SG11201408343TA - Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product - Google Patents

Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product

Info

Publication number
SG11201408343TA
SG11201408343TA SG11201408343TA SG11201408343TA SG11201408343TA SG 11201408343T A SG11201408343T A SG 11201408343TA SG 11201408343T A SG11201408343T A SG 11201408343TA SG 11201408343T A SG11201408343T A SG 11201408343TA SG 11201408343T A SG11201408343T A SG 11201408343TA
Authority
SG
Singapore
Prior art keywords
epoxy resin
phosphorus
tokyo
containing epoxy
cured product
Prior art date
Application number
SG11201408343TA
Inventor
Chikara Miyake
Kazuo Ishihara
Hideyuki Murai
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of SG11201408343TA publication Critical patent/SG11201408343TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/3272—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B32B2260/023—Two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» allium 2013# 12 fll9 0(19.12.2013) w , PO tpCT (10) WO 2013/187184 A1 (51) C08G 59/14 (2006.01) B32B 27/38 (2006.01) (21) (22) g&ttHQ: (25) g&fflgia)] (26) HI®4>§f]CDl =E. DP . =E. DP . C08J5/24 (2006.01) HOSK1/03 (2006.01) PCT/JP2013/063865 2013 ^ 5 M 13 0(13.05.2013) (30) fiBfefix — 5: 4#Jg| 2012-135707 2012 ^6^ 15 0(15.06.2012) JP (71) ttiJSIA: §T 0 (NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.) [JP/JP]; T 1010021 1 4|1 Tokyo (JP). (72) ^KVIIYAKK, Chikara); T2990266 1#±fe5 8r0ttft&lb^ it £ tt fa Chiba (JP). 5 J! — H (ISHIHARA, Kazuo); T2990266 1 1 f ife = 5 Chiba (JP). W# = ^ ffi (MURAI, Hideyuki); T 1010021 M. JS. f P •ft H — EnttearaTg 1 4#1 ^ Tokyo (JP). (74) ftIIA: H4 3 ^(l ANAKA, Hiroshi cl al ); T 1050001 P] 6 — Tl 1 9f 1 4-% nm M)l> 7 ® Tokyo (JP). (8i) (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% 11^ nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), -3- — =y v 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). - (&&£ 21 &(3)) •t 00 i-H l> 00 i-H en i-H o CJ (54) Title: PHOSPHORUS-CONTAINING EPOXY RESIN, COMPOSITION CONTAINING PHOSPHORUS-CONTAINING EPOXY RESIN AS ESSENTIAL COMPONENT, AND CURED PRODUCT (54)i: u tt (57) Abstract: The present invention provides an epoxy resin that has further improved heat resistance, while maintaining conven­ tional adhesion, specifically phosphorus-containing a epoxy resin (A) which is obtained by reacting, as essential components, a phosphorus compound represented by general formula (1), a quinone compound and an epoxy resin (a), and which characterized is in that the epoxy resin (a) is a novolac epoxy resin that has molecular weight a distribution having dinuclear component content of a 15% by area or less, a trinuclear component content of 15-60% by area, and a number average molecular weight of 350-700 as de­ termined by gel permeation chromatography. (57)sift: -usse (1) u villi! (a) (a) —51 — V3> fit. LTSlSLT^b^l-SU vlltflsl-fcL^T^ <7P\"7 1 5®f*%JiLT, 1 5®f*% ~ 6 0 U > mkW-tfyft-FM ft 3 5 0 ~ 7 00 / TK\"7 y h vlltfls (A) -efts.
SG11201408343TA 2012-06-15 2013-05-13 Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product SG11201408343TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012135707 2012-06-15
PCT/JP2013/063865 WO2013187184A1 (en) 2012-06-15 2013-05-13 Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product

Publications (1)

Publication Number Publication Date
SG11201408343TA true SG11201408343TA (en) 2015-01-29

Family

ID=49758016

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408343TA SG11201408343TA (en) 2012-06-15 2013-05-13 Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product

Country Status (6)

