08 | 2008-09-23 | Micron Technology, Inc. | Photonic crystal-based lens elements for use in an image sensor |
FR2873492B1 (fr) | 2004-07-21 | 2006-11-24 | Commissariat Energie Atomique | Nanocomposite photoactif et son procede de fabrication |
JPWO2006013890A1 (ja) | 2004-08-04 | 2008-05-01 | 松下電器産業株式会社 | コヒーレント光源 |
US20060027071A1 (en) | 2004-08-06 | 2006-02-09 | Barnett Ronald J | Tensegrity musical structures |
US7713849B2 (en) | 2004-08-20 | 2010-05-11 | Illuminex Corporation | Metallic nanowire arrays and methods for making and using same |
US7285812B2 (en) | 2004-09-02 | 2007-10-23 | Micron Technology, Inc. | Vertical transistors |
KR101214780B1 (ko) | 2004-09-15 | 2012-12-21 | 인터젠엑스 인크. | 미세유동 장치 |
US20060071290A1 (en) | 2004-09-27 | 2006-04-06 | Rhodes Howard E | Photogate stack with nitride insulating cap over conductive layer |
EP1643565B1 (de) | 2004-09-30 | 2020-03-04 | OSRAM Opto Semiconductors GmbH | Strahlungsdetektor |
US20080260225A1 (en) | 2004-10-06 | 2008-10-23 | Harold Szu | Infrared Multi-Spectral Camera and Process of Using Infrared Multi-Spectral Camera |
US7544977B2 (en) | 2006-01-27 | 2009-06-09 | Hewlett-Packard Development Company, L.P. | Mixed-scale electronic interface |
US7208783B2 (en) | 2004-11-09 | 2007-04-24 | Micron Technology, Inc. | Optical enhancement of integrated circuit photodetectors |
KR100745595B1 (ko) | 2004-11-29 | 2007-08-02 | 삼성전자주식회사 | 이미지 센서의 마이크로 렌즈 및 그 형성 방법 |
US7306963B2 (en) | 2004-11-30 | 2007-12-11 | Spire Corporation | Precision synthesis of quantum dot nanostructures for fluorescent and optoelectronic devices |
US7193289B2 (en) | 2004-11-30 | 2007-03-20 | International Business Machines Corporation | Damascene copper wiring image sensor |
TWI263802B (en) | 2004-12-03 | 2006-10-11 | Innolux Display Corp | Color filter |
US7342268B2 (en) | 2004-12-23 | 2008-03-11 | International Business Machines Corporation | CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom |
US7235475B2 (en) | 2004-12-23 | 2007-06-26 | Hewlett-Packard Development Company, L.P. | Semiconductor nanowire fluid sensor and method for fabricating the same |
US7507595B2 (en) | 2004-12-30 | 2009-03-24 | Dongbu Electronics Co., Ltd. | CMOS image sensor and method for fabricating the same |
US7245370B2 (en) | 2005-01-06 | 2007-07-17 | Hewlett-Packard Development Company, L.P. | Nanowires for surface-enhanced Raman scattering molecular sensors |
US8115093B2 (en) | 2005-02-15 | 2012-02-14 | General Electric Company | Layer-to-layer interconnects for photoelectric devices and methods of fabricating the same |
JP2006261235A (ja) | 2005-03-15 | 2006-09-28 | Toshiba Corp | 半導体装置 |
KR100688542B1 (ko) | 2005-03-28 | 2007-03-02 | 삼성전자주식회사 | 수직형 나노튜브 반도체소자 및 그 제조방법 |
US7655860B2 (en) | 2005-04-01 | 2010-02-02 | North Carolina State University | Nano-structured photovoltaic solar cell and related methods |
US7326915B2 (en) | 2005-04-01 | 2008-02-05 | Em4, Inc. | Wavelength stabilization for broadband light sources |
US20070238265A1 (en) | 2005-04-05 | 2007-10-11 | Keiichi Kurashina | Plating apparatus and plating method |
KR101145146B1 (ko) | 2005-04-07 | 2012-05-14 | 엘지디스플레이 주식회사 | 박막트랜지스터와 그 제조방법 |
US7272287B2 (en) | 2005-05-11 | 2007-09-18 | Fitel Usa Corp | Optical fiber filter for suppression of amplified spontaneous emission |
US7230286B2 (en) | 2005-05-23 | 2007-06-12 | International Business Machines Corporation | Vertical FET with nanowire channels and a silicided bottom contact |
TWI429066B (zh) | 2005-06-02 | 2014-03-01 | Sony Corp | Semiconductor image sensor module and manufacturing method thereof |
GB0511300D0 (en) | 2005-06-03 | 2005-07-13 | Ct For Integrated Photonics Th | Control of vertical axis for passive alignment of optical components with wave guides |
US7262408B2 (en) | 2005-06-15 | 2007-08-28 | Board Of Trustees Of Michigan State University | Process and apparatus for modifying a surface in a work region |
US20090050204A1 (en) | 2007-08-03 | 2009-02-26 | Illuminex Corporation. | Photovoltaic device using nanostructured material |
JP4825982B2 (ja) | 2005-06-29 | 2011-11-30 | 国立大学法人 奈良先端科学技術大学院大学 | 固体撮像素子及びその信号読み出し方法 |
US8084728B2 (en) | 2005-07-06 | 2011-12-27 | Capella Microsystems, Corp. | Optical sensing device |
DE102005033455A1 (de) | 2005-07-18 | 2007-01-25 | GEMÜ Gebr. Müller Apparatebau GmbH & Co. KG | Antriebsvorrichtung zum linearen Bewegen von länglichen Körpern |
US8344238B2 (en) | 2005-07-19 | 2013-01-01 | Solyndra Llc | Self-cleaning protective coatings for use with photovoltaic cells |
EP1909121A1 (en) | 2005-07-22 | 2008-04-09 | Zeon Corporation | Grid polarizer and method for manufacturing same |
EP1748494B1 (en) * | 2005-07-29 | 2008-04-09 | Interuniversitair Microelektronica Centrum | Wavelength-sensitive detector with elongate nanostructures |
US7683407B2 (en) | 2005-08-01 | 2010-03-23 | Aptina Imaging Corporation | Structure and method for building a light tunnel for use with imaging devices |
