HK82497A - Method of and apparatus for molding resin to seal electronic parts - Google Patents
Method of and apparatus for molding resin to seal electronic partsInfo
- Publication number
- HK82497A HK82497A HK82497A HK82497A HK82497A HK 82497 A HK82497 A HK 82497A HK 82497 A HK82497 A HK 82497A HK 82497 A HK82497 A HK 82497A HK 82497 A HK82497 A HK 82497A
- Authority
- HK
- Hong Kong
- Prior art keywords
- evacuation
- die space
- instantaneous
- vacuum
- electronic parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/228—Injection plunger or ram: transfer molding type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/812—Venting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5120745A JP2524955B2 (ja) | 1993-04-22 | 1993-04-22 | 電子部品の樹脂封止成形方法及び装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK82497A true HK82497A (en) | 1997-06-27 |
Family
ID=14793940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK82497A HK82497A (en) | 1993-04-22 | 1997-06-19 | Method of and apparatus for molding resin to seal electronic parts |
Country Status (10)
Country | Link |
---|---|
US (2) | US5603879A (nl) |
JP (1) | JP2524955B2 (nl) |
KR (1) | KR0158238B1 (nl) |
CN (1) | CN1032781C (nl) |
GB (1) | GB2277294B (nl) |
HK (1) | HK82497A (nl) |
MY (1) | MY111091A (nl) |
NL (1) | NL194709C (nl) |
SG (1) | SG43830A1 (nl) |
TW (1) | TW264565B (nl) |
Families Citing this family (71)
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JP3423766B2 (ja) * | 1994-03-11 | 2003-07-07 | Towa株式会社 | 電子部品の樹脂封止成形方法及び金型装置 |
JP3566426B2 (ja) * | 1995-10-30 | 2004-09-15 | Towa株式会社 | 電子部品の樹脂成形装置 |
JPH09252017A (ja) * | 1996-03-14 | 1997-09-22 | Towa Kk | 電子部品の樹脂封止成形方法 |
NL1004460C2 (nl) * | 1996-11-06 | 1998-05-08 | Fico Bv | Ejectorpen, vormdeel en mal voor het omhullen van electronische componenten alsmede een werkwijze voor het afdichten van een tussenruimte. |
US5997798A (en) * | 1997-06-27 | 1999-12-07 | International Business Machines Corporation | Biasing mold for integrated circuit chip assembly encapsulation |
JP3367870B2 (ja) * | 1997-07-28 | 2003-01-20 | 東芝マイクロエレクトロニクス株式会社 | 半導体装置樹脂封止金型及び半導体装置の樹脂封止方法 |
JP3127889B2 (ja) * | 1998-06-25 | 2001-01-29 | 日本電気株式会社 | 半導体パッケージの製造方法およびその成形用金型 |
US6234681B1 (en) | 1999-05-21 | 2001-05-22 | Lucent Technologies Inc. | Apparatus and method for interconnecting optical fibers |
JP2001129833A (ja) * | 1999-11-05 | 2001-05-15 | Miyagi Oki Electric Co Ltd | 成形金型及び半導体装置の製造方法 |
JP3510554B2 (ja) * | 2000-02-10 | 2004-03-29 | 山形日本電気株式会社 | 樹脂モールド方法、モールド成形用金型及び配線基材 |
FR2809229B1 (fr) | 2000-05-22 | 2002-12-13 | St Microelectronics Sa | Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres |
JP2002166448A (ja) * | 2000-12-01 | 2002-06-11 | Sony Corp | 成形用金型装置および成形方法 |
JP3859457B2 (ja) * | 2001-03-27 | 2006-12-20 | 沖電気工業株式会社 | 半導体装置の製造方法 |
JP4769380B2 (ja) | 2001-05-18 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | クリーニング用シートおよびそれを用いた半導体装置の製造方法 |
US6982094B2 (en) * | 2001-09-28 | 2006-01-03 | Mcneil-Ppc, Inc. | Systems, methods and apparatuses for manufacturing dosage forms |
US6742646B2 (en) * | 2001-09-28 | 2004-06-01 | Mcneil-Ppc, Inc. | Systems, methods and apparatuses for manufacturing dosage forms |
US7217381B2 (en) * | 2001-09-28 | 2007-05-15 | Mcneil-Ppc, Inc. | Systems, methods and apparatuses for manufacturing dosage forms |
US6837696B2 (en) * | 2001-09-28 | 2005-01-04 | Mcneil-Ppc, Inc. | Apparatus for manufacturing dosage forms |
