KR0160755B1 - Epoxy terminated polyoxazolidones - Google Patents

Epoxy terminated polyoxazolidones Download PDF

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Publication number
KR0160755B1
KR0160755B1 KR1019910701786A KR910701786A KR0160755B1 KR 0160755 B1 KR0160755 B1 KR 0160755B1 KR 1019910701786 A KR1019910701786 A KR 1019910701786A KR 910701786 A KR910701786 A KR 910701786A KR 0160755 B1 KR0160755 B1 KR 0160755B1
Authority
KR
South Korea
Prior art keywords
percent
epoxy
preparation
polyoxazolidone
isocyanate groups
Prior art date
Application number
KR1019910701786A
Other languages
English (en)
Other versions
KR920701289A (ko
Inventor
Raymond A Koenig
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of KR920701289A publication Critical patent/KR920701289A/ko
Application granted granted Critical
Publication of KR0160755B1 publication Critical patent/KR0160755B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/09—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
    • C08G18/092—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
KR1019910701786A 1989-06-06 1991-12-06 Epoxy terminated polyoxazolidones KR0160755B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB898912952A GB8912952D0 (en) 1989-06-06 1989-06-06 Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
GB89129522 1989-06-06
PCT/US1990/002973 WO1990015089A1 (en) 1989-06-06 1990-05-25 Epoxy-terminated polyoxazolidones, process of preparation, and electrical laminates therefrom
SG9590553 1995-03-28

Publications (2)

Publication Number Publication Date
KR920701289A KR920701289A (ko) 1992-08-11
KR0160755B1 true KR0160755B1 (en) 1999-01-15

Family

ID=26295443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701786A KR0160755B1 (en) 1989-06-06 1991-12-06 Epoxy terminated polyoxazolidones

Country Status (14)