US7307327B2 (en) | 2005-08-04 | 2007-12-11 | Micron Technology, Inc. | Reduced crosstalk CMOS image sensors |
KR100750933B1 (ko) | 2005-08-14 | 2007-08-22 | 삼성전자주식회사 | 희토류 금속이 도핑된 투명 전도성 아연산화물의나노구조를 사용한 탑에미트형 질화물계 백색광 발광소자및 그 제조방법 |
US7485908B2 (en) | 2005-08-18 | 2009-02-03 | United States Of America As Represented By The Secretary Of The Air Force | Insulated gate silicon nanowire transistor and method of manufacture |
US7847180B2 (en) | 2005-08-22 | 2010-12-07 | Q1 Nanosystems, Inc. | Nanostructure and photovoltaic cell implementing same |
US7265328B2 (en) | 2005-08-22 | 2007-09-04 | Micron Technology, Inc. | Method and apparatus providing an optical guide for an imager pixel having a ring of air-filled spaced slots around a photosensor |
US7623746B2 (en) | 2005-08-24 | 2009-11-24 | The Trustees Of Boston College | Nanoscale optical microscope |
JP2009506546A (ja) | 2005-08-24 | 2009-02-12 | ザ トラスティーズ オブ ボストン カレッジ | ナノスケール共金属構造を用いた太陽エネルギー変換のための装置および方法 |
WO2007025023A2 (en) | 2005-08-24 | 2007-03-01 | The Trustees Of Boston College | Apparatus and methods for optical switching using nanoscale optics |
US7736954B2 (en) | 2005-08-26 | 2010-06-15 | Sematech, Inc. | Methods for nanoscale feature imprint molding |
US20070052050A1 (en) | 2005-09-07 | 2007-03-08 | Bart Dierickx | Backside thinned image sensor with integrated lens stack |
JP5452922B2 (ja) | 2005-09-13 | 2014-03-26 | アフィメトリックス・インコーポレーテッド | コード化されたマイクロ粒子 |
US7608823B2 (en) | 2005-10-03 | 2009-10-27 | Teledyne Scientific & Imaging, Llc | Multimode focal plane array with electrically isolated commons for independent sub-array biasing |
US8133637B2 (en) | 2005-10-06 | 2012-03-13 | Headwaters Technology Innovation, Llc | Fuel cells and fuel cell catalysts incorporating a nanoring support |
US7286740B2 (en) | 2005-10-07 | 2007-10-23 | Sumitomo Electric Industries, Ltd. | Optical fiber, optical transmission line, optical module and optical transmission system |
US7585474B2 (en) | 2005-10-13 | 2009-09-08 | The Research Foundation Of State University Of New York | Ternary oxide nanostructures and methods of making same |
CN1956223A (zh) | 2005-10-26 | 2007-05-02 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
WO2007056753A2 (en) | 2005-11-08 | 2007-05-18 | General Atomics | Apparatus and methods for use in flash detection |
US20070104441A1 (en) | 2005-11-08 | 2007-05-10 | Massachusetts Institute Of Technology | Laterally-integrated waveguide photodetector apparatus and related coupling methods |
JP2007134562A (ja) | 2005-11-11 | 2007-05-31 | Sharp Corp | 固体撮像装置およびそれの製造方法 |
US7728277B2 (en) | 2005-11-16 | 2010-06-01 | Eastman Kodak Company | PMOS pixel structure with low cross talk for active pixel image sensors |
US20070107773A1 (en) | 2005-11-17 | 2007-05-17 | Palo Alto Research Center Incorporated | Bifacial cell with extruded gridline metallization |
US7960251B2 (en) * | 2005-12-01 | 2011-06-14 | Samsung Electronics Co., Ltd. | Method for producing nanowires using a porous template |
US7262400B2 (en) | 2005-12-02 | 2007-08-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor device having an active layer overlying a substrate and an isolating region in the active layer |
WO2007067257A2 (en) | 2005-12-02 | 2007-06-14 | Vanderbilt University | Broad-emission nanocrystals and methods of making and using same |
JP2007158119A (ja) | 2005-12-06 | 2007-06-21 | Canon Inc | ナノワイヤを有する電気素子およびその製造方法並びに電気素子集合体 |
US7439560B2 (en) | 2005-12-06 | 2008-10-21 | Canon Kabushiki Kaisha | Semiconductor device using semiconductor nanowire and display apparatus and image pick-up apparatus using the same |
US7524694B2 (en) | 2005-12-16 | 2009-04-28 | International Business Machines Corporation | Funneled light pipe for pixel sensors |
JP4745816B2 (ja) | 2005-12-20 | 2011-08-10 | 富士通セミコンダクター株式会社 | 画像処理回路及び画像処理方法 |
US20070155025A1 (en) | 2006-01-04 | 2007-07-05 | Anping Zhang | Nanowire structures and devices for use in large-area electronics and methods of making the same |
US7368779B2 (en) | 2006-01-04 | 2008-05-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Hemi-spherical structure and method for fabricating the same |
JP4952227B2 (ja) | 2006-01-06 | 2012-06-13 | 富士通株式会社 | 微粒子サイズ選別装置 |
US20070290193A1 (en) | 2006-01-18 | 2007-12-20 | The Board Of Trustees Of The University Of Illinois | Field effect transistor devices and methods |
JP2007226935A (ja) | 2006-01-24 | 2007-09-06 | Sony Corp | 音響再生装置、音響再生方法および音響再生プログラム |
JP2007201091A (ja) | 2006-01-25 | 2007-08-09 | Fujifilm Corp | 固体撮像素子の製造方法 |
US20070187787A1 (en) | 2006-02-16 | 2007-08-16 | Ackerson Kristin M | Pixel sensor structure including light pipe and method for fabrication thereof |
US7358583B2 (en) | 2006-02-24 | 2008-04-15 | Tower Semiconductor Ltd. | Via wave guide with curved light concentrator for image sensing devices |
CA2643439C (en) | 2006-03-10 | 2015-09-08 | Stc.Unm | Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices |
TW200742425A (en) | 2006-03-24 | 2007-11-01 | Matsushita Electric Ind Co Ltd | Solid-state image pickup device |
