TWI372766B - Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof - Google Patents

Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Info

Publication number
TWI372766B
TWI372766B TW097115210A TW97115210A TWI372766B TW I372766 B TWI372766 B TW I372766B TW 097115210 A TW097115210 A TW 097115210A TW 97115210 A TW97115210 A TW 97115210A TW I372766 B TWI372766 B TW I372766B
Authority
TW
Taiwan
Prior art keywords
preparation
epoxy
excess
epoxy resin
thermoset compositions
Prior art date
Application number
TW097115210A
Other languages
English (en)
Other versions
TW200914482A (en
Inventor
Maurice Joel Marks
Courtney Lawrence Sherman
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of TW200914482A publication Critical patent/TW200914482A/zh
Application granted granted Critical
Publication of TWI372766B publication Critical patent/TWI372766B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW097115210A 2007-05-09 2008-04-25 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof TWI372766B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92848207P 2007-05-09 2007-05-09

Publications (2)

Publication Number Publication Date
TW200914482A TW200914482A (en) 2009-04-01
TWI372766B true TWI372766B (en) 2012-09-21

Family

ID=39673147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097115210A TWI372766B (en) 2007-05-09 2008-04-25 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Country Status (8)

Country Link
US (1) US20100144965A1 (zh)
EP (1) EP2147034B1 (zh)
JP (1) JP2010526907A (zh)
KR (1) KR20100017712A (zh)
CN (2) CN103059267A (zh)
BR (1) BRPI0810290A2 (zh)
TW (1) TWI372766B (zh)
WO (1) WO2008140906A1 (zh)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130059945A1 (en) 2010-05-21 2013-03-07 Maurice J. Marks Curable compositions
MX2011006417A (es) 2010-06-24 2012-01-02 Momentive Specialty Chem Inc Sistemas de epoxi mejorados para materiales compuestos.
KR20140045954A (ko) 2011-06-24 2014-04-17 다우 글로벌 테크놀로지스 엘엘씨 열경화성 조성물 및 섬유-보강된 복합체를 제조하는 방법
CN103619900B (zh) 2011-06-30 2016-05-11 陶氏环球技术有限责任公司 含胺硬化剂的混合物与过量环氧基团的可固化环氧树脂体系
KR101976890B1 (ko) * 2011-12-20 2019-05-09 다우 글로벌 테크놀로지스 엘엘씨 경화된 에폭시 수지 복합체의 제조 방법
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
CN104781303B (zh) * 2012-11-13 2017-11-10 陶氏环球技术有限责任公司 用于树脂传递模塑方法的含多亚乙基四胺的环氧树脂体系
US9321880B2 (en) 2012-11-13 2016-04-26 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
JP2016501970A (ja) * 2012-12-21 2016-01-21 ダウ グローバル テクノロジーズ エルエルシー チオール硬化弾性エポキシ樹脂
CN104968703B (zh) 2012-12-21 2018-04-10 陶氏环球技术有限责任公司 相分段的非异氰酸酯弹性体
WO2014100242A1 (en) 2012-12-21 2014-06-26 Dow Global Technologies Llc Non-isocyanate sealant for electrical cable joining
CA2922853C (en) 2013-09-16 2020-10-20 Dow Global Technologies Llc Polyurethane elastomer for use in subsea pipeline insulation
MX2016007065A (es) 2013-12-18 2016-09-06 Dow Global Technologies Llc Proceso para la formacion de un polimero organico en una reaccion de un polieno, una resina epoxi y una mezcla de agentes de curado de tiol y de amina.
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
US10023686B2 (en) 2014-02-07 2018-07-17 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
JP6655021B2 (ja) 2014-03-18 2020-02-26 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂系
WO2015164031A1 (en) 2014-04-22 2015-10-29 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
EP3169716B1 (en) 2014-07-17 2018-04-04 Dow Global Technologies LLC Epoxy systems employing triethylaminetetraamine and tin catalysts
KR20170056572A (ko) * 2014-09-12 2017-05-23 드렉셀유니버시티 그래프트 트리글리세라이드가 사용되는 무수물 경화 열경화성 에폭시 폴리머의 강인화
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
BR112017008974A2 (pt) 2014-11-11 2017-12-26 Dow Global Technologies Llc sistema de resina epóxi de cura rápida e temperatura de transição vítrea elevada
US20170369635A1 (en) 2014-12-24 2017-12-28 Dow Global Technologies Llc Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
EP3313913B1 (en) 2015-06-25 2020-12-30 Dow Global Technologies LLC Novel epoxy resin system for making carbon fiber composites
CN107922590B (zh) 2015-07-07 2020-08-04 陶氏环球技术有限责任公司 用于制造复合材料的稳定高玻璃化转变温度环氧树脂系统
KR102716321B1 (ko) * 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
WO2018034856A1 (en) 2016-08-19 2018-02-22 Dow Global Technologies Llc Epoxy resin compositions containing an internal mold release agent
US11261289B2 (en) * 2016-10-17 2022-03-01 Warren Environmental & Coating, Llc Method of lining a pipeline with a delayed curing resin composition
WO2018164794A1 (en) 2017-03-09 2018-09-13 Dow Global Technologies Llc Stable epoxy/internal mold release agent blends for the manufacture of composite articles
US11186756B2 (en) 2017-03-17 2021-11-30 Ddp Specialty Electronic Materials Us, Llc Epoxy-acrylic hybrid adhesive
US20210277174A1 (en) 2017-06-20 2021-09-09 Dow Global Technologies Llc Epoxy resin system for making fiber reinforced composites
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020033037A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033036A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
JP7006853B2 (ja) * 2019-11-14 2022-01-24 Dic株式会社 硬化性組成物、硬化物、繊維強化複合材料、成形品及びその製造方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2750395A (en) * 1954-01-05 1956-06-12 Union Carbide & Carbon Corp Diepoxides
US2890194A (en) * 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US3018262A (en) * 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US3960979A (en) * 1974-12-24 1976-06-01 E. I. Du Pont De Nemours And Company High solids can coating compositions based on epoxy resin crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier
US4018848A (en) * 1974-12-24 1977-04-19 E. I. Du Pont De Nemours And Company High solids can coating compositions based on epoxy resin, crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier
US3969979A (en) * 1975-07-29 1976-07-20 Sun Ventures, Inc. Liquid propellant for a gun
US4076764A (en) * 1976-07-22 1978-02-28 Shell Oil Company Epoxy resin composition having improved physical properties
US4181784A (en) * 1977-12-27 1980-01-01 Ford Motor Company High solids coating composition adapted for use as automotive topcoat--#1
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
US4595623A (en) * 1984-05-07 1986-06-17 Hughes Aircraft Company Fiber-reinforced syntactic foam composites and method of forming same
US4656207A (en) * 1985-02-19 1987-04-07 Hercules Incorporated Epoxy thermosets having improved toughness
EP0249262A3 (en) * 1986-06-09 1990-07-04 Shell Internationale Researchmaatschappij B.V. Thermoplastic polymer composition having thermosetting processing characteristics
CN1046741A (zh) * 1988-04-30 1990-11-07 三井东圧化学株式会社 以多硫化物为基础的树脂，含有该树脂的塑料透镜以及制造该种透镜的方法
GB8912952D0 (en) * 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
JPH07228580A (ja) * 1993-12-21 1995-08-29 Yuka Shell Epoxy Kk 変性多価エポキシ化合物、同化合物の製造方法及びエポキシ樹脂組成物
GB9411367D0 (en) * 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5686185A (en) * 1996-06-28 1997-11-11 Morton International, Inc. Disbondment resistant epoxy powder coating composition
US6153719A (en) * 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
JP2000273280A (ja) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
US6469074B1 (en) * 1999-05-26 2002-10-22 Matsushita Electric Works, Ltd. Composition of cyanate ester, epoxy resin and acid anhydride
US6632893B2 (en) * 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
DE19956893A1 (de) * 1999-11-26 2001-05-31 Daimler Chrysler Ag Kühlkreis für einen Verbrennungsmotor
US20040082720A1 (en) * 2000-07-18 2004-04-29 Fmc Corporation Adducts of amine-terminated polyolefins and epoxides
JP2002212390A (ja) * 2001-01-19 2002-07-31 Hitachi Chem Co Ltd 絶縁樹脂組成物、銅箔付き絶縁材および銅張積層板
US6572971B2 (en) * 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) * 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
US6808819B2 (en) * 2002-02-14 2004-10-26 Shin Etsu Chemical Co., Ltd. Heat resistant resin composition and adhesive film
JP4047613B2 (ja) * 2002-03-29 2008-02-13 住友ベークライト株式会社 液状封止樹脂及びそれを用いた半導体装置
JP3862004B2 (ja) * 2002-05-10 2006-12-27 信越化学工業株式会社 耐熱性樹脂組成物及びそれを用いた接着フィルム
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US20050215656A1 (en) * 2002-11-28 2005-09-29 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting resin composition and printed circuit boards made by using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
US8048819B2 (en) * 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
MX2011006417A (es) * 2010-06-24 2012-01-02 Momentive Specialty Chem Inc Sistemas de epoxi mejorados para materiales compuestos.
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions

Also Published As

Publication number Publication date
US20100144965A1 (en) 2010-06-10
TW200914482A (en) 2009-04-01
EP2147034B1 (en) 2014-12-17
JP2010526907A (ja) 2010-08-05
EP2147034A1 (en) 2010-01-27
BRPI0810290A2 (pt) 2014-11-04
KR20100017712A (ko) 2010-02-16
CN101679603A (zh) 2010-03-24
WO2008140906A1 (en) 2008-11-20
CN103059267A (zh) 2013-04-24

Similar Documents

Publication Publication Date Title
TWI372766B (en) Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
HK1170514A1 (zh) 環氧樹脂組合物
EP2174969A4 (en) RESIN COMPOSITION
HK1152324A1 (zh) 熱固化型環氧樹脂組合物
GB2447980B (en) Thermosetting resin composition
EP2025695A4 (en) EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN
EP2251369A4 (en) SINGLE-PACKED EPOXY RESIN COMPOSITION AND ITS USE
EP2246377A4 (en) Resin composition
GB2451136B (en) Thermoset resin fibres
EP2280044A4 (en) EPOXY RESIN COMPOSITION FOR THE PACKAGING OF AN ELECTRONIC COMPONENT
EP2088170A4 (en) Resin composition
EP2226347A4 (en) EPOXY RESIN HARDENERS, PRODUCTION PROCESSES THEREOF AND EPOXY RESIN COMPOSITION
EP2017307A4 (en) HEAT-RESISTANT RESIN COMPOSITION AND ITS USE
HK1173462A1 (zh) 熱固性樹脂組合物及物件
HK1119725A1 (en) Thermosetting epoxy resin composition
EP2138525A4 (en) EPOXY SILICONE AND MANUFACTURING METHOD THEREOF, CURABLE RESIN COMPOSITION USING THE SAME, AND USE THEREOF
EP2366742A4 (en) THERMOSETTING RESIN COMPOSITION AND PREPREGATION USING THE SAME
EP1870436A4 (en) COMPOSITION OF POLYAMIDE POLYETHER RESIN OF PHENYLENE
PL2115069T3 (pl) Kompozycja termoutwardzalna
HK1141821A1 (en) Resin composition
EP1795558A4 (en) MODULATION OF MODIFIED EPOXY RESIN
EP1964869A4 (en) THERMOSETTING RESIN COMPOSITION
EP2505610A4 (en) ONE PIECE OF EPOXY RESIN COMPOSITION AND ITS USE
HK1161889A1 (zh) 高固體環氧樹脂塗料組合物
EP2045295A4 (en) THERMOSETTING POLYIMIDE RESIN COMPOSITION

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees