KR100993056B1 - 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판 - Google Patents
프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판 Download PDFInfo
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H05K2201/09—Shape and layout
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- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Abstract
Description
Claims (15)
- 도전성 잉크를 토출시키는 잉크젯 헤드와, 상기 도전성 잉크가 도화되는 기판을 지지하는 구동 스테이지를 구비하는 잉크젯 인쇄 장치를 이용하여, 상기 기판 상에 미세 선폭 패턴을 도화(Drawing)하는 잉크젯 인쇄 방법에 있어서,(A) 미세 선폭 패턴을 형성할 기판의 표면에 골과 턱으로 이루어진 요철(凹凸) 형상으로 이루어지고, 상기 골과 턱이 상기 미세 선폭 패턴이 형성되는 영역에 등간격으로 복수 형성되어 반복된 띠 형상을 갖는 스트라이프 패턴을 형성하여 프리 패턴(Pre-Pattern)된 기판을 준비하는 단계;(B) 상기 기판을 잉크젯 인쇄 장치에 로딩하는 단계; 및(C) 상기 기판의 스트라이프 패턴이 형성된 영역에 도전성 잉크를 분사하여 미세 선폭 패턴을 도화하는 단계;를 포함하되,상기 스트라이프 패턴의 등간격은 도전성 잉크에 의해 도화되는 미세 선폭보다 좁게 형성되고,상기 기판 상에 도화되는 도전성 잉크는 스트라이프 패턴이 형성된 영역 내에서 이방성 유동되는 것을 특징으로 하는 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법.
- 제1항에 있어서, 상기 (A) 단계의 스트라이프 패턴을 형성하는 단계는,(A1) 기판 상에 반사 방지층을 형성하는 단계;(A2) 상기 반사 방지층 상에 포토 레지스트층을 형성하는 단계;(A3) 상기 포토 레지스트층이 반사 방지층을 주기적으로 노출시키는 반복된 띠 형상의 포토 레지스트 패턴을 갖도록 레이저 간섭 리소그래피 처리하는 단계; 및(A4) 상기 포토 레지스트 패턴이 형성된 기판을 현상 및 에칭하여, 상기 기판 상에 스트라이프 패턴을 형성하는 단계;를 포함하는 것을 특징으로 하는 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법.
- 제1항 또는 제2항에 있어서,상기 스트라이프 패턴은 포지티브 또는 네거티브 타입인 것을 특징으로 하는 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법.
- 삭제
- 삭제
- 제1항에 있어서,상기 도전성 잉크는 골을 따라 이방성 유동하고, 상기 턱에 의해 확산 방지되는 것을 특징으로 하는 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법.
- 제1항에 있어서,상기 스트라이프 패턴은 임프린팅 또는 롤프린팅 공정에 의해 형성되는 것을 특징으로 하는 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법.
- 기판 상에 미세 선폭 패턴이 도화된 도전성 기판에 있어서,골과 턱으로 이루어진 요철(凹凸) 형상으로 이루어지고, 상기 골과 턱이 상기 미세 선폭 패턴이 형성되는 영역에 등간격으로 복수 형성되어 반복된 띠 형상을 갖는 스트라이프 패턴이 형성된 기판; 및상기 스트라이프 패턴이 형성된 영역 내에서 이방성 유동하여 미세 선폭 패턴을 형성하는 도전성 잉크;를 포함하되,상기 스트라이프 패턴의 등간격은 도전성 잉크에 의해 도화되는 미세 선폭보다 좁게 형성되는 것을 특징으로 하는 도전성 기판.
- 제8항에 있어서,상기 스트라이프 패턴은 리소그래피, 임프린팅 또는 롤프린팅 공정에 의해 형성되는 것을 특징으로 하는 도전성 기판.
- 제9항에 있어서,상기 리소그래피 공정은 레이저 간섭 리소그래피 공정인 것을 특징으로 하는 도전성 기판.
- 제8항에 있어서,상기 스트라이프 패턴은 포지티브 또는 네거티브 타입인 것을 특징으로 하는 도전성 기판.
- 삭제
- 삭제
- 제8에 있어서,상기 도전성 잉크는 골을 따라 이방성 유동하고, 상기 턱에 의해 확산 방지되는 것을 특징으로 하는 도전성 기판.
- 제8항에 있어서,상기 미세 선폭 패턴은 컬러필터 패턴 또는 전극 배선 패턴인 것을 특징으로 하는 도전성 기판.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060122217A KR100993056B1 (ko) | 2006-12-05 | 2006-12-05 | 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판 |
JP2009540150A JP5230641B2 (ja) | 2006-12-05 | 2007-12-05 | プレパターンされた基板を用いた高解像度インクジェット印刷方法 |
US12/312,858 US8113648B2 (en) | 2006-12-05 | 2007-12-05 | Method for high resolution ink-jet print using pre-patterned substrate and conductive substrate manufactured using the same |
PCT/KR2007/006275 WO2008069565A1 (en) | 2006-12-05 | 2007-12-05 | Method for high resolution ink-jet print using pre-patterned substrate and conductive substrate manufactured using the same |
US13/354,159 US8541093B2 (en) | 2006-12-05 | 2012-01-19 | Method for high resolution ink-jet print using pre-patterned substrate and conductive substrate manufactured using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060122217A KR100993056B1 (ko) | 2006-12-05 | 2006-12-05 | 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판 |
Publications (2)
Publication Number | Publication Date |
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KR20080051338A KR20080051338A (ko) | 2008-06-11 |
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KR102510963B1 (ko) | 2018-02-20 | 2023-03-16 | 세메스 주식회사 | 약액 검사 방법 |
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US8541093B2 (en) | 2013-09-24 |
KR20080051338A (ko) | 2008-06-11 |
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