DK0478606T3 - Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra - Google Patents

Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra

Info

Publication number
DK0478606T3
DK0478606T3 DK90909068.0T DK90909068T DK0478606T3 DK 0478606 T3 DK0478606 T3 DK 0478606T3 DK 90909068 T DK90909068 T DK 90909068T DK 0478606 T3 DK0478606 T3 DK 0478606T3
Authority
DK
Denmark
Prior art keywords
preparation
epoxy
terminated
percent
electrical laminates
Prior art date
Application number
DK90909068.0T
Other languages
English (en)
Inventor
Raymond A Koenig
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of DK0478606T3 publication Critical patent/DK0478606T3/da

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/04Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/003Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/09Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
    • C08G18/092Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/28Di-epoxy compounds containing acyclic nitrogen atoms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00Epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Compounds (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
DK90909068.0T 1989-06-06 1990-05-25 Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra DK0478606T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB898912952A GB8912952D0 (en) 1989-06-06 1989-06-06 Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
SG9590553 1995-03-28

Publications (1)

Publication Number Publication Date
DK0478606T3 true DK0478606T3 (da) 1995-05-15

Family

ID=26295443

Family Applications (1)

Application Number Title Priority Date Filing Date
DK90909068.0T DK0478606T3 (da) 1989-06-06 1990-05-25 Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra

Country Status (14)