US7718347B2 (en) | 2006-03-31 | 2010-05-18 | Applied Materials, Inc. | Method for making an improved thin film solar cell interconnect using etch and deposition process |
US20070246689A1 (en) | 2006-04-11 | 2007-10-25 | Jiaxin Ge | Transparent thin polythiophene films having improved conduction through use of nanomaterials |
KR20070101917A (ko) | 2006-04-12 | 2007-10-18 | 엘지전자 주식회사 | 박막형 태양전지와 그의 제조방법 |
US7566875B2 (en) | 2006-04-13 | 2009-07-28 | Integrated Micro Sensors Inc. | Single-chip monolithic dual-band visible- or solar-blind photodetector |
US7381966B2 (en) | 2006-04-13 | 2008-06-03 | Integrated Micro Sensors, Inc. | Single-chip monolithic dual-band visible- or solar-blind photodetector |
EP2016620A2 (en) | 2006-04-17 | 2009-01-21 | Omnivision Cdm Optics, Inc. | Arrayed imaging systems and associated methods |
US7582857B2 (en) | 2006-04-18 | 2009-09-01 | The Trustees Of The University Of Pennsylvania | Sensor and polarimetric filters for real-time extraction of polarimetric information at the focal plane |
TWI297223B (en) | 2006-04-25 | 2008-05-21 | Gigno Technology Co Ltd | Package module of light emitting diode |
US7924413B2 (en) | 2006-04-28 | 2011-04-12 | Hewlett-Packard Development Company, L.P. | Nanowire-based photonic devices |
US20070272828A1 (en) | 2006-05-24 | 2007-11-29 | Micron Technology, Inc. | Method and apparatus providing dark current reduction in an active pixel sensor |
JP5060740B2 (ja) | 2006-05-26 | 2012-10-31 | シャープ株式会社 | 集積回路装置およびその製造方法、ならびに表示装置 |
WO2008057629A2 (en) | 2006-06-05 | 2008-05-15 | The Board Of Trustees Of The University Of Illinois | Photovoltaic and photosensing devices based on arrays of aligned nanostructures |
US7696964B2 (en) | 2006-06-09 | 2010-04-13 | Philips Lumileds Lighting Company, Llc | LED backlight for LCD with color uniformity recalibration over lifetime |
US7718995B2 (en) | 2006-06-20 | 2010-05-18 | Panasonic Corporation | Nanowire, method for fabricating the same, and device having nanowires |
US7579593B2 (en) | 2006-07-25 | 2009-08-25 | Panasonic Corporation | Night-vision imaging apparatus, control method of the same, and headlight module |
TWI305047B (en) | 2006-08-11 | 2009-01-01 | United Microelectronics Corp | Image sensor and the method for manufacturing the same |
JP2008072090A (ja) | 2006-08-14 | 2008-03-27 | Fujifilm Corp | 光電変換素子及び固体撮像素子 |
US20080044984A1 (en) | 2006-08-16 | 2008-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods of avoiding wafer breakage during manufacture of backside illuminated image sensors |
US7786376B2 (en) | 2006-08-22 | 2010-08-31 | Solexel, Inc. | High efficiency solar cells and manufacturing methods |
US7893348B2 (en) | 2006-08-25 | 2011-02-22 | General Electric Company | Nanowires in thin-film silicon solar cells |
JP4321568B2 (ja) | 2006-08-29 | 2009-08-26 | ソニー株式会社 | 固体撮像装置および撮像装置 |
JP2008066497A (ja) | 2006-09-07 | 2008-03-21 | Sony Corp | 受光装置および受光装置の製造方法 |
CN101140637A (zh) | 2006-09-08 | 2008-03-12 | 鸿富锦精密工业(深圳)有限公司 | 电子订单转工单的系统及方法 |
KR20090075819A (ko) | 2006-09-19 | 2009-07-09 | 큐나노 에이비 | 나노스케일 전계 효과 트랜지스터의 조립체 |
US7361989B1 (en) | 2006-09-26 | 2008-04-22 | International Business Machines Corporation | Stacked imager package |
JP4296193B2 (ja) | 2006-09-29 | 2009-07-15 | 株式会社東芝 | 光デバイス |
KR100772114B1 (ko) | 2006-09-29 | 2007-11-01 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
JP5116277B2 (ja) | 2006-09-29 | 2013-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置、液晶表示装置、表示モジュール及び電子機器 |
US7525170B2 (en) | 2006-10-04 | 2009-04-28 | International Business Machines Corporation | Pillar P-i-n semiconductor diodes |
TW200837403A (en) | 2006-10-12 | 2008-09-16 | Cambrios Technologies Corp | Functional films formed by highly oriented deposition of nanowires |
US8094247B2 (en) * | 2006-10-12 | 2012-01-10 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
US7427525B2 (en) | 2006-10-13 | 2008-09-23 | Hewlett-Packard Development Company, L.P. | Methods for coupling diamond structures to photonic devices |
US7608905B2 (en) | 2006-10-17 | 2009-10-27 | Hewlett-Packard Development Company, L.P. | Independently addressable interdigitated nanowires |
US7888159B2 (en) | 2006-10-26 | 2011-02-15 | Omnivision Technologies, Inc. | Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating |
US7537951B2 (en) | 2006-11-15 | 2009-05-26 | International Business Machines Corporation | Image sensor including spatially different active and dark pixel interconnect patterns |
US7781781B2 (en) | 2006-11-17 | 2010-08-24 | International Business Machines Corporation | CMOS imager array with recessed dielectric |
EP1926211A3 (en) | 2006-11-21 | 2013-08-14 | Imec | Diamond enhanced thickness shear mode resonator |
KR100923165B1 (ko) | 2006-12-04 | 2009-10-23 | 한국전자통신연구원 | 부양형 나노선 센서 및 그 제조 방법 |
US20080128760A1 (en) | 2006-12-04 | 2008-06-05 | Electronics And Telecommunications Research Institute | Schottky barrier nanowire field effect transistor and method for fabricating the same |
