JP4650269B2 - 積層型半導体装置の製造方法 - Google Patents
積層型半導体装置の製造方法 Download PDFInfo
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- JP4650269B2 JP4650269B2 JP2006000682A JP2006000682A JP4650269B2 JP 4650269 B2 JP4650269 B2 JP 4650269B2 JP 2006000682 A JP2006000682 A JP 2006000682A JP 2006000682 A JP2006000682 A JP 2006000682A JP 4650269 B2 JP4650269 B2 JP 4650269B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
図1は、本発明の第1の実施の形態に係る積層型半導体装置を説明するために示す図である。図1(a)は断面図を、図1(b)はA矢視図を、図1(c)は側面図をそれぞれ示す。
図1(a)〜(c)において、符号1で示す積層型半導体装置1は、層間接続用の半田ボール2を用いたリフロー実装によって積層型に接合された2つの半導体装置3,4から大略構成されている。
半導体装置3は、回路面5Aを基板側に有する半導体チップ5と、この半導体チップ5を搭載するBGA用の回路基板(配線基板)6とを備えている。
半導体装置4は、半導体装置3と同様に回路面10Aを基板側に有する半導体チップ10と、この半導体チップ10を搭載するBGA用の回路基板(配線基板)11とを備え、半導体装置3上に接合されている。
予め絶縁基板(図示せず)に導体パターン(図示せず)を形成してなる(図2のステップS1)回路基板6,11の回路面側にそれぞれ平面略H字状の接着フィルム7と平面略矩形状の接着フィルム12を貼付する(図2のステップS2)。この場合、接着フィルム7は回路基板6のチップ搭載位置(1箇所)及び突起接着位置(4箇所)を含む領域に、また接着フィルム12はチップ搭載位置(1箇所)にそれぞれ貼付される。なお、回路基板6,11上に接着材としてそれぞれ接着フィルム7,12を貼付する場合について説明したが、これら接着フィルム7,12を貼付する代わりに接着剤を塗布してもよい。
回路基板6の突起接着位置に接着フィルム7を介して4つの突起8を配置する(図2のステップS3)。この場合、突起8の接着は、接着フィルム7の形成・接着に用いるプレス金型によってその形成と同時に実施される。
回路基板6,11の各チップ搭載位置にそれぞれ接着フィルム7,12を介して半導体チップ5,10を配置する(図2のステップS4)。この場合、半導体チップ5,10の配置は、突起8の配置前に、あるいは突起8の配置と同時に実施してもよい。
回路基板6,11上の接着フィルム7,12を硬化させる(図2のステップS5)。この場合、接着フィルム7が硬化すると、回路基板6,11の各チップ搭載側面にそれぞれ接着フィルム7と接着フィルム12を介して半導体チップ5,10が搭載されるとともに、回路基板6のチップ搭載側面に突起8が接着される。
回路基板6,11のチップ反搭載側面(ランド)にそれぞれ半田ボール9,2を搭載する。ここで、半田ボール9,2を搭載するにあたり、半導体チップ5,10の封止工程やワイヤボンディング工程を必要とする場合には、これら工程が「半導体装置の接合」の工程前に実施される(図2のステップS6)。
このようにして、積層型半導体装置1を製造することができる。
以上説明した第1の実施の形態によれば、次に示す効果が得られる。
図5は、本発明の参考形態に係る積層型半導体装置を説明するために示す図である。図5(a)は断面図を、図5(b)はB矢視図を、図5(c)は側面図をそれぞれ示す。図5(a)〜(c)において、図1(a)〜(c)と同一又は同等の部材については同一の符号を付し、詳細な説明は省略する。
以上説明した参考形態によれば、第1の実施の形態の効果(1)〜(5)に加え、次に示す効果が得られる。
第1接着フィルム52及び第2接着フィルムの平面形状は矩形であるため、その加工を簡単に行うことができる。
Claims (2)
- 半導体チップを搭載したボールグリッドアレイ用の回路基板を備えた複数の半導体装置を積層する積層型半導体装置の製造方法において、
前記回路基板に接着材を配置する工程と、
前記回路基板に未硬化の前記接着材を介して前記半導体チップを搭載するとともに、前記回路基板間に基板傾斜規制用の突起を前記未硬化の接着材によって配置する工程と、
前記未硬化の接着材を硬化させる工程と、
前記回路基板間に半田ボールが介在するように前記複数の半導体装置を積層する工程とを備えたことを特徴とする積層型半導体装置の製造方法。 - 絶縁性フィルムを打ち抜くことにより前記突起を複数個形成し、前記複数個の突起を前記回路基板に同時に貼り付ける請求項1に記載の積層型半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006000682A JP4650269B2 (ja) | 2006-01-05 | 2006-01-05 | 積層型半導体装置の製造方法 |
US11/447,975 US7626126B2 (en) | 2006-01-05 | 2006-06-07 | Multilayer semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006000682A JP4650269B2 (ja) | 2006-01-05 | 2006-01-05 | 積層型半導体装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010024254A Division JP5170123B2 (ja) | 2010-02-05 | 2010-02-05 | 積層型半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007184362A JP2007184362A (ja) | 2007-07-19 |
JP4650269B2 true JP4650269B2 (ja) | 2011-03-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006000682A Expired - Fee Related JP4650269B2 (ja) | 2006-01-05 | 2006-01-05 | 積層型半導体装置の製造方法 |
Country Status (2)
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US (1) | US7626126B2 (ja) |