Country Link
JP (1) JP6067699B2 (en)
KR (1) KR102038173B1 (en)
CN (3) CN104379626B (en)
SG (1) SG11201408343TA (en)
TW (1) TWI598371B (en)
WO (1) WO2013187184A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6179446B2 (en) * 2014-04-14 2017-08-16 株式会社オートネットワーク技術研究所 Reactor
JP6670045B2 (en) * 2015-03-13 2020-03-18 日鉄ケミカル＆マテリアル株式会社 Oxazolidone ring-containing epoxy resin, production method thereof, epoxy resin composition and cured product
JP6770793B2 (en) * 2015-08-19 2020-10-21 日鉄ケミカル＆マテリアル株式会社 Flame-retardant epoxy resin composition and its cured product
EP3564289B1 (en) * 2016-12-27 2022-08-03 NIPPON STEEL Chemical & Material Co., Ltd. Curable epoxy resin composition, and fiber-reinforced composite material using same
JP2019104821A (en) * 2017-12-12 2019-06-27 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product of the same
CN112585189B (en) * 2018-08-27 2023-08-01 日铁化学材料株式会社 Epoxy resin composition, prepreg, laminated board, material for circuit board, cured product, and method for producing phosphorus-containing epoxy resin
JP7211744B2 (en) * 2018-09-19 2023-01-24 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product thereof
JP7211829B2 (en) * 2019-01-23 2023-01-24 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product thereof
JP2020122034A (en) * 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition, and cured product of the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092009B2 (en) 1990-05-01 2000-09-25 東都化成株式会社 Flame retardant and thermosetting flame-retardant resin composition containing the flame retardant
JP3268498B2 (en) 1990-05-01 2002-03-25 東都化成株式会社 Phosphorus-containing flame-retardant epoxy resin
JP2823057B2 (en) * 1990-12-20 1998-11-11 日本化薬株式会社 Manufacturing method of epoxy resin
JP3613724B2 (en) 1997-09-09 2005-01-26 東都化成株式会社 Phosphorus-containing epoxy resin composition
JP3533973B2 (en) 1998-01-27 2004-06-07 東都化成株式会社 Phosphorus-containing epoxy resin composition
JP2001123049A (en) 1999-10-28 2001-05-08 Dainippon Ink & Chem Inc Flame-retardant epoxy resin composition
JP3651843B2 (en) * 1999-12-16 2005-05-25 住友ベークライト株式会社 Method for producing phenolic resin
JP4588834B2 (en) 2000-04-06 2010-12-01 パナソニック電工株式会社 Phosphorus-containing epoxy resin composition, flame-retardant resin sheet using the phosphorus-containing epoxy resin, metal foil with resin, prepreg and laminate, multilayer board
JP2002012739A (en) * 2000-06-29 2002-01-15 Nippon Kayaku Co Ltd Flame-retardant epoxy resin composition and use thereof
JP4837175B2 (en) * 2001-02-23 2011-12-14 新日鐵化学株式会社 Phosphorus-containing epoxy resin composition
JP4906020B2 (en) 2001-07-26 2012-03-28 新日鐵化学株式会社 Phosphorus-containing phenol resin and epoxy resin composition using the phenol resin
JP4435791B2 (en) * 2001-11-16 2010-03-24 旭有機材工業株式会社 Method for producing novolac-type phenolic resin and resin-coated sand
KR100866653B1 (en) * 2004-06-29 2008-11-04 아사히 가세이 케미칼즈 가부시키가이샤 Flame-retardant epoxy resin composition
WO2006006593A1 (en) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing and electronic component device
CN101883806B (en) * 2007-11-09 2013-08-14 新日铁住金化学株式会社 Phosphorus-containing epoxy resin and phosphorus-containing epoxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and the resin composition
JP5547386B2 (en) * 2008-09-25 2014-07-09 パナソニック株式会社 Epoxy resin composition for prepreg, prepreg, and multilayer printed wiring board
JP5441477B2 (en) * 2009-04-01 2014-03-12 新日鉄住金化学株式会社 Flame retardant phosphorus-containing epoxy resin composition and cured product thereof
JP5686512B2 (en) * 2009-11-05 2015-03-18 新日鉄住金化学株式会社 Phosphorus-containing epoxy resin, resin composition, and flame-retardant cured product thereof
JP5544184B2 (en) * 2010-02-08 2014-07-09 新日鉄住金化学株式会社 Method for producing phosphorus-containing epoxy resin, epoxy resin composition and cured product thereof
JP5579008B2 (en) * 2010-09-29 2014-08-27 新日鉄住金化学株式会社 Phosphorus-containing epoxy resin

Also Published As

Publication number Publication date
JPWO2013187184A1 (en) 2016-02-04
WO2013187184A1 (en) 2013-12-19
CN104379626B (en) 2019-03-22
KR20150031237A (en) 2015-03-23
TW201402632A (en) 2014-01-16
KR102038173B1 (en) 2019-10-29
CN108314774A (en) 2018-07-24
CN104379626A (en) 2015-02-25
CN109293881A (en) 2019-02-01
JP6067699B2 (en) 2017-01-25
CN109293881B (en) 2021-04-13
TWI598371B (en) 2017-09-11
CN108314774B (en) 2021-02-12

Similar Documents

Publication Publication Date Title
SG11201408343TA (en) Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product
SG11201408157QA (en) Epoxy resin, epoxy resin composition and cured product
SG11201408155RA (en) Epoxy resin composition and cured product thereof and curable resin composition
SG11201408661WA (en) Microetching agent for copper, replenishment solution thereof, and method for producing wiring board
SG11201803697SA (en) Method for the economic manufacturing of metallic parts
SG11201408303WA (en) Adhesive compositions of propylene-based and ethylene-based polymers
SG11201809912UA (en) Hybrid carriers for nucleic acid cargo
SG11201809132RA (en) Novel compounds as autotaxin inhibitors and pharmaceutical compositions comprising the same
SG11201901497VA (en) Coatings
SG11201811201VA (en) Articles made from hydrophilic thermoplastic polyurethane compositions
SG11201407350XA (en) Carbinol-terminated polymers containing amine
SG11201408095XA (en) Fibroblast growth factor 21 proteins
SG11201407728RA (en) Pul-core method with a pmi foam core
SG11201407742VA (en) Method for manufacturing an interdental cleaning tool and the interdental cleaning tool
SG11201407352TA (en) Carbinol-terminated polymers containing allylamine
SG11201809830WA (en) Selective reduction of cysteine-engineered antibodies
SG11201408297XA (en) Porous graphene oxide materials
SG11201408099VA (en) Method for producing polybutylene terephthalate
SG11201803949RA (en) Novel pharmaceutical composition comprising particles comprising a complex of a double-stranded polyribonucleotide and a polyalkyleneimine
SG11201408103XA (en) Polyurethane-based waterproofing composition for the water-proofing of concrete structures
SG11201402416VA (en) Water-soluble metalworking oil agent, metalworking fluid, and metalworking method
SG11201407828SA (en) Anti-ageing composition containing dehydrogenated abietic acid as active ingredient
SG11201908605XA (en) Antifouling article
SG11201805387RA (en) Meta-azacyclic amino benzoic acid derivatives as pan integrin antagonists
SG11201403176YA (en) Method for producing cooked and frozen pasta