JP2008028395A - アレイ基板、これを有する表示装置及びその製造方法 - Google Patents

アレイ基板、これを有する表示装置及びその製造方法 Download PDF

Info

Publication number
JP2008028395A
JP2008028395A JP2007188757A JP2007188757A JP2008028395A JP 2008028395 A JP2008028395 A JP 2008028395A JP 2007188757 A JP2007188757 A JP 2007188757A JP 2007188757 A JP2007188757 A JP 2007188757A JP 2008028395 A JP2008028395 A JP 2008028395A
Authority
JP
Japan
Prior art keywords
gate
layer
electrode
pattern
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007188757A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008028395A5 (https=
Inventor
Seikun Lee
制 勳 李
Do-Hyun Kim
度 賢 金
Eun-Guk Lee
殷 國 李
Chang-Oh Jeong
敞 午 鄭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2008028395A publication Critical patent/JP2008028395A/ja
Publication of JP2008028395A5 publication Critical patent/JP2008028395A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/13629Multilayer wirings
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/136295Materials; Compositions; Manufacture processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Formation Of Insulating Films (AREA)
JP2007188757A 2006-07-20 2007-07-19 アレイ基板、これを有する表示装置及びその製造方法 Pending JP2008028395A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060067979A KR20080008562A (ko) 2006-07-20 2006-07-20 어레이 기판의 제조방법, 어레이 기판 및 이를 갖는표시장치

Publications (2)

Publication Number Publication Date
JP2008028395A true JP2008028395A (ja) 2008-02-07
JP2008028395A5 JP2008028395A5 (https=) 2011-07-07

Family

ID=38421183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007188757A Pending JP2008028395A (ja) 2006-07-20 2007-07-19 アレイ基板、これを有する表示装置及びその製造方法

Country Status (6)

Country Link
US (3) US7511300B2 (https=)
EP (1) EP1881366B1 (https=)
JP (1) JP2008028395A (https=)
KR (1) KR20080008562A (https=)
CN (1) CN101132011A (https=)
DE (1) DE602007009162D1 (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251809A (ja) * 2007-03-30 2008-10-16 Ulvac Japan Ltd 薄膜トランジスタ製造方法、液晶表示装置製造方法
JP2011186424A (ja) * 2010-03-10 2011-09-22 Samsung Mobile Display Co Ltd 液晶表示装置のアレイ基板及びその製造方法
JP2012151443A (ja) * 2011-01-19 2012-08-09 Samsung Electronics Co Ltd 薄膜トランジスター表示板およびその製造方法
JP2013153093A (ja) * 2012-01-26 2013-08-08 Hitachi Cable Ltd 薄膜トランジスタ、その製造方法および該薄膜トランジスタを用いた表示装置
KR20130094161A (ko) * 2012-02-15 2013-08-23 엘지디스플레이 주식회사 박막트랜지스터, 박막트랜지스터 어레이 기판 및 이의 제조방법
JP2014007388A (ja) * 2012-05-10 2014-01-16 Semiconductor Energy Lab Co Ltd 半導体装置
US8736793B2 (en) 2010-02-24 2014-05-27 Sharp Kabushiki Kaisha Liquid crystal display panel, and liquid crystal display device
JP2016502264A (ja) * 2012-11-02 2016-01-21 京東方科技集團股▲ふん▼有限公司 薄膜トランジスター及びその製作方法、アレイ基板、表示装置及びストップ層
JP2022169521A (ja) * 2009-11-27 2022-11-09 株式会社半導体エネルギー研究所 半導体装置
JP7838175B1 (ja) * 2012-02-09 2026-03-31 株式会社半導体エネルギー研究所 液晶表示装置

