CN100560631C - 阻燃环氧树脂组合物 - Google Patents
阻燃环氧树脂组合物 Download PDFInfo
- Publication number
- CN100560631C CN100560631C CNB200580025451XA CN200580025451A CN100560631C CN 100560631 C CN100560631 C CN 100560631C CN B200580025451X A CNB200580025451X A CN B200580025451XA CN 200580025451 A CN200580025451 A CN 200580025451A CN 100560631 C CN100560631 C CN 100560631C
- Authority
- CN
- China
- Prior art keywords
- component
- layered product
- epoxy resin
- compound
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2915—Rod, strand, filament or fiber including textile, cloth or fabric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
环氧当量(g/当量) | 可水解的氯(ppm) | α-二醇(meq/kg) | IR强度比 | n=0组分(重量%) | |
含有噁唑烷酮环的环氧树脂I | 334 | 130 | <3 | 0.05 | 28 |
含有噁唑烷酮环的环氧树脂II | 461 | 125 | <3 | 0.07 | 20 |
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP191548/2004 | 2004-06-29 | ||
JP2004191548 | 2004-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1989203A CN1989203A (zh) | 2007-06-27 |
CN100560631C true CN100560631C (zh) | 2009-11-18 |
Family
ID=35781873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200580025451XA Expired - Fee Related CN100560631C (zh) | 2004-06-29 | 2005-06-28 | 阻燃环氧树脂组合物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7671147B2 (zh) |
EP (1) | EP1775321A4 (zh) |
JP (1) | JP4662489B2 (zh) |
KR (1) | KR100866653B1 (zh) |
CN (1) | CN100560631C (zh) |
TW (1) | TWI313285B (zh) |
WO (1) | WO2006001445A1 (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101151294B (zh) * | 2005-04-07 | 2011-02-09 | 旭化成电子材料株式会社 | 环氧树脂组合物 |
JP2007326929A (ja) * | 2006-06-07 | 2007-12-20 | Asahi Kasei Electronics Co Ltd | エポキシ樹脂組成物、当該樹脂組成物を用いたプリプレグ |
KR101450928B1 (ko) * | 2006-12-01 | 2014-10-14 | 교세라 케미카르 가부시키가이샤 | 감광성 열경화형 수지 조성물 및 플렉시블 프린트 배선판 |
JP2008291056A (ja) * | 2007-05-22 | 2008-12-04 | Asahi Kasei Chemicals Corp | エポキシ樹脂組成物及びこれを用いたプリプレグ、並びに、これらを用いた金属箔張積層板及びプリント配線板 |
JP5213017B2 (ja) * | 2007-09-28 | 2013-06-19 | 株式会社伏見製薬所 | エポキシ化合物組成物 |
CN101381506B (zh) * | 2008-09-26 | 2012-05-30 | 广东生益科技股份有限公司 | 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板 |
JP5136573B2 (ja) | 2009-02-24 | 2013-02-06 | 日立化成工業株式会社 | ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板 |
KR101530754B1 (ko) * | 2009-03-25 | 2015-06-22 | 도레이 카부시키가이샤 | 에폭시 수지 조성물, 프리프레그, 탄소 섬유 강화 복합 재료 및 전자 전기 부품 케이스 |
EP2412740B1 (en) * | 2009-03-26 | 2015-04-01 | Panasonic Corporation | Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate and multi-layer board |
TWI503339B (zh) * | 2009-05-19 | 2015-10-11 | Albemarle Corp | Dopo衍生的阻燃劑及環氧樹脂組合物 |
CA2828086C (en) | 2010-03-10 | 2018-07-31 | Nuvo Research Inc. | Foamable formulation |
CN105153233B (zh) | 2010-03-31 | 2018-11-13 | 雅宝公司 | 制备dopo衍生的化合物及其组合物的方法 |
CN102372900B (zh) * | 2010-08-10 | 2014-04-02 | 台燿科技股份有限公司 | 环氧树脂组合物及其制成的预浸材和印刷电路板 |
CN102399415B (zh) * | 2010-09-14 | 2014-03-26 | 联茂电子股份有限公司 | 预浸体组合物及应用该预浸体组合物所制成的胶片和基板 |
JP6076907B2 (ja) | 2010-09-23 | 2017-02-08 | インヴィスタ テクノロジーズ エスアエルエルINVISTA TECHNOLOGIES S.a.r.l. | 難燃繊維、ヤーンおよびこれらから作られた布 |
CN102585480B (zh) * | 2011-12-29 | 2014-06-11 | 广东生益科技股份有限公司 | 热固性树脂组合物以及使用其制作的预浸料与印刷电路板用层压板 |
SG11201408343TA (en) * | 2012-06-15 | 2015-01-29 | Nippon Steel & Sumikin Chem Co | Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product |
RU2537403C1 (ru) * | 2013-07-03 | 2015-01-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Российский химико-технологический университет им. Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) | Способ получения эпоксидной смолы, модифицированной эпоксифосфазенами |