KR101232179B1 (ko) | 2006-12-04 | 2013-02-12 | 엘지디스플레이 주식회사 | 박막 패턴의 제조장치 및 방법 |
KR100993056B1 (ko) | 2006-12-05 | 2010-11-08 | 주식회사 엘지화학 | 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판 |
JP4795214B2 (ja) | 2006-12-07 | 2011-10-19 | チェイル インダストリーズ インコーポレイテッド | ワイヤーグリッド偏光子及びその製造方法 |
US8183587B2 (en) | 2006-12-22 | 2012-05-22 | Qunano Ab | LED with upstanding nanowire structure and method of producing such |
US8049203B2 (en) | 2006-12-22 | 2011-11-01 | Qunano Ab | Nanoelectronic structure and method of producing such |
CN102255018B (zh) | 2006-12-22 | 2013-06-19 | 昆南诺股份有限公司 | 带有直立式纳米线结构的led及其制作方法 |
JP5470852B2 (ja) | 2007-01-10 | 2014-04-16 | 日本電気株式会社 | 光制御素子 |
KR100830587B1 (ko) | 2007-01-10 | 2008-05-21 | 삼성전자주식회사 | 이미지 센서 및 이를 이용한 이미지 표시 방법 |
US8003883B2 (en) | 2007-01-11 | 2011-08-23 | General Electric Company | Nanowall solar cells and optoelectronic devices |
US7977568B2 (en) | 2007-01-11 | 2011-07-12 | General Electric Company | Multilayered film-nanowire composite, bifacial, and tandem solar cells |
KR20090117881A (ko) | 2007-01-30 | 2009-11-13 | 솔라스타, 인코포레이티드 | 광전지 및 광전지를 제조하는 방법 |
US20090104160A1 (en) | 2007-02-01 | 2009-04-23 | Moraga Biotechnology Corporation | Mobilization of Stem Cells After Trauma and Methods Therefor |
US7960807B2 (en) | 2007-02-09 | 2011-06-14 | Intersil Americas Inc. | Ambient light detectors using conventional CMOS image sensor process |
KR20080079058A (ko) | 2007-02-26 | 2008-08-29 | 엘지전자 주식회사 | 박막형 태양전지 모듈과 그의 제조방법 |
WO2008143727A2 (en) | 2007-02-27 | 2008-11-27 | The Regents Of The University Of California | Nanowire photodetector and image sensor with internal gain |
US8110883B2 (en) | 2007-03-12 | 2012-02-07 | Nantero Inc. | Electromagnetic and thermal sensors using carbon nanotubes and methods of making same |
EP1971129A1 (en) | 2007-03-16 | 2008-09-17 | STMicroelectronics (Research & Development) Limited | Improvements in or relating to image sensors |
US20080233280A1 (en) | 2007-03-22 | 2008-09-25 | Graciela Beatriz Blanchet | Method to form a pattern of functional material on a substrate by treating a surface of a stamp |
SE532485C2 (sv) | 2007-03-27 | 2010-02-02 | Qunano Ab | Nanostruktur för laddningslagring |
US7906778B2 (en) | 2007-04-02 | 2011-03-15 | Hewlett-Packard Development Company, L.P. | Methods of making nano-scale structures having controlled size, nanowire structures and methods of making the nanowire structures |
US7803698B2 (en) | 2007-04-09 | 2010-09-28 | Hewlett-Packard Development Company, L.P. | Methods for controlling catalyst nanoparticle positioning and apparatus for growing a nanowire |
US8027086B2 (en) | 2007-04-10 | 2011-09-27 | The Regents Of The University Of Michigan | Roll to roll nanoimprint lithography |
US7652280B2 (en) | 2007-04-11 | 2010-01-26 | General Electric Company | Light-emitting device and article |
CN102017147B (zh) | 2007-04-18 | 2014-01-29 | 因维萨热技术公司 | 用于光电装置的材料、系统和方法 |
WO2008129010A2 (en) | 2007-04-19 | 2008-10-30 | Oc Oerlikon Balzers Ag | Test equipment for automated quality control of thin film solar modules |
US7719688B2 (en) | 2007-04-24 | 2010-05-18 | Hewlett-Packard Development Company, L.P. | Optical device and method of making the same |
US7719678B2 (en) | 2007-04-25 | 2010-05-18 | Hewlett-Packard Development Company, L.P. | Nanowire configured to couple electromagnetic radiation to selected guided wave, devices using same, and methods of fabricating same |
US8212235B2 (en) | 2007-04-25 | 2012-07-03 | Hewlett-Packard Development Company, L.P. | Nanowire-based opto-electronic device |
TW200915551A (en) | 2007-05-10 | 2009-04-01 | Koninkl Philips Electronics Nv | Spectrum detector and manufacturing method therefore |
JP2008288243A (ja) | 2007-05-15 | 2008-11-27 | Sony Corp | 固体撮像装置とその製造方法および撮像装置 |
KR100901236B1 (ko) | 2007-05-16 | 2009-06-08 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
KR101426941B1 (ko) | 2007-05-30 | 2014-08-06 | 주성엔지니어링(주) | 태양전지 및 그의 제조방법 |
US7812692B2 (en) | 2007-06-01 | 2010-10-12 | Georgia Tech Research Corporation | Piezo-on-diamond resonators and resonator systems |
EP2040477B1 (en) | 2007-06-15 | 2018-08-29 | Panasonic Intellectual Property Management Co., Ltd. | Image processing device |
CN101803035B (zh) | 2007-06-19 | 2016-08-24 | 昆南诺股份有限公司 | 基于纳米线的太阳能电池结构 |
US7736979B2 (en) | 2007-06-20 | 2010-06-15 | New Jersey Institute Of Technology | Method of forming nanotube vertical field effect transistor |
US7663202B2 (en) | 2007-06-26 | 2010-02-16 | Hewlett-Packard Development Company, L.P. | Nanowire photodiodes and methods of making nanowire photodiodes |
US7586077B2 (en) | 2007-07-18 | 2009-09-08 | Mesa Imaging Ag | Reference pixel array with varying sensitivities for time of flight (TOF) sensor |
EP2171761A4 (en) | 2007-07-19 | 2011-11-02 | California Inst Of Techn | STRUCTURES OF ORDERED NETWORKS OF SEMICONDUCTORS |
US8154127B1 (en) | 2007-07-30 | 2012-04-10 | Hewlett-Packard Development Company, L.P. | Optical device and method of making the same |