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090080790A (ko) * 2008-01-22 2009-07-27 삼성전자주식회사 박막 트랜지스터 표시판 및 이를 제조하는 방법
KR101449460B1 (ko) * 2008-05-23 2014-10-13 주성엔지니어링(주) 박막 트랜지스터 어레이 기판 및 이의 제조 방법
KR101253497B1 (ko) * 2008-06-02 2013-04-11 엘지디스플레이 주식회사 액정표시장치용 어레이 기판의 제조방법
KR101476817B1 (ko) 2009-07-03 2014-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터를 갖는 표시 장치 및 그 제작 방법
US8563095B2 (en) * 2010-03-15 2013-10-22 Applied Materials, Inc. Silicon nitride passivation layer for covering high aspect ratio features
CN102213877B (zh) * 2010-04-06 2013-10-02 北京京东方光电科技有限公司 阵列基板、液晶面板及其制造方法
KR101113354B1 (ko) * 2010-04-16 2012-02-29 삼성모바일디스플레이주식회사 표시 장치 및 그 제조방법
KR101702645B1 (ko) 2010-08-18 2017-02-06 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
KR20130021607A (ko) * 2011-08-23 2013-03-06 삼성디스플레이 주식회사 저저항 배선, 박막 트랜지스터, 및 박막 트랜지스터 표시판과 이들을 제조하는 방법
KR101774491B1 (ko) 2011-10-14 2017-09-13 삼성전자주식회사 유기 포토다이오드를 포함하는 유기 픽셀, 이의 제조 방법, 및 상기 유기 픽셀을 포함하는 장치들
CN102629592A (zh) * 2012-03-23 2012-08-08 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置
JP6004319B2 (ja) * 2012-04-06 2016-10-05 住友電工デバイス・イノベーション株式会社 半導体装置および半導体装置の製造方法
CN102664194B (zh) * 2012-04-10 2015-01-07 深超光电(深圳)有限公司 薄膜晶体管
KR101968115B1 (ko) * 2012-04-23 2019-08-13 엘지디스플레이 주식회사 어레이 기판 및 이의 제조방법
CN102738007B (zh) * 2012-07-02 2014-09-03 京东方科技集团股份有限公司 一种薄膜晶体管的制造方法及阵列基板的制造方法
KR102004398B1 (ko) * 2012-07-24 2019-07-29 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP2014032999A (ja) * 2012-08-01 2014-02-20 Panasonic Liquid Crystal Display Co Ltd 薄膜トランジスタ及びその製造方法
KR20140021096A (ko) * 2012-08-07 2014-02-20 한국전자통신연구원 도핑 베리어를 가지는 자기 정렬 박막 트랜지스터 및 그 제조 방법
JP5951442B2 (ja) * 2012-10-17 2016-07-13 株式会社半導体エネルギー研究所 半導体装置
KR102028505B1 (ko) 2012-11-19 2019-10-04 엘지디스플레이 주식회사 유기발광 표시패널 및 이의 제조방법
CN103000694B (zh) * 2012-12-13 2015-08-19 京东方科技集团股份有限公司 一种薄膜晶体管及其制作方法、阵列基板和显示装置
KR102029986B1 (ko) * 2012-12-13 2019-10-10 삼성디스플레이 주식회사 액정 표시 장치 및 그 제조 방법
KR102090460B1 (ko) * 2012-12-31 2020-03-18 엘지디스플레이 주식회사 박막트랜지스터 및 그 제조 방법
US8753975B1 (en) 2013-02-01 2014-06-17 Globalfoundries Inc. Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting device
US8859419B2 (en) 2013-02-01 2014-10-14 Globalfoundries Inc. Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device
KR102290801B1 (ko) * 2013-06-21 2021-08-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
CN103489902B (zh) * 2013-09-30 2016-01-06 京东方科技集团股份有限公司 一种电极及其制作方法、阵列基板及显示装置
CN103915452B (zh) * 2014-03-28 2016-04-06 京东方科技集团股份有限公司 一种阵列基板、其制作方法及显示装置
KR102230619B1 (ko) 2014-07-25 2021-03-24 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR20160014833A (ko) * 2014-07-29 2016-02-12 삼성디스플레이 주식회사 금속 배선의 제조 방법 및 박막트랜지스터 기판 제조 방법
CN104409516A (zh) * 2014-11-28 2015-03-11 京东方科技集团股份有限公司 薄膜晶体管及制备方法、阵列基板及制备方法和显示装置
TWI651574B (zh) * 2015-01-12 2019-02-21 友達光電股份有限公司 顯示面板及其製造方法
JP2016181332A (ja) 2015-03-23 2016-10-13 三星ディスプレイ株式會社Samsung Display Co.,Ltd. 表示装置および表示装置の製造方法
