JP2022132350A - 固体撮像素子および製造方法、並びに電子機器 - Google Patents
固体撮像素子および製造方法、並びに電子機器 Download PDFInfo
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Abstract
Description
・自動停止等の安全運転や、運転者の状態の認識等のために、自動車の前方や後方、周囲、車内等を撮影する車載用センサ、走行車両や道路を監視する監視カメラ、車両間等の測距を行う測距センサ等の、交通の用に供される装置
・ユーザのジェスチャを撮影して、そのジェスチャに従った機器操作を行うために、TVや、冷蔵庫、エアーコンディショナ等の家電に供される装置
・内視鏡や、赤外光の受光による血管撮影を行う装置等の、医療やヘルスケアの用に供される装置
・防犯用途の監視カメラや、人物認証用途のカメラ等の、セキュリティの用に供される装置
・肌を撮影する肌測定器や、頭皮を撮影するマイクロスコープ等の、美容の用に供される装置
・スポーツ用途等向けのアクションカメラやウェアラブルカメラ等の、スポーツの用に供される装置
・畑や作物の状態を監視するためのカメラ等の、農業の用に供される装置
(1)
複数の画素が平面的に配置される画素領域が設けられる半導体基板と、
前記半導体基板に対して積層され、複数の前記画素に接続される配線が設けられる配線層と、
前記配線層に対して接合され、前記半導体基板を支持する支持基板と
を備え、
前記配線層には、前記半導体基板を平面的に見て前記画素領域に重なり合う位置で、外部との電気的な接続に利用される複数の電極パッドが配置され、
前記支持基板には、複数の前記電極パッドに対応する箇所に貫通孔が設けられる
固体撮像素子。
(2)
前記配線層には、前記配線が多層構造で形成されており、前記配線よりも前記支持基板側に複数の前記電極パッドが配置される電極パッド層が設けられる
上記(1)に記載の固体撮像素子。
(3)
前記電極パッドは、前記配線と異なる導体により形成される
上記(1)または(2)に記載の固体撮像素子。
(4)
前記電極パッドは、前記配線層に多層構造で形成される前記配線の一部として、前記配線と同一の層に形成される
上記(1)に記載の固体撮像素子。
(5)
前記電極パッドは、前記配線と同一の導体により形成される
上記(1)または(4)に記載の固体撮像素子。
(6)
前記貫通孔の底面で前記電極パッドと電気的に接続され、前記貫通孔を通って前記支持基板の上面まで延在する貫通電極
をさらに備える上記(1)から(5)までのいずれかに記載の固体撮像素子。
(7)
前記貫通電極は、前記貫通孔を導体で埋め込むことにより形成される
上記(6)に記載の固体撮像素子。
(8)
前記貫通孔に絶縁膜を介して貫通電極となる導体が予め埋め込まれている前記支持基板と前記配線層とが互いの面どうしで接合されるとともに、前記貫通電極と前記電極パッドとが同一の導体どうしで接合される
上記(1)から(7)までのいずれかに記載の固体撮像素子。
(9)
前記支持基板を貫通しない深さで形成されたビアに前記導体が埋め込まれ、前記支持基板を薄肉化して前記導体を頭出しすることにより前記貫通電極が形成される
上記(8)に記載の固体撮像素子。
(10)
前記貫通電極に対応する前記支持基板の表面に電極パッドが配置される
上記(8)または(9)に記載の固体撮像素子。
(11)
前記電極パッドに電気的に接続されるように前記支持基板の表面に形成されるはんだボールを利用し、他の基板に対してフリップチップボンディングされる
上記(1)から(10)までのいずれかに記載の固体撮像素子。
(12)
前記支持基板を貫通して前記電極パッドに接続される貫通電極を形成した後に、前記半導体基板に対してカラーフィルタ層が積層される
上記(1)から(11)までのいずれかに記載の固体撮像素子。
(13)
複数の前記電極パッドは、前記半導体基板を平面的に見たときにグリッド状に配置される
上記(1)から(12)までのいずれかに記載の固体撮像素子。
(14)
前記半導体基板の裏面側から、前記画素が受光する光が照射される裏面照射型である
上記(1)から(12)までのいずれかに記載の固体撮像素子。
(15)
複数の画素が平面的に配置される画素領域が設けられる半導体基板と、
前記半導体基板に対して積層され、複数の前記画素に接続される配線が設けられる配線層と、
前記配線層に対して接合され、前記半導体基板を支持する支持基板と
を備える固体撮像素子の製造方法において、
前記配線層に、前記半導体基板を平面的に見て前記画素領域に重なり合う位置で、外部との電気的な接続に利用される複数の電極パッドを形成し、
前記支持基板に、複数の前記電極パッドに対応する箇所に貫通孔を形成する
工程を含む製造方法。
(16)
複数の画素が平面的に配置される画素領域が設けられる半導体基板と、
前記半導体基板に対して積層され、複数の前記画素に接続される配線が設けられる配線層と、
