TWI566422B - 改良之蕭基整流器 - Google Patents

改良之蕭基整流器 Download PDF

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Publication number
TWI566422B
TWI566422B TW100137738A TW100137738A TWI566422B TW I566422 B TWI566422 B TW I566422B TW 100137738 A TW100137738 A TW 100137738A TW 100137738 A TW100137738 A TW 100137738A TW I566422 B TWI566422 B TW I566422B
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TW
Taiwan
Prior art keywords
layer
type
trench
substrate
rectifier
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TW100137738A
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English (en)
Chinese (zh)
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TW201238059A (en
Inventor
許志維
佛洛林 優卓亞
林意茵
Original Assignee
微協通用半導體有限責任公司
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Publication of TW201238059A publication Critical patent/TW201238059A/zh
Application granted granted Critical
Publication of TWI566422B publication Critical patent/TWI566422B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/01—Manufacture or treatment
    • H10D8/051—Manufacture or treatment of Schottky diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/50—PIN diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H10D8/605—Schottky-barrier diodes  of the trench conductor-insulator-semiconductor barrier type, e.g. trench MOS barrier Schottky rectifiers [TMBS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electrodes Of Semiconductors (AREA)
TW100137738A 2010-10-21 2011-10-18 改良之蕭基整流器 TWI566422B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40529310P 2010-10-21 2010-10-21
US13/222,249 US8816468B2 (en) 2010-10-21 2011-08-31 Schottky rectifier

Publications (2)

Publication Number Publication Date
TW201238059A TW201238059A (en) 2012-09-16
TWI566422B true TWI566422B (zh) 2017-01-11

Family

ID=45972289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100137738A TWI566422B (zh) 2010-10-21 2011-10-18 改良之蕭基整流器

Country Status (7)

Country Link
US (2) US8816468B2 (enExample)
EP (1) EP2630663B1 (enExample)
JP (2) JP5989652B2 (enExample)
KR (1) KR101987009B1 (enExample)
CN (1) CN103180961B (enExample)
TW (1) TWI566422B (enExample)
WO (1) WO2012054682A2 (enExample)

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US9018698B2 (en) * 2012-11-16 2015-04-28 Vishay General Semiconductor Llc Trench-based device with improved trench protection
US8981381B2 (en) 2012-11-16 2015-03-17 Vishay General Semiconductor Llc GaN-based Schottky diode having dual metal, partially recessed electrode
US9716151B2 (en) * 2013-09-24 2017-07-25 Semiconductor Components Industries, Llc Schottky device having conductive trenches and a multi-concentration doping profile therebetween
CN104795452B (zh) * 2014-01-16 2018-04-27 上海韦尔半导体股份有限公司 肖特基整流器及其制作方法
CN103943688B (zh) * 2014-04-21 2017-06-13 中航（重庆）微电子有限公司 一种肖特基势垒二极管器件结构及其制作方法
DE102015204137A1 (de) * 2015-03-09 2016-09-15 Robert Bosch Gmbh Halbleitervorrichtung mit einer Trench-Schottky-Barrier-Schottky-Diode
DE102015204138A1 (de) * 2015-03-09 2016-09-15 Robert Bosch Gmbh Halbleitervorrichtung mit einer Trench-MOS-Barrier-Schottky-Diode
EP3067935A1 (en) * 2015-03-10 2016-09-14 ABB Technology AG Power semiconductor rectifier with controllable on-state voltage
CN107591318B (zh) * 2016-07-07 2020-08-07 北大方正集团有限公司 沟槽肖特基器件的制作方法
CN106024915B (zh) * 2016-07-25 2019-01-01 电子科技大学 一种超级结肖特基二极管
JP6742925B2 (ja) * 2017-01-18 2020-08-19 株式会社 日立パワーデバイス 半導体装置、及びそれを用いた電力変換装置
CN107946371B (zh) * 2017-01-24 2024-04-05 重庆中科渝芯电子有限公司 一种肖特基势垒接触的超势垒整流器及其制造方法
CN107946301A (zh) * 2017-02-24 2018-04-20 重庆中科渝芯电子有限公司 一种肖特基势垒接触的沟槽型超势垒整流器及其制造方法
CN109148605B (zh) * 2017-06-19 2022-02-18 比亚迪半导体股份有限公司 快恢复二极管及制备方法、电子设备
EP3654387A4 (en) * 2017-07-08 2021-03-31 Flosfia Inc. SEMICONDUCTOR COMPONENT
US10424677B2 (en) * 2017-08-31 2019-09-24 Littelfuse, Inc. Charge carrier extraction inverse diode
CN108010910A (zh) * 2017-11-21 2018-05-08 重庆大学 一种沟槽型肖特基接触超级势垒整流器及其制作方法
CN109962097A (zh) * 2017-12-26 2019-07-02 比亚迪股份有限公司 二极管器件及其制造工艺
WO2019155768A1 (ja) * 2018-02-09 2019-08-15 三菱電機株式会社 電力用半導体装置
US10608122B2 (en) 2018-03-13 2020-03-31 Semicondutor Components Industries, Llc Schottky device and method of manufacture
US10692988B2 (en) 2018-11-26 2020-06-23 Infineon Technologies Austria Ag Semiconductor device having integrated MOS-gated or Schottky diodes
CN109786472A (zh) * 2019-03-01 2019-05-21 重庆平伟实业股份有限公司 一种功率半导体器件
TW202038473A (zh) * 2019-04-10 2020-10-16 台灣茂矽電子股份有限公司 二極體結構及其製造方法
CN111816693A (zh) * 2019-04-10 2020-10-23 台湾茂矽电子股份有限公司 二极管结构及其制造方法
US11532758B2 (en) 2019-09-24 2022-12-20 Texas Instruments Incorporated Low leakage Schottky diode
CN114300543B (zh) * 2022-03-10 2022-06-07 安建科技(深圳)有限公司 一种电子抽取型续流二极管器件及其制备方法
CN115312591B (zh) * 2022-10-10 2022-12-23 深圳市威兆半导体股份有限公司 一种快恢复二极管及其制备方法
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Also Published As

Publication number Publication date
JP6471126B2 (ja) 2019-02-13
KR20130093126A (ko) 2013-08-21
WO2012054682A2 (en) 2012-04-26
US20140357059A1 (en) 2014-12-04
EP2630663A2 (en) 2013-08-28
CN103180961A (zh) 2013-06-26
US8816468B2 (en) 2014-08-26
KR101987009B1 (ko) 2019-06-10
TW201238059A (en) 2012-09-16
JP2016197753A (ja) 2016-11-24
CN103180961B (zh) 2016-02-17
JP5989652B2 (ja) 2016-09-07
EP2630663A4 (en) 2014-10-01
WO2012054682A3 (en) 2012-06-21
JP2013545295A (ja) 2013-12-19
EP2630663B1 (en) 2016-10-19
US20120098082A1 (en) 2012-04-26

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