Country Link
US (1) US5112932A (da)
EP (1) EP0478606B1 (da)
JP (1) JP2859956B2 (da)
KR (1) KR0160755B1 (da)
AT (1) ATE115596T1 (da)
AU (1) AU628596B2 (da)
BR (1) BR9007428A (da)
CA (1) CA2018265A1 (da)
DE (1) DE69015188T2 (da)
DK (1) DK0478606T3 (da)
ES (1) ES2067030T3 (da)
GB (1) GB8912952D0 (da)
NZ (1) NZ233933A (da)
WO (1) WO1990015089A1 (da)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322909B2 (ja) * 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
DE4223630A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223622A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223632A1 (de) 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
US5290903A (en) * 1992-11-09 1994-03-01 Norton Company Composite abrasive wheels
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
CA2115533C (en) * 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5480958A (en) 1994-09-21 1996-01-02 Air Products And Chemicals, Inc. Polyepoxide resins incorporating epoxy terminated urethanes as tougheners
KR19990021907A (ko) * 1995-05-24 1999-03-25 디어터 크리스트, 베르너 뵈켈 할로겐을 함유하지 않는 난연성 에폭시수지 성형재료
US5686541A (en) * 1995-11-14 1997-11-11 National Science Council Modification of epoxy resins with urethane prepolymer for electronic encapsulation
GB2315490B (en) * 1996-07-22 2001-02-07 Dow Deutschland Inc Improved curing catalysts for curing epoxy resins
KR100347286B1 (ko) * 1997-03-27 2002-08-03 미쯔비시 레이온 가부시끼가이샤 섬유보강 수지용 에폭시 수지 조성물, 프리프레그 및 이들을 이용하여 얻는 튜브형 성형품
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
WO2005118604A1 (en) * 2004-05-28 2005-12-15 Dow Global Technologies Inc. Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
KR100866653B1 (ko) * 2004-06-29 2008-11-04 아사히 가세이 케미칼즈 가부시키가이샤 난연성 에폭시 수지 조성물
CN101151294B (zh) * 2005-04-07 2011-02-09 旭化成电子材料株式会社 环氧树脂组合物
EP1818044A1 (en) * 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
US20090159313A1 (en) * 2005-12-22 2009-06-25 Ludovic Valette Curable epoxy resin composition and laminates made therefrom
WO2008140906A1 (en) * 2007-05-09 2008-11-20 Dow Global Technologies Inc. Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
WO2008144252A1 (en) * 2007-05-16 2008-11-27 Dow Global Technologies Inc. Flame retardant composition
BRPI0811680A2 (pt) 2007-06-20 2015-02-10 Dow Global Technologies Inc "adesivo estrutural de um componente e método"
BRPI0813210A2 (pt) * 2007-08-02 2014-12-23 Dow Global Technologies Inc "processo para amortecer vibrações num artigo, compósito tendo propriedades de amortecimento melhoradas em temperaturas elevadas e composição termofixa tendo propriedades de amortecimento melhoradas em temperaturas elevadas"
CN101802037A (zh) * 2007-09-11 2010-08-11 陶氏环球技术公司 熔融粘结的环氧泡沫体涂敷用的异氰酸酯改性的环氧树脂
JP2010540724A (ja) * 2007-09-28 2010-12-24 ダウ グローバル テクノロジーズ インコーポレイティド エポキシ樹脂組成
CN101815734A (zh) * 2007-10-05 2010-08-25 陶氏环球技术公司 异氰酸酯改性环氧树脂及其环氧粉末涂料组合物
CN101910230A (zh) * 2007-10-26 2010-12-08 陶氏环球技术公司 用于电层合体中的含有异氰脲酸酯的环氧树脂组合物
WO2009058715A2 (en) 2007-10-31 2009-05-07 Dow Global Technology Inc. Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications
JP2011505461A (ja) * 2007-11-29 2011-02-24 ダウ グローバル テクノロジーズ インコーポレイティド 熱硬化性エポキシ樹脂用硬化剤としてジシアンジアミドを使用するジメチルホルムアミドを含まない配合物
EP2244871A1 (en) 2007-11-29 2010-11-03 Dow Global Technologies Inc. Microwave heatable monovinyl aromatic polymers
US8742018B2 (en) * 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
US20110263754A1 (en) * 2009-01-06 2011-10-27 Dow Global Technologies Llc Metallic compounds in non-brominated flame retardant epoxy resins
EP2385962B1 (en) * 2009-01-06 2015-09-02 Dow Global Technologies LLC Metal stabilizers for epoxy resins and advancement process
BRPI1005818A2 (pt) 2009-02-26 2016-03-08 Dow Global Technologies Llc adesivo estrutural monocomponente e método de aplicação de adesivo estrutural
US7947785B2 (en) * 2009-05-21 2011-05-24 New Jersey Institute Of Technology Polyoxazolidones derived from bisanhydrohexitols
KR100929380B1 (ko) * 2009-06-18 2009-12-02 주식회사 신아티앤씨 난연성 폴리에폭시 화합물의 제조방법
CN102803335A (zh) 2009-06-22 2012-11-28 陶氏环球技术有限责任公司 环氧树脂的硬化剂组合物
EP2284004A1 (en) 2009-08-13 2011-02-16 Nan Ya Plastics Corp. Electric circuit board composition and a method of preparing circuit board
