ATE115596T1 - Verfahren zur herstellung von epoxyendgruppen enthaltenden polyoxazolidonen sowie von elektrischen laminaten daraus. - Google Patents

Verfahren zur herstellung von epoxyendgruppen enthaltenden polyoxazolidonen sowie von elektrischen laminaten daraus.

Info

Publication number
ATE115596T1
ATE115596T1 AT90909068T AT90909068T ATE115596T1 AT E115596 T1 ATE115596 T1 AT E115596T1 AT 90909068 T AT90909068 T AT 90909068T AT 90909068 T AT90909068 T AT 90909068T AT E115596 T1 ATE115596 T1 AT E115596T1
Authority
AT
Austria
Prior art keywords
polyoxazolidones
manufacture
percent
containing epoxy
electrical laminates
Prior art date
Application number
AT90909068T
Other languages
English (en)
Inventor
Raymond A Koenig
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of ATE115596T1 publication Critical patent/ATE115596T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/04Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/003Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/09Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
    • C08G18/092Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/28Di-epoxy compounds containing acyclic nitrogen atoms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00Epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Compounds (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
AT90909068T 1989-06-06 1990-05-25 Verfahren zur herstellung von epoxyendgruppen enthaltenden polyoxazolidonen sowie von elektrischen laminaten daraus. ATE115596T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB898912952A GB8912952D0 (en) 1989-06-06 1989-06-06 Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
SG9590553 1995-03-28

Publications (1)

Publication Number Publication Date
ATE115596T1 true ATE115596T1 (de) 1994-12-15

Family

ID=26295443

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90909068T ATE115596T1 (de) 1989-06-06 1990-05-25 Verfahren zur herstellung von epoxyendgruppen enthaltenden polyoxazolidonen sowie von elektrischen laminaten daraus.

Country Status (14)