Country Link
US (1) US5112932A (ko)
EP (1) EP0478606B1 (ko)
JP (1) JP2859956B2 (ko)
KR (1) KR0160755B1 (ko)
AT (1) ATE115596T1 (ko)
AU (1) AU628596B2 (ko)
BR (1) BR9007428A (ko)
CA (1) CA2018265A1 (ko)
DE (1) DE69015188T2 (ko)
DK (1) DK0478606T3 (ko)
ES (1) ES2067030T3 (ko)
GB (1) GB8912952D0 (ko)
NZ (1) NZ233933A (ko)
WO (1) WO1990015089A1 (ko)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322909B2 (ja) * 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
DE4223622A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223630A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223632A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
US5290903A (en) * 1992-11-09 1994-03-01 Norton Company Composite abrasive wheels
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
CA2115533C (en) * 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5480958A (en) * 1994-09-21 1996-01-02 Air Products And Chemicals, Inc. Polyepoxide resins incorporating epoxy terminated urethanes as tougheners
EP0828774B1 (de) * 1995-05-24 1999-08-11 Siemens Aktiengesellschaft Epoxidharzformmassen mit halogenfreiem flammschutz
US5686541A (en) * 1995-11-14 1997-11-11 National Science Council Modification of epoxy resins with urethane prepolymer for electronic encapsulation
GB2315490B (en) * 1996-07-22 2001-02-07 Dow Deutschland Inc Improved curing catalysts for curing epoxy resins
WO1998044017A1 (fr) * 1997-03-27 1998-10-08 Mitsubishi Rayon Co., Ltd. Composition de resine epoxyde pour plastique renforce de fibre de verre, preimpregne et moulage tubulaire produit au moyen de cette composition
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
WO2005118604A1 (en) 2004-05-28 2005-12-15 Dow Global Technologies Inc. Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
KR100866653B1 (ko) * 2004-06-29 2008-11-04 아사히 가세이 케미칼즈 가부시키가이샤 난연성 에폭시 수지 조성물
CN101151294B (zh) * 2005-04-07 2011-02-09 旭化成电子材料株式会社 环氧树脂组合物
EP1818044A1 (en) 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
EP1966268A1 (en) * 2005-12-22 2008-09-10 Dow Gloval Technologies Inc. A curable epoxy resin composition and laminates made therefrom
CN103059267A (zh) * 2007-05-09 2013-04-24 陶氏环球技术公司 含有过量环氧树脂的环氧热固性组合物及其制备方法
JP2010527403A (ja) * 2007-05-16 2010-08-12 ダウ グローバル テクノロジーズ インコーポレイティド 難燃性組成物
BRPI0811680A2 (pt) 2007-06-20 2015-02-10 Dow Global Technologies Inc "adesivo estrutural de um componente e método"
US8404310B2 (en) * 2007-08-02 2013-03-26 Dow Global Technologies Llc Thermoset dampener material
CA2696785A1 (en) * 2007-09-11 2009-03-19 Dow Global Technologies Inc. Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
CN101878239B (zh) * 2007-09-28 2014-06-18 陶氏环球技术有限责任公司 环氧树脂配制物
BRPI0816499A2 (pt) * 2007-10-05 2019-09-24 Dow Global Technologies Inc composição de resina epóxi de revestimento em pó e artigo
KR20100084561A (ko) 2007-10-26 2010-07-26 다우 글로벌 테크놀로지스 인크. 전기적 적층물에 사용하기 위한 이소시아누레이트 함유 에폭시 수지 조성물
CN101842401B (zh) * 2007-10-31 2015-06-24 陶氏环球技术公司 用于熔融粘结环氧树脂应用的非烧结异氰酸酯改性环氧树脂
EP2217637B1 (en) * 2007-11-29 2011-05-11 Dow Global Technologies LLC Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
EP2244871A1 (en) 2007-11-29 2010-11-03 Dow Global Technologies Inc. Microwave heatable monovinyl aromatic polymers
WO2009089145A1 (en) * 2008-01-08 2009-07-16 Dow Global Technologies Inc. High tg epoxy systems for composite application
US20110263754A1 (en) * 2009-01-06 2011-10-27 Dow Global Technologies Llc Metallic compounds in non-brominated flame retardant epoxy resins
CN102272190A (zh) * 2009-01-06 2011-12-07 陶氏环球技术有限责任公司 环氧树脂的金属稳定剂和增长方法
EP2401339A1 (en) 2009-02-26 2012-01-04 Dow Global Technologies LLC One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol
US7947785B2 (en) * 2009-05-21 2011-05-24 New Jersey Institute Of Technology Polyoxazolidones derived from bisanhydrohexitols
KR100929380B1 (ko) 2009-06-18 2009-12-02 주식회사 신아티앤씨 난연성 폴리에폭시 화합물의 제조방법
CN106832224A (zh) 2009-06-22 2017-06-13 蓝立方知识产权有限责任公司 环氧树脂的硬化剂组合物
EP2284004A1 (en) 2009-08-13 2011-02-16 Nan Ya Plastics Corp. Electric circuit board composition and a method of preparing circuit board
KR20120112447A (ko) 2009-11-05 2012-10-11 다우 글로벌 테크놀로지스 엘엘씨 케톡심으로 캠핑된 탄성중합체성 강인화제를 함유하는 구조용 에폭시 수지 접착제
CN105713179A (zh) * 2009-11-12 2016-06-29 陶氏环球技术有限责任公司 聚噁唑烷酮树脂
WO2011087486A1 (en) 2009-12-22 2011-07-21 Dow Global Technologies Inc. Oxazolidone ring contaning adducts
WO2011094004A2 (en) 2010-01-29 2011-08-04 Dow Global Technologies Llc Compositions having phosphorus-containing compounds
CA2803289A1 (en) 2010-06-23 2011-12-29 Dow Global Technologies Llc Powder coatings compositions
