JP2013038391A - 集積回路構造及び裏面照射型イメージセンサデバイス - Google Patents
集積回路構造及び裏面照射型イメージセンサデバイス Download PDFInfo
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- JP2013038391A JP2013038391A JP2012126896A JP2012126896A JP2013038391A JP 2013038391 A JP2013038391 A JP 2013038391A JP 2012126896 A JP2012126896 A JP 2012126896A JP 2012126896 A JP2012126896 A JP 2012126896A JP 2013038391 A JP2013038391 A JP 2013038391A
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Abstract
【解決手段】前面及び背面を含む半導体基板、前記半導体基板の前記前面に配置される低k誘電体層、前記低k誘電体層に配置される非低k誘電体層、前記非低k誘電体層に配置される金属パッド、前記半導体基板の背面から延伸し、前記半導体基板、前記低k誘電体層、及び低k誘電体層を貫通し、前記金属パッドの表面を露出する開口、及び前記開口の側壁及び底部上に形成され、前記開口の底部は、前記金属パッドの前記露出された表面を部分的に覆う保護層を含む集積回路構造。
【選択図】図6
Description
22 ウエハ
24 イメージセンサ
25 層間絶縁層(ILD)
26 半導体基板
26A、26B 表面
28 相互接続構造
30、38 誘電体層
32 金属線/パッド
34 ビア
36 誘電パッド(シャロートレンチアイソレーション(STI)パッド)
40、46 接着層
44 金属構造体
44A 金属パッド
44B 金属線44
47、62 保護層
48、56 バッファ酸化層
50 マスク
55 金属遮蔽層
56 バッファ酸化層
68 ワイヤボンドバンプ
70 光
M1、M2、M3、M4、Mtop 金属層
Claims (10)
- 前面及び背面を含む半導体基板、
前記半導体基板の前記前面に配置される低k誘電体層、
前記低k誘電体層に配置される非低k誘電体層、
前記非低k誘電体層に配置される金属パッド、
前記半導体基板の背面から延伸し、前記半導体基板、前記低k誘電体層、及び低k誘電体層を貫通し、前記金属パッドの表面を露出する開口、及び
前記開口の側壁及び底部上に形成され、前記開口の底部は、前記金属パッドの前記露出された表面を部分的に覆う保護層を含む集積回路構造。 - 前記半導体基板の前面から前記半導体基板内に延伸し、前記開口がそれを更に貫通する誘電パッド、及び
前記半導体基板の前記前面に配置されたイメージセンサを更に含む請求項1に記載の集積回路構造。 - 前記開口に配置されて、前記金属パッドに電気的接続され、前記金属パッドと物理的接触しているバンプを更に含む請求項1に記載の集積回路構造。
- 前記半導体基板の前記背面に金属遮蔽を更に含み、前記保護層が延伸し、前記金属遮蔽層を覆う請求項1に記載の集積回路構造。
- 前記金属パッドと前記非低k誘電体層との間に接着層を更に含み、前記開口が前記接着層内に延伸する請求項1に記載の集積回路構造。
- 半導体基板、
前記半導体基板の前面から前記半導体基板内に延伸するシャロートレンチアイソレーションパッド、
前記半導体基板の前記前面に配置されるイメージセンサ、
前記イメージセンサ及び前記半導体基板の前面の上方に配置された複数の誘電体層、
前記複数の誘電体層の上方に配置された金属パッド、
前記半導体基板の背面から前記前面に延伸し、前記シャロートレンチアイソレーションパッド及び前記複数の誘電体層を通過し、前記金属パッドの一部を露出する開口、及び
前記開口の側壁及び底部に形成され、前記開口の底部にある前記保護層が前記金属パッドの前記露出された部分を部分的に覆う保護層を含む集積回路構造。 - 前記複数の誘電体層は、前記半導体基板の前記前面上に少なくとも1つの低k誘電体層、及び前記少なくとも1つの低k誘電体層に第1非低k誘電体層を含む請求項6に記載の集積回路構造。
- 前記第1非低k誘電体層上の第2非低k誘電体層、
前記金属パッドと前記第1非低k誘電体層との間の第1接着層、及び
前記金属パッドと前記第2非低k誘電体層との間の第2接着層を更に含む請求項7に記載の集積回路構造。 - 前面及び背面を含む半導体基板、
前記半導体基板の前記前面に配置される複数の誘電体層、
前記複数の誘電体層に配置される金属パッド、
前記半導体基板の背面から延伸し、前記半導体基板及び複数の誘電体層を貫通し、前記金属パッドの一部を露出する開口、及び
前記開口に形成され、前記金属パッドに電気的接続するバンプを含む裏面照射型イメージセンサデバイス。 - 前記バンプと前記複数の誘電体層との間に配置された保護層、
前記半導体基板の前記前面に形成され、前記複数の誘電体層によって覆われるイメージセンサ、
前記半導体基板の前記前面に形成され、前記開口がシャロートレンチアイソレーションを貫通するシャロートレンチアイソレーション、及び
前記半導体基板の背面に配置された金属遮蔽層を更に含む請求項9に記載の裏面照射型イメージセンサデバイス。
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US13/198,111 US9013022B2 (en) | 2011-08-04 | 2011-08-04 | Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014204048A (ja) * | 2013-04-08 | 2014-10-27 | キヤノン株式会社 | 固体撮像装置、その製造方法及びカメラ |
US9312295B2 (en) | 2014-02-28 | 2016-04-12 | Renesas Electronics Corporation | Semiconductor device and a manufacturing method thereof |
JP2017120912A (ja) * | 2015-12-29 | 2017-07-06 | 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. | Bsi接合能力改善のためのパッド領域下のサポート構造 |