Country Link
US (1) US5112932A (de)
EP (1) EP0478606B1 (de)
JP (1) JP2859956B2 (de)
KR (1) KR0160755B1 (de)
AT (1) ATE115596T1 (de)
AU (1) AU628596B2 (de)
BR (1) BR9007428A (de)
CA (1) CA2018265A1 (de)
DE (1) DE69015188T2 (de)
DK (1) DK0478606T3 (de)
ES (1) ES2067030T3 (de)
GB (1) GB8912952D0 (de)
NZ (1) NZ233933A (de)
WO (1) WO1990015089A1 (de)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322909B2 (ja) * 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
DE4223622A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223630A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Oxazolidinonstrukturen aufweisende präpolymere Epoxidharzmischung
DE4223632A1 (de) * 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
US5290903A (en) * 1992-11-09 1994-03-01 Norton Company Composite abrasive wheels
CA2115533C (en) * 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
US5480958A (en) * 1994-09-21 1996-01-02 Air Products And Chemicals, Inc. Polyepoxide resins incorporating epoxy terminated urethanes as tougheners
DE59602725D1 (de) * 1995-05-24 1999-09-16 Siemens Ag Epoxidharzformmassen mit halogenfreiem flammschutz
US5686541A (en) * 1995-11-14 1997-11-11 National Science Council Modification of epoxy resins with urethane prepolymer for electronic encapsulation
GB2315490B (en) * 1996-07-22 2001-02-07 Dow Deutschland Inc Improved curing catalysts for curing epoxy resins
CN1132867C (zh) * 1997-03-27 2003-12-31 三菱丽阳株式会社 用于纤维增强塑料的环氧树脂组合物、预浸渍片和用其制备的管状模制品
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) * 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
KR101148353B1 (ko) 2004-05-28 2012-05-21 다우 글로벌 테크놀로지스 엘엘씨 내인화성 할로겐 무함유 중합체의 제조에 유용한 인 함유화합물
CN100560631C (zh) * 2004-06-29 2009-11-18 旭化成电子材料株式会社 阻燃环氧树脂组合物
DE602006019836D1 (de) * 2005-04-07 2011-03-10 Asahi Kasei Chemicals Corp Epoxidharzzusammensetzung
EP1818044A1 (de) * 2005-11-25 2007-08-15 DSMIP Assets B.V. Kosmetische Zusammensetzung enthaltend ein Polymer mit Oxazolidongruppen
US20090159313A1 (en) * 2005-12-22 2009-06-25 Ludovic Valette Curable epoxy resin composition and laminates made therefrom
BRPI0810290A2 (pt) * 2007-05-09 2014-11-04 Dow Global Technologies Inc "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."
KR20100024936A (ko) * 2007-05-16 2010-03-08 다우 글로벌 테크놀로지스 인크. 난연성 조성물
BRPI0811680A2 (pt) 2007-06-20 2015-02-10 Dow Global Technologies Inc "adesivo estrutural de um componente e método"
WO2009018194A1 (en) * 2007-08-02 2009-02-05 Dow Global Technologies Inc. Thermoset dampener material
WO2009035860A1 (en) * 2007-09-11 2009-03-19 Dow Global Technologies Inc. Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
EP2195364A1 (de) * 2007-09-28 2010-06-16 Dow Global Technologies Inc. Epoxidharzformulierungen
EP2197929A1 (de) * 2007-10-05 2010-06-23 Dow Global Technologies Inc. Isocyanatmodifiziertes epoxidharz und epoxidpulverbeschichtungszusammensetzung dafür
US20100240816A1 (en) * 2007-10-26 2010-09-23 Dow Global Technologies Inc. Epoxy resin composition containing isocyanurates for use in electrical laminates
JP5628678B2 (ja) * 2007-10-31 2014-11-19 ダウ グローバル テクノロジーズ エルエルシー 融着エポキシ樹脂用の非焼結イソシアネート改質エポキシ樹脂
WO2009070488A1 (en) * 2007-11-29 2009-06-04 Dow Global Technologies Inc. Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
WO2009070458A1 (en) 2007-11-29 2009-06-04 Dow Global Technologies Inc. Microwave heatable monovinyl aromatic polymers
CN101910238B (zh) * 2008-01-08 2013-03-27 陶氏环球技术公司 用于复合材料应用的高Tg环氧体系