EP2496657B1 (en) 2009-11-05 2016-04-27 Dow Global Technologies LLC Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes
JP5706437B2 (ja) 2009-11-12 2015-04-22 ダウ グローバル テクノロジーズ エルエルシー ポリオキサゾリドン樹脂
KR20120115329A (ko) 2009-12-22 2012-10-17 다우 글로벌 테크놀로지스 엘엘씨 옥사졸리돈 고리 함유 부가물
EP2528971A2 (en) 2010-01-29 2012-12-05 Dow Global Technologies LLC Compositions having phosphorus-containing compounds
WO2011163100A2 (en) * 2010-06-23 2011-12-29 Dow Global Technologies Llc Powder coatings compositions
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
US9000120B2 (en) 2010-06-29 2015-04-07 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
KR101981715B1 (ko) 2010-12-26 2019-05-23 다우 글로벌 테크놀로지스 엘엘씨 페놀, 폴리페놀 또는 아미노페놀 화합물로 캡핑된 쇄-연장된 탄성중합체성 강인화제를 함유하는 구조적 에폭시 수지 접착제
KR101520202B1 (ko) 2010-12-28 2015-05-13 미쓰이 가가쿠 토세로 가부시키가이샤 수지 조성물, 이것을 포함하는 보호막, 드라이 필름, 회로 기판 및 다층 회로 기판
BR112013031429A2 (pt) 2011-06-24 2016-12-13 Dow Global Technologies Llc sistema de resina epóxi curável de dois componentes e processo para formar um compósito de epóxi reforçado com fibra
BR112013031427A2 (pt) 2011-06-30 2017-04-25 Dow Global Technologies Llc sistema de resina epoxi curável e processo para formar um compósito epoxi reforçado com fibra
JP2014521793A (ja) 2011-08-01 2014-08-28 ダウ グローバル テクノロジーズ エルエルシー オキサゾリドン環含有ビニルエステル樹脂及びその生成物
US9346983B2 (en) 2012-03-23 2016-05-24 Dow Global Technologies Llc Flame retardant structural epoxy resin adhesives and process for bonding metal members
JP6173424B2 (ja) 2012-03-23 2017-08-02 ダウ グローバル テクノロジーズ エルエルシー 応力耐久性が高い破壊耐久性接着剤
RU2015118176A (ru) 2012-10-17 2016-12-10 БЛЮ КЬЮБ АйПи ЭлЭлСи Ударопрочные отверждающиеся эпоксидные композиции для применения при высокой температуре
WO2014062531A2 (en) * 2012-10-17 2014-04-24 Dow Global Technologies Llc Core shell rubber modified solid epoxy resins
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
US9834671B2 (en) 2012-11-07 2017-12-05 Dow Global Technologies Llc Curable epoxy composition and a composite made therefrom
WO2014078219A1 (en) 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
US9321880B2 (en) 2012-11-13 2016-04-26 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
BR112015014765A2 (pt) 2012-12-21 2017-07-11 Dow Global Technologies Llc processo para formar um polímero elastomérico
WO2014100238A2 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Phase-segmented non-isocyanate elastomers
JP6379110B2 (ja) 2012-12-21 2018-08-29 ダウ グローバル テクノロジーズ エルエルシー 電気ケーブル接続のための非イソシアネート系シーラント
US10107064B2 (en) 2013-06-06 2018-10-23 Halliburton Energy Services, Inc. Changeable well seal tool
US20160152822A1 (en) * 2013-08-16 2016-06-02 Dow Global Technologies Llc 1k thermoset epoxy composition
DK3046943T3 (da) 2013-09-16 2020-04-27 Dow Global Technologies Llc Polyurethanelastomer til anvendelse til isolering af undersøiske rørledninger
CA2933688C (en) 2013-12-18 2022-01-18 Dow Global Technologies Llc Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
WO2015167881A1 (en) 2014-05-01 2015-11-05 Dow Global Technologies Llc Prepreg manufacturing and drying process
US20170114198A1 (en) 2014-06-09 2017-04-27 Dow Global Technologies Llc Process for making curable, multi-layer fiber-reinforced prepreg
BR112017000856A2 (pt) 2014-07-23 2017-12-05 Dow Global Technologies Llc adesivos estruturais tendo resistência à lavagem melhorada e método para distribuir os mesmos
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
DE102014226838A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
CN107001591B (zh) 2014-12-24 2020-03-13 陶氏环球技术有限责任公司 快速凝固的环氧树脂系统和使用所述环氧树脂系统涂布管道的方法
CN104497271A (zh) * 2014-12-24 2015-04-08 济南圣泉集团股份有限公司 一种改性环氧树脂和改性环氧树脂组合物
WO2016108958A1 (en) 2014-12-31 2016-07-07 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
CN107743503B (zh) 2015-06-25 2020-03-31 陶氏环球技术有限责任公司 用于制造碳纤维复合材料的新型环氧树脂体系
JP6923514B2 (ja) 2015-09-10 2021-08-18 ダウ グローバル テクノロジーズ エルエルシー 高アスペクト比充填剤を伴う高弾性強靭化一液型エポキシ構造用接着剤
CN107922583A (zh) 2015-09-10 2018-04-17 陶氏环球技术有限责任公司 具有改进的对油性表面的粘附力和高抗冲掉性的单组分增韧环氧粘合剂
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
EP3405510B2 (en) 2016-01-19 2023-06-07 Dow Global Technologies LLC One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
CN107227001B (zh) * 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
