JP2013545295A5 - - Google Patents
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- Publication number
- JP2013545295A5 JP2013545295A5 JP2013535073A JP2013535073A JP2013545295A5 JP 2013545295 A5 JP2013545295 A5 JP 2013545295A5 JP 2013535073 A JP2013535073 A JP 2013535073A JP 2013535073 A JP2013535073 A JP 2013535073A JP 2013545295 A5 JP2013545295 A5 JP 2013545295A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- trench
- semiconductor rectifier
- substrate
- conductivity type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- IYYIVELXUANFED-UHFFFAOYSA-N bromo(trimethyl)silane Chemical compound C[Si](C)(C)Br IYYIVELXUANFED-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 claims 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40529310P | 2010-10-21 | 2010-10-21 | |
| US61/405,293 | 2010-10-21 | ||
| US13/222,249 | 2011-08-31 | ||
| US13/222,249 US8816468B2 (en) | 2010-10-21 | 2011-08-31 | Schottky rectifier |
| PCT/US2011/057012 WO2012054682A2 (en) | 2010-10-21 | 2011-10-20 | Improved schottky rectifier |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016155375A Division JP6471126B2 (ja) | 2010-10-21 | 2016-08-08 | 改良されたショットキー整流器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013545295A JP2013545295A (ja) | 2013-12-19 |
| JP2013545295A5 true JP2013545295A5 (enExample) | 2014-11-06 |
| JP5989652B2 JP5989652B2 (ja) | 2016-09-07 |
Family
ID=45972289
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013535073A Active JP5989652B2 (ja) | 2010-10-21 | 2011-10-20 | 改良されたショットキー整流器 |
| JP2016155375A Active JP6471126B2 (ja) | 2010-10-21 | 2016-08-08 | 改良されたショットキー整流器 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016155375A Active JP6471126B2 (ja) | 2010-10-21 | 2016-08-08 | 改良されたショットキー整流器 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8816468B2 (enExample) |
| EP (1) | EP2630663B1 (enExample) |
| JP (2) | JP5989652B2 (enExample) |
| KR (1) | KR101987009B1 (enExample) |
| CN (1) | CN103180961B (enExample) |
| TW (1) | TWI566422B (enExample) |
| WO (1) | WO2012054682A2 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103378177B (zh) * | 2012-04-30 | 2017-04-26 | 朱江 | 一种具有沟槽肖特基半导体装置及其制备方法 |
| JP5787853B2 (ja) * | 2012-09-12 | 2015-09-30 | 株式会社東芝 | 電力用半導体装置 |
| CN103681877A (zh) * | 2012-09-26 | 2014-03-26 | 比亚迪股份有限公司 | 一种快恢复二极管的结构及其制造方法 |
| US8981528B2 (en) | 2012-11-16 | 2015-03-17 | Vishay General Semiconductor Llc | GaN-based Schottky diode having partially recessed anode |
| US9018698B2 (en) * | 2012-11-16 | 2015-04-28 | Vishay General Semiconductor Llc | Trench-based device with improved trench protection |
| US8981381B2 (en) | 2012-11-16 | 2015-03-17 | Vishay General Semiconductor Llc | GaN-based Schottky diode having dual metal, partially recessed electrode |
| US9716151B2 (en) * | 2013-09-24 | 2017-07-25 | Semiconductor Components Industries, Llc | Schottky device having conductive trenches and a multi-concentration doping profile therebetween |
| CN104795452B (zh) * | 2014-01-16 | 2018-04-27 | 上海韦尔半导体股份有限公司 | 肖特基整流器及其制作方法 |