US20110218273A1 (en) * 2009-01-06 2011-09-08 Dow Global Technologies Llc Metal stabilizers for epoxy resins and advancement process
CN102272226B (zh) * 2009-01-06 2015-06-10 陶氏环球技术有限责任公司 无溴阻燃环氧树脂中的金属化合物
US20110297317A1 (en) 2009-02-26 2011-12-08 Andreas Lutz One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol
US7947785B2 (en) * 2009-05-21 2011-05-24 New Jersey Institute Of Technology Polyoxazolidones derived from bisanhydrohexitols
KR100929380B1 (ko) * 2009-06-18 2009-12-02 주식회사 신아티앤씨 난연성 폴리에폭시 화합물의 제조방법
SG176923A1 (en) 2009-06-22 2012-01-30 Dow Global Technologies Llc Hardener composition for epoxy resins
EP2284004A1 (de) 2009-08-13 2011-02-16 Nan Ya Plastics Corp. Elektrische Leiterplattenzusammensetzung und Verfahren zur Herstellung der Leiterplatte
JP5715638B2 (ja) 2009-11-05 2015-05-13 ダウ グローバル テクノロジーズ エルエルシー ケトオキシムでキャップされたエラストマー強化剤を含む構造用エポキシ樹脂系接着剤
CN105713179A (zh) 2009-11-12 2016-06-29 陶氏环球技术有限责任公司 聚噁唑烷酮树脂
EP2516499A1 (de) 2009-12-22 2012-10-31 Dow Global Technologies LLC Oxazolidonring-enthaltende addukte
US9267030B2 (en) 2010-01-29 2016-02-23 Blue Cube Ip Llc Compositions having phosphorus-containing compounds
KR20130131283A (ko) * 2010-06-23 2013-12-03 다우 글로벌 테크놀로지스 엘엘씨 분말 코팅 조성물
WO2012006001A2 (en) 2010-06-29 2012-01-12 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
JP2011063804A (ja) * 2010-10-15 2011-03-31 Hitachi Chem Co Ltd プリント配線板用プリプレグおよびそれを用いた積層板
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
US9181463B2 (en) 2010-12-26 2015-11-10 Dow Global Technologies Llc Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds
WO2012090476A1 (ja) 2010-12-28 2012-07-05 三井化学株式会社 樹脂組成物、これを含む保護膜、ドライフィルム、回路基板、及び多層回路基板
JP2014517136A (ja) 2011-06-24 2014-07-17 ダウ グローバル テクノロジーズ エルエルシー 熱硬化性組成物、及び繊維強化コンポジットの調製方法
KR101969083B1 (ko) 2011-06-30 2019-04-15 다우 글로벌 테크놀로지스 엘엘씨 아민 경화제와 과량의 에폭사이드기의 혼합물을 함유하는 경화성 에폭시 수지 시스템
WO2013016865A1 (en) 2011-08-01 2013-02-07 Dow Global Technologies Llc An oxazolidone ring containing vinyl ester resin and products therefrom
BR112014018126B1 (pt) 2012-03-23 2021-07-13 Dow Global Technologies Llc Adesivo estrutural termocurável e processo para unir e soldar membros metálicos
JP6173424B2 (ja) 2012-03-23 2017-08-02 ダウ グローバル テクノロジーズ エルエルシー 応力耐久性が高い破壊耐久性接着剤
US9701811B2 (en) 2012-10-17 2017-07-11 Blue Cube Ip Llc Toughened, curable epoxy compositions for high temperature applications
KR20200063250A (ko) * 2012-10-17 2020-06-04 다우 글로벌 테크놀로지스 엘엘씨 코어 쉘 고무 개질된 고체 에폭시 수지
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
BR112015010248A2 (pt) 2012-11-07 2017-07-11 Dow Global Technologies Llc composição de resina epóxi curável, processo para preparar a composição de resina epóxi curável e compósito
EP2920227B1 (de) 2012-11-13 2017-02-08 Dow Global Technologies LLC Epoxidharzsystem mit polyethylentetraaminen für harzinjektionsverfahren
US9321880B2 (en) 2012-11-13 2016-04-26 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
WO2014100242A1 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Non-isocyanate sealant for electrical cable joining
EP2935392B1 (de) 2012-12-21 2020-01-22 Dow Global Technologies LLC Phasensegmentierte isocyanatfreie elastomere
CN104955865B (zh) 2012-12-21 2017-12-19 陶氏环球技术有限责任公司 硫醇固化弹性体环氧树脂
WO2014197827A1 (en) 2013-06-06 2014-12-11 Halliburton Energy Services, Inc. Changeable well seal tool
JP2016528361A (ja) * 2013-08-16 2016-09-15 ダウ グローバル テクノロジーズ エルエルシー 1k熱硬化性エポキシ組成物
