KR100765478B1 - 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 - Google Patents

구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 Download PDF

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Publication number
KR100765478B1
KR100765478B1 KR1020050074257A KR20050074257A KR100765478B1 KR 100765478 B1 KR100765478 B1 KR 100765478B1 KR 1020050074257 A KR1020050074257 A KR 1020050074257A KR 20050074257 A KR20050074257 A KR 20050074257A KR 100765478 B1 KR100765478 B1 KR 100765478B1
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KR
South Korea
Prior art keywords
tape
wiring pattern
wiring board
hole
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020050074257A
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English (en)
Korean (ko)
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KR20070019358A (ko
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정예정
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삼성전자주식회사
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Publication date
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Priority to KR1020050074257A priority Critical patent/KR100765478B1/ko
Priority to US11/336,785 priority patent/US7435914B2/en
Priority to JP2006069587A priority patent/JP2007053331A/ja
Publication of KR20070019358A publication Critical patent/KR20070019358A/ko
Application granted granted Critical
Publication of KR100765478B1 publication Critical patent/KR100765478B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020050074257A 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 Expired - Lifetime KR100765478B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020050074257A KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치
US11/336,785 US7435914B2 (en) 2005-08-12 2006-01-23 Tape substrate, tape package and flat panel display using same
JP2006069587A JP2007053331A (ja) 2005-08-12 2006-03-14 テープ配線基板と、それを用いたテープパッケージ及び平板表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050074257A KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치

Publications (2)

Publication Number Publication Date
KR20070019358A KR20070019358A (ko) 2007-02-15
KR100765478B1 true KR100765478B1 (ko) 2007-10-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050074257A Expired - Lifetime KR100765478B1 (ko) 2005-08-12 2005-08-12 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치

Country Status (3)

Country Link
US (1) US7435914B2 (enExample)
JP (1) JP2007053331A (enExample)
KR (1) KR100765478B1 (enExample)

Cited By (1)

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US9177904B2 (en) 2012-05-03 2015-11-03 Samsung Electronics Co., Ltd. Chip-on-film package and device assembly including the same

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JP2007279577A (ja) * 2006-04-11 2007-10-25 Sony Corp 電子機器
US20090020858A1 (en) * 2007-07-17 2009-01-22 Matsushita Electric Industrial Co., Ltd. Tape carrier substrate and semiconductor device
US8637478B2 (en) 2007-11-13 2014-01-28 Isis Pharmaceuticals, Inc. Compounds and methods for modulating protein expression
JP5140816B2 (ja) 2009-03-31 2013-02-13 デクセリアルズ株式会社 接合体及びその製造方法
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
DE102010019841A1 (de) * 2010-05-07 2011-11-10 Ident Technology Ag Leiterplatte für Display und Anzeigemodul mit Display und Leiterplatte
US20120194990A1 (en) * 2011-01-31 2012-08-02 Martin Kuster Semiconductor Arrangements
JP2012215841A (ja) * 2011-04-01 2012-11-08 Sony Corp 表示装置
US8867231B2 (en) * 2012-01-13 2014-10-21 Tyco Electronics Corporation Electronic module packages and assemblies for electrical systems
KR101383085B1 (ko) * 2012-06-25 2014-04-08 삼성디스플레이 주식회사 유기 발광 표시 장치
US9210810B2 (en) * 2012-07-12 2015-12-08 Universal Display Corporation Method of fabricating flexible devices
KR101955465B1 (ko) 2012-08-16 2019-03-12 삼성디스플레이 주식회사 표시 장치
KR20140038823A (ko) * 2012-09-21 2014-03-31 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
KR102178470B1 (ko) * 2012-09-26 2020-11-18 엘지디스플레이 주식회사 연성 필름 케이블을 가지는 표시장치
KR101882827B1 (ko) 2012-11-02 2018-07-30 삼성디스플레이 주식회사 액정 표시 장치
KR101991892B1 (ko) 2013-02-18 2019-06-24 삼성디스플레이 주식회사 테이프 패키지 및 이를 구비한 평판 표시 장치
KR102144378B1 (ko) * 2013-08-27 2020-08-13 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
KR20150070567A (ko) * 2013-12-17 2015-06-25 삼성디스플레이 주식회사 표시장치
KR102232166B1 (ko) 2014-03-06 2021-03-29 삼성디스플레이 주식회사 표시 장치
KR102258746B1 (ko) 2014-08-13 2021-06-01 삼성전자주식회사 벤딩부를 갖는 칩 온 필름 패키지
KR102251684B1 (ko) * 2014-09-03 2021-05-14 삼성디스플레이 주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
CN107432082A (zh) * 2015-03-31 2017-12-01 夏普株式会社 柔性印刷基板和显示装置
CN105828524A (zh) * 2016-05-27 2016-08-03 深圳市华星光电技术有限公司 显示器、多段电路板及其制造方法
JP6789230B2 (ja) * 2016-07-11 2020-11-25 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． チップオンフィルム、及びそれを備えたフレキシブルディスプレイ装置並びにその製造方法
JP6672108B2 (ja) * 2016-08-12 2020-03-25 株式会社フジクラ 配線基板及び当該配線基板の製造方法
KR102612998B1 (ko) * 2016-12-30 2023-12-11 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
KR102582059B1 (ko) 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
TWI646877B (zh) 2018-03-12 2019-01-01 Chipbond Technology Corporation 軟性電路基板之佈線結構
WO2019230524A1 (ja) * 2018-05-28 2019-12-05 株式会社村田製作所 樹脂多層基板および電子機器
KR102517268B1 (ko) * 2018-07-16 2023-04-03 삼성전자주식회사 디스플레이 패널
JP7094837B2 (ja) * 2018-08-29 2022-07-04 株式会社ジャパンディスプレイ 表示装置、フレキシブル配線基板、及び、表示装置の製造方法
CN209167757U (zh) * 2019-01-29 2019-07-26 合肥鑫晟光电科技有限公司 覆晶薄膜及显示装置
WO2020258295A1 (zh) * 2019-06-28 2020-12-30 京东方科技集团股份有限公司 柔性电路板、柔性装置及显示设备
KR20220055759A (ko) * 2020-10-27 2022-05-04 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스
US11839030B2 (en) * 2020-11-12 2023-12-05 Lg Innotek Co., Ltd. Flexible printed circuit board, COF module, and electronic device comprising the same
KR102847580B1 (ko) 2021-12-30 2025-08-18 엘지디스플레이 주식회사 디스플레이 장치

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Publication number Priority date Publication date Assignee Title
US9177904B2 (en) 2012-05-03 2015-11-03 Samsung Electronics Co., Ltd. Chip-on-film package and device assembly including the same
US9818732B2 (en) 2012-05-03 2017-11-14 Samsung Electronics Co., Ltd. Chip-on-film package and device assembly including the same

Also Published As

Publication number Publication date
KR20070019358A (ko) 2007-02-15
US7435914B2 (en) 2008-10-14
US20070034402A1 (en) 2007-02-15
JP2007053331A (ja) 2007-03-01

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