CN101878239B - 环氧树脂配制物 - Google Patents
环氧树脂配制物 Download PDFInfo
- Publication number
- CN101878239B CN101878239B CN200880117984.4A CN200880117984A CN101878239B CN 101878239 B CN101878239 B CN 101878239B CN 200880117984 A CN200880117984 A CN 200880117984A CN 101878239 B CN101878239 B CN 101878239B
- Authority
- CN
- China
- Prior art keywords
- composition
- group
- epoxy resin
- weight
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Abstract
Description
层压材料要求 | 条件 | 实施例1 | 对比例1 | 对比例2 | 要求 | 单位 | 测试方法 |
ANSI类型 | Fr-4 | G10 | |||||
最高操作温度 | 200 | 130 | 140 | ||||
剥离强度 | 1.7(9.7) | 1.05(6) | N/mm(1b/inch) | 2.4.8 | |||
剥离强度 | 288℃热应力后 | 1.7(9.7) | N/mm(1b/inch) | 2.4.8 | |||
剥离强度 | 288℃热应力后,且在252℃热应力10天后 | 0.595(3.4) | >11b/inch | N/mm(1b/inch) | 2.4.8 | ||
易燃性,(层压材料 & 层压时的预浸料) | v-1[17] | v-0 | 非阻燃 | 等级[秒] | UL94 | ||
玻璃化转变温度 | TMA | 183 | 170 | 160 | ℃ | 2.4.24 | |
玻璃化转变温度 | DSC | 201 | 175 | 160 | ℃ | 2.4.25 | |
T260 | TMA(除去铜的) | >60 | 10 | 分钟 | 2.4.24.1 | ||
T288 | TMA(除去铜的) | >60 | 0 | 分钟 | 2.4.24.1 | ||
T300 | TMA(除去铜的) | >60 | 0 | 分钟 | 2.4.24.1 | ||
Td | TMA(除去铜的)1%wt失重2%wt失重3%wt失重5%wt失重 | 285.05347.87373.99387.15 | 315 | 333.46358.30379.86394.59 | [℃][℃][℃][℃] | 2.4.24.1 |
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99577807P | 2007-09-28 | 2007-09-28 | |
US60/995,778 | 2007-09-28 | ||
PCT/US2008/077521 WO2009045817A1 (en) | 2007-09-28 | 2008-09-24 | Epoxy resin formulations |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101878239A CN101878239A (zh) | 2010-11-03 |
CN101878239B true CN101878239B (zh) | 2014-06-18 |
Family
ID=40127230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880117984.4A Expired - Fee Related CN101878239B (zh) | 2007-09-28 | 2008-09-24 | 环氧树脂配制物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100294429A1 (zh) |
EP (1) | EP2195364A1 (zh) |
JP (2) | JP2010540724A (zh) |
KR (1) | KR101520131B1 (zh) |
CN (1) | CN101878239B (zh) |
TW (1) | TWI452081B (zh) |
WO (1) | WO2009045817A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5720118B2 (ja) * | 2009-06-01 | 2015-05-20 | 三菱レイヨン株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
US9309381B2 (en) * | 2011-06-24 | 2016-04-12 | Air Products And Chemicals, Inc. | Epoxy resin compositions using solvated solids |
WO2013157061A1 (ja) * | 2012-04-16 | 2013-10-24 | 新日鉄住金化学株式会社 | エポキシ樹脂組成物及び硬化物 |
CN105121495A (zh) * | 2013-02-15 | 2015-12-02 | 英派尔科技开发有限公司 | 酚类环氧化合物 |
EP3008125A4 (en) | 2013-06-13 | 2016-12-07 | Empire Technology Dev Llc | MULTIFUNCTIONAL PHENOLIN RESINS |
US10106494B2 (en) | 2013-12-02 | 2018-10-23 | Empire Technology Development Llc | Gemini surfactant and their use |
WO2016029450A1 (en) * | 2014-08-29 | 2016-03-03 | Blue Cube Ip Llc | Halogen-free epoxy formulations |
JP2019073629A (ja) * | 2017-10-17 | 2019-05-16 | 本田技研工業株式会社 | 放熱性塗料組成物、放熱性被膜及び被膜形成方法 |
TWI671355B (zh) * | 2018-01-03 | 2019-09-11 | Taiwan Union Technology Corporation | 樹脂組合物,以及使用該組合物所製得之預浸漬片、金屬箔積層板、與印刷電路板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5273793A (en) * | 1989-11-27 | 1993-12-28 | The Dow Chemical Company | Nonlinear optical materials |
