JP2000503478A - 二重基板ホルダを有する基板搬送装置 - Google Patents
二重基板ホルダを有する基板搬送装置Info
- Publication number
- JP2000503478A JP2000503478A JP9526114A JP52611497A JP2000503478A JP 2000503478 A JP2000503478 A JP 2000503478A JP 9526114 A JP9526114 A JP 9526114A JP 52611497 A JP52611497 A JP 52611497A JP 2000503478 A JP2000503478 A JP 2000503478A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holder
- movable arm
- arm assembly
- holders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.二対の被駆動アームを有する可動アームアセンブリと; 前記被駆動アーム対のうちの別々の1本のアームに各々個別に連結され、第1 のホルダが少なくとも2つの離隔した基板を上に同時に保持するように適切なサ イズおよび形状を有しているような2つの基板ホルダを含む基板搬送装置であっ て、 前記2つの基板ホルダが常に、前記可動アームアセンブリの同じ側に位置設定 されていることを特徴とする基板搬送装置。 2.前記可動アームアセンブリに連結されている同軸駆動シャフトアセンブリを さらに含んでいることを特徴とする請求項1に記載の装置。 3.前記2つの基板ホルダは、一方のホルダが他方のホルダより上に位置設定さ れた状態で平行な複数の平面内に位置設定されていることを特徴とする請求項1 に記載の装置。 4.両方の基板ホルダが、少なくとも2つの離隔した基板を上に同時に保持する ように適切なサイズおよび形状を有していることを特徴とする請求項1に記載の 装置。 5.前記第1の基板ホルダが、互いに隣接する形で同じ平面内に2つの平面基板 を保持するため2つの並んだ基板保持部域を有していることを特徴とする請求項 1に記載の装置。 6.前記第1の基板ホルダは、一方の基板がもう1つの基板よりも上に位置設定 されている状態で平行な複数の平面内に2つの平面基板を保持するため、一方の 部域がもう1つの部域よりも上に位置設定されている2つの基板保持部域を有し ていることを特徴とする請求項1に記載の装置。 7.基板供給装置と; 前記基板供給装置に連結された基板搬送モジュールであって、可動アームアセ ンブリ及びこのアセンブリに搭載されてこのアセンブリの中心に対する拡張およ び引込みをなす2つの基板ホルダを有し、かつ、第1のホルダが同時に2つの基 板を保持するため2つの別々の保持部域を有する、基板搬送モジュールと; 前記基板搬送モジュールに連結され前記可動アームアセンブリおよび前記第1 のホルダにより搬送された2つの基板を同時に収容するように適切なサイズおよ び形状を有する基板処理モジュールと; を含んでいる基板処理装置であって、 前記基板搬送モジュールは、その中心軸のまわりで前記基板ホルダを回転させ ることなく2つ以上の基板を移動させることができ; 前記2つの基板ホルダは、前記可動アームアセンブリの相対する側に位置設定 されており; 前記第1の基板ホルダは、2つの保持部域の各々においてフレーム部材の上部 表面から延びる3点マウントを伴う 全体的に平面のモノブロックフレーム部材を有し、前記2つの保持部域は、横に 並んだ構成で互いに隣接して位置設定されていることを特徴とする基板処理装置 。 8.両方の基板ホルダの各々が2つの別々の離隔した保持部域を有することを特 徴とする請求項6に記載の装置。 9.前記2つの別々のホルダが前記可動アームアセンブリの同じ側に位置設定さ れていることを特徴とする請求項6に記載の装置。 10.前記可動アームアセンブリが2本の駆動アームと4本の被駆動アームを含 んでいることを特徴とする請求項6に記載の装置。 11.2本の駆動アームと二対の被駆動アームを有し、各々の被駆動アーム対が 、駆動アームのうちの第1のものに連結された第1の被駆動アームと、第2の駆 動アームに連結された第2の被駆動アームを有し、前記二対の被駆動アームが駆 動アームの相対する側に位置設定されている、可動アームアセンブリと; 前記被駆動アーム対のうちの別々のものに個別に連結され、一度に複数の基板 を同時に保持するように各ホルダのための1つ以上の別々の基板保持部域を各々 有している2つの基板ホルダと; を含んでいる基板搬送装置であって、 前記基板ホルダの各々が平行な複数平面内で互いの上に位置設定されたそのそ れぞれの保持部域を有することを特 徴とする基板搬送装置。 12.前記2つの基板ホルダの各々が2つの基板保持部域を含んでいることを特 徴とする請求項11に記載の装置。 13.可動アームアセンブリと; 前記可動アームアセンブリに連結された第1の基板ホルダと; 前記可動アームアセンブリに連結された第2の基板ホルダを含んでいる基板搬 送装置であって、 前記可動アームアセンブリが相対して一斉に第1および第2の基板ホルダを移 動させ; 第1の基板ホルダが、第1の最大数の基板を保持するような適切なサイズおよ び形状を有しており、第2の基板ホルダが異なる第2の最大数の基板を保持する ような適切なサイズおよび形状を有していることを特徴とする基板搬送装置。 14.前記第1の基板ホルダが、その上に唯一の基板のみを保持するようなサイ ズおよび形状を有することを特徴とする請求項13に記載の装置。 15.前記第1および第2の基板ホルダが、前記可動アームアセンブリの相対す る側に位置設定されていることを特徴とする請求項13に記載の装置。 16.前記第1および第2の基板ホルダが前記可動アームアセンブリの同じ側に あることを特徴とする請求項13に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/587,087 | 1996-01-16 | ||
US08/587,087 US6299404B1 (en) | 1995-10-27 | 1996-01-16 | Substrate transport apparatus with double substrate holders |
PCT/US1997/000533 WO1997026117A1 (en) | 1996-01-16 | 1997-01-13 | Substrate transport apparatus with double substrate holders |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000503478A true JP2000503478A (ja) | 2000-03-21 |
JP4084417B2 JP4084417B2 (ja) | 2008-04-30 |
Family
ID=24348294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52611497A Expired - Lifetime JP4084417B2 (ja) | 1996-01-16 | 1997-01-13 | 二重基板ホルダを有する基板搬送装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US6299404B1 (ja) |
EP (1) | EP0883467A4 (ja) |
JP (1) | JP4084417B2 (ja) |
KR (1) | KR19990077353A (ja) |
AU (1) | AU1578397A (ja) |
WO (1) | WO1997026117A1 (ja) |
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JP2012160759A (ja) * | 2012-05-15 | 2012-08-23 | Dainippon Screen Mfg Co Ltd | 基板搬送装置およびこれを備えた基板処理装置 |
JP5395271B2 (ja) * | 2010-08-17 | 2014-01-22 | キヤノンアネルバ株式会社 | 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法 |
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EP0883467A1 (en) | 1998-12-16 |
US6158941A (en) | 2000-12-12 |
WO1997026117A1 (en) | 1997-07-24 |
AU1578397A (en) | 1997-08-11 |
KR19990077353A (ko) | 1999-10-25 |
JP4084417B2 (ja) | 2008-04-30 |
US6299404B1 (en) | 2001-10-09 |
EP0883467A4 (en) | 2000-05-31 |
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