前記配線層に対して接合され、前記半導体基板を支持する支持基板と
を有し、
前記配線層には、前記半導体基板を平面的に見て前記画素領域に重なり合う位置で、外部との電気的な接続に利用される複数の電極パッドが配置され、
前記支持基板には、複数の前記電極パッドに対応する箇所に貫通孔が設けられる
固体撮像素子を備える電子機器。
Claims (16)
- 複数の画素が平面的に配置される画素領域が設けられる半導体基板と、
前記半導体基板に対して積層され、複数の前記画素に接続される配線が設けられる配線層と、
前記配線層に対して接合され、前記半導体基板を支持する支持基板と
を備え、
前記配線層には、前記半導体基板を平面的に見て前記画素領域に重なり合う位置で、外部との電気的な接続に利用される複数の電極パッドが配置され、
前記支持基板には、複数の前記電極パッドに対応する箇所に貫通孔が設けられ、
複数の前記電極パッド、および、複数の前記電極パッドまで開口するように前記支持基板を貫通して形成される複数の前記貫通孔が、前記半導体基板を平面的に見て、複数の行と複数の列とでそれぞれ略均等な間隔でグリッド状に配置される
固体撮像素子。 - 前記配線層には、前記配線が多層構造で形成されており、前記配線よりも前記支持基板側に複数の前記電極パッドが配置される電極パッド層が設けられる
請求項1に記載の固体撮像素子。 - 前記電極パッドは、前記配線と異なる導体により形成される
請求項2に記載の固体撮像素子。 - 前記電極パッドは、前記配線層に多層構造で形成される前記配線の一部として、前記配線と同一の層に形成される
請求項1に記載の固体撮像素子。 - 前記電極パッドは、前記配線と同一の導体により形成される
請求項4に記載の固体撮像素子。 - 前記貫通孔の底面で前記電極パッドと電気的に接続され、前記貫通孔を通って前記支持基板の上面まで延在する貫通電極
をさらに備える請求項1に記載の固体撮像素子。 - 前記貫通電極は、前記貫通孔を導体で埋め込むことにより形成される
請求項6に記載の固体撮像素子。 - 前記貫通孔に絶縁膜を介して貫通電極となる導体が予め埋め込まれている前記支持基板と前記配線層とが互いの面どうしで接合されるとともに、前記貫通電極と前記電極パッドとが同一の導体どうしで接合される
請求項1に記載の固体撮像素子。 - 前記支持基板を貫通しない深さで形成されたビアに前記導体が埋め込まれ、前記支持基板を薄肉化して前記導体を頭出しすることにより前記貫通電極が形成される
請求項8に記載の固体撮像素子。 - 前記貫通電極に対応する前記支持基板の表面に電極パッドが配置される
請求項8に記載の固体撮像素子。 - 前記電極パッドに電気的に接続されるように前記支持基板の表面に形成されるはんだボールを利用し、他の基板に対してフリップチップボンディングされる
請求項1に記載の固体撮像素子。 - 前記支持基板を貫通して前記電極パッドに接続される貫通電極を形成した後に、前記半導体基板に対してカラーフィルタ層が積層される
請求項1に記載の固体撮像素子。 - 複数の前記電極パッドは、前記半導体基板を平面的に見たときにグリッド状に配置される
請求項1に記載の固体撮像素子。 - 前記半導体基板の裏面側から、前記画素が受光する光が照射される裏面照射型である
請求項1に記載の固体撮像素子。 - 複数の画素が平面的に配置される画素領域が設けられる半導体基板と、
前記半導体基板に対して積層され、複数の前記画素に接続される配線が設けられる配線層と、
前記配線層に対して接合され、前記半導体基板を支持する支持基板と
を備える固体撮像素子の製造方法において、
前記配線層に、前記半導体基板を平面的に見て前記画素領域に重なり合う位置で、外部との電気的な接続に利用される複数の電極パッドを形成し、
前記支持基板に、複数の前記電極パッドに対応する箇所に貫通孔を形成する
工程を含み、
複数の前記電極パッド、および、複数の前記電極パッドまで開口するように前記支持基板を貫通して形成される複数の前記貫通孔が、前記半導体基板を平面的に見て、複数の行と複数の列とでそれぞれ略均等な間隔でグリッド状に配置される
製造方法。 - 複数の画素が平面的に配置される画素領域が設けられる半導体基板と、
前記半導体基板に対して積層され、複数の前記画素に接続される配線が設けられる配線層と、
前記配線層に対して接合され、前記半導体基板を支持する支持基板と
を有し、
前記配線層には、前記半導体基板を平面的に見て前記画素領域に重なり合う位置で、外部との電気的な接続に利用される複数の電極パッドが配置され、
前記支持基板には、複数の前記電極パッドに対応する箇所に貫通孔が設けられ、
複数の前記電極パッド、および、複数の前記電極パッドまで開口するように前記支持基板を貫通して形成される複数の前記貫通孔が、前記半導体基板を平面的に見て、複数の行と複数の列とでそれぞれ略均等な間隔でグリッド状に配置される
固体撮像素子を備える電子機器。
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