WO2009015414A1 (en) | 2007-08-01 | 2009-02-05 | Silverbrook Research Pty Ltd | Two dimensional contact image sensor with backlighting |
JP5285880B2 (ja) | 2007-08-31 | 2013-09-11 | シャープ株式会社 | 光電変換素子、光電変換素子接続体および光電変換モジュール |
WO2009030980A2 (en) | 2007-09-06 | 2009-03-12 | Quantum Semiconductor Llc | Photonic via waveguide for pixel arrays |
US7786440B2 (en) | 2007-09-13 | 2010-08-31 | Honeywell International Inc. | Nanowire multispectral imaging array |
US7623560B2 (en) | 2007-09-27 | 2009-11-24 | Ostendo Technologies, Inc. | Quantum photonic imagers and methods of fabrication thereof |
US8619168B2 (en) | 2007-09-28 | 2013-12-31 | Regents Of The University Of Minnesota | Image sensor with high dynamic range imaging and integrated motion detection |
US7790495B2 (en) | 2007-10-26 | 2010-09-07 | International Business Machines Corporation | Optoelectronic device with germanium photodetector |
WO2009060808A1 (en) | 2007-11-09 | 2009-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
KR20090048920A (ko) | 2007-11-12 | 2009-05-15 | 삼성전자주식회사 | 카메라 모듈 및 이를 구비한 전자 기기 |
FR2923602B1 (fr) | 2007-11-12 | 2009-11-20 | Commissariat Energie Atomique | Detecteur de rayonnement electromagnetique a thermometre a nanofil et procede de realisation |
FR2923651A1 (fr) | 2007-11-13 | 2009-05-15 | Commissariat Energie Atomique | Procede de realisation d'une jonction pn dans un nanofil, et d'un nanofil avec au moins une jonction pn. |
US7822300B2 (en) | 2007-11-20 | 2010-10-26 | Aptina Imaging Corporation | Anti-resonant reflecting optical waveguide for imager light pipe |
WO2009067668A1 (en) | 2007-11-21 | 2009-05-28 | The Trustees Of Boston College | Apparatus and methods for visual perception using an array of nanoscale waveguides |
KR101385250B1 (ko) * | 2007-12-11 | 2014-04-16 | 삼성전자주식회사 | Cmos 이미지 센서 |
KR101000064B1 (ko) | 2007-12-18 | 2010-12-10 | 엘지전자 주식회사 | 이종접합 태양전지 및 그 제조방법 |
CA2707027C (en) | 2007-12-19 | 2012-05-22 | Fpinnovations | Conversion of knot rejects from chemical pulping |
US8106289B2 (en) | 2007-12-31 | 2012-01-31 | Banpil Photonics, Inc. | Hybrid photovoltaic device |
US7880207B2 (en) | 2008-01-14 | 2011-02-01 | International Business Machines Corporation | Photo detector device |
US8030729B2 (en) | 2008-01-29 | 2011-10-04 | Hewlett-Packard Development Company, L.P. | Device for absorbing or emitting light and methods of making the same |
US20090188552A1 (en) | 2008-01-30 | 2009-07-30 | Shih-Yuan Wang | Nanowire-Based Photovoltaic Cells And Methods For Fabricating The Same |
US20090189145A1 (en) | 2008-01-30 | 2009-07-30 | Shih-Yuan Wang | Photodetectors, Photovoltaic Devices And Methods Of Making The Same |
US9009573B2 (en) | 2008-02-01 | 2015-04-14 | Qualcomm Incorporated | Method and apparatus for facilitating concatenated codes for beacon channels |
WO2009097627A2 (en) | 2008-02-03 | 2009-08-06 | Nliten Energy Corporation | Thin-film photovoltaic devices and related manufacturing methods |
US20090199597A1 (en) | 2008-02-07 | 2009-08-13 | Danley Jeffrey D | Systems and methods for collapsing air lines in nanostructured optical fibers |
US20090201400A1 (en) | 2008-02-08 | 2009-08-13 | Omnivision Technologies, Inc. | Backside illuminated image sensor with global shutter and storage capacitor |
US20090206405A1 (en) | 2008-02-15 | 2009-08-20 | Doyle Brian S | Fin field effect transistor structures having two dielectric thicknesses |
WO2009102280A1 (en) | 2008-02-15 | 2009-08-20 | Agency For Science, Technology And Research | Photodetector with valence-mending adsorbate region and a method of fabrication thereof |
US20090266418A1 (en) | 2008-02-18 | 2009-10-29 | Board Of Regents, The University Of Texas System | Photovoltaic devices based on nanostructured polymer films molded from porous template |
US20090211622A1 (en) | 2008-02-21 | 2009-08-27 | Sunlight Photonics Inc. | Multi-layered electro-optic devices |
CN101527327B (zh) | 2008-03-07 | 2012-09-19 | 清华大学 | 太阳能电池 |
US8101526B2 (en) | 2008-03-12 | 2012-01-24 | City University Of Hong Kong | Method of making diamond nanopillars |
WO2009114768A1 (en) | 2008-03-14 | 2009-09-17 | Albonia Innovative Technologies Ltd. | Electrostatic desalination and water purification |
US20110284061A1 (en) | 2008-03-21 | 2011-11-24 | Fyzikalni Ustav Av Cr, V.V.I. | Photovoltaic cell and methods for producing a photovoltaic cell |
JP4770857B2 (ja) | 2008-03-27 | 2011-09-14 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置 |
KR20090105732A (ko) | 2008-04-03 | 2009-10-07 | 삼성전자주식회사 | 태양전지 |
CN102084467A (zh) | 2008-04-14 | 2011-06-01 | 班德加普工程有限公司 | 制作纳米线阵列的方法 |
KR20090109980A (ko) | 2008-04-17 | 2009-10-21 | 한국과학기술연구원 | 가시광 대역 반도체 나노선 광센서 및 이의 제조 방법 |
WO2009135078A2 (en) | 2008-04-30 | 2009-11-05 | The Regents Of The University Of California | Method and apparatus for fabricating optoelectromechanical devices by structural transfer using re-usable substrate |
US7902540B2 (en) | 2008-05-21 | 2011-03-08 | International Business Machines Corporation | Fast P-I-N photodetector with high responsitivity |
