JP2007053331A - テープ配線基板と、それを用いたテープパッケージ及び平板表示装置 - Google Patents

テープ配線基板と、それを用いたテープパッケージ及び平板表示装置 Download PDF

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Publication number
JP2007053331A
JP2007053331A JP2006069587A JP2006069587A JP2007053331A JP 2007053331 A JP2007053331 A JP 2007053331A JP 2006069587 A JP2006069587 A JP 2006069587A JP 2006069587 A JP2006069587 A JP 2006069587A JP 2007053331 A JP2007053331 A JP 2007053331A
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JP
Japan
Prior art keywords
tape
wiring pattern
base film
hole
bent portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006069587A
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English (en)
Japanese (ja)
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JP2007053331A5 (enExample
Inventor
Ye-Chung Chung
鄭　禮貞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2007053331A publication Critical patent/JP2007053331A/ja
Publication of JP2007053331A5 publication Critical patent/JP2007053331A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2006069587A 2005-08-12 2006-03-14 テープ配線基板と、それを用いたテープパッケージ及び平板表示装置 Pending JP2007053331A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050074257A KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치

Publications (2)

Publication Number Publication Date
JP2007053331A true JP2007053331A (ja) 2007-03-01
JP2007053331A5 JP2007053331A5 (enExample) 2009-04-30

Family

ID=37741552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006069587A Pending JP2007053331A (ja) 2005-08-12 2006-03-14 テープ配線基板と、それを用いたテープパッケージ及び平板表示装置

Country Status (3)

Country Link
US (1) US7435914B2 (enExample)
JP (1) JP2007053331A (enExample)
KR (1) KR100765478B1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2012215841A (ja) * 2011-04-01 2012-11-08 Sony Corp 表示装置
KR101383085B1 (ko) * 2012-06-25 2014-04-08 삼성디스플레이 주식회사 유기 발광 표시 장치
US10327334B1 (en) 2018-03-12 2019-06-18 Chipbond Technology Corporation Layout structure of flexible circuit board
JP2019527842A (ja) * 2016-07-11 2019-10-03 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． チップオンフィルム、及びそれを備えたフレキシブルディスプレイ装置並びにその製造方法
JP2020034676A (ja) * 2018-08-29 2020-03-05 株式会社ジャパンディスプレイ 表示装置、フレキシブル配線基板、及び、表示装置の製造方法

Families Citing this family (31)

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JP2007279577A (ja) 2006-04-11 2007-10-25 Sony Corp 電子機器
US20090020858A1 (en) * 2007-07-17 2009-01-22 Matsushita Electric Industrial Co., Ltd. Tape carrier substrate and semiconductor device
EP2219680A2 (en) 2007-11-13 2010-08-25 Isis Pharmaceuticals, Inc. Compounds and methods for modulating protein expression
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
DE102010019841A1 (de) * 2010-05-07 2011-11-10 Ident Technology Ag Leiterplatte für Display und Anzeigemodul mit Display und Leiterplatte
US20120194990A1 (en) * 2011-01-31 2012-08-02 Martin Kuster Semiconductor Arrangements
US8867231B2 (en) * 2012-01-13 2014-10-21 Tyco Electronics Corporation Electronic module packages and assemblies for electrical systems
KR101942918B1 (ko) 2012-05-03 2019-01-28 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 장치 어셈블리
US9210810B2 (en) * 2012-07-12 2015-12-08 Universal Display Corporation Method of fabricating flexible devices
KR101955465B1 (ko) 2012-08-16 2019-03-12 삼성디스플레이 주식회사 표시 장치
KR20140038823A (ko) * 2012-09-21 2014-03-31 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
KR102178470B1 (ko) * 2012-09-26 2020-11-18 엘지디스플레이 주식회사 연성 필름 케이블을 가지는 표시장치
KR101882827B1 (ko) 2012-11-02 2018-07-30 삼성디스플레이 주식회사 액정 표시 장치
KR101991892B1 (ko) 2013-02-18 2019-06-24 삼성디스플레이 주식회사 테이프 패키지 및 이를 구비한 평판 표시 장치
KR102144378B1 (ko) 2013-08-27 2020-08-13 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
KR20150070567A (ko) * 2013-12-17 2015-06-25 삼성디스플레이 주식회사 표시장치
KR102232166B1 (ko) 2014-03-06 2021-03-29 삼성디스플레이 주식회사 표시 장치
KR102258746B1 (ko) 2014-08-13 2021-06-01 삼성전자주식회사 벤딩부를 갖는 칩 온 필름 패키지
KR102251684B1 (ko) * 2014-09-03 2021-05-14 삼성디스플레이 주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
CN107432082A (zh) * 2015-03-31 2017-12-01 夏普株式会社 柔性印刷基板和显示装置
CN105828524A (zh) * 2016-05-27 2016-08-03 深圳市华星光电技术有限公司 显示器、多段电路板及其制造方法
JP6672108B2 (ja) * 2016-08-12 2020-03-25 株式会社フジクラ 配線基板及び当該配線基板の製造方法
KR102612998B1 (ko) * 2016-12-30 2023-12-11 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
KR102582059B1 (ko) 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
CN214101885U (zh) * 2018-05-28 2021-08-31 株式会社村田制作所 树脂多层基板以及电子设备
KR102517268B1 (ko) * 2018-07-16 2023-04-03 삼성전자주식회사 디스플레이 패널
CN209167757U (zh) * 2019-01-29 2019-07-26 合肥鑫晟光电科技有限公司 覆晶薄膜及显示装置
WO2020258295A1 (zh) * 2019-06-28 2020-12-30 京东方科技集团股份有限公司 柔性电路板、柔性装置及显示设备
KR20220055759A (ko) * 2020-10-27 2022-05-04 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR20220064598A (ko) * 2020-11-12 2022-05-19 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR102847580B1 (ko) 2021-12-30 2025-08-18 엘지디스플레이 주식회사 디스플레이 장치