CN1157628A (zh) * | 1994-09-09 | 1997-08-20 | 西门子公司 | 用于半固化片和复合材料的环氧树脂混合物 |
CN1900202A (zh) * | 2006-03-20 | 2007-01-24 | 刘萍 | 柔性电路基材胶粘剂、制备方法及制得的基材 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4066628A (en) * | 1976-08-02 | 1978-01-03 | Mitsubishi Chemical Industries Ltd. | Oxazolidone catalyst |
US4157324A (en) * | 1977-01-31 | 1979-06-05 | Monsanto Company | High ortho etherified resole resins admixed with coreactive resins |
US4338225A (en) * | 1980-08-04 | 1982-07-06 | The Boeing Company | High performance resin reaction products of carboxyl terminated 1,2-polybutadiene with epoxides and acid terminated difunctional aliphatic alcohols |
GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
US5157080A (en) * | 1990-05-15 | 1992-10-20 | Monsanto Company | Coating composition |
US6090637A (en) * | 1997-02-13 | 2000-07-18 | 3M Innovative Properties Company | Fabrication of II-VI semiconductor device with BeTe buffer layer |
JP2000336146A (ja) * | 1999-05-26 | 2000-12-05 | Takeda Chem Ind Ltd | 難燃性エポキシ樹脂組成物 |
ATE308585T1 (de) * | 1999-12-13 | 2005-11-15 | Dow Global Technologies Inc | Feuerhemmende phosporenthaltende epoxidharzzusammensetzung |
JP3500465B2 (ja) * | 2000-07-03 | 2004-02-23 | 京セラケミカル株式会社 | 難燃性エポキシ樹脂組成物、プリプレグおよび積層製品 |
US7271225B2 (en) * | 2002-05-29 | 2007-09-18 | Nippon Chemical Industrial Co., Ltd. | Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition |
JP5502277B2 (ja) * | 2004-05-28 | 2014-05-28 | ダウ グローバル テクノロジーズ エルエルシー | ハロゲン非含有耐発火性ポリマーの製造に有用なリン含有化合物 |
JP4475034B2 (ja) * | 2004-06-23 | 2010-06-09 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグおよび積層板 |
TW200732412A (en) * | 2006-02-23 | 2007-09-01 | Pont Taiwan Ltd Du | Non-halogen composition having phosphor-containing epoxy resin |
-
2008
- 2008-09-24 WO PCT/US2008/077521 patent/WO2009045817A1/en active Application Filing
- 2008-09-24 JP JP2010527108A patent/JP2010540724A/ja active Pending
- 2008-09-24 EP EP08835110A patent/EP2195364A1/en not_active Withdrawn
- 2008-09-24 CN CN200880117984.4A patent/CN101878239B/zh not_active Expired - Fee Related
- 2008-09-24 US US12/679,445 patent/US20100294429A1/en not_active Abandoned
- 2008-09-24 KR KR1020107009213A patent/KR101520131B1/ko not_active IP Right Cessation
- 2008-09-26 TW TW097137184A patent/TWI452081B/zh not_active IP Right Cessation
-
2014
- 2014-02-03 JP JP2014018838A patent/JP2014159566A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5273793A (en) * | 1989-11-27 | 1993-12-28 | The Dow Chemical Company | Nonlinear optical materials |
CN1157628A (zh) * | 1994-09-09 | 1997-08-20 | 西门子公司 | 用于半固化片和复合材料的环氧树脂混合物 |
CN1900202A (zh) * | 2006-03-20 | 2007-01-24 | 刘萍 | 柔性电路基材胶粘剂、制备方法及制得的基材 |
Also Published As
Publication number | Publication date |
---|---|
WO2009045817A1 (en) | 2009-04-09 |
KR20100085073A (ko) | 2010-07-28 |
CN101878239A (zh) | 2010-11-03 |
EP2195364A1 (en) | 2010-06-16 |
KR101520131B1 (ko) | 2015-05-13 |
TWI452081B (zh) | 2014-09-11 |
US20100294429A1 (en) | 2010-11-25 |
JP2010540724A (ja) | 2010-12-24 |
JP2014159566A (ja) | 2014-09-04 |
TW200918598A (en) | 2009-05-01 |
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