CN105452321A (zh) * | 2013-08-16 | 2016-03-30 | 陶氏环球技术有限责任公司 | 1k热固性环氧树脂组合物 |
CN103834168B (zh) | 2014-02-25 | 2016-09-07 | 广东生益科技股份有限公司 | 一种无卤阻燃型树脂组合物 |
CN105778414B (zh) | 2014-12-26 | 2018-05-29 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
CN104610530A (zh) * | 2015-02-10 | 2015-05-13 | 广东广山新材料有限公司 | 带双酚a基的阻燃物、阻燃性环氧树脂及阻燃性组合物 |
KR102375986B1 (ko) * | 2015-03-13 | 2022-03-17 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 옥사졸리돈 고리 함유 에폭시 수지, 그 제조 방법, 에폭시 수지 조성물, 및 경화물 |
CN106916282B (zh) * | 2015-12-28 | 2019-07-26 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用其的预浸料和层压板 |
CN107227001B (zh) * | 2016-03-25 | 2019-06-14 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板 |
US11581212B2 (en) | 2017-03-28 | 2023-02-14 | Showa Denko Materials Co., Ltd. | Prepreg for coreless substrate, coreless substrate and semiconductor package |
JP2019178224A (ja) * | 2018-03-30 | 2019-10-17 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂、エポキシ樹脂組成物およびそれを用いた繊維強化複合材料 |
US20200308735A1 (en) | 2019-03-28 | 2020-10-01 | Southern Mills, Inc. | Flame resistant fabrics |
CN118103557A (zh) | 2021-08-10 | 2024-05-28 | 南磨房公司 | 阻燃织物 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61115929A (ja) * | 1984-11-13 | 1986-06-03 | Fujitsu Ltd | 半導体封止用エポキシ樹脂組成物 |
GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
JP3468597B2 (ja) | 1994-11-01 | 2003-11-17 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
JP3479884B2 (ja) * | 2000-02-29 | 2003-12-15 | 大塚化学ホールディングス株式会社 | 難燃性エポキシ樹脂組成物及び電子部品 |
JP3394029B2 (ja) | 2000-03-21 | 2003-04-07 | 大塚化学株式会社 | 難燃性エポキシ樹脂組成物、及びその成形物、及び電子部品 |
JP2003012765A (ja) * | 2001-06-29 | 2003-01-15 | Dainippon Ink & Chem Inc | 難燃性エポキシ樹脂組成物 |
JP3794991B2 (ja) * | 2001-08-08 | 2006-07-12 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
-
2005
- 2005-06-28 WO PCT/JP2005/011818 patent/WO2006001445A1/ja active Application Filing
- 2005-06-28 EP EP05765378A patent/EP1775321A4/en not_active Withdrawn
- 2005-06-28 JP JP2006528700A patent/JP4662489B2/ja not_active Expired - Fee Related
- 2005-06-28 US US11/630,886 patent/US7671147B2/en not_active Expired - Fee Related
- 2005-06-28 CN CNB200580025451XA patent/CN100560631C/zh not_active Expired - Fee Related
- 2005-06-28 KR KR1020077001473A patent/KR100866653B1/ko not_active IP Right Cessation
- 2005-06-29 TW TW94122000A patent/TWI313285B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1775321A4 (en) | 2011-09-14 |
KR100866653B1 (ko) | 2008-11-04 |
TW200617097A (en) | 2006-06-01 |
KR20070039060A (ko) | 2007-04-11 |
CN1989203A (zh) | 2007-06-27 |
WO2006001445A1 (ja) | 2006-01-05 |
JP4662489B2 (ja) | 2011-03-30 |
JPWO2006001445A1 (ja) | 2008-04-17 |
US7671147B2 (en) | 2010-03-02 |
US20080050596A1 (en) | 2008-02-28 |
TWI313285B (en) | 2009-08-11 |
EP1775321A1 (en) | 2007-04-18 |
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Owner name: ASAHI KASEI ELECTRONICS MATERIALS CO., LTD. Free format text: FORMER OWNER: ASAHI CHEMICAL CORP. Effective date: 20090619 |
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Effective date of registration: 20090619 Address after: Tokyo, Japan Applicant after: Asahi Chemical Corp. Address before: Tokyo, Japan Applicant before: Asahi Kasei Chemical K. K. |
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Granted publication date: 20091118 Termination date: 20160628 |