JP2009521817A5 - - Google Patents
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- Publication number
- JP2009521817A5 JP2009521817A5 JP2008548658A JP2008548658A JP2009521817A5 JP 2009521817 A5 JP2009521817 A5 JP 2009521817A5 JP 2008548658 A JP2008548658 A JP 2008548658A JP 2008548658 A JP2008548658 A JP 2008548658A JP 2009521817 A5 JP2009521817 A5 JP 2009521817A5
- Authority
- JP
- Japan
- Prior art keywords
- rectifier
- lightly doped
- trenches
- metal layer
- polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 4
- 230000004888 barrier function Effects 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/320,313 | 2005-12-27 | ||
| US11/320,313 US7696598B2 (en) | 2005-12-27 | 2005-12-27 | Ultrafast recovery diode |
| PCT/US2006/049118 WO2007076056A2 (en) | 2005-12-27 | 2006-12-19 | Ultrafast recovery diode |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012043607A Division JP5704652B2 (ja) | 2005-12-27 | 2012-02-29 | 超高速リカバリダイオード |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009521817A JP2009521817A (ja) | 2009-06-04 |
| JP2009521817A5 true JP2009521817A5 (enExample) | 2009-12-17 |
| JP5059025B2 JP5059025B2 (ja) | 2012-10-24 |
Family
ID=38048000
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008548658A Expired - Fee Related JP5059025B2 (ja) | 2005-12-27 | 2006-12-19 | 超高速リカバリダイオード |
| JP2012043607A Expired - Fee Related JP5704652B2 (ja) | 2005-12-27 | 2012-02-29 | 超高速リカバリダイオード |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012043607A Expired - Fee Related JP5704652B2 (ja) | 2005-12-27 | 2012-02-29 | 超高速リカバリダイオード |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7696598B2 (enExample) |
| JP (2) | JP5059025B2 (enExample) |
| CN (2) | CN102683428A (enExample) |
| TW (1) | TWI381532B (enExample) |
| WO (1) | WO2007076056A2 (enExample) |
Families Citing this family (51)
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| US8026568B2 (en) | 2005-11-15 | 2011-09-27 | Velox Semiconductor Corporation | Second Schottky contact metal layer to improve GaN Schottky diode performance |
| US7859037B2 (en) | 2007-02-16 | 2010-12-28 | Power Integrations, Inc. | Checkerboarded high-voltage vertical transistor layout |
| US7557406B2 (en) * | 2007-02-16 | 2009-07-07 | Power Integrations, Inc. | Segmented pillar layout for a high-voltage vertical transistor |
| US7595523B2 (en) * | 2007-02-16 | 2009-09-29 | Power Integrations, Inc. | Gate pullback at ends of high-voltage vertical transistor structure |
| US8653583B2 (en) * | 2007-02-16 | 2014-02-18 | Power Integrations, Inc. | Sensing FET integrated with a high-voltage transistor |
| US7939853B2 (en) * | 2007-03-20 | 2011-05-10 | Power Integrations, Inc. | Termination and contact structures for a high voltage GaN-based heterojunction transistor |
| US8212281B2 (en) * | 2008-01-16 | 2012-07-03 | Micron Technology, Inc. | 3-D and 3-D schottky diode for cross-point, variable-resistance material memories, processes of forming same, and methods of using same |
| US8310845B2 (en) | 2010-02-10 | 2012-11-13 | Power Integrations, Inc. | Power supply circuit with a control terminal for different functional modes of operation |
| CN101866855B (zh) * | 2010-06-07 | 2011-08-31 | 北京时代民芯科技有限公司 | 一种高压功率快恢复平面二极管芯片制造方法 |
| JP5730521B2 (ja) * | 2010-09-08 | 2015-06-10 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
| CN101976687B (zh) * | 2010-10-21 | 2012-04-25 | 电子科技大学 | 一种低功耗快恢复金属氧化物半导体二极管 |
| US8580667B2 (en) * | 2010-12-14 | 2013-11-12 | Alpha And Omega Semiconductor Incorporated | Self aligned trench MOSFET with integrated diode |
