JP2010199589A - イメージセンサー装置および半導体イメージセンサー装置の製造方法 - Google Patents
イメージセンサー装置および半導体イメージセンサー装置の製造方法 Download PDFInfo
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- 239000011521 glass Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- Computer Hardware Design (AREA)
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Abstract
【解決手段】半導体イメージセンサー装置は、第一および第二半導体基板を含む。画素アレイと制御回路とが、第一基板の第一表面中に形成される。相互接続層が、第一基板の第一表面の上に形成され、制御回路を画素アレイに電気的に接続する。頂部導電層が、相互接続層を介して制御回路または画素アレイの少なくとも一つと電気的接続を有するように、相互接続層の上に形成される。第二基板の表面は、頂部導電層に接合される。導電性スルーシリコンビア(TSV)は第二基板を貫通し、頂部導電層と電気的接続を有する。第二基板の反対の表面上に端子が形成され、TSVに電気的に接続される。
【選択図】図3
Description
Claims (11)
- イメージセンサー装置であって、
画素領域と回路領域とを有する装置基板と、
前記装置基板上かつ前記画素領域中に形成される画素アレイと、
前記装置基板上かつ前記回路領域中に形成される制御回路と、
前記画素アレイおよび前記制御回路の上に形成され、前記制御回路を前記画素アレイに電気的に接続する相互接続構造と、
前記相互接続構造上に形成される導電層とを含み、
前記導電層は前記画素領域に形成される部分を含み、前記部分はパッドとして機能する、イメージセンサー装置。 - 前記パッドは一体である、請求項1に記載のイメージセンサー装置。
- 前記導電層の上に存在する担体基板と、
前記担体基板を貫通し、前記導電層に電気的に接続される導電ビアとをさらに含む、請求項1に記載のイメージセンサー装置。 - 前記導電ビアは、前記画素領域に対応して設置される、請求項3に記載のイメージセンサー装置。
- 前記導電ビアは、前記導電層中に延伸する、請求項3に記載のイメージセンサー装置。
- 前記導電ビアの側壁を取り囲む絶縁層をさらに含む、請求項3に記載のイメージセンサー装置。
- 前記装置基板は、前側と後側とを有し、前記イメージセンサー装置は、前記後側から照射され、前記画素アレイは、前記装置基板の前記前側上に形成される、請求項1に記載のイメージセンサー装置。
- 半導体イメージセンサー装置の製造方法であって、
装置基板上に画素アレイを形成するステップを含み、前記画素アレイは前記装置基板の画素領域を規定し、前記方法はさらに、
前記装置基板上に制御回路を形成するステップを含み、前記制御回路は前記装置基板の回路領域を規定し、前記方法はさらに、
前記画素アレイおよび前記制御回路の上に、前記制御回路を前記画素アレイに電気的に接続する相互接続構造を形成するステップと、
前記相互接続構造上に導電層を形成するステップとを含み、
前記導電層は、前記画素領域に形成され、パッドとして機能する部分を含む、半導体イメージセンサー装置の製造方法。 - 前記パッドは、一体の導電体から形成される、請求項8に記載の半導体イメージセンサー装置の製造方法。
- 前記導電層に担体基板を接合するステップと、
前記担体基板を貫通し、前記導電層に電気的に接続される導電ビアを形成するステップとをさらに含み、前記導電ビアは前記パッドの上に形成され、絶縁層が前記導電ビアの側壁上に形成される、請求項8に記載の半導体イメージセンサー装置の製造方法。 - 前記装置基板は、前側と後側とを有し、前記イメージセンサー装置は、前記後側から照射され、前記画素アレイは、前記装置基板の前記前側上に形成される、請求項8に記載の半導体イメージセンサー装置の製造方法。
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US15494009P | 2009-02-24 | 2009-02-24 | |
US61/154,940 | 2009-02-24 | ||
US12/708,167 US9142586B2 (en) | 2009-02-24 | 2010-02-18 | Pad design for backside illuminated image sensor |
US12/708,167 | 2010-02-18 |
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JP2010199589A true JP2010199589A (ja) | 2010-09-09 |
JP5618348B2 JP5618348B2 (ja) | 2014-11-05 |
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US (4) | US9142586B2 (ja) |
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TW (1) | TWI493697B (ja) |
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KR20190116288A (ko) | 2017-02-09 | 2019-10-14 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 반도체 장치, 및 반도체 장치의 제조 방법 |
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US20100213560A1 (en) | 2010-08-26 |
US9142586B2 (en) | 2015-09-22 |
JP5618348B2 (ja) | 2014-11-05 |
KR20100097073A (ko) | 2010-09-02 |
US20160005780A1 (en) | 2016-01-07 |
TWI493697B (zh) | 2015-07-21 |
KR101128124B1 (ko) | 2012-03-26 |
TW201042757A (en) | 2010-12-01 |
US20180026069A1 (en) | 2018-01-25 |
US10290671B2 (en) | 2019-05-14 |
US10879297B2 (en) | 2020-12-29 |
US20190244999A1 (en) | 2019-08-08 |
US9773828B2 (en) | 2017-09-26 |
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