BRPI0810290A2 - "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." - Google Patents

"processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."

Info

Publication number
BRPI0810290A2
BRPI0810290A2 BRPI0810290-2A2A BRPI0810290A BRPI0810290A2 BR PI0810290 A2 BRPI0810290 A2 BR PI0810290A2 BR PI0810290 A BRPI0810290 A BR PI0810290A BR PI0810290 A2 BRPI0810290 A2 BR PI0810290A2
Authority
BR
Brazil
Prior art keywords
thermosetting composition
cure
composite
thermosetting
composition
Prior art date
Application number
BRPI0810290-2A2A
Other languages
English (en)
Inventor
Maurice Joel Marks
Courtney Lawrence Sherman
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0810290A2 publication Critical patent/BRPI0810290A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0810290-2A2A 2007-05-09 2008-04-22 "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." BRPI0810290A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92848207P 2007-05-09 2007-05-09
PCT/US2008/061163 WO2008140906A1 (en) 2007-05-09 2008-04-22 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Publications (1)

Publication Number Publication Date
BRPI0810290A2 true BRPI0810290A2 (pt) 2014-11-04

Family

ID=39673147

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0810290-2A2A BRPI0810290A2 (pt) 2007-05-09 2008-04-22 "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."

Country Status (8)

Country Link
US (1) US20100144965A1 (pt)
EP (1) EP2147034B1 (pt)
JP (1) JP2010526907A (pt)
KR (1) KR20100017712A (pt)
CN (2) CN103059267A (pt)
BR (1) BRPI0810290A2 (pt)
TW (1) TWI372766B (pt)
WO (1) WO2008140906A1 (pt)

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US20110319564A1 (en) 2010-06-24 2011-12-29 Larry Steven Corley Epoxy systems for composites
BR112013031429A2 (pt) 2011-06-24 2016-12-13 Dow Global Technologies Llc sistema de resina epóxi curável de dois componentes e processo para formar um compósito de epóxi reforçado com fibra
US9688808B2 (en) 2011-06-30 2017-06-27 Dow Global Technologies Llc Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups
US20150299457A1 (en) * 2011-12-20 2015-10-22 Dow Global Technologies Llc Epoxy resin composites
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
BR112015010679A2 (pt) 2012-11-13 2017-07-11 Dow Global Technologies Llc sistema de resina epóxi curável, processo para formar um compósito de epóxi reforçado com fibra e compósito reforçado com fibra curada
KR102131211B1 (ko) 2012-11-13 2020-07-08 다우 글로벌 테크놀로지스 엘엘씨 수지 이송 성형 공정을 위한 폴리에틸렌 테트라아민을 함유하는 에폭시 수지 시스템
JP6379110B2 (ja) 2012-12-21 2018-08-29 ダウ グローバル テクノロジーズ エルエルシー 電気ケーブル接続のための非イソシアネート系シーラント
US9790320B2 (en) 2012-12-21 2017-10-17 Dow Global Technologies Llc Thiol-cured elastomeric epoxy resins
US9758615B2 (en) 2012-12-21 2017-09-12 Dow Global Technologies Llc Phase-segmented non-isocyanate elastomers
SG11201601534WA (en) 2013-09-16 2016-04-28 Dow Global Technologies Llc Polyurethane elastomer for use in subsea pipeline insulation
CA2933688C (en) 2013-12-18 2022-01-18 Dow Global Technologies Llc Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
US10662304B2 (en) 2013-12-31 2020-05-26 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
WO2015119881A1 (en) 2014-02-07 2015-08-13 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
EP3119828B1 (en) 2014-03-18 2018-01-31 Dow Global Technologies LLC Epoxy resin system
US10066136B2 (en) 2014-04-22 2018-09-04 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
KR102375219B1 (ko) 2014-07-17 2022-03-17 다우 글로벌 테크놀로지스 엘엘씨 트리에틸아민테트라아민 및 주석 촉매를 이용한 에폭시 시스템
KR20170056572A (ko) * 2014-09-12 2017-05-23 드렉셀유니버시티 그래프트 트리글리세라이드가 사용되는 무수물 경화 열경화성 에폭시 폴리머의 강인화
US9822227B2 (en) * 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
EP3218421B1 (en) 2014-11-11 2020-03-11 Dow Global Technologies LLC Fast curing high glass transition temperature epoxy resin system
WO2016105913A1 (en) 2014-12-24 2016-06-30 Dow Global Technologies Llc Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
JP6978326B2 (ja) 2015-06-25 2021-12-08 ダウ グローバル テクノロジーズ エルエルシー 炭素繊維複合材を作製するための新規エポキシ樹脂系
CN107922590B (zh) 2015-07-07 2020-08-04 陶氏环球技术有限责任公司 用于制造复合材料的稳定高玻璃化转变温度环氧树脂系统
KR20170132605A (ko) * 2016-05-24 2017-12-04 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
WO2018034856A1 (en) 2016-08-19 2018-02-22 Dow Global Technologies Llc Epoxy resin compositions containing an internal mold release agent
US11261289B2 (en) * 2016-10-17 2022-03-01 Warren Environmental & Coating, Llc Method of lining a pipeline with a delayed curing resin composition
WO2018164794A1 (en) 2017-03-09 2018-09-13 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
EP3596182B1 (en) 2017-03-17 2021-06-30 Dow Global Technologies LLC Epoxy-acrylic hybrid adhesive
CN110709444A (zh) 2017-06-20 2020-01-17 陶氏环球技术有限责任公司 用于制造纤维增强型复合材料的环氧树脂系统
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020033037A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033036A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
EP4059978A4 (en) * 2019-11-14 2023-12-06 DIC Corporation CURABLE COMPOSITION, HARDENED ARTICLE, FIBER REINFORCED COMPOSITE, MOLDED BODY AND PRODUCTION METHOD THEREOF

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Also Published As

Publication number Publication date
EP2147034B1 (en) 2014-12-17
CN103059267A (zh) 2013-04-24
EP2147034A1 (en) 2010-01-27
CN101679603A (zh) 2010-03-24
WO2008140906A1 (en) 2008-11-20
TW200914482A (en) 2009-04-01
TWI372766B (en) 2012-09-21
US20100144965A1 (en) 2010-06-10
JP2010526907A (ja) 2010-08-05
KR20100017712A (ko) 2010-02-16

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2329 DE 25-08-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]