US8138493B2 (en) | 2008-07-09 | 2012-03-20 | Qunano Ab | Optoelectronic semiconductor device |
KR101435519B1 (ko) | 2008-07-24 | 2014-08-29 | 삼성전자주식회사 | 광 포커싱 구조를 가진 이미지 센서 |
US7863625B2 (en) | 2008-07-24 | 2011-01-04 | Hewlett-Packard Development Company, L.P. | Nanowire-based light-emitting diodes and light-detection devices with nanocrystalline outer surface |
US8198706B2 (en) | 2008-07-25 | 2012-06-12 | Hewlett-Packard Development Company, L.P. | Multi-level nanowire structure and method of making the same |
JP5454476B2 (ja) | 2008-07-25 | 2014-03-26 | コニカミノルタ株式会社 | 透明電極および透明電極の製造方法 |
CN102112901B (zh) | 2008-07-31 | 2014-08-06 | 惠普开发有限公司 | 用于放大、调制和检测光信号的纳米线光学块设备 |
JP2010040672A (ja) | 2008-08-01 | 2010-02-18 | Oki Semiconductor Co Ltd | 半導体装置およびその製造方法 |
EP2321853A4 (en) | 2008-08-14 | 2015-04-15 | Brookhaven Science Ass Llc | STRUCTURED PILLAR ELECTRODES |
US8299472B2 (en) | 2009-12-08 | 2012-10-30 | Young-June Yu | Active pixel sensor with nanowire structured photodetectors |
US20100304061A1 (en) | 2009-05-26 | 2010-12-02 | Zena Technologies, Inc. | Fabrication of high aspect ratio features in a glass layer by etching |
US8507840B2 (en) | 2010-12-21 | 2013-08-13 | Zena Technologies, Inc. | Vertically structured passive pixel arrays and methods for fabricating the same |
US8229255B2 (en) | 2008-09-04 | 2012-07-24 | Zena Technologies, Inc. | Optical waveguides in image sensors |
US8835831B2 (en) | 2010-06-22 | 2014-09-16 | Zena Technologies, Inc. | Polarized light detecting device and fabrication methods of the same |
JP2012502466A (ja) | 2008-09-04 | 2012-01-26 | クナノ アーベー | ナノ構造のフォトダイオード |
US20100148221A1 (en) | 2008-11-13 | 2010-06-17 | Zena Technologies, Inc. | Vertical photogate (vpg) pixel structure with nanowires |
US8748799B2 (en) * | 2010-12-14 | 2014-06-10 | Zena Technologies, Inc. | Full color single pixel including doublet or quadruplet si nanowires for image sensors |
US8269985B2 (en) | 2009-05-26 | 2012-09-18 | Zena Technologies, Inc. | Determination of optimal diameters for nanowires |
US8866065B2 (en) | 2010-12-13 | 2014-10-21 | Zena Technologies, Inc. | Nanowire arrays comprising fluorescent nanowires |
US8791470B2 (en) | 2009-10-05 | 2014-07-29 | Zena Technologies, Inc. | Nano structured LEDs |
US9000353B2 (en) | 2010-06-22 | 2015-04-07 | President And Fellows Of Harvard College | Light absorption and filtering properties of vertically oriented semiconductor nano wires |
US9299866B2 (en) | 2010-12-30 | 2016-03-29 | Zena Technologies, Inc. | Nanowire array based solar energy harvesting device |
US20130112256A1 (en) | 2011-11-03 | 2013-05-09 | Young-June Yu | Vertical pillar structured photovoltaic devices with wavelength-selective mirrors |
US7646943B1 (en) | 2008-09-04 | 2010-01-12 | Zena Technologies, Inc. | Optical waveguides in image sensors |
US8384007B2 (en) | 2009-10-07 | 2013-02-26 | Zena Technologies, Inc. | Nano wire based passive pixel image sensor |
US8274039B2 (en) | 2008-11-13 | 2012-09-25 | Zena Technologies, Inc. | Vertical waveguides with various functionality on integrated circuits |
US9082673B2 (en) | 2009-10-05 | 2015-07-14 | Zena Technologies, Inc. | Passivated upstanding nanostructures and methods of making the same |
US8519379B2 (en) | 2009-12-08 | 2013-08-27 | Zena Technologies, Inc. | Nanowire structured photodiode with a surrounding epitaxially grown P or N layer |
US8735797B2 (en) | 2009-12-08 | 2014-05-27 | Zena Technologies, Inc. | Nanowire photo-detector grown on a back-side illuminated image sensor |
US9515218B2 (en) | 2008-09-04 | 2016-12-06 | Zena Technologies, Inc. | Vertical pillar structured photovoltaic devices with mirrors and optical claddings |
EP2332175B1 (en) | 2008-09-09 | 2015-08-26 | Vanguard Solar, Inc. | Solar cells and photodetectors with semiconducting nanostructures |
KR101143706B1 (ko) | 2008-09-24 | 2012-05-09 | 인터내셔널 비지네스 머신즈 코포레이션 | 나노전자 소자 |
US7972885B1 (en) | 2008-09-25 | 2011-07-05 | Banpil Photonics, Inc. | Broadband imaging device and manufacturing thereof |
US20110247676A1 (en) | 2008-09-30 | 2011-10-13 | The Regents Of The University Of California | Photonic Crystal Solar Cell |
US8138410B2 (en) | 2008-10-01 | 2012-03-20 | International Business Machines Corporation | Optical tandem photovoltaic cell panels |
US8591661B2 (en) | 2009-12-11 | 2013-11-26 | Novellus Systems, Inc. | Low damage photoresist strip method for low-K dielectrics |
US20100090341A1 (en) | 2008-10-14 | 2010-04-15 | Molecular Imprints, Inc. | Nano-patterned active layers formed by nano-imprint lithography |
EP2180526A2 (en) | 2008-10-23 | 2010-04-28 | Samsung Electronics Co., Ltd. | Photovoltaic device and method for manufacturing the same |
FR2937791B1 (fr) | 2008-10-24 | 2010-11-26 | Thales Sa | Dispositif d'imagerie polarimetrique optimise par rapport au contraste de polarisation |
US20100104494A1 (en) | 2008-10-24 | 2010-04-29 | Meng Yu-Fei | Enhanced Optical Properties of Chemical Vapor Deposited Single Crystal Diamond by Low-Pressure/High-Temperature Annealing |