| CN103943688B (zh) * | 2014-04-21 | 2017-06-13 | 中航(重庆)微电子有限公司 | 一种肖特基势垒二极管器件结构及其制作方法 |
| DE102015204137A1 (de) * | 2015-03-09 | 2016-09-15 | Robert Bosch Gmbh | Halbleitervorrichtung mit einer Trench-Schottky-Barrier-Schottky-Diode |
| DE102015204138A1 (de) * | 2015-03-09 | 2016-09-15 | Robert Bosch Gmbh | Halbleitervorrichtung mit einer Trench-MOS-Barrier-Schottky-Diode |
| EP3067935A1 (en) * | 2015-03-10 | 2016-09-14 | ABB Technology AG | Power semiconductor rectifier with controllable on-state voltage |
| CN107591318B (zh) * | 2016-07-07 | 2020-08-07 | 北大方正集团有限公司 | 沟槽肖特基器件的制作方法 |
| CN106024915B (zh) * | 2016-07-25 | 2019-01-01 | 电子科技大学 | 一种超级结肖特基二极管 |
| JP6742925B2 (ja) * | 2017-01-18 | 2020-08-19 | 株式会社 日立パワーデバイス | 半導体装置、及びそれを用いた電力変換装置 |
| CN107946371B (zh) * | 2017-01-24 | 2024-04-05 | 重庆中科渝芯电子有限公司 | 一种肖特基势垒接触的超势垒整流器及其制造方法 |
| CN107946301A (zh) * | 2017-02-24 | 2018-04-20 | 重庆中科渝芯电子有限公司 | 一种肖特基势垒接触的沟槽型超势垒整流器及其制造方法 |
| CN109148605B (zh) * | 2017-06-19 | 2022-02-18 | 比亚迪半导体股份有限公司 | 快恢复二极管及制备方法、电子设备 |
| EP3654387A4 (en) * | 2017-07-08 | 2021-03-31 | Flosfia Inc. | SEMICONDUCTOR COMPONENT |
| US10424677B2 (en) * | 2017-08-31 | 2019-09-24 | Littelfuse, Inc. | Charge carrier extraction inverse diode |
| CN108010910A (zh) * | 2017-11-21 | 2018-05-08 | 重庆大学 | 一种沟槽型肖特基接触超级势垒整流器及其制作方法 |
| CN109962097A (zh) * | 2017-12-26 | 2019-07-02 | 比亚迪股份有限公司 | 二极管器件及其制造工艺 |
| WO2019155768A1 (ja) * | 2018-02-09 | 2019-08-15 | 三菱電機株式会社 | 電力用半導体装置 |
| US10608122B2 (en) | 2018-03-13 | 2020-03-31 | Semicondutor Components Industries, Llc | Schottky device and method of manufacture |
| US10692988B2 (en) | 2018-11-26 | 2020-06-23 | Infineon Technologies Austria Ag | Semiconductor device having integrated MOS-gated or Schottky diodes |
| CN109786472A (zh) * | 2019-03-01 | 2019-05-21 | 重庆平伟实业股份有限公司 | 一种功率半导体器件 |
| TW202038473A (zh) * | 2019-04-10 | 2020-10-16 | 台灣茂矽電子股份有限公司 | 二極體結構及其製造方法 |
| CN111816693A (zh) * | 2019-04-10 | 2020-10-23 | 台湾茂矽电子股份有限公司 | 二极管结构及其制造方法 |
| US11532758B2 (en) | 2019-09-24 | 2022-12-20 | Texas Instruments Incorporated | Low leakage Schottky diode |
| CN114300543B (zh) * | 2022-03-10 | 2022-06-07 | 安建科技(深圳)有限公司 | 一种电子抽取型续流二极管器件及其制备方法 |
| CN115312591B (zh) * | 2022-10-10 | 2022-12-23 | 深圳市威兆半导体股份有限公司 | 一种快恢复二极管及其制备方法 |
| KR20250071546A (ko) | 2023-11-15 | 2025-05-22 | 주식회사 웨이브트랙 | 고출력 고주파 입력 신호 내성을 갖는 고주파 신호 직류 정류 회로 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51120674A (en) * | 1975-04-16 | 1976-10-22 | Hitachi Ltd | Semiconductor device |
| JP2590284B2 (ja) | 1990-02-28 | 1997-03-12 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
| JPH0590565A (ja) | 1991-09-25 | 1993-04-09 | Shindengen Electric Mfg Co Ltd | 整流用半導体装置 |
| JP2835544B2 (ja) * | 1991-10-15 | 1998-12-14 | 新電元工業株式会社 | 整流用半導体装置 |
| JPH0878702A (ja) * | 1994-09-01 | 1996-03-22 | Fuji Electric Co Ltd | 半導体装置 |
| FR2764117B1 (fr) * | 1997-05-30 | 1999-08-13 | Sgs Thomson Microelectronics | Contact sur une region de type p |