| CN102222701A (zh) * | 2011-06-23 | 2011-10-19 | 哈尔滨工程大学 | 一种沟槽结构肖特基器件 |
| DE102011080258A1 (de) * | 2011-08-02 | 2013-02-07 | Robert Bosch Gmbh | Super-Junction-Schottky-Oxid-PiN-Diode |
| US8633094B2 (en) | 2011-12-01 | 2014-01-21 | Power Integrations, Inc. | GaN high voltage HFET with passivation plus gate dielectric multilayer structure |
| CN102437200B (zh) * | 2011-12-06 | 2017-03-15 | 上海集成电路研发中心有限公司 | 一种frd器件结构及其制造方法 |
| US8940620B2 (en) | 2011-12-15 | 2015-01-27 | Power Integrations, Inc. | Composite wafer for fabrication of semiconductor devices |
| TWI492311B (zh) * | 2012-03-30 | 2015-07-11 | Richtek Technology Corp | 蕭特基位障二極體及其製造方法 |
| CN102723369B (zh) * | 2012-06-12 | 2014-12-10 | 电子科技大学 | 一种具有低导通压降的P-i-N二极管 |
| CN103579365A (zh) * | 2012-07-24 | 2014-02-12 | 杭州恩能科技有限公司 | 一种新型二极管器件 |
| CN103579364A (zh) * | 2012-07-24 | 2014-02-12 | 杭州恩能科技有限公司 | 一种新型平面型二极管器件 |
| US8928037B2 (en) | 2013-02-28 | 2015-01-06 | Power Integrations, Inc. | Heterostructure power transistor with AlSiN passivation layer |
| US9331197B2 (en) | 2013-08-08 | 2016-05-03 | Cree, Inc. | Vertical power transistor device |
| US9455621B2 (en) | 2013-08-28 | 2016-09-27 | Power Integrations, Inc. | Controller IC with zero-crossing detector and capacitor discharge switching element |
| US9029974B2 (en) * | 2013-09-11 | 2015-05-12 | Infineon Technologies Ag | Semiconductor device, junction field effect transistor and vertical field effect transistor |
| US10868169B2 (en) | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
| US10600903B2 (en) | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
| US20150084063A1 (en) * | 2013-09-20 | 2015-03-26 | Cree, Inc. | Semiconductor device with a current spreading layer |
| US9318597B2 (en) | 2013-09-20 | 2016-04-19 | Cree, Inc. | Layout configurations for integrating schottky contacts into a power transistor device |
| CN104701367A (zh) * | 2013-12-06 | 2015-06-10 | 上海华虹宏力半导体制造有限公司 | 稳流管及制造方法 |
| US9543396B2 (en) | 2013-12-13 | 2017-01-10 | Power Integrations, Inc. | Vertical transistor device structure with cylindrically-shaped regions |
| US10325988B2 (en) | 2013-12-13 | 2019-06-18 | Power Integrations, Inc. | Vertical transistor device structure with cylindrically-shaped field plates |
| JP6287377B2 (ja) * | 2014-03-11 | 2018-03-07 | 住友電気工業株式会社 | ワイドバンドギャップ半導体装置 |
| JP6539026B2 (ja) * | 2014-08-22 | 2019-07-03 | 日産自動車株式会社 | 半導体装置及びその製造方法 |
| CN104269445B (zh) * | 2014-10-11 | 2017-11-10 | 丽晶美能(北京)电子技术有限公司 | 快恢复二极管及快恢复二极管的制作方法 |
| CN106033781A (zh) * | 2015-03-16 | 2016-10-19 | 中航(重庆)微电子有限公司 | 肖特基势垒二极管及其制备方法 |
| US9602009B1 (en) | 2015-12-08 | 2017-03-21 | Power Integrations, Inc. | Low voltage, closed loop controlled energy storage circuit |
| US9629218B1 (en) | 2015-12-28 | 2017-04-18 | Power Integrations, Inc. | Thermal protection for LED bleeder in fault condition |
| JP6787690B2 (ja) | 2016-05-19 | 2020-11-18 | ローム株式会社 | 高速ダイオード及びその製造方法 |
| CN107731891A (zh) * | 2016-08-14 | 2018-02-23 | 朱江 | 一种沟槽肖特基半导体装置 |
| CN106784021A (zh) * | 2016-12-15 | 2017-05-31 | 东莞市联洲知识产权运营管理有限公司 | 一种改进的沟槽式肖特基整流器件及其制造方法 |
| US11749758B1 (en) | 2019-11-05 | 2023-09-05 | Semiq Incorporated | Silicon carbide junction barrier schottky diode with wave-shaped regions |
| US11469333B1 (en) | 2020-02-19 | 2022-10-11 | Semiq Incorporated | Counter-doped silicon carbide Schottky barrier diode |
| JP2022159760A (ja) * | 2021-04-05 | 2022-10-18 | ローム株式会社 | 半導体装置 |
| CN113659014B (zh) * | 2021-10-20 | 2022-01-18 | 四川洪芯微科技有限公司 | 一种含有阴极短接槽栅结构的功率二极管 |
| CN115132726B (zh) * | 2022-09-02 | 2022-11-29 | 深圳芯能半导体技术有限公司 | 快恢复功率器件的结构、制造方法及电子设备 |