WO2010062644A2 (en) | 2008-10-28 | 2010-06-03 | The Regents Of The University Of California | Vertical group iii-v nanowires on si, heterostructures, flexible arrays and fabrication |
US8993873B2 (en) | 2008-11-26 | 2015-03-31 | Microlink Devices, Inc. | Solar cell with a backside via to contact the emitter layer |
KR20100063536A (ko) | 2008-12-03 | 2010-06-11 | 삼성에스디아이 주식회사 | 발광 장치 및 이 발광 장치를 광원으로 사용하는 표시 장치 |
WO2010067958A2 (ko) | 2008-12-10 | 2010-06-17 | 한양대학교 산학협력단 | 기판의 재사용이 가능한 태양 전지 및 그 제조 방법 |
EP2374155A1 (en) | 2008-12-19 | 2011-10-12 | Hewlett-Packard Development Company, L.P. | Photovoltaic structure and method of fabrication employing nanowire on stub |
KR20100079058A (ko) | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
US20100200065A1 (en) | 2009-02-12 | 2010-08-12 | Kyu Hyun Choi | Photovoltaic Cell and Fabrication Method Thereof |
TW201034212A (en) | 2009-03-13 | 2010-09-16 | guo-hong Shen | Thin-film solar cell structure |
US7888155B2 (en) | 2009-03-16 | 2011-02-15 | Industrial Technology Research Institute | Phase-change memory element and method for fabricating the same |
US8242353B2 (en) | 2009-03-16 | 2012-08-14 | International Business Machines Corporation | Nanowire multijunction solar cell |
US20100244108A1 (en) | 2009-03-31 | 2010-09-30 | Glenn Eric Kohnke | Cmos image sensor on a semiconductor-on-insulator substrate and process for making same |
TWI425643B (zh) | 2009-03-31 | 2014-02-01 | Sony Corp | 固態攝像裝置及其製造方法、攝像裝置和抗反射結構之製造方法 |
JP2012523365A (ja) | 2009-04-09 | 2012-10-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 光起電力セル用の導体中に使用されるガラス組成物 |
JP5307901B2 (ja) | 2009-04-13 | 2013-10-02 | オリンパス株式会社 | 蛍光センサ、針型蛍光センサ、およびアナライトの計測方法 |
US8389388B2 (en) | 2009-04-30 | 2013-03-05 | Hewlett-Packard Development Company, L.P. | Photonic device and method of making the same |
CN102272944B (zh) | 2009-05-06 | 2013-08-14 | 薄膜硅公司 | 光伏电池和提高半导体层堆叠中的光俘获的方法 |
US8809672B2 (en) | 2009-05-27 | 2014-08-19 | The Regents Of The University Of California | Nanoneedle plasmonic photodetectors and solar cells |
JP5504695B2 (ja) | 2009-05-29 | 2014-05-28 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法および電子機器 |
US9551650B2 (en) | 2009-06-01 | 2017-01-24 | Cornell University | Integrated optofluidic system using microspheres |
US8211735B2 (en) | 2009-06-08 | 2012-07-03 | International Business Machines Corporation | Nano/microwire solar cell fabricated by nano/microsphere lithography |
EP2441095A4 (en) | 2009-06-10 | 2013-07-03 | Thinsilicon Corp | PV MODULES AND METHOD FOR PRODUCING PV MODULES WITH TANDEM SEMICONDUCTOR LAYERING PLATES |
WO2010144866A2 (en) | 2009-06-11 | 2010-12-16 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Microgrid imaging polarimeters with frequency domain reconstruction |
KR101139458B1 (ko) | 2009-06-18 | 2012-04-30 | 엘지전자 주식회사 | 태양전지 및 그 제조방법 |
US8304759B2 (en) | 2009-06-22 | 2012-11-06 | Banpil Photonics, Inc. | Integrated image sensor system on common substrate |
US8558336B2 (en) | 2009-08-17 | 2013-10-15 | United Microelectronics Corp. | Semiconductor photodetector structure and the fabrication method thereof |
EP2290718B1 (en) | 2009-08-25 | 2015-05-27 | Samsung Electronics Co., Ltd. | Apparatus for generating electrical energy and method for manufacturing the same |
US8319309B2 (en) | 2009-08-28 | 2012-11-27 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device and method for manufacturing of the same |
KR101051578B1 (ko) | 2009-09-08 | 2011-07-22 | 삼성전기주식회사 | 반도체 소자 및 그 제조 방법 |
KR101067114B1 (ko) | 2009-09-08 | 2011-09-22 | 삼성전기주식회사 | 반도체 소자 및 그 제조 방법 |
KR101058593B1 (ko) | 2009-09-08 | 2011-08-22 | 삼성전기주식회사 | 반도체 소자 및 그 제조 방법 |
US20110084212A1 (en) | 2009-09-22 | 2011-04-14 | Irvine Sensors Corporation | Multi-layer photon counting electronic module |
US8173473B2 (en) | 2009-09-29 | 2012-05-08 | Applied Materials, Inc. | Laser system for processing solar wafers in a carrier |
CN102714137B (zh) | 2009-10-16 | 2015-09-30 | 康奈尔大学 | 包括纳米线结构的方法和装置 |
US8115097B2 (en) | 2009-11-19 | 2012-02-14 | International Business Machines Corporation | Grid-line-free contact for a photovoltaic cell |
US8563395B2 (en) | 2009-11-30 | 2013-10-22 | The Royal Institute For The Advancement Of Learning/Mcgill University | Method of growing uniform semiconductor nanowires without foreign metal catalyst and devices thereof |
US20120006390A1 (en) | 2009-12-08 | 2012-01-12 | Yijie Huo | Nano-wire solar cell or detector |
US20120240999A1 (en) | 2009-12-15 | 2012-09-27 | Sony Corporation | Photoelectric conversion device and method of manufacturing photoelectric conversion device |
JP5608384B2 (ja) | 2010-02-05 | 2014-10-15 | 東京エレクトロン株式会社 | 半導体装置の製造方法及びプラズマエッチング装置 |
US9410891B2 (en) | 2010-02-19 | 2016-08-09 | Pacific Biosciences Of California, Inc. | Optics collection and detection system and method |