KR102448348B1 (ko) 2016-08-19 2022-09-28 코베스트로 도이칠란트 아게 폴리옥사졸리디논 화합물의 합성 방법
CN109790279B (zh) 2016-08-19 2022-06-28 陶氏环球技术有限责任公司 含有内部脱模剂的环氧树脂组合物
CN110050052B (zh) 2016-10-24 2021-09-28 陶氏环球技术有限责任公司 耐受开放珠湿度暴露的环氧粘合剂
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
WO2018080760A1 (en) 2016-10-28 2018-05-03 Dow Global Technologies Llc Crash durable epoxy adhesive having improved low-temperature impact resistance
CN106519185B (zh) * 2016-11-16 2020-03-31 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在绝缘漆中的应用
EP3585854B1 (en) 2017-02-26 2021-10-13 Dow Global Technologies, LLC One-component toughened epoxy adhesives containing a mixture of latent curing agents
WO2018164794A1 (en) 2017-03-09 2018-09-13 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
US11186756B2 (en) 2017-03-17 2021-11-30 Ddp Specialty Electronic Materials Us, Llc Epoxy-acrylic hybrid adhesive
US10344115B2 (en) 2017-05-25 2019-07-09 International Business Machines Corporation Amine glyoxal resins
KR102503026B1 (ko) 2017-06-07 2023-02-23 다우 글로벌 테크놀로지스 엘엘씨 무작위적으로 배향된 필라멘트를 갖는 성형 화합물 및 이의 제조 및 사용 방법
KR102627557B1 (ko) 2017-08-15 2024-01-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 이액형 상온 경화성 에폭시 접착제
US11492525B2 (en) 2017-09-12 2022-11-08 Ddp Specialty Electronic Materials Us, Llc Adhesive formulation
JP7295095B2 (ja) 2017-09-12 2023-06-20 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー 一成分強化エポキシ接着剤
KR20200060406A (ko) * 2017-09-29 2020-05-29 바스프 에스이 디이소시아네이트 및 2-페닐-1,3-프로판디올 유도체의 디글리시딜 에테르로부터의 열가소성 폴리옥사졸리돈
KR20200110354A (ko) 2018-01-08 2020-09-23 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 인크. 에폭시 수지 접착제 조성물
JP7286678B2 (ja) 2018-05-18 2023-06-05 ダウ グローバル テクノロジーズ エルエルシー ポリイソシアネート成分、ポリウレタン発泡系、およびそれから製造される物品
WO2019231694A1 (en) 2018-05-29 2019-12-05 Dow Global Technologies Llc Method for bonding using one-component epoxy adhesive mixtures
KR20210016552A (ko) 2018-06-05 2021-02-16 다우 글로벌 테크놀로지스 엘엘씨 에폭시-섬유 복합재를 폴리올레핀에 재활용하는 방법
JP2021529224A (ja) 2018-06-15 2021-10-28 ダウ グローバル テクノロジーズ エルエルシー 強化エポキシ組成物
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
JP2021531381A (ja) * 2018-07-18 2021-11-18 ビーエイエスエフ・ソシエタス・エウロパエアBasf Se ポリオキサゾリドンのバルク重合
EP3830156A4 (en) * 2018-07-30 2022-03-16 Dow Global Technologies LLC CURING RESIN COMPOSITION
JP7394833B2 (ja) 2018-08-31 2023-12-08 ダウ グローバル テクノロジーズ エルエルシー エポキシ複合配合物
US11225542B1 (en) * 2018-11-09 2022-01-18 ASK Chemicals LLC Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
JP2022520435A (ja) 2019-02-15 2022-03-30 ダウ グローバル テクノロジーズ エルエルシー エポキシ複合材料
KR20220011129A (ko) 2019-05-21 2022-01-27 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 에폭시 접착제 조성물 및 사용 방법
CN114008162A (zh) 2019-06-18 2022-02-01 Ddp特种电子材料美国有限责任公司 具有改进的耐湿性的单组分增韧环氧胶粘剂
WO2021100649A1 (ja) * 2019-11-18 2021-05-27 東レ株式会社 繊維強化複合材料の成形方法、およびそれに用いられるエポキシ樹脂組成物
US20210253772A1 (en) * 2020-02-18 2021-08-19 Covestro Llc Polyoxazolidinone compositions
WO2022122606A1 (en) 2020-12-10 2022-06-16 Covestro Deutschland Ag Composition comprising epoxy-functional oxazolidinone
EP4011927A1 (en) 2020-12-10 2022-06-15 Covestro Deutschland AG Composition comprising epoxy-functional oxazolidinone
WO2024076409A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition
WO2024076408A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305494A (en) * 1963-04-12 1967-02-21 Baker Chem Co J T Oxazolidonyl sulfones and method of making same
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
US3494888A (en) * 1966-08-30 1970-02-10 Wilbur R Mcelroy Resin compositions from polyepoxides and isocyanate polymers
US3471442A (en) * 1967-02-02 1969-10-07 American Cyanamid Co Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates
US3694406A (en) * 1970-07-31 1972-09-26 Us Air Force Preparation of polyoxazolidones
US3767624A (en) * 1971-12-27 1973-10-23 Dow Chemical Co Oxazolidinone modified epoxy novolac resin
JPS5231000B2 (da) * 1972-11-29 1977-08-11
JPS5315757B2 (da) * 1973-08-31 1978-05-26
JPS57131219A (en) * 1981-02-06 1982-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
FR2549277B1 (fr) * 1983-07-13 1985-10-25 Alsthom Atlantique Procede d'isolation par impregnation d'un bobinage electrique, et vernis sans solvant stabilise utilisable dans ce procede
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze

Also Published As

Publication number Publication date
ATE115596T1 (de) 1994-12-15
AU5829190A (en) 1991-01-07
NZ233933A (en) 1993-05-26
KR920701289A (ko) 1992-08-11
EP0478606A4 (en) 1992-05-13
JP2859956B2 (ja) 1999-02-24
EP0478606B1 (en) 1994-12-14
JPH04506678A (ja) 1992-11-19
DE69015188T2 (de) 1995-05-04
US5112932A (en) 1992-05-12
AU628596B2 (en) 1992-09-17
DE69015188D1 (de) 1995-01-26
CA2018265A1 (en) 1990-12-06
WO1990015089A1 (en) 1990-12-13
ES2067030T3 (es) 1995-03-16
GB8912952D0 (en) 1989-07-26
BR9007428A (pt) 1992-07-21
KR0160755B1 (en) 1999-01-15
EP0478606A1 (en) 1992-04-08

Similar Documents

Publication Publication Date Title
DK0478606T3 (da) Fremgangsmåde til fremstilling af epoxy-afsluttede polyoxazolidoner og af elektriske laminater derfra
DK0420629T3 (da) Lysemitterende eller lysregistrerende anordning og fremgangsmåde til fremstilling heraf
MY115821A (en) Prepreg, resin varnish and resin composition for printed wiring boards and laminates for printed wiring boards produced therefrom
EP0324405A3 (en) Modified advanced epoxy resins
DE69020820D1 (de) Harzmassen, die aromatische Cyanatester, Polyepoxidverbindungen und thermoplastische Polymere umfassen, und daraus hergestellte Prepregs.
KR970001407A (ko) 마이크로일렉트로닉스 접착제용 글리시딜옥시페닐기로 종료된 플렉시블 체인으로 구성되는 에폭시수지
MY101814A (en) New monomers and oligomers containing plurality of vinylbenzyl ether groups, method for their preparation and cured products therefrom
DE3866829D1 (de) Oligomere cyanoguanidine.
KR890014687A (ko) 폴리이미드계 수지조성물
NO892337D0 (no) Organisk polymermateriale og jonebyttermembran fremstilt fra dette.
GB2210371B (en) Microencapsulation method, microelectric devices made therefrom, and heat curable epoxy resin compositions
DE69028464D1 (de) Herstellung von kettenverlängerten Epoxyharzen
DK540086A (da) Imidgruppeholdige polymere og fremgangsmaade til fremstilling deraf
EP0379131A3 (en) Thermosetting resin composition
DE3782640D1 (de) Verfahren zur herstellung waermehaertbarer zusammensetzungen mit hohen betriebstemperaturen.
MY130153A (en) Epoxy-terminated polyoxazolidones, process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones.
NO854180L (no) Fremgangsmaate for fremstilling av triazin- eller trazin- og oksazolin-gruppeholdige epoksyharpikser
DK0402826T3 (da) Fremgangsmåde til fremstilling af ethylencopolymerer fyldt med ikke-fibrøse carbonhydrater
EP0303969A3 (en) Bulk polymerized cycloolefin circuit boards
EP0232019A3 (en) Aromatic polymer
BR8604970A (pt) Fio eletrico isolado e processo para sua preparacao
ATE36000T1 (de) Verfahren zur herstellung von formmassen auf basis von hochmolekularen poly(etheresteramiden).
BR8705685A (pt) Polimeros com grupamentos imidas,e processos de preparacao de polimeros endurecidos e de polimeros termo-endureciveis
JPS5598244A (en) Thermosetting resin composition
Schoenberg Carbinol-Containing Polyimide Oligomers Terminated With Epoxide-Reactive Groups, and the Epoxide Adducts Thereof