CN104730782B (zh) * 2015-04-01 2018-03-27 上海天马微电子有限公司 一种阵列基板、显示面板和显示装置
US10147745B2 (en) 2015-04-01 2018-12-04 Shanghai Tianma Micro-electronics Co., Ltd. Array substrate, display panel and display device
CN104934330A (zh) * 2015-05-08 2015-09-23 京东方科技集团股份有限公司 一种薄膜晶体管及其制备方法、阵列基板和显示面板
KR102494732B1 (ko) 2015-10-16 2023-02-01 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
CN108292684B (zh) * 2015-11-20 2022-06-21 株式会社半导体能源研究所 半导体装置、该半导体装置的制造方法或包括该半导体装置的显示装置
KR102617444B1 (ko) * 2015-12-30 2023-12-21 엘지디스플레이 주식회사 박막 트랜지스터 기판
CN113219749B (zh) * 2016-02-17 2023-01-10 群创光电股份有限公司 主动元件阵列基板以及显示面板
CN106653772B (zh) * 2016-12-30 2019-10-01 惠科股份有限公司 一种显示面板及制程
CN107065237A (zh) * 2016-12-30 2017-08-18 惠科股份有限公司 一种显示面板制程
CN107290913A (zh) * 2017-07-31 2017-10-24 武汉华星光电技术有限公司 显示面板、阵列基板及其形成方法
KR102263122B1 (ko) 2017-10-19 2021-06-09 삼성디스플레이 주식회사 트랜지스터 표시판
TWI671913B (zh) * 2018-05-02 2019-09-11 Au Optronics Corporation 半導體裝置及其製造方法
KR102716630B1 (ko) * 2018-11-22 2024-10-15 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11005079B2 (en) * 2018-11-30 2021-05-11 Wuhan China Star Optoelectronics Technology Co., Ltd. Anti-reflection bottom-emitting type OLED display device and manufacturing method thereof
CN110459607B (zh) * 2019-08-08 2021-08-06 Tcl华星光电技术有限公司 薄膜晶体管阵列基板
TWI719838B (zh) * 2019-08-20 2021-02-21 友達光電股份有限公司 顯示裝置
CN110780497A (zh) * 2019-10-22 2020-02-11 深圳市华星光电技术有限公司 一种显示面板的走线结构、显示面板走线方法及显示面板
TWI719785B (zh) * 2019-12-27 2021-02-21 友達光電股份有限公司 顯示器
CN111403336A (zh) * 2020-03-31 2020-07-10 成都中电熊猫显示科技有限公司 阵列基板、显示面板以及阵列基板的制作方法
CN112874655B (zh) * 2021-02-04 2021-12-24 北京理工大学 可控角度的机器人被动足部及应用该被动足的机器人
CN113161292B (zh) * 2021-04-12 2023-04-25 北海惠科光电技术有限公司 阵列基板的制作方法、阵列基板及显示面板
CN114141869B (zh) * 2021-11-30 2025-02-14 北海惠科光电技术有限公司 薄膜晶体管及其制备方法、阵列基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02237039A (ja) * 1989-03-09 1990-09-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2000165002A (ja) * 1998-11-26 2000-06-16 Furontekku:Kk 電子機器用基板及びその製造方法と電子機器
JP2000208773A (ja) * 1999-01-13 2000-07-28 Fujitsu Ltd 薄膜トランジスタ及びその製造方法
JP2003005220A (ja) * 2001-03-21 2003-01-08 Lg Phillips Lcd Co Ltd 2層構造のソース電極及びドレイン電極を有する液晶表示素子及びその製造方法
JP2006148040A (ja) * 2004-11-17 2006-06-08 Samsung Electronics Co Ltd 薄膜トランジスタ表示板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6008110A (en) * 1994-07-21 1999-12-28 Kabushiki Kaisha Toshiba Semiconductor substrate and method of manufacturing same
US6518594B1 (en) * 1998-11-16 2003-02-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor devices
KR100303141B1 (ko) 1999-02-23 2001-09-26 구본준, 론 위라하디락사 박막트랜지스터의 제조방법
JP4243401B2 (ja) * 1999-12-21 2009-03-25 エルジー ディスプレイ カンパニー リミテッド 銅配線基板およびその製造方法ならびに液晶表示装置
US6888586B2 (en) * 2001-06-05 2005-05-03 Lg. Philips Lcd Co., Ltd. Array substrate for liquid crystal display and method for fabricating the same
