JP6501211B2 - 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ - Google Patents
半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ Download PDFInfo
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- JP6501211B2 JP6501211B2 JP2017560669A JP2017560669A JP6501211B2 JP 6501211 B2 JP6501211 B2 JP 6501211B2 JP 2017560669 A JP2017560669 A JP 2017560669A JP 2017560669 A JP2017560669 A JP 2017560669A JP 6501211 B2 JP6501211 B2 JP 6501211B2
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- epoxy resin
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- 239000011342 resin composition Substances 0.000 title claims description 48
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 39
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 229920005989 resin Polymers 0.000 claims description 114
- 239000011347 resin Substances 0.000 claims description 114
- 239000000945 filler Substances 0.000 claims description 43
- 239000003822 epoxy resin Substances 0.000 claims description 38
- 229920000647 polyepoxide Polymers 0.000 claims description 38
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 36
- 229920000800 acrylic rubber Polymers 0.000 claims description 35
- 229920000058 polyacrylate Polymers 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 33
- 239000011256 inorganic filler Substances 0.000 claims description 29
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 29
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 25
- -1 acrylate silane compound Chemical group 0.000 claims description 25
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 24
- 239000000126 substance Substances 0.000 claims description 24
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 17
- 230000000704 physical effect Effects 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 14
- 230000009477 glass transition Effects 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- 239000003365 glass fiber Substances 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000454 talc Substances 0.000 claims description 6
- 229910052623 talc Inorganic materials 0.000 claims description 6
- 239000005995 Aluminium silicate Substances 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 5
- 235000012211 aluminium silicate Nutrition 0.000 claims description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims description 3
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims description 2
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims description 2
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 239000011889 copper foil Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 17
- 239000011888 foil Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000002966 varnish Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000002002 slurry Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000005395 methacrylic acid group Chemical group 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- HIDBROSJWZYGSZ-UHFFFAOYSA-N O=C(C=CC1=O)N1c1ccccc1 Chemical compound O=C(C=CC1=O)N1c1ccccc1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 239000004643 cyanate ester Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- MWGMEGAYPPQWFG-UHFFFAOYSA-N [SiH4].OC(=O)C=C Chemical compound [SiH4].OC(=O)C=C MWGMEGAYPPQWFG-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- PJGPQOXWPYYELJ-UHFFFAOYSA-N 2,4-dichloro-5-ethyl-1h-imidazole Chemical compound CCC=1NC(Cl)=NC=1Cl PJGPQOXWPYYELJ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ACKLHLPNCLNXBA-UHFFFAOYSA-N 2-cyclohexyl-5-methyl-1h-imidazole Chemical compound CC1=CNC(C2CCCCC2)=N1 ACKLHLPNCLNXBA-UHFFFAOYSA-N 0.000 description 1
- VXPSQDAMFATNNG-UHFFFAOYSA-N 3-[2-(2,5-dioxopyrrol-3-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C(=CC=CC=2)C=2C(NC(=O)C=2)=O)=C1 VXPSQDAMFATNNG-UHFFFAOYSA-N 0.000 description 1
- LJIAAIOUUCAFLO-UHFFFAOYSA-N 5-butyl-4-ethyl-1h-imidazole Chemical compound CCCCC=1N=CNC=1CC LJIAAIOUUCAFLO-UHFFFAOYSA-N 0.000 description 1
- JEQQZUVLBKETJD-UHFFFAOYSA-N 5-hexyl-2-octyl-1h-imidazole Chemical compound CCCCCCCCC1=NC(CCCCCC)=CN1 JEQQZUVLBKETJD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- CNHSPEGZKYOVTM-UHFFFAOYSA-N CC=1NC(=CN1)CC.CC=1NC(=CN1)CC Chemical compound CC=1NC(=CN1)CC.CC=1NC(=CN1)CC CNHSPEGZKYOVTM-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000005130 benzoxazines Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GLTDLAUASUFHNK-UHFFFAOYSA-N n-silylaniline Chemical compound [SiH3]NC1=CC=CC=C1 GLTDLAUASUFHNK-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/24—Homopolymers or copolymers of amides or imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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Description
本出願は、2016年1月13日付の韓国特許出願第10−2016−0004390号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示されたすべての内容は本明細書の一部として含まれる。
アクリル系ゴム5〜20重量部および充填剤160〜350重量部を含み、
前記アクリル系ゴムは、重量平均分子量30×104〜65×104、粘度1,000〜6,000mPa.s、ガラス転移温度10℃〜50℃の物性を有し、
前記充填剤は、(メタ)アクリレートシラン化合物が充填剤の表面に結合されており、平均粒径が0.2μm〜1μmの第1無機充填剤と、(メタ)アクリレートシラン化合物が充填剤の表面に結合されており、平均粒径が20nm〜50nmの第2無機充填剤とを含む1種以上の混合物である、半導体パッケージ用熱硬化性樹脂組成物を提供する。
エポキシ樹脂
前記エポキシ樹脂は、通常、プリプレグ用熱硬化性樹脂組成物に使用されるものが使用可能であり、その種類に限定はない。
[化学式1]
前記シアネート樹脂は、下記化学式3で表される化合物からなる群より選択された1種以上であってもよい。好ましい一例を挙げると、前記シアネート樹脂は、ノボラック型シアネート樹脂、ビスフェノールA型シアネート樹脂、ビスフェノールE型シアネート樹脂、テトラメチルビスフェノールF型シアネート樹脂のビスフェノール型シアネート樹脂、およびこれらの一部トリアジン化されたプレポリマーが挙げられ、これらは、単独あるいは2種以上を混合して使用することができる。
[化学式3]
本発明は、既存の硬化剤として用いていたフェノールノボラックをベンズオキサジン樹脂に変更して使用することによって、反応速度を制御することができる。つまり、従来主に使用されてきたフェノールノボラック硬化剤は、一般に、ヒドロキシ基が自体構造に含まれて、常温からエポキシ樹脂などと反応して初期反応速度が速い。反面、本発明で使用するベンズオキサジン樹脂は、硬化剤としての役割を示し、150℃以上の温度でヒドロキシ基が生じる特性があり、これにより、常温または初期には反応がゆっくり起こるが、一定温度以上で反応に参加して反応速度を調節することが可能である。
本発明で特徴とするアクリル系ゴムは、樹脂組成物に含まれて低い硬化収縮率特性を示すことができる。また、前記アクリル系ゴムは、膨張緩和作用の効果をより一層高めることができる。
本発明の他の実施例によれば、前記熱硬化性樹脂組成物を繊維基材に含浸させて製造されたプリプレグが提供される。
本発明のさらに他の実施例によれば、前記プリプレグ;および加熱および加圧によって前記プリプレグと一体化された金属箔;を含む金属箔積層板が提供される。
次の表1から4のような組成の成分を混合した後、高速撹拌機にて400rpmの速度で混合して、実施例1〜6および比較例1〜9の感光性樹脂組成物(樹脂ワニス)を製造した。
エポキシ樹脂:ナフタレン系エポキシ樹脂(HP