WO2012093908A3 - 경화성 조성물 - Google Patents

경화성 조성물 Download PDF

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Publication number
WO2012093908A3
WO2012093908A3 PCT/KR2012/000182 KR2012000182W WO2012093908A3 WO 2012093908 A3 WO2012093908 A3 WO 2012093908A3 KR 2012000182 W KR2012000182 W KR 2012000182W WO 2012093908 A3 WO2012093908 A3 WO 2012093908A3
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WO
WIPO (PCT)
Prior art keywords
curable composition
composition
exhibit
resistance
whitening
Prior art date
Application number
PCT/KR2012/000182
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English (en)
French (fr)
Other versions
WO2012093908A2 (ko
Inventor
최범규
고민진
문명선
정재호
강대호
김민균
조병규
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201280011880.1A priority Critical patent/CN103415572B/zh
Priority to EP12732111.5A priority patent/EP2662412B1/en
Publication of WO2012093908A2 publication Critical patent/WO2012093908A2/ko
Publication of WO2012093908A3 publication Critical patent/WO2012093908A3/ko
Priority to US13/935,865 priority patent/US8937136B2/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K95/00—Sinkers for angling
    • A01K95/005—Sinkers not containing lead
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K95/00—Sinkers for angling
    • A01K95/02—Devices for fixing on or removing sinkers from lines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Animal Husbandry (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)

Abstract

본 발명은, 경화성 조성물 및 그 용도에 관한 것이다. 하나의 예시적인 경화성 조성물은, 우수한 가공성 및 작업성을 나타낼 수 있다. 또한, 상기 경화성 조성물은, 경화 전 또는 후에 높은 굴절률을 나타낼 수 있다. 상기 조성물은 경화 전 또는 후에 수분 투과율이 낮고, 균열 내성, 내열 충격성, 접착성 및 경도가 우수하다. 또한, 상기 조성물은 고온 또는 고습 조건에서 백탁 등의 색변화를 유발하지 않고, 표면에서의 끈적임도 나타내지 않는다. 하나의 예시에서 상기 경화성 조성물은, LED, CCD, 포토 커플러 또는 광전지 등과 같은 반도체 소자에 대한 접착 소재 또는 봉지 소재 등으로 사용될 수 있다.
PCT/KR2012/000182 2011-01-06 2012-01-06 경화성 조성물 WO2012093908A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280011880.1A CN103415572B (zh) 2011-01-06 2012-01-06 可固化组合物
EP12732111.5A EP2662412B1 (en) 2011-01-06 2012-01-06 Curable composition
US13/935,865 US8937136B2 (en) 2011-01-06 2013-07-05 Curable composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110001480 2011-01-06
KR10-2011-0001480 2011-01-06
KR1020120002156A KR101547382B1 (ko) 2011-01-06 2012-01-06 경화성 조성물
KR10-2012-0002156 2012-01-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/935,865 Continuation US8937136B2 (en) 2011-01-06 2013-07-05 Curable composition

Publications (2)

Publication Number Publication Date
WO2012093908A2 WO2012093908A2 (ko) 2012-07-12
WO2012093908A3 true WO2012093908A3 (ko) 2012-11-29

Family

ID=46712876

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/000182 WO2012093908A2 (ko) 2011-01-06 2012-01-06 경화성 조성물

Country Status (5)

Country Link
US (1) US8937136B2 (ko)
EP (1) EP2662412B1 (ko)
KR (1) KR101547382B1 (ko)
CN (1) CN103415572B (ko)
WO (1) WO2012093908A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259657B2 (ja) * 2013-12-24 2018-01-10 協立化学産業株式会社 液晶表示素子用シール剤
TWI653295B (zh) * 2014-02-04 2019-03-11 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
TWI624510B (zh) * 2014-02-04 2018-05-21 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
JP6944120B2 (ja) * 2016-09-07 2021-10-06 日亜化学工業株式会社 硬化性樹脂組成物、その硬化物、及び半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080007158A1 (en) * 2004-06-15 2008-01-10 Omar Farooq Linear Polysiloxanes, Silicone Composition, and Organic Light-Emitting Diode
US7521813B2 (en) * 2003-07-09 2009-04-21 Shin-Estu Chemical Co., Ltd. Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
JP2009527622A (ja) * 2006-02-24 2009-07-30 ダウ・コーニング・コーポレイション シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物
US7851564B2 (en) * 2007-03-05 2010-12-14 Kabushiki Kaisha Toshiba Silicone resin composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043872B2 (ja) * 1979-09-29 1985-09-30 信越化学工業株式会社 熱硬化性オルガノポリシロキサン組成物
US5753751A (en) * 1996-10-24 1998-05-19 General Electric Company Process for preparing self-curable alkenyl hydride siloxane copolymers and coating composition
JP3241338B2 (ja) 1998-01-26 2001-12-25 日亜化学工業株式会社 半導体発光装置
US6432137B1 (en) * 1999-09-08 2002-08-13 Medennium, Inc. High refractive index silicone for use in intraocular lenses
JP2001196151A (ja) 2000-01-12 2001-07-19 Takazono Sangyo Kk 発熱体装置及び発熱体温度制御方法
JP2002226551A (ja) 2001-01-31 2002-08-14 Matsushita Electric Ind Co Ltd 発光ダイオード
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
JP5170471B2 (ja) * 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521813B2 (en) * 2003-07-09 2009-04-21 Shin-Estu Chemical Co., Ltd. Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
US20080007158A1 (en) * 2004-06-15 2008-01-10 Omar Farooq Linear Polysiloxanes, Silicone Composition, and Organic Light-Emitting Diode
JP2009527622A (ja) * 2006-02-24 2009-07-30 ダウ・コーニング・コーポレイション シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物
US7851564B2 (en) * 2007-03-05 2010-12-14 Kabushiki Kaisha Toshiba Silicone resin composition

Also Published As

Publication number Publication date
EP2662412A4 (en) 2014-05-14
WO2012093908A2 (ko) 2012-07-12
US20130296515A1 (en) 2013-11-07
EP2662412B1 (en) 2018-07-11
KR101547382B1 (ko) 2015-08-26
CN103415572A (zh) 2013-11-27
US8937136B2 (en) 2015-01-20
KR20120080142A (ko) 2012-07-16
CN103415572B (zh) 2015-07-29
EP2662412A2 (en) 2013-11-13

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