| JP3618517B2 (ja) * | 1997-06-18 | 2005-02-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| US6252288B1 (en) | 1999-01-19 | 2001-06-26 | Rockwell Science Center, Llc | High power trench-based rectifier with improved reverse breakdown characteristic |
| JP2000216410A (ja) * | 1999-01-22 | 2000-08-04 | Hitachi Ltd | ショットキ―バリアダイオ―ドの製造方法 |
| US6191447B1 (en) | 1999-05-28 | 2001-02-20 | Micro-Ohm Corporation | Power semiconductor devices that utilize tapered trench-based insulating regions to improve electric field profiles in highly doped drift region mesas and methods of forming same |
| JP4118459B2 (ja) * | 1999-07-09 | 2008-07-16 | 富士電機デバイステクノロジー株式会社 | ショットキーバリアダイオード |
| JP2001068688A (ja) * | 1999-08-26 | 2001-03-16 | Fuji Electric Co Ltd | ショットキーバリアダイオードの製造方法およびショットキーバリアダイオード |
| JP3691736B2 (ja) * | 2000-07-31 | 2005-09-07 | 新電元工業株式会社 | 半導体装置 |
| US6846729B2 (en) | 2001-10-01 | 2005-01-25 | International Rectifier Corporation | Process for counter doping N-type silicon in Schottky device Ti silicide barrier |
| JP3858693B2 (ja) * | 2001-12-28 | 2006-12-20 | サンケン電気株式会社 | 半導体素子の製造方法 |
| US6998694B2 (en) | 2003-08-05 | 2006-02-14 | Shye-Lin Wu | High switching speed two mask Schottky diode with high field breakdown |
| JP2005243717A (ja) * | 2004-02-24 | 2005-09-08 | Sanyo Electric Co Ltd | 半導体装置 |
| US7078780B2 (en) * | 2004-04-19 | 2006-07-18 | Shye-Lin Wu | Schottky barrier diode and method of making the same |
| DE102004059640A1 (de) | 2004-12-10 | 2006-06-22 | Robert Bosch Gmbh | Halbleitereinrichtung und Verfahren zu deren Herstellung |
| JP4793905B2 (ja) * | 2005-03-24 | 2011-10-12 | 日本碍子株式会社 | 半導体装置およびその製造方法 |
| CN101361194B (zh) | 2005-12-27 | 2010-12-22 | 美商科斯德半导体股份有限公司 | 用于快速恢复整流器结构的装置及方法 |
| US7709864B2 (en) * | 2006-04-07 | 2010-05-04 | Diodes Fabtech Inc | High-efficiency Schottky rectifier and method of manufacturing same |
| JP4930904B2 (ja) * | 2007-09-07 | 2012-05-16 | サンケン電気株式会社 | 電気回路のスイッチング装置 |
| US20090309181A1 (en) * | 2008-06-12 | 2009-12-17 | Force Mos Technology Co. Ltd. | Trench schottky with multiple epi structure |
| US7750412B2 (en) * | 2008-08-06 | 2010-07-06 | Fairchild Semiconductor Corporation | Rectifier with PN clamp regions under trenches |
| US8049276B2 (en) * | 2009-06-12 | 2011-11-01 | Fairchild Semiconductor Corporation | Reduced process sensitivity of electrode-semiconductor rectifiers |
-
2011
- 2011-08-31 US US13/222,249 patent/US8816468B2/en active Active
- 2011-10-18 TW TW100137738A patent/TWI566422B/zh active
- 2011-10-20 KR KR1020137012458A patent/KR101987009B1/ko active Active
- 2011-10-20 JP JP2013535073A patent/JP5989652B2/ja active Active
- 2011-10-20 EP EP11835119.6A patent/EP2630663B1/en active Active
- 2011-10-20 CN CN201180050938.9A patent/CN103180961B/zh active Active
- 2011-10-20 WO PCT/US2011/057012 patent/WO2012054682A2/en not_active Ceased
-
2014
- 2014-08-14 US US14/459,599 patent/US20140357059A1/en not_active Abandoned
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2016
- 2016-08-08 JP JP2016155375A patent/JP6471126B2/ja active Active