KR100765478B1 - 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 - Google Patents

구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 Download PDF

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Publication number
KR100765478B1
KR100765478B1 KR1020050074257A KR20050074257A KR100765478B1 KR 100765478 B1 KR100765478 B1 KR 100765478B1 KR 1020050074257 A KR1020050074257 A KR 1020050074257A KR 20050074257 A KR20050074257 A KR 20050074257A KR 100765478 B1 KR100765478 B1 KR 100765478B1
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South Korea
Prior art keywords
tape
wiring pattern
wiring board
hole
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020050074257A
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English (en)
Korean (ko)
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KR20070019358A (ko
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정예정
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삼성전자주식회사
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Priority to KR1020050074257A priority Critical patent/KR100765478B1/ko
Priority to US11/336,785 priority patent/US7435914B2/en
Priority to JP2006069587A priority patent/JP2007053331A/ja
Publication of KR20070019358A publication Critical patent/KR20070019358A/ko
Application granted granted Critical
Publication of KR100765478B1 publication Critical patent/KR100765478B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020050074257A 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 Expired - Lifetime KR100765478B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020050074257A KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치
US11/336,785 US7435914B2 (en) 2005-08-12 2006-01-23 Tape substrate, tape package and flat panel display using same
JP2006069587A JP2007053331A (ja) 2005-08-12 2006-03-14 テープ配線基板と、それを用いたテープパッケージ及び平板表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050074257A KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치

Publications (2)

Publication Number Publication Date
KR20070019358A KR20070019358A (ko) 2007-02-15
KR100765478B1 true KR100765478B1 (ko) 2007-10-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050074257A Expired - Lifetime KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치

Country Status (3)

Country Link
US (1) US7435914B2 (enExample)
JP (1) JP2007053331A (enExample)
KR (1) KR100765478B1 (enExample)

Cited By (1)

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US9177904B2 (en) 2012-05-03 2015-11-03 Samsung Electronics Co., Ltd. Chip-on-film package and device assembly including the same

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JP2007279577A (ja) 2006-04-11 2007-10-25 Sony Corp 電子機器
US20090020858A1 (en) * 2007-07-17 2009-01-22 Matsushita Electric Industrial Co., Ltd. Tape carrier substrate and semiconductor device
EP2219680A2 (en) 2007-11-13 2010-08-25 Isis Pharmaceuticals, Inc. Compounds and methods for modulating protein expression
JP5140816B2 (ja) * 2009-03-31 2013-02-13 デクセリアルズ株式会社 接合体及びその製造方法
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
DE102010019841A1 (de) * 2010-05-07 2011-11-10 Ident Technology Ag Leiterplatte für Display und Anzeigemodul mit Display und Leiterplatte
US20120194990A1 (en) * 2011-01-31 2012-08-02 Martin Kuster Semiconductor Arrangements
JP2012215841A (ja) * 2011-04-01 2012-11-08 Sony Corp 表示装置
US8867231B2 (en) * 2012-01-13 2014-10-21 Tyco Electronics Corporation Electronic module packages and assemblies for electrical systems
KR101383085B1 (ko) * 2012-06-25 2014-04-08 삼성디스플레이 주식회사 유기 발광 표시 장치
US9210810B2 (en) * 2012-07-12 2015-12-08 Universal Display Corporation Method of fabricating flexible devices
KR101955465B1 (ko) 2012-08-16 2019-03-12 삼성디스플레이 주식회사 표시 장치
KR20140038823A (ko) * 2012-09-21 2014-03-31 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
KR102178470B1 (ko) * 2012-09-26 2020-11-18 엘지디스플레이 주식회사 연성 필름 케이블을 가지는 표시장치
KR101882827B1 (ko) 2012-11-02 2018-07-30 삼성디스플레이 주식회사 액정 표시 장치
KR101991892B1 (ko) 2013-02-18 2019-06-24 삼성디스플레이 주식회사 테이프 패키지 및 이를 구비한 평판 표시 장치
KR102144378B1 (ko) 2013-08-27 2020-08-13 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
KR20150070567A (ko) * 2013-12-17 2015-06-25 삼성디스플레이 주식회사 표시장치
KR102232166B1 (ko) 2014-03-06 2021-03-29 삼성디스플레이 주식회사 표시 장치
KR102258746B1 (ko) 2014-08-13 2021-06-01 삼성전자주식회사 벤딩부를 갖는 칩 온 필름 패키지
KR102251684B1 (ko) * 2014-09-03 2021-05-14 삼성디스플레이 주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
CN107432082A (zh) * 2015-03-31 2017-12-01 夏普株式会社 柔性印刷基板和显示装置
CN105828524A (zh) * 2016-05-27 2016-08-03 深圳市华星光电技术有限公司 显示器、多段电路板及其制造方法
US10248164B2 (en) * 2016-07-11 2019-04-02 Boe Technology Group Co., Ltd. Chip on film, flexible display apparatus having the same, and fabricating method thereof
JP6672108B2 (ja) * 2016-08-12 2020-03-25 株式会社フジクラ 配線基板及び当該配線基板の製造方法
KR102612998B1 (ko) * 2016-12-30 2023-12-11 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
KR102582059B1 (ko) 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
TWI646877B (zh) 2018-03-12 2019-01-01 Chipbond Technology Corporation 軟性電路基板之佈線結構
CN214101885U (zh) * 2018-05-28 2021-08-31 株式会社村田制作所 树脂多层基板以及电子设备
KR102517268B1 (ko) * 2018-07-16 2023-04-03 삼성전자주식회사 디스플레이 패널
JP7094837B2 (ja) * 2018-08-29 2022-07-04 株式会社ジャパンディスプレイ 表示装置、フレキシブル配線基板、及び、表示装置の製造方法
CN209167757U (zh) * 2019-01-29 2019-07-26 合肥鑫晟光电科技有限公司 覆晶薄膜及显示装置
WO2020258295A1 (zh) * 2019-06-28 2020-12-30 京东方科技集团股份有限公司 柔性电路板、柔性装置及显示设备
KR20220055759A (ko) * 2020-10-27 2022-05-04 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR20220064598A (ko) * 2020-11-12 2022-05-19 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
KR102847580B1 (ko) 2021-12-30 2025-08-18 엘지디스플레이 주식회사 디스플레이 장치

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Publication number Priority date Publication date Assignee Title
US9177904B2 (en) 2012-05-03 2015-11-03 Samsung Electronics Co., Ltd. Chip-on-film package and device assembly including the same
US9818732B2 (en) 2012-05-03 2017-11-14 Samsung Electronics Co., Ltd. Chip-on-film package and device assembly including the same

Also Published As

Publication number Publication date
JP2007053331A (ja) 2007-03-01
KR20070019358A (ko) 2007-02-15
US7435914B2 (en) 2008-10-14
US20070034402A1 (en) 2007-02-15

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