EP2541625A1 (en) | 2010-02-25 | 2013-01-02 | National University Corporation Hokkaido University | Semiconductor device and method for manufacturing semiconductor device |
WO2011156042A2 (en) | 2010-03-23 | 2011-12-15 | California Institute Of Technology | Heterojunction wire array solar cells |
US20130037100A1 (en) | 2010-04-09 | 2013-02-14 | Charlotte PLATZER BJÖRKMAN | Thin Film Photovoltaic Solar Cells |
US8194197B2 (en) | 2010-04-13 | 2012-06-05 | Sharp Kabushiki Kaisha | Integrated display and photovoltaic element |
TWI409963B (zh) | 2010-05-07 | 2013-09-21 | Huang Chung Cheng | 同軸奈米線結構的太陽能電池 |
CN105911814A (zh) | 2010-05-21 | 2016-08-31 | 普林斯顿大学 | 用于增强局部电场、光吸收、光辐射、材料检测的结构以及用于制作和使用此结构的方法 |
US8431817B2 (en) * | 2010-06-08 | 2013-04-30 | Sundiode Inc. | Multi-junction solar cell having sidewall bi-layer electrical interconnect |
US8324010B2 (en) | 2010-06-29 | 2012-12-04 | Himax Imaging, Inc. | Light pipe etch control for CMOS fabrication |
US8878055B2 (en) | 2010-08-09 | 2014-11-04 | International Business Machines Corporation | Efficient nanoscale solar cell and fabrication method |
US9231133B2 (en) | 2010-09-10 | 2016-01-05 | International Business Machines Corporation | Nanowires formed by employing solder nanodots |
JP5884486B2 (ja) | 2010-09-30 | 2016-03-15 | 三菱マテリアル株式会社 | 太陽電池の反射防止膜用組成物、太陽電池の反射防止膜、太陽電池の反射防止膜の製造方法、及び太陽電池 |
US20140096816A1 (en) | 2010-12-22 | 2014-04-10 | Harry A. Atwater | Heterojunction microwire array semiconductor devices |
SG185248A1 (en) | 2011-05-05 | 2012-11-29 | Agency Science Tech & Res | A photodetector and a method of forming the same |
US20120291859A1 (en) | 2011-05-17 | 2012-11-22 | Christopher Vineis | Multi-Junction Semiconductor Photovoltaic Apparatus and Methods |
US8809843B2 (en) | 2011-06-07 | 2014-08-19 | California Institute Of Technology | Nickel-based electrocatalytic photoelectrodes |
US20120318336A1 (en) | 2011-06-17 | 2012-12-20 | International Business Machines Corporation | Contact for silicon heterojunction solar cells |
US9331220B2 (en) | 2011-06-30 | 2016-05-03 | International Business Machines Corporation | Three-dimensional conductive electrode for solar cell |
US20130174896A1 (en) | 2011-06-30 | 2013-07-11 | California Institute Of Technology | Tandem solar cell using a silicon microwire array and amorphous silicon photovoltaic layer |
US9406824B2 (en) | 2011-11-23 | 2016-08-02 | Quswami, Inc. | Nanopillar tunneling photovoltaic cell |
US20130220406A1 (en) | 2012-02-27 | 2013-08-29 | Sharp Kabushiki Kaisha | Vertical junction solar cell structure and method |
EP2912700A4 (en) | 2012-10-26 | 2016-04-06 | Glo Ab | NANODRAHT LED STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF |
US20150171272A1 (en) | 2013-12-12 | 2015-06-18 | Zhijiong Luo | Semiconductor plate device |
-
2010
- 2010-12-14 US US12/967,880 patent/US8748799B2/en not_active Expired - Fee Related
-
2011
- 2011-12-13 JP JP2013544690A patent/JP5540161B2/ja not_active Expired - Fee Related
- 2011-12-13 KR KR1020137018243A patent/KR101422144B1/ko not_active IP Right Cessation
- 2011-12-13 CN CN201180065814.8A patent/CN103339744B/zh not_active Expired - Fee Related
- 2011-12-13 WO PCT/US2011/064635 patent/WO2012082734A1/en active Application Filing
- 2011-12-14 TW TW103145582A patent/TW201513325A/zh unknown
- 2011-12-14 TW TW100146327A patent/TWI472020B/zh not_active IP Right Cessation
-
2014
- 2014-05-01 JP JP2014094365A patent/JP2014209625A/ja active Pending
- 2014-05-30 US US14/291,888 patent/US9543458B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004193527A (ja) * | 2002-12-13 | 2004-07-08 | Canon Inc | 半導体デバイスアレイ及びその製造方法 |
JP2005328135A (ja) * | 2004-05-12 | 2005-11-24 | Sony Corp | Ad変換方法および物理量分布検知の半導体装置 |
JP2007184566A (ja) * | 2005-12-06 | 2007-07-19 | Canon Inc | 半導体ナノワイヤを用いた半導体素子、それを用いた表示装置及び撮像装置 |
JP2007184560A (ja) * | 2006-01-05 | 2007-07-19 | Korea Advanced Inst Of Sci Technol | Cmosイメージセンサ及びその製造方法 |
US20100127153A1 (en) * | 2007-05-07 | 2010-05-27 | Nxp B.V. | Photosensitive device and a method of manufacturing a photosensitive device |
US20100193017A1 (en) * | 2007-07-12 | 2010-08-05 | Huth Gerald C | Solar photovoltaic structure comprising quantized interaction sensitive nanocells |
JP2009236914A (ja) * | 2008-03-26 | 2009-10-15 | Samsung Electronics Co Ltd | 距離測定センサ及びそれを備えた立体カラーイメージセンサ |
US20100308214A1 (en) * | 2009-06-04 | 2010-12-09 | Zena Technologies, Inc. | Array of nanowires in a single cavity with anti-reflective coating on substrate |
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US20120145880A1 (en) | 2012-06-14 |
KR20130136509A (ko) | 2013-12-12 |
JP2014507783A (ja) | 2014-03-27 |
WO2012082734A1 (en) | 2012-06-21 |
TWI472020B (zh) | 2015-02-01 |
KR101422144B1 (ko) | 2014-07-22 |
CN103339744B (zh) | 2016-02-24 |
US9543458B2 (en) | 2017-01-10 |
US20140263967A1 (en) | 2014-09-18 |
TW201238039A (en) | 2012-09-16 |
US8748799B2 (en) | 2014-06-10 |
CN103339744A (zh) | 2013-10-02 |
TW201513325A (zh) | 2015-04-01 |
JP5540161B2 (ja) | 2014-07-02 |
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