JP (1) | JP4650269B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4973225B2 (ja) * | 2007-02-16 | 2012-07-11 | 凸版印刷株式会社 | 高集積半導体装置 |
JP5259369B2 (ja) | 2008-12-16 | 2013-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
JP2010186848A (ja) * | 2009-02-12 | 2010-08-26 | Fujitsu Ltd | 電子部品ユニットの製造方法 |
EP2309829A1 (en) * | 2009-09-24 | 2011-04-13 | Harman Becker Automotive Systems GmbH | Multilayer circuit board |
US20110084375A1 (en) * | 2009-10-13 | 2011-04-14 | Freescale Semiconductor, Inc | Semiconductor device package with integrated stand-off |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284368U (ja) * | 1988-12-17 | 1990-06-29 | ||
JPH0846313A (ja) * | 1994-07-29 | 1996-02-16 | Fujitsu Ltd | パッケージの実装構造 |
JPH10112478A (ja) * | 1996-10-04 | 1998-04-28 | Denso Corp | ボールグリッドアレイ半導体装置及びその実装方法 |
JP2001223289A (ja) * | 2000-02-08 | 2001-08-17 | Sony Corp | リードフレームと、その製造方法と、半導体集積回路装置と、その製造方法 |
JP2002076265A (ja) * | 2000-09-01 | 2002-03-15 | Sony Corp | 半導体デバイスの実装方法、半導体デバイス及び半導体装置 |
JP2004023084A (ja) * | 2002-06-20 | 2004-01-22 | Dt Circuit Technology Co Ltd | 3次元モジュール、3次元モジュールの製造方法 |
JP2004311667A (ja) * | 2003-04-07 | 2004-11-04 | Hitachi Cable Ltd | 半導体装置及び電子装置、ならびに配線板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW434767B (en) * | 1998-09-05 | 2001-05-16 | Via Tech Inc | Package architecture of ball grid array integrated circuit device |
US6400033B1 (en) * | 2000-06-01 | 2002-06-04 | Amkor Technology, Inc. | Reinforcing solder connections of electronic devices |
US6778404B1 (en) * | 2000-06-02 | 2004-08-17 | Micron Technology Inc | Stackable ball grid array |
KR100443504B1 (ko) * | 2001-06-12 | 2004-08-09 | 주식회사 하이닉스반도체 | 볼 그리드 어레이 패키지 구조 및 그 제조방법 |
JP3847602B2 (ja) | 2001-10-30 | 2006-11-22 | シャープ株式会社 | 積層型半導体装置及びその製造方法並びに半導体装置搭載マザーボード及び半導体装置搭載マザーボードの製造方法 |
DE10227342B4 (de) * | 2002-06-19 | 2008-06-05 | Qimonda Ag | Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung |
JP3923441B2 (ja) * | 2003-03-25 | 2007-05-30 | 三光株式会社 | 難燃性合成樹脂組成物 |
-
2006
- 2006-01-05 JP JP2006000682A patent/JP4650269B2/ja not_active Expired - Fee Related
- 2006-06-07 US US11/447,975 patent/US7626126B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284368U (ja) * | 1988-12-17 | 1990-06-29 | ||
JPH0846313A (ja) * | 1994-07-29 | 1996-02-16 | Fujitsu Ltd | パッケージの実装構造 |
JPH10112478A (ja) * | 1996-10-04 | 1998-04-28 | Denso Corp | ボールグリッドアレイ半導体装置及びその実装方法 |
JP2001223289A (ja) * | 2000-02-08 | 2001-08-17 | Sony Corp | リードフレームと、その製造方法と、半導体集積回路装置と、その製造方法 |
JP2002076265A (ja) * | 2000-09-01 | 2002-03-15 | Sony Corp | 半導体デバイスの実装方法、半導体デバイス及び半導体装置 |
JP2004023084A (ja) * | 2002-06-20 | 2004-01-22 | Dt Circuit Technology Co Ltd | 3次元モジュール、3次元モジュールの製造方法 |
JP2004311667A (ja) * | 2003-04-07 | 2004-11-04 | Hitachi Cable Ltd | 半導体装置及び電子装置、ならびに配線板 |
Also Published As
Publication number | Publication date |
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US7626126B2 (en) | 2009-12-01 |
JP2007184362A (ja) | 2007-07-19 |
US20070151754A1 (en) | 2007-07-05 |
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