JP2018022905A (ja) * | 2015-01-09 | 2018-02-08 | 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. | 半導体構造およびそれを製造する方法 |
JP2022176875A (ja) * | 2021-05-17 | 2022-11-30 | 台湾積體電路製造股▲ふん▼有限公司 | 集積回路チップ及びその形成方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8987855B2 (en) * | 2011-08-04 | 2015-03-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad structures formed in double openings in dielectric layers |
US9013022B2 (en) | 2011-08-04 | 2015-04-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips |
US9006900B2 (en) * | 2013-03-11 | 2015-04-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same |
CN104103511B (zh) * | 2013-04-03 | 2017-03-08 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法 |
KR20140141400A (ko) * | 2013-05-29 | 2014-12-10 | 삼성전자주식회사 | 디스플레이 장치 |
US9337225B2 (en) * | 2013-09-13 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
CN104637961B (zh) * | 2013-11-13 | 2018-09-11 | 联华电子股份有限公司 | 半导体结构及其制造方法 |
US9117879B2 (en) * | 2013-12-30 | 2015-08-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
EP3032583B1 (en) | 2014-12-08 | 2020-03-04 | ams AG | Integrated optical sensor and method of producing an integrated optical sensor |
KR102437163B1 (ko) | 2015-08-07 | 2022-08-29 | 삼성전자주식회사 | 반도체 소자 |
FR3059143B1 (fr) * | 2016-11-24 | 2019-05-31 | Stmicroelectronics (Crolles 2) Sas | Puce de capteur d'image |
CN107204349A (zh) * | 2017-07-19 | 2017-09-26 | 武汉新芯集成电路制造有限公司 | 一种铝垫放置方法以及铝垫结构 |
US20190027531A1 (en) * | 2017-07-19 | 2019-01-24 | Omnivision Technologies, Inc. | Image sensor module having protective structure |
JP2019129215A (ja) * | 2018-01-24 | 2019-08-01 | キヤノン株式会社 | 撮像装置および表示装置 |
US10707089B2 (en) * | 2018-03-27 | 2020-07-07 | Texas Instruments Incorporated | Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby |
US11296038B2 (en) | 2018-04-03 | 2022-04-05 | Corning Incorporated | Precision structured glass article having EMI shielding and methods for making the same |
US10707358B2 (en) * | 2018-07-04 | 2020-07-07 | Globalfoundries Singapore Pte. Ltd. | Selective shielding of ambient light at chip level |
US11227836B2 (en) | 2018-10-23 | 2022-01-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad structure for enhanced bondability |
KR102639539B1 (ko) | 2018-11-05 | 2024-02-26 | 삼성전자주식회사 | 이미지 센서 및 이의 형성 방법 |
US11211352B2 (en) * | 2019-10-01 | 2021-12-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion |
US20210143114A1 (en) * | 2019-11-08 | 2021-05-13 | Nanya Technology Corporation | Semiconductor device with edge-protecting spacers over bonding pad |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004095611A (ja) * | 2002-08-29 | 2004-03-25 | Fujitsu Ltd | 半導体装置およびその製造方法 |
JP2005210060A (ja) * | 2003-12-26 | 2005-08-04 | Fujitsu Ltd | 半導体装置とその製造方法 |
JP2009176777A (ja) * | 2008-01-21 | 2009-08-06 | Sony Corp | 固体撮像装置とその製造方法、及びカメラ |
JP2009252949A (ja) * | 2008-04-04 | 2009-10-29 | Canon Inc | 固体撮像装置及びその製造方法 |