TW200531284A (en) 2003-07-29 2005-09-16 Samsung Electronics Co Ltd Thin film array panel and manufacturing method thereof
JP2006005190A (ja) * 2004-06-18 2006-01-05 Renesas Technology Corp 半導体装置
KR100671640B1 (ko) 2004-06-24 2007-01-18 삼성에스디아이 주식회사 박막 트랜지스터 어레이 기판과 이를 이용한 표시장치와그의 제조방법
TWI242289B (en) 2004-11-22 2005-10-21 Au Optronics Corp Fabrication method of thin film transistor
TWI354350B (en) * 2005-05-25 2011-12-11 Au Optronics Corp Copper gate electrode and fabricating method there
KR101199533B1 (ko) * 2005-06-22 2012-11-09 삼성디스플레이 주식회사 식각액, 이를 이용하는 배선 형성 방법 및 박막 트랜지스터기판의 제조 방법
KR101168728B1 (ko) * 2005-07-15 2012-07-26 삼성전자주식회사 배선 구조와 배선 형성 방법 및 박막 트랜지스터 기판과 그제조 방법
KR101167661B1 (ko) * 2005-07-15 2012-07-23 삼성전자주식회사 배선 구조와 배선 형성 방법 및 박막 트랜지스터 기판과 그제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02237039A (ja) * 1989-03-09 1990-09-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2000165002A (ja) * 1998-11-26 2000-06-16 Furontekku:Kk 電子機器用基板及びその製造方法と電子機器
JP2000208773A (ja) * 1999-01-13 2000-07-28 Fujitsu Ltd 薄膜トランジスタ及びその製造方法
JP2003005220A (ja) * 2001-03-21 2003-01-08 Lg Phillips Lcd Co Ltd 2層構造のソース電極及びドレイン電極を有する液晶表示素子及びその製造方法
JP2006148040A (ja) * 2004-11-17 2006-06-08 Samsung Electronics Co Ltd 薄膜トランジスタ表示板及びその製造方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251809A (ja) * 2007-03-30 2008-10-16 Ulvac Japan Ltd 薄膜トランジスタ製造方法、液晶表示装置製造方法
US12396292B2 (en) 2009-11-27 2025-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising first and second conductive layers
JP2022169521A (ja) * 2009-11-27 2022-11-09 株式会社半導体エネルギー研究所 半導体装置
US8736793B2 (en) 2010-02-24 2014-05-27 Sharp Kabushiki Kaisha Liquid crystal display panel, and liquid crystal display device
TWI475643B (zh) * 2010-03-10 2015-03-01 三星顯示器有限公司 液晶顯示器之陣列基板及其之製造方法
JP2011186424A (ja) * 2010-03-10 2011-09-22 Samsung Mobile Display Co Ltd 液晶表示装置のアレイ基板及びその製造方法
JP2012151443A (ja) * 2011-01-19 2012-08-09 Samsung Electronics Co Ltd 薄膜トランジスター表示板およびその製造方法
JP2013153093A (ja) * 2012-01-26 2013-08-08 Hitachi Cable Ltd 薄膜トランジスタ、その製造方法および該薄膜トランジスタを用いた表示装置
JP7838175B1 (ja) * 2012-02-09 2026-03-31 株式会社半導体エネルギー研究所 液晶表示装置
US8937311B2 (en) 2012-02-15 2015-01-20 Lg Display Co., Ltd. Thin film transistor, thin film transistor array substrate and method of fabricating the same
KR102068956B1 (ko) * 2012-02-15 2020-01-23 엘지디스플레이 주식회사 박막트랜지스터, 박막트랜지스터 어레이 기판 및 이의 제조방법
JP2013168632A (ja) * 2012-02-15 2013-08-29 Lg Display Co Ltd 薄膜トランジスタ、薄膜トランジスタアレイ基板及びそれらの製造方法
KR20130094161A (ko) * 2012-02-15 2013-08-23 엘지디스플레이 주식회사 박막트랜지스터, 박막트랜지스터 어레이 기판 및 이의 제조방법
JP2017028311A (ja) * 2012-05-10 2017-02-02 株式会社半導体エネルギー研究所 半導体装置
US9831325B2 (en) 2012-05-10 2017-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2021016008A (ja) * 2012-05-10 2021-02-12 株式会社半導体エネルギー研究所 トランジスタ
JP2014007388A (ja) * 2012-05-10 2014-01-16 Semiconductor Energy Lab Co Ltd 半導体装置
JP2016502264A (ja) * 2012-11-02 2016-01-21 京東方科技集團股▲ふん▼有限公司 薄膜トランジスター及びその製作方法、アレイ基板、表示装置及びストップ層