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
KR20130108100A (ko) 2010-06-29 2013-10-02 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용의 저장 안정성 열 활성화된 3급 아민 촉매
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
BR112013010668A2 (pt) 2010-12-26 2021-03-23 Dow Global Technologies Llc adesivo estrutural de uma parte e método de aplicação de adesivo estrutural
US9408296B2 (en) 2010-12-28 2016-08-02 Mitsui Chemicals Tohcello, Inc. Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
US9309354B2 (en) 2011-06-24 2016-04-12 Dow Global Technologies Llc Thermosetting composition and process for preparing fiber-reinforced composites
KR101969083B1 (ko) 2011-06-30 2019-04-15 다우 글로벌 테크놀로지스 엘엘씨 아민 경화제와 과량의 에폭사이드기의 혼합물을 함유하는 경화성 에폭시 수지 시스템
CN103842436A (zh) * 2011-08-01 2014-06-04 陶氏环球技术有限责任公司 包含*唑烷酮环的乙烯基酯树脂及其产品
BR112014018126B1 (pt) 2012-03-23 2021-07-13 Dow Global Technologies Llc Adesivo estrutural termocurável e processo para unir e soldar membros metálicos
US9840070B2 (en) 2012-03-23 2017-12-12 Dow Global Technologies Llc Crash-durable adhesive with enhanced stress durability
KR20150073173A (ko) * 2012-10-17 2015-06-30 다우 글로벌 테크놀로지스 엘엘씨 코어 쉘 고무 개질된 고체 에폭시 수지
EP2909250B1 (en) 2012-10-17 2016-12-07 Blue Cube IP LLC Toughened, curable epoxy compositions for high temperature applications
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
EP2917278A4 (en) 2012-11-07 2016-06-08 Dow Global Technologies Llc CURABLE EPOXY COMPOSITION AND COMPOSITE MANUFACTURED THEREFROM
US9688807B2 (en) 2012-11-13 2017-06-27 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
BR112015010679A2 (pt) 2012-11-13 2017-07-11 Dow Global Technologies Llc sistema de resina epóxi curável, processo para formar um compósito de epóxi reforçado com fibra e compósito reforçado com fibra curada
EP2935389B1 (en) 2012-12-21 2017-11-29 Dow Global Technologies LLC Non-isocyanate sealant for electrical cable joining
CN104955865B (zh) 2012-12-21 2017-12-19 陶氏环球技术有限责任公司 硫醇固化弹性体环氧树脂
EP2935392B1 (en) 2012-12-21 2020-01-22 Dow Global Technologies LLC Phase-segmented non-isocyanate elastomers
WO2014197834A1 (en) 2013-06-06 2014-12-11 Halliburton Energy Services, Inc. Fluid loss well treatment
WO2015023615A1 (en) * 2013-08-16 2015-02-19 Dow Global Technologies Llc 1k thermoset epoxy composition
CN105518044B (zh) 2013-09-16 2019-05-21 陶氏环球技术有限责任公司 用于海底管道绝缘材料的聚氨酯弹性体
JP6400707B2 (ja) 2013-12-18 2018-10-03 ダウ グローバル テクノロジーズ エルエルシー ポリエンと、エポキシ樹脂と、チオール及びアミン硬化剤の混合物との反応における、有機ポリマーを形成するための方法
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
WO2015167881A1 (en) 2014-05-01 2015-11-05 Dow Global Technologies Llc Prepreg manufacturing and drying process
EP3152251B1 (en) 2014-06-09 2018-05-02 Dow Global Technologies LLC Process for making curable, multi-layer fiber-reinforced prepreg
WO2016014284A1 (en) 2014-07-23 2016-01-28 Dow Global Technologies Llc Structural adhesives having improved wash-off resistance and method for dispensing same
DE102014226838A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
US20170369635A1 (en) 2014-12-24 2017-12-28 Dow Global Technologies Llc Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
CN104497271A (zh) * 2014-12-24 2015-04-08 济南圣泉集团股份有限公司 一种改性环氧树脂和改性环氧树脂组合物
CN107001897A (zh) 2014-12-31 2017-08-01 陶氏环球技术有限责任公司 具有改善的低温抗冲击性和耐冲洗性的耐撞击环氧粘合剂组合物
CN107743503B (zh) 2015-06-25 2020-03-31 陶氏环球技术有限责任公司 用于制造碳纤维复合材料的新型环氧树脂体系
KR102626998B1 (ko) 2015-09-10 2024-01-19 다우 글로벌 테크놀로지스 엘엘씨 높은 종횡비의 충전제를 갖는 높은 모듈러스의 강인화된 1성분 에폭시 구조용 접착제
KR102625909B1 (ko) 2015-09-10 2024-01-18 다우 글로벌 테크놀로지스 엘엘씨 유성 표면에 대한 개선된 접착력 및 높은 워시-오프 저항성을 갖는 일액형 강인화된 에폭시 접착제
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
WO2017127253A1 (en) 2016-01-19 2017-07-27 Dow Global Technologies Llc One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
CN107227001B (zh) * 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
KR102448348B1 (ko) * 2016-08-19 2022-09-28 코베스트로 도이칠란트 아게 폴리옥사졸리디논 화합물의 합성 방법
US11390741B2 (en) 2016-08-19 2022-07-19 Dow Global Technologies Llc Epoxy resin compositions containing an internal mold release agent
EP3529328B1 (en) 2016-10-24 2020-06-24 Dow Global Technologies LLC Epoxy adhesive resistant to open bead humidity exposure
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
EP3532527A1 (en) 2016-10-28 2019-09-04 Dow Global Technologies, LLC Crash durable epoxy adhesive having improved low-temperature impact resistance
CN106519185B (zh) * 2016-11-16 2020-03-31 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在绝缘漆中的应用
