JP2008522446A5 - - Google Patents
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- Publication number
- JP2008522446A5 JP2008522446A5 JP2007544574A JP2007544574A JP2008522446A5 JP 2008522446 A5 JP2008522446 A5 JP 2008522446A5 JP 2007544574 A JP2007544574 A JP 2007544574A JP 2007544574 A JP2007544574 A JP 2007544574A JP 2008522446 A5 JP2008522446 A5 JP 2008522446A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- chuck
- workpiece
- flat support
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/004,179 US20050211385A1 (en) | 2001-04-30 | 2004-12-02 | Method and apparatus for controlling spatial temperature distribution |
| PCT/US2005/043801 WO2006068805A1 (en) | 2004-12-02 | 2005-12-01 | Method and apparatus for controlling spatial temperature distribution |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011176261A Division JP2011244011A (ja) | 2004-12-02 | 2011-08-11 | 空間温度分布の制御方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008522446A JP2008522446A (ja) | 2008-06-26 |
| JP2008522446A5 true JP2008522446A5 (enExample) | 2012-08-09 |
Family
ID=36295018
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007544574A Pending JP2008522446A (ja) | 2004-12-02 | 2005-12-01 | 空間温度分布の制御方法及び装置 |
| JP2011176261A Pending JP2011244011A (ja) | 2004-12-02 | 2011-08-11 | 空間温度分布の制御方法及び装置 |
| JP2014055288A Pending JP2014146822A (ja) | 2004-12-02 | 2014-03-18 | 空間温度分布の制御方法及び装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011176261A Pending JP2011244011A (ja) | 2004-12-02 | 2011-08-11 | 空間温度分布の制御方法及び装置 |
| JP2014055288A Pending JP2014146822A (ja) | 2004-12-02 | 2014-03-18 | 空間温度分布の制御方法及び装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20050211385A1 (enExample) |
| JP (3) | JP2008522446A (enExample) |
| KR (1) | KR101109440B1 (enExample) |
| CN (2) | CN102122607B (enExample) |
| SG (3) | SG158101A1 (enExample) |
| TW (1) | TWI481297B (enExample) |
| WO (1) | WO2006068805A1 (enExample) |
Families Citing this family (79)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050211385A1 (en) | 2001-04-30 | 2005-09-29 | Lam Research Corporation, A Delaware Corporation | Method and apparatus for controlling spatial temperature distribution |
| US8038796B2 (en) | 2004-12-30 | 2011-10-18 | Lam Research Corporation | Apparatus for spatial and temporal control of temperature on a substrate |
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| US7723648B2 (en) * | 2006-09-25 | 2010-05-25 | Tokyo Electron Limited | Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system |
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| JP5417338B2 (ja) | 2007-10-31 | 2014-02-12 | ラム リサーチ コーポレーション | 冷却液と構成部品本体との間の熱伝導性を制御するためにガス圧を使用する温度制御モジュール及び温度制御方法 |
| JP5222442B2 (ja) * | 2008-02-06 | 2013-06-26 | 東京エレクトロン株式会社 | 基板載置台、基板処理装置及び被処理基板の温度制御方法 |
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| JP4980461B1 (ja) * | 2010-12-24 | 2012-07-18 | 三井造船株式会社 | 誘導加熱装置 |
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| US10388493B2 (en) | 2011-09-16 | 2019-08-20 | Lam Research Corporation | Component of a substrate support assembly producing localized magnetic fields |
| US8624168B2 (en) | 2011-09-20 | 2014-01-07 | Lam Research Corporation | Heating plate with diode planar heater zones for semiconductor processing |
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| CN103137517B (zh) * | 2011-11-25 | 2016-08-03 | 中芯国际集成电路制造(北京)有限公司 | 用于处理晶圆的反应装置、静电吸盘和晶圆温度控制方法 |
| JP6017781B2 (ja) * | 2011-12-07 | 2016-11-02 | 新光電気工業株式会社 | 基板温調固定装置及びその製造方法 |
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| US9324589B2 (en) | 2012-02-28 | 2016-04-26 | Lam Research Corporation | Multiplexed heater array using AC drive for semiconductor processing |
| US8809747B2 (en) | 2012-04-13 | 2014-08-19 | Lam Research Corporation | Current peak spreading schemes for multiplexed heated array |
| US10049948B2 (en) * | 2012-11-30 | 2018-08-14 | Lam Research Corporation | Power switching system for ESC with array of thermal control elements |
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| JP6530220B2 (ja) * | 2015-03-30 | 2019-06-12 | 日本特殊陶業株式会社 | セラミックヒータ及びその制御方法、並びに、静電チャック及びその制御方法 |
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| TWI703671B (zh) * | 2015-08-06 | 2020-09-01 | 美商應用材料股份有限公司 | 螺接式晶圓夾具熱管理系統及用於晶圓處理系統的方法 |
| US10690414B2 (en) * | 2015-12-11 | 2020-06-23 | Lam Research Corporation | Multi-plane heater for semiconductor substrate support |
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| US11069553B2 (en) * | 2016-07-07 | 2021-07-20 | Lam Research Corporation | Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity |
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| CN108062124B (zh) * | 2016-11-08 | 2020-04-07 | 中微半导体设备(上海)股份有限公司 | 一种温控晶圆安装台及其温控方法 |
| US10910195B2 (en) | 2017-01-05 | 2021-02-02 | Lam Research Corporation | Substrate support with improved process uniformity |
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| DE102019207772A1 (de) | 2019-05-28 | 2020-12-03 | Siltronic Ag | Verfahren zum Abscheiden einer epitaktischen Schicht auf einer Vorderseite einer Halbleiterscheibe und Vorrichtung zur Durchführung des Verfahrens |
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| CN110752171B (zh) * | 2019-11-01 | 2022-07-29 | 长江存储科技有限责任公司 | 晶圆弯曲度调整装置及方法 |
| JP7330078B2 (ja) * | 2019-11-25 | 2023-08-21 | 東京エレクトロン株式会社 | エッチング方法およびエッチング装置 |
| CN111668140B (zh) * | 2020-07-02 | 2025-07-18 | 沈阳芯源微电子设备股份有限公司 | 一种基于陶瓷加热器温度一致性的调整装置及方法 |
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2004
- 2004-12-02 US US11/004,179 patent/US20050211385A1/en not_active Abandoned
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2005
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- 2005-12-01 SG SG200907998-9A patent/SG158101A1/en unknown
- 2005-12-01 SG SG10201408008QA patent/SG10201408008QA/en unknown
- 2005-12-01 JP JP2007544574A patent/JP2008522446A/ja active Pending
- 2005-12-01 WO PCT/US2005/043801 patent/WO2006068805A1/en not_active Ceased
- 2005-12-01 CN CNA2005800472891A patent/CN101111934A/zh active Pending
- 2005-12-01 SG SG10201609601XA patent/SG10201609601XA/en unknown
- 2005-12-01 KR KR1020077014977A patent/KR101109440B1/ko not_active Expired - Lifetime
- 2005-12-02 TW TW094142661A patent/TWI481297B/zh active
-
2009
- 2009-05-06 US US12/436,443 patent/US8963052B2/en not_active Expired - Lifetime
-
2011
- 2011-08-11 JP JP2011176261A patent/JP2011244011A/ja active Pending
-
2014
- 2014-03-18 JP JP2014055288A patent/JP2014146822A/ja active Pending
-
2015
- 2015-01-12 US US14/594,648 patent/US9824904B2/en not_active Expired - Lifetime
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