| CN115172445B (zh) * | 2022-09-02 | 2022-11-29 | 深圳芯能半导体技术有限公司 | 快恢复功率器件的结构、制造方法及电子设备 |
| CN115312591B (zh) * | 2022-10-10 | 2022-12-23 | 深圳市威兆半导体股份有限公司 | 一种快恢复二极管及其制备方法 |
| CN115312581B (zh) * | 2022-10-10 | 2023-01-03 | 深圳市威兆半导体股份有限公司 | 快恢复二极管及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5637683A (en) * | 1979-09-04 | 1981-04-11 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor rectifying device |
| US4871686A (en) * | 1988-03-28 | 1989-10-03 | Motorola, Inc. | Integrated Schottky diode and transistor |
| JPH022179A (ja) * | 1988-06-13 | 1990-01-08 | Fujitsu Ltd | メタル・セミコンダクタ・fet |
| US4982260A (en) * | 1989-10-02 | 1991-01-01 | General Electric Company | Power rectifier with trenches |
| JPH07254718A (ja) * | 1992-12-24 | 1995-10-03 | Nippon Inter Electronics Corp | 半導体装置 |
| US5612567A (en) * | 1996-05-13 | 1997-03-18 | North Carolina State University | Schottky barrier rectifiers and methods of forming same |
| JP3618517B2 (ja) * | 1997-06-18 | 2005-02-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| US6936892B2 (en) * | 1998-07-24 | 2005-08-30 | Fuji Electric Co., Ltd. | Semiconductor device with alternating conductivity type layer and method of manufacturing the same |
| JP3988262B2 (ja) * | 1998-07-24 | 2007-10-10 | 富士電機デバイステクノロジー株式会社 | 縦型超接合半導体素子およびその製造方法 |
| US6252288B1 (en) * | 1999-01-19 | 2001-06-26 | Rockwell Science Center, Llc | High power trench-based rectifier with improved reverse breakdown characteristic |
| CN1284240C (zh) * | 1999-07-27 | 2006-11-08 | 北京工业大学 | 具有延伸肖特基结的高速高压功率集成器件 |
| US6252258B1 (en) * | 1999-08-10 | 2001-06-26 | Rockwell Science Center Llc | High power rectifier |
| TW565630B (en) * | 1999-09-07 | 2003-12-11 | Sixon Inc | SiC wafer, SiC semiconductor device and method for manufacturing SiC wafer |
| US7186609B2 (en) * | 1999-12-30 | 2007-03-06 | Siliconix Incorporated | Method of fabricating trench junction barrier rectifier |
| JP2002076371A (ja) * | 2000-06-12 | 2002-03-15 | Fuji Electric Co Ltd | 半導体装置 |
| JP2002009082A (ja) * | 2000-06-21 | 2002-01-11 | Fuji Electric Co Ltd | 半導体装置および半導体装置の製造方法 |
| JP4770009B2 (ja) * | 2000-09-05 | 2011-09-07 | 富士電機株式会社 | 超接合ショットキーダイオード |
| JP3551154B2 (ja) * | 2001-02-20 | 2004-08-04 | サンケン電気株式会社 | 半導体素子 |
| JP4100071B2 (ja) * | 2001-08-02 | 2008-06-11 | 富士電機デバイステクノロジー株式会社 | 半導体装置 |
| JP3998454B2 (ja) * | 2001-10-31 | 2007-10-24 | 株式会社東芝 | 電力用半導体装置 |
| US6841812B2 (en) * | 2001-11-09 | 2005-01-11 | United Silicon Carbide, Inc. | Double-gated vertical junction field effect power transistor |
| JP2004014662A (ja) * | 2002-06-05 | 2004-01-15 | Sanken Electric Co Ltd | ショットキバリアを有する半導体装置 |
| US7235827B2 (en) * | 2004-04-20 | 2007-06-26 | Power-One, Inc. | Vertical power JFET with low on-resistance for high voltage applications |
| US20050242411A1 (en) * | 2004-04-29 | 2005-11-03 | Hsuan Tso | [superjunction schottky device and fabrication thereof] |
| JP2006295062A (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co Ltd | 半導体装置 |
-
2005
- 2005-12-27 US US11/320,313 patent/US7696598B2/en not_active Expired - Fee Related
-
2006
- 2006-12-19 WO PCT/US2006/049118 patent/WO2007076056A2/en not_active Ceased
- 2006-12-19 CN CN2012101351735A patent/CN102683428A/zh active Pending
- 2006-12-19 CN CN2006800513966A patent/CN101366124B/zh not_active Expired - Fee Related
- 2006-12-19 JP JP2008548658A patent/JP5059025B2/ja not_active Expired - Fee Related
- 2006-12-27 TW TW095149314A patent/TWI381532B/zh not_active IP Right Cessation
-
2012
- 2012-02-29 JP JP2012043607A patent/JP5704652B2/ja not_active Expired - Fee Related
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