MX2016002821A (es) 2013-09-16 2016-06-22 Dow Global Technologies Llc Elastomero de poliuretano para uso en aislamiento de tuberias submarinas.
CA2933688C (en) 2013-12-18 2022-01-18 Dow Global Technologies Llc Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
EP3137538A1 (de) 2014-05-01 2017-03-08 Dow Global Technologies LLC Herstellung von prepreg und trocknungsverfahren
WO2015191354A1 (en) 2014-06-09 2015-12-17 Dow Global Technologies Llc Process for making curable, multi-layer fiber-reinforced prepreg
KR102407087B1 (ko) 2014-07-23 2022-06-10 다우 글로벌 테크놀로지스 엘엘씨 개선된 워시-오프 저항성을 갖는 구조용 접착제 및 이의 분배 방법
DE102014226838A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
CN104497271A (zh) * 2014-12-24 2015-04-08 济南圣泉集团股份有限公司 一种改性环氧树脂和改性环氧树脂组合物
US20170369635A1 (en) 2014-12-24 2017-12-28 Dow Global Technologies Llc Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
CN107001897A (zh) 2014-12-31 2017-08-01 陶氏环球技术有限责任公司 具有改善的低温抗冲击性和耐冲洗性的耐撞击环氧粘合剂组合物
CN107743503B (zh) 2015-06-25 2020-03-31 陶氏环球技术有限责任公司 用于制造碳纤维复合材料的新型环氧树脂体系
WO2017044401A1 (en) 2015-09-10 2017-03-16 Dow Global Technologies Llc One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance
JP6923514B2 (ja) 2015-09-10 2021-08-18 ダウ グローバル テクノロジーズ エルエルシー 高アスペクト比充填剤を伴う高弾性強靭化一液型エポキシ構造用接着剤
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
US10815405B2 (en) 2016-01-19 2020-10-27 Dow Global Technologies Llc One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
CN107227001B (zh) 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
JP6966537B2 (ja) 2016-08-19 2021-11-17 ダウ グローバル テクノロジーズ エルエルシー 内部離型剤を含有するエポキシ樹脂組成物
KR102448348B1 (ko) 2016-08-19 2022-09-28 코베스트로 도이칠란트 아게 폴리옥사졸리디논 화합물의 합성 방법
EP3529328B1 (de) 2016-10-24 2020-06-24 Dow Global Technologies LLC Gegen feuchtigkeitsexposition einer offenen raupe beständiger epodxidhaftstoff
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
BR112019008520A2 (pt) 2016-10-28 2019-07-09 Dow Global Technologies Llc adesivo de epóxi durável em quebra que tem resistência ao impacto em baixa temperatura aprimorada
CN106519185B (zh) * 2016-11-16 2020-03-31 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在绝缘漆中的应用
EP3585854B1 (de) 2017-02-26 2021-10-13 Dow Global Technologies, LLC Einkomponentige gehärtete epoxidklebstoffe mit einem gemisch aus latenten härtungsmitteln
EP3592796B1 (de) 2017-03-09 2021-04-21 Dow Global Technologies LLC Stabile epoxid-/innenformtrennmittelmischungen für die herstellung von verbundartikeln
EP3596182B1 (de) 2017-03-17 2021-06-30 Dow Global Technologies LLC Epoxid-acryl-hybridklebstoff
US10344115B2 (en) 2017-05-25 2019-07-09 International Business Machines Corporation Amine glyoxal resins
CN110678314B (zh) 2017-06-07 2022-08-02 陶氏环球技术有限责任公司 具有随机定向的长丝的模制化合物及其制作和使用方法
CN111315839B (zh) 2017-08-15 2022-09-20 Ddp特种电子材料美国公司 室温可固化的双组分增韧的环氧粘合剂
WO2019055128A1 (en) 2017-09-12 2019-03-21 Dow Global Technologies Llc EPOXY ADHESIVES REINFORCED WITH A COMPONENT
KR102628558B1 (ko) 2017-09-12 2024-01-25 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 접착제 제형
RU2020114951A (ru) * 2017-09-29 2021-10-29 Басф Се Термопластичныe полиоксазолидоны из диизоцианатов и производных диглицидилового эфира 2-фенил-1,3-пропандиола
WO2019135857A1 (en) 2018-01-08 2019-07-11 Dow Global Technologies Llc Epoxy resin adhesive compositions
US11472910B2 (en) 2018-05-18 2022-10-18 Dow Global Technologies Llc Polyisocyanate component, a polyurethane foaming system and an article made therefrom