JP2009277732A (ja) * | 2008-05-12 | 2009-11-26 | Sony Corp | 固体撮像装置の製造方法 |
JP2011003645A (ja) * | 2009-06-17 | 2011-01-06 | Sharp Corp | 半導体装置およびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100533166B1 (ko) * | 2000-08-18 | 2005-12-02 | 매그나칩 반도체 유한회사 | 마이크로렌즈 보호용 저온산화막을 갖는 씨모스이미지센서및 그 제조방법 |
US20050142715A1 (en) | 2003-12-26 | 2005-06-30 | Fujitsu Limited | Semiconductor device with high dielectric constant insulator and its manufacture |
US9038973B2 (en) * | 2007-07-12 | 2015-05-26 | Panduit Corp. | Accessory bracket |
US7659595B2 (en) | 2007-07-16 | 2010-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded bonding pad for backside illuminated image sensor |
US8212328B2 (en) * | 2007-12-05 | 2012-07-03 | Intellectual Ventures Ii Llc | Backside illuminated image sensor |
KR100882991B1 (ko) | 2008-08-06 | 2009-02-12 | 주식회사 동부하이텍 | 후면 수광 이미지센서의 제조방법 |
JP4655137B2 (ja) | 2008-10-30 | 2011-03-23 | ソニー株式会社 | 半導体装置 |
US9013022B2 (en) | 2011-08-04 | 2015-04-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips |
-
2011
- 2011-08-04 US US13/198,111 patent/US9013022B2/en active Active
- 2011-10-05 TW TW100136015A patent/TWI487082B/zh active
- 2011-10-17 KR KR20110106062A patent/KR101430793B1/ko active IP Right Grant
- 2011-11-09 CN CN201110353065.0A patent/CN102915991B/zh active Active
-
2012
- 2012-06-04 JP JP2012126896A patent/JP5543992B2/ja active Active
-
2015
- 2015-04-20 US US14/691,243 patent/US9362329B2/en active Active
-
2016
- 2016-05-16 US US15/155,961 patent/US9653508B2/en active Active
-
2017
- 2017-05-15 US US15/595,510 patent/US10535696B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004095611A (ja) * | 2002-08-29 | 2004-03-25 | Fujitsu Ltd | 半導体装置およびその製造方法 |
JP2005210060A (ja) * | 2003-12-26 | 2005-08-04 | Fujitsu Ltd | 半導体装置とその製造方法 |
JP2009176777A (ja) * | 2008-01-21 | 2009-08-06 | Sony Corp | 固体撮像装置とその製造方法、及びカメラ |
JP2009252949A (ja) * | 2008-04-04 | 2009-10-29 | Canon Inc | 固体撮像装置及びその製造方法 |
JP2009277732A (ja) * | 2008-05-12 | 2009-11-26 | Sony Corp | 固体撮像装置の製造方法 |
JP2011003645A (ja) * | 2009-06-17 | 2011-01-06 | Sharp Corp | 半導体装置およびその製造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022176875A (ja) * | 2021-05-17 | 2022-11-30 | 台湾積體電路製造股▲ふん▼有限公司 | 集積回路チップ及びその形成方法 |
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CN102915991A (zh) | 2013-02-06 |
CN102915991B (zh) | 2015-08-26 |
US9013022B2 (en) | 2015-04-21 |
TWI487082B (zh) | 2015-06-01 |
KR20130016017A (ko) | 2013-02-14 |
US20170250215A1 (en) | 2017-08-31 |
KR101430793B1 (ko) | 2014-08-18 |
US20130032916A1 (en) | 2013-02-07 |
US10535696B2 (en) | 2020-01-14 |
US20150228690A1 (en) | 2015-08-13 |
TW201308555A (zh) | 2013-02-16 |
US9653508B2 (en) | 2017-05-16 |
US20160260764A1 (en) | 2016-09-08 |
US9362329B2 (en) | 2016-06-07 |
JP5543992B2 (ja) | 2014-07-09 |
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