Also Published As

Publication number Publication date
EP1881366B1 (en) 2010-09-15
US20080017862A1 (en) 2008-01-24
KR20080008562A (ko) 2008-01-24
US20110309510A1 (en) 2011-12-22
DE602007009162D1 (de) 2010-10-28
US7511300B2 (en) 2009-03-31
CN101132011A (zh) 2008-02-27
EP1881366A1 (en) 2008-01-23
US20090162982A1 (en) 2009-06-25

Similar Documents

Publication Publication Date Title
JP2008028395A (ja) アレイ基板、これを有する表示装置及びその製造方法
US6441468B1 (en) Semiconductor device
US8816346B2 (en) TFT array substrate and manufacturing method thereof
KR101412761B1 (ko) 박막 트랜지스터 기판 및 이의 제조 방법
KR101158896B1 (ko) 박막트랜지스터 기판 및 이의 제조방법과,박막트랜지스터를 갖는 액정표시패널 및 전계발광 표시패널
US7919795B2 (en) Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating the thin film transistor substrate
US20100155721A1 (en) Thin film transistor array substrate and method of fabricating the same
JP5085010B2 (ja) 薄膜トランジスタ及びその製造方法と、薄膜トランジスタを含む平板表示装置及びその製造方法
KR20040024666A (ko) 액정 표시 장치 및 이의 제조방법
KR20010066250A (ko) 박막 트랜지스터 및 그 제조방법
KR101697588B1 (ko) 액정표시장치 및 그 제조방법
KR20020001733A (ko) 박막 트랜지스터와 그 제조 방법
KR20050079429A (ko) Tft lcd 기판의 알루미늄 배선 형성방법과 이에의한 tft lcd 기판
CN212112068U (zh) 显示面板
KR20060078572A (ko) 폴리 박막 트랜지스터 기판 및 그 제조 방법
US6861671B2 (en) Thin film transistor liquid crystal display and fabrication method thereof
KR101085450B1 (ko) 박막트랜지스터 기판과 그 제조방법
KR100662488B1 (ko) Tft-lcd 패널 및 그 제조 방법
KR100379566B1 (ko) 액정표시장치 제조방법
US8080449B2 (en) Method for manufacturing thin-film transistors
US20070159564A1 (en) Thin film transistor substrate of liquid crystal display and method for fabricating the same
KR20050079430A (ko) Tft lcd 기판의 알루미늄 배선 형성방법과 이에의한 tft lcd 기판
KR20050035789A (ko) 박막트랜지스터의 제조방법
KR20050075520A (ko) Tft lcd 기판의 다중층 배선 형성방법과 이에 의한tft lcd 기판
KR20020039088A (ko) 박막트랜지스터-액정표시장치의 제조방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100617

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110518

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121212

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20121213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121218

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130604