WO2019231694A1 (en) 2018-05-29 2019-12-05 Dow Global Technologies Llc Method for bonding using one-component epoxy adhesive mixtures
CN112135869A (zh) 2018-06-05 2020-12-25 陶氏环球技术有限责任公司 将环氧-纤维复合材料回收到聚烯烃中的方法
US20210230421A1 (en) 2018-06-15 2021-07-29 Dow Global Technologies Llc Toughened epoxy compositions
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
KR20210034025A (ko) * 2018-07-18 2021-03-29 바스프 에스이 폴리옥사졸리돈의 벌크 중합
US20210261715A1 (en) * 2018-07-30 2021-08-26 Dow Global Technologies Llc Curable resin composition
EP3844202A1 (de) 2018-08-31 2021-07-07 Dow Global Technologies, LLC Epoxidverbundstoffformulierung
US11225542B1 (en) * 2018-11-09 2022-01-18 ASK Chemicals LLC Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
KR20210127964A (ko) 2019-02-15 2021-10-25 다우 글로벌 테크놀로지스 엘엘씨 에폭시 조성물
WO2020236366A1 (en) 2019-05-21 2020-11-26 Ddp Specialty Electronic Materials Us, Llc Epoxy adhesive composition and method of use
JP2022537353A (ja) 2019-06-18 2022-08-25 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー 改善された耐湿性を有する強化された一液型エポキシ接着剤
JPWO2021100649A1 (de) * 2019-11-18 2021-05-27
US20210253772A1 (en) * 2020-02-18 2021-08-19 Covestro Llc Polyoxazolidinone compositions
EP4011927A1 (de) 2020-12-10 2022-06-15 Covestro Deutschland AG Zusammensetzung mit epoxyfunktionellen oxazolidinonen
WO2022122606A1 (en) 2020-12-10 2022-06-16 Covestro Deutschland Ag Composition comprising epoxy-functional oxazolidinone
WO2024076408A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition
WO2024076409A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305494A (en) * 1963-04-12 1967-02-21 Baker Chem Co J T Oxazolidonyl sulfones and method of making same
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
US3494888A (en) * 1966-08-30 1970-02-10 Wilbur R Mcelroy Resin compositions from polyepoxides and isocyanate polymers
US3471442A (en) * 1967-02-02 1969-10-07 American Cyanamid Co Process for the preparation of thermoplastic polymers prepared by reacting diepoxide monomers with aromatic diisocyanates
US3694406A (en) * 1970-07-31 1972-09-26 Us Air Force Preparation of polyoxazolidones
US3767624A (en) * 1971-12-27 1973-10-23 Dow Chemical Co Oxazolidinone modified epoxy novolac resin
JPS5231000B2 (de) * 1972-11-29 1977-08-11
JPS5315757B2 (de) * 1973-08-31 1978-05-26
JPS57131219A (en) * 1981-02-06 1982-08-14 Sumitomo Bakelite Co Ltd Thermosetting resin composition
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) * 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
FR2549277B1 (fr) * 1983-07-13 1985-10-25 Alsthom Atlantique Procede d'isolation par impregnation d'un bobinage electrique, et vernis sans solvant stabilise utilisable dans ce procede
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze

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EP0478606A4 (en) 1992-05-13
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BR9007428A (pt) 1992-07-21
ES2067030T3 (es) 1995-03-16
AU5829190A (en) 1991-01-07
DE69015188T2 (de) 1995-05-04
EP0478606A1 (de) 1992-04-08
CA2018265A1 (en) 1990-12-06
DE69015188D1 (de) 1995-01-26
EP0478606B1 (de) 1994-12-14
DK0478606T3 (da) 1995-05-15
KR0160755B1 (en) 1999-01-15
US5112932A (en) 1992-05-12
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NZ233933A (en) 1993-05-26
WO1990015089A1 (en) 1990-12-13
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KR920701289A (ko) 1992-08-11
JPH04506678A (ja) 1992-11-19

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