JP2009527622A - シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 - Google Patents

シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 Download PDF

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JP2009527622A
JP2009527622A JP2008556343A JP2008556343A JP2009527622A JP 2009527622 A JP2009527622 A JP 2009527622A JP 2008556343 A JP2008556343 A JP 2008556343A JP 2008556343 A JP2008556343 A JP 2008556343A JP 2009527622 A JP2009527622 A JP 2009527622A
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optionally
composition
sio
phenyl group
group
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Pending
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JP2008556343A
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Japanese (ja)
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JP2009527622A5 (enExample
Inventor
タミー・チェン
ブライアン・ハークネス
博司 江南
智子 加藤
好次 森田
正志 村上
匡慶 寺田
誠 吉武
ミシェル・カミングス
アン・ワルストロム・ノリス
マリンダ・ハウエル
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DuPont Toray Specialty Materials KK
Dow Silicones Corp
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Dow Corning Toray Co Ltd
Dow Corning Corp
Dow Silicones Corp
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Application filed by Dow Corning Toray Co Ltd, Dow Corning Corp, Dow Silicones Corp filed Critical Dow Corning Toray Co Ltd
Publication of JP2009527622A publication Critical patent/JP2009527622A/ja
Publication of JP2009527622A5 publication Critical patent/JP2009527622A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008556343A 2006-02-24 2007-02-01 シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 Pending JP2009527622A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77657506P 2006-02-24 2006-02-24
PCT/US2007/002966 WO2007100445A2 (en) 2006-02-24 2007-02-01 Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

Related Child Applications (1)

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JP2012279902A Division JP5669815B2 (ja) 2006-02-24 2012-12-21 シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物

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JP2009527622A true JP2009527622A (ja) 2009-07-30
JP2009527622A5 JP2009527622A5 (enExample) 2011-03-24

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JP2008556343A Pending JP2009527622A (ja) 2006-02-24 2007-02-01 シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物
JP2012279902A Active JP5669815B2 (ja) 2006-02-24 2012-12-21 シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物

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Country Status (7)

Country Link
US (1) US8258502B2 (enExample)
EP (1) EP1987084B1 (enExample)
JP (2) JP2009527622A (enExample)
KR (1) KR20080104279A (enExample)
CN (1) CN101389695B (enExample)
TW (1) TWI470028B (enExample)
WO (1) WO2007100445A2 (enExample)

Cited By (20)

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Publication number Priority date Publication date Assignee Title
JP2009235265A (ja) * 2008-03-27 2009-10-15 Shin Etsu Chem Co Ltd 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
JP2010043136A (ja) * 2008-08-08 2010-02-25 Yokohama Rubber Co Ltd:The シリコーン樹脂組成物、これを用いるシリコーン樹脂および光半導体素子封止体
JP2011225715A (ja) * 2010-04-20 2011-11-10 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物
JP2011246693A (ja) * 2010-04-30 2011-12-08 Shin-Etsu Chemical Co Ltd 高接着性シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP2012052045A (ja) * 2010-09-02 2012-03-15 Shin-Etsu Chemical Co Ltd 低ガス透過性シリコーン樹脂組成物及び光半導体装置
WO2012053301A1 (ja) * 2010-10-19 2012-04-26 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012144617A (ja) * 2011-01-11 2012-08-02 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2012219184A (ja) * 2011-04-08 2012-11-12 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
WO2012093909A3 (ko) * 2011-01-06 2012-11-29 주식회사 엘지화학 경화성 조성물
WO2012093910A3 (ko) * 2011-01-06 2012-11-29 주식회사 엘지화학 경화성 조성물
WO2012093907A3 (ko) * 2011-01-06 2012-11-29 주식회사 엘지화학 경화성 조성물
WO2012093908A3 (ko) * 2011-01-06 2012-11-29 주식회사 엘지화학 경화성 조성물
WO2013051600A1 (ja) * 2011-10-04 2013-04-11 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
JP2013518144A (ja) * 2010-01-25 2013-05-20 エルジー・ケム・リミテッド 硬化性組成物
JP2013518142A (ja) * 2010-01-25 2013-05-20 エルジー・ケム・リミテッド 硬化性組成物
US8569429B2 (en) 2011-12-22 2013-10-29 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition with high reliability and optical semiconductor device using same
JP2013239506A (ja) * 2012-05-14 2013-11-28 Kaneka Corp ポリシロキサン系組成物、および該組成物を封止材として用いてなる光半導体装置
JP2014009322A (ja) * 2012-06-29 2014-01-20 Dow Corning Toray Co Ltd 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
US9410018B2 (en) 2010-01-25 2016-08-09 Lg Chem, Ltd. Curable composition
US9657175B2 (en) 2014-10-20 2017-05-23 Shin-Etsu Chemical Co., Ltd. Silicone resin composition for sealing optical semiconductor element and optical semiconductor device

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CN101336383B (zh) 2006-02-01 2012-05-09 陶氏康宁公司 抗冲击的光波导管及其制造方法
CN101389695B (zh) 2006-02-24 2012-07-04 陶氏康宁公司 用硅氧烷包封的发光器件和用于制备该硅氧烷的可固化的硅氧烷组合物
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5667740B2 (ja) * 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
WO2010050625A1 (en) 2008-10-31 2010-05-06 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
JP2012509393A (ja) 2008-11-19 2012-04-19 ダウ コーニング コーポレーション シリコーン組成物およびその製造方法
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
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US8035236B2 (en) * 2009-10-16 2011-10-11 The Regents Of The University Of California Semiconductor device comprising high performance encapsulation resins
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US9299896B2 (en) * 2010-01-25 2016-03-29 Lg Chem, Ltd. Curable composition
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JP6300218B2 (ja) 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
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