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JPH04196555A (ja) * 1990-11-28 1992-07-16 Sharp Corp Ｔａｂパッケージ
JPH04342148A (ja) * 1991-05-20 1992-11-27 Toshiba Corp テープキャリア
JPH07297235A (ja) * 1994-04-22 1995-11-10 Hitachi Cable Ltd Ｔａｂ用テープキャリア，及びその製造方法
JPH11271795A (ja) * 1998-03-25 1999-10-08 Toshiba Electronic Engineering Corp テープキャリアパッケージ
JP2002358026A (ja) * 2001-03-26 2002-12-13 Sharp Corp 表示モジュール並びにフレキシブル配線板及びフレキシブル配線板の接続方法
JP2003302914A (ja) * 2002-04-09 2003-10-24 Sharp Corp 電子装置

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JPH04196555A (ja) * 1990-11-28 1992-07-16 Sharp Corp Ｔａｂパッケージ
JPH04342148A (ja) * 1991-05-20 1992-11-27 Toshiba Corp テープキャリア
JPH07297235A (ja) * 1994-04-22 1995-11-10 Hitachi Cable Ltd Ｔａｂ用テープキャリア，及びその製造方法
JPH11271795A (ja) * 1998-03-25 1999-10-08 Toshiba Electronic Engineering Corp テープキャリアパッケージ
JP2002358026A (ja) * 2001-03-26 2002-12-13 Sharp Corp 表示モジュール並びにフレキシブル配線板及びフレキシブル配線板の接続方法
JP2003302914A (ja) * 2002-04-09 2003-10-24 Sharp Corp 電子装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
WO2010113367A1 (ja) * 2009-03-31 2010-10-07 ソニーケミカル＆インフォメーションデバイス株式会社 接合体及びその製造方法
US8330052B2 (en) 2009-03-31 2012-12-11 Sony Chemical & Information Device Corporation Joined structure and method for producing the same
KR101253642B1 (ko) 2009-03-31 2013-04-11 데쿠세리아루즈 가부시키가이샤 접합체 및 그 제조 방법
JP2012215841A (ja) * 2011-04-01 2012-11-08 Sony Corp 表示装置
KR101383085B1 (ko) * 2012-06-25 2014-04-08 삼성디스플레이 주식회사 유기 발광 표시 장치
US8823042B2 (en) 2012-06-25 2014-09-02 Samsung Display Co., Ltd. Organic light emitting diode display
JP2019527842A (ja) * 2016-07-11 2019-10-03 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． チップオンフィルム、及びそれを備えたフレキシブルディスプレイ装置並びにその製造方法
US10327334B1 (en) 2018-03-12 2019-06-18 Chipbond Technology Corporation Layout structure of flexible circuit board
JP2022008726A (ja) * 2018-03-12 2022-01-14 ▲き▼邦科技股▲分▼有限公司 フレキシブル回路基板の配線構造
JP2020034676A (ja) * 2018-08-29 2020-03-05 株式会社ジャパンディスプレイ 表示装置、フレキシブル配線基板、及び、表示装置の製造方法
JP7094837B2 (ja) 2018-08-29 2022-07-04 株式会社ジャパンディスプレイ 表示装置、フレキシブル配線基板、及び、表示装置の製造方法

Also Published As

Publication number Publication date
KR20070019358A (ko) 2007-02-15
KR100765478B1 (ko) 2007-10-09
US7435914B2 (en) 2008-10-14
US20070034402A1 (en) 2007-02-15

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