EP3585854B1 (en) 2017-02-26 2021-10-13 Dow Global Technologies, LLC One-component toughened epoxy adhesives containing a mixture of latent curing agents
EP3592796B1 (en) 2017-03-09 2021-04-21 Dow Global Technologies LLC Stable epoxy/internal mold release agent blends for the manufacture of composite articles
EP3596182B1 (en) 2017-03-17 2021-06-30 Dow Global Technologies LLC Epoxy-acrylic hybrid adhesive
US10344115B2 (en) 2017-05-25 2019-07-09 International Business Machines Corporation Amine glyoxal resins
WO2018226288A1 (en) 2017-06-07 2018-12-13 Dow Global Technologies Llc Molding compound having randomly oriented filaments and methods for making and using same
CN111315839B (zh) 2017-08-15 2022-09-20 Ddp特种电子材料美国公司 室温可固化的双组分增韧的环氧粘合剂
JP7295095B2 (ja) 2017-09-12 2023-06-20 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 一成分強化エポキシ接着剤
US11492525B2 (en) 2017-09-12 2022-11-08 Ddp Specialty Electronic Materials Us, Llc Adhesive formulation
CA3077272A1 (en) * 2017-09-29 2019-04-04 Basf Se Thermoplastic polyoxazolidones from diisocyanates and diglycidyl ether of 2-phenyl-1,3-propanediol derivatives
KR20240025034A (ko) 2018-01-08 2024-02-26 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 에폭시 수지 접착제 조성물
US11472910B2 (en) 2018-05-18 2022-10-18 Dow Global Technologies Llc Polyisocyanate component, a polyurethane foaming system and an article made therefrom
EP3802723B1 (en) * 2018-05-29 2022-09-21 DDP Specialty Electronic Materials US, LLC Method for bonding using one-component epoxy adhesive mixtures
EP3802678A1 (en) 2018-06-05 2021-04-14 Dow Global Technologies, LLC Method for recycling epoxy-fiber composites into polyolefins
WO2019240897A1 (en) 2018-06-15 2019-12-19 Dow Global Technologies Llc Toughened epoxy compositions
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
EP3824012B1 (de) * 2018-07-18 2022-09-07 Basf Se Bulkpolymerisierung von polyoxazolidon
CN112638973B (zh) * 2018-07-30 2023-03-31 陶氏环球技术有限责任公司 可固化的树脂组合物
KR20210053311A (ko) 2018-08-31 2021-05-11 다우 글로벌 테크놀로지스 엘엘씨 에폭시 복합체 제형
US11225542B1 (en) * 2018-11-09 2022-01-18 ASK Chemicals LLC Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
US11732085B2 (en) 2019-02-15 2023-08-22 Dow Global Technologies Llc Epoxy composition
EP3973011A1 (en) 2019-05-21 2022-03-30 DDP Specialty Electronic Materials US, LLC Epoxy adhesive composition and method of use
US20220195267A1 (en) 2019-06-18 2022-06-23 Ddp Specialty Electronic Materials Us, Llc One-component toughened epoxy adhesives with improved humidity resistance
JPWO2021100649A1 (ko) * 2019-11-18 2021-05-27
US20210253772A1 (en) * 2020-02-18 2021-08-19 Covestro Llc Polyoxazolidinone compositions
EP4011927A1 (en) 2020-12-10 2022-06-15 Covestro Deutschland AG Composition comprising epoxy-functional oxazolidinone
WO2022122606A1 (en) 2020-12-10 2022-06-16 Covestro Deutschland Ag Composition comprising epoxy-functional oxazolidinone
WO2024076408A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition
WO2024076409A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305494A (en) * 1963-04-12 1967-02-21 Baker Chem Co J T Oxazolidonyl sulfones and method of making same
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
US3494888A (en) * 1966-08-30 1970-02-10 Wilbur R Mcelroy Resin compositions from polyepoxides and isocyanate polymers
US3471442A (en) * 1967-02-02 1969-10-07 American Cyanamid Co Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates
US3694406A (en) * 1970-07-31 1972-09-26 Us Air Force Preparation of polyoxazolidones
US3767624A (en) * 1971-12-27 1973-10-23 Dow Chemical Co Oxazolidinone modified epoxy novolac resin
JPS5231000B2 (ko) * 1972-11-29 1977-08-11
JPS5315757B2 (ko) * 1973-08-31 1978-05-26
JPS57131219A (en) * 1981-02-06 1982-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
FR2549277B1 (fr) * 1983-07-13 1985-10-25 Alsthom Atlantique Procede d'isolation par impregnation d'un bobinage electrique, et vernis sans solvant stabilise utilisable dans ce procede
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze

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CA2018265A1 (en) 1990-12-06
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DE69015188D1 (de) 1995-01-26
AU628596B2 (en) 1992-09-17
JP2859956B2 (ja) 1999-02-24
BR9007428A (pt) 1992-07-21
WO1990015089A1 (en) 1990-12-13
NZ233933A (en) 1993-05-26
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ES2067030T3 (es) 1995-03-16
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US5112932A (en) 1992-05-12
EP0478606B1 (en) 1994-12-14

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