US7122143B2 (en) | 2001-09-28 | 2006-10-17 | Mcneil-Ppc, Inc. | Methods for manufacturing dosage forms |
US7323192B2 (en) * | 2001-09-28 | 2008-01-29 | Mcneil-Ppc, Inc. | Immediate release tablet |
US7838026B2 (en) | 2001-09-28 | 2010-11-23 | Mcneil-Ppc, Inc. | Burst-release polymer composition and dosage forms comprising the same |
US6767200B2 (en) * | 2001-09-28 | 2004-07-27 | Mcneil-Ppc, Inc. | Systems, methods and apparatuses for manufacturing dosage forms |
BR0212951A (pt) | 2001-09-28 | 2004-10-26 | Mcneil Ppc Inc | Formas de dosagens compósitas |
US6532694B1 (en) * | 2002-01-02 | 2003-03-18 | Wayne Gathright | Method of casting lure and multi cavity mold therefor |
JP2004134591A (ja) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP4519398B2 (ja) * | 2002-11-26 | 2010-08-04 | Towa株式会社 | 樹脂封止方法及び半導体装置の製造方法 |
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US6858466B1 (en) * | 2003-11-03 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | System and a method for fluid filling wafer level packages |
JP3958309B2 (ja) * | 2004-08-23 | 2007-08-15 | 株式会社名機製作所 | 射出成形機 |
US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
US8673352B2 (en) | 2005-04-15 | 2014-03-18 | Mcneil-Ppc, Inc. | Modified release dosage form |
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US7595515B2 (en) * | 2005-10-24 | 2009-09-29 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
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JP5468574B2 (ja) * | 2011-06-29 | 2014-04-09 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
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JP5944866B2 (ja) * | 2013-06-20 | 2016-07-05 | Towa株式会社 | 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 |
CN103640145B (zh) * | 2013-12-30 | 2016-08-17 | 东莞捷荣技术股份有限公司 | 一种基于pc/abs的铝制复合体及其注塑方法 |
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US5405255A (en) * | 1992-11-24 | 1995-04-11 | Neu Dynamics Corp. | Encapsulaton molding equipment |
JP2936929B2 (ja) * | 1992-12-22 | 1999-08-23 | 豊田合成株式会社 | 真空箱付き成形装置 |
-
1993
- 1993-04-22 JP JP5120745A patent/JP2524955B2/ja not_active Expired - Fee Related
-
1994
- 1994-04-09 TW TW083103124A patent/TW264565B/zh not_active IP Right Cessation
- 1994-04-18 US US08/229,232 patent/US5603879A/en not_active Expired - Lifetime
- 1994-04-19 GB GB9407713A patent/GB2277294B/en not_active Expired - Fee Related
- 1994-04-19 SG SG1996001664A patent/SG43830A1/en unknown
- 1994-04-21 KR KR1019940008420A patent/KR0158238B1/ko not_active IP Right Cessation
- 1994-04-22 CN CN94104041.0A patent/CN1032781C/zh not_active Expired - Fee Related
- 1994-04-22 MY MYPI94000993A patent/MY111091A/en unknown
- 1994-04-22 NL NL9400648A patent/NL194709C/nl not_active IP Right Cessation
-
1996
- 1996-12-18 US US08/770,724 patent/US5834035A/en not_active Expired - Fee Related
-
1997
- 1997-06-19 HK HK82497A patent/HK82497A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2524955B2 (ja) | 1996-08-14 |
NL194709B (nl) | 2002-08-01 |
CN1099189A (zh) | 1995-02-22 |
GB2277294A (en) | 1994-10-26 |
KR0158238B1 (ko) | 1999-02-18 |
TW264565B (nl) | 1995-12-01 |
NL194709C (nl) | 2002-12-03 |
GB2277294B (en) | 1997-01-15 |
SG43830A1 (en) | 1997-11-14 |
US5834035A (en) | 1998-11-10 |
MY111091A (en) | 1999-08-30 |
US5603879A (en) | 1997-02-18 |
CN1032781C (zh) | 1996-09-11 |
JPH06310553A (ja) | 1994-11-04 |
GB9407713D0 (en) | 1994-06-15 |
NL9400648A (nl) | 1994-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120419 |