HK1173462A1 - 熱固性樹脂組合物及物件 - Google Patents
熱固性樹脂組合物及物件Info
- Publication number
- HK1173462A1 HK1173462A1 HK13100673.9A HK13100673A HK1173462A1 HK 1173462 A1 HK1173462 A1 HK 1173462A1 HK 13100673 A HK13100673 A HK 13100673A HK 1173462 A1 HK1173462 A1 HK 1173462A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- articles
- thermosetting resin
- resin compositions
- compositions
- thermosetting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/718—Weight, e.g. weight per square meter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23808109P | 2009-08-28 | 2009-08-28 | |
PCT/US2010/046998 WO2011025961A2 (en) | 2009-08-28 | 2010-08-27 | Thermosetting resin compositions and articles |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1173462A1 true HK1173462A1 (zh) | 2013-05-16 |
Family
ID=43623154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13100673.9A HK1173462A1 (zh) | 2009-08-28 | 2013-01-16 | 熱固性樹脂組合物及物件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8258216B2 (zh) |
CN (1) | CN102597089B (zh) |
HK (1) | HK1173462A1 (zh) |
TW (1) | TWI537341B (zh) |
WO (1) | WO2011025961A2 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120129414A1 (en) * | 2010-11-24 | 2012-05-24 | Chung-Hao Chang | Thermosetting resin composition and prepreg or laminate using the same |
KR20120066141A (ko) * | 2010-12-14 | 2012-06-22 | 삼성전기주식회사 | 인쇄회로기판의 절연층, 이의 제조방법, 및 이를 포함하는 인쇄회로기판 |
TWI449722B (zh) | 2011-04-12 | 2014-08-21 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
CN102746616B (zh) * | 2011-04-19 | 2014-10-01 | 台燿科技股份有限公司 | 一种树脂组合物及其应用 |
US20120299162A1 (en) * | 2011-05-23 | 2012-11-29 | Samsung Electronics Co. Ltd. | Barrier film for electronic device, method of manufacture thereof, and articles including the same |
US9279051B2 (en) * | 2011-09-22 | 2016-03-08 | Elite Material Co., Ltd. | Halogen-free resin composition, and copper clad laminate and printed circuit board using same |
US9422412B2 (en) * | 2011-09-22 | 2016-08-23 | Elite Material Co., Ltd. | Halogen-free resin composition and copper clad laminate and printed circuit board using same |
EP2799493B1 (en) * | 2011-12-29 | 2018-07-04 | Shengyi Technology Co., Ltd | Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom |
CN102821570A (zh) * | 2012-07-31 | 2012-12-12 | 深圳光启创新技术有限公司 | 电子设备及其壳体 |
CN102821565A (zh) * | 2012-07-31 | 2012-12-12 | 深圳光启创新技术有限公司 | 一种电子设备及其壳体 |
KR101392217B1 (ko) * | 2012-09-24 | 2014-05-08 | 정세현 | 스탬핑 호일용 착색 조성물 및 그를 구비하는 스탬핑 호일 |
US20150355365A1 (en) * | 2012-12-28 | 2015-12-10 | Schlumberger Technology Corporation | Well-Logging Device with Dielectric Thermoset Material |
CN104425879B (zh) * | 2013-09-03 | 2017-12-29 | 深圳光启创新技术有限公司 | 共形天线、制造共形天线的方法及材料 |
CN104744892A (zh) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | 树脂组合物及其应用 |
US10662304B2 (en) | 2013-12-31 | 2020-05-26 | Saint-Gobain Performance Plastics Corporation | Composites for protecting signal transmitters/receivers |
US9879163B2 (en) | 2014-06-06 | 2018-01-30 | General Electric Company | Composition for bonding windings or core laminates in an electrical machine, and associated method |
US9911521B2 (en) | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
JP6546993B2 (ja) * | 2014-11-11 | 2019-07-17 | 廣東生益科技股▲ふん▼有限公司Shengyi Technology Co.,Ltd. | 熱硬化性樹脂組成物、及びそれを用いて製造されたプリプレグと積層板 |
JP6501211B2 (ja) | 2016-01-13 | 2019-04-17 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ |
US20220153945A1 (en) * | 2017-09-29 | 2022-05-19 | Iteq Corporation | Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effect |
US20190104612A1 (en) * | 2017-09-29 | 2019-04-04 | Iteq Corporation | Polymer matrix composite for eliminating skew and fiber weave effect |
JP2019178304A (ja) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
US11555095B2 (en) | 2019-03-29 | 2023-01-17 | Carbon, Inc. | Dual cure resin for the production of moisture-resistant articles by additive manufacturing |
US11639398B2 (en) * | 2019-12-30 | 2023-05-02 | Rohm And Haas Electronic Materials Llc | Photosensitive bismaleimide composition |
WO2022066565A1 (en) | 2020-09-25 | 2022-03-31 | Carbon, Inc. | Epoxy dual cure resin for the production of moisture-resistant articles by additive manufacturing |
US20240047229A1 (en) * | 2022-08-02 | 2024-02-08 | Advanced Micro Devices, Inc. | Organic package core for a substrate with high density plated holes |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6387990B1 (en) * | 1999-09-10 | 2002-05-14 | General Electric Company | Curable epoxy resin compositions with brominated triazine flame retardants |
MY142518A (en) * | 2001-01-10 | 2010-12-15 | Hitachi Chemical Co Ltd | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
JP2003128785A (ja) * | 2001-10-19 | 2003-05-08 | Hitachi Chem Co Ltd | 難燃性熱硬化性樹脂組成物並びに該組成物を用いたプリプレグ、積層板、樹脂フィルム、樹脂付き金属箔及び多層配線板とその製造方法 |
JP2003128909A (ja) * | 2001-10-23 | 2003-05-08 | Asahi Kasei Corp | 難燃性熱硬化樹脂組成物 |
TWI278481B (en) * | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
JP3985633B2 (ja) * | 2002-08-26 | 2007-10-03 | 株式会社日立製作所 | 低誘電正接絶縁材料を用いた高周波用電子部品 |
CN1726252A (zh) * | 2002-12-13 | 2006-01-25 | 陶氏环球技术公司 | 阻燃聚合物复合材料 |
JP5264133B2 (ja) * | 2007-09-21 | 2013-08-14 | パナソニック株式会社 | エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板 |
-
2010
- 2010-08-27 WO PCT/US2010/046998 patent/WO2011025961A2/en active Application Filing
- 2010-08-27 CN CN201080049278.8A patent/CN102597089B/zh active Active
- 2010-08-27 US US12/870,477 patent/US8258216B2/en active Active
- 2010-08-30 TW TW099129138A patent/TWI537341B/zh active
-
2013
- 2013-01-16 HK HK13100673.9A patent/HK1173462A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN102597089B (zh) | 2015-08-19 |
CN102597089A (zh) | 2012-07-18 |
US8258216B2 (en) | 2012-09-04 |
WO2011025961A3 (en) | 2011-07-14 |
TWI537341B (zh) | 2016-06-11 |
WO2011025961A2 (en) | 2011-03-03 |
WO2011025961A4 (en) | 2011-09-15 |
TW201116588A (en) | 2011-05-16 |
US20110048776A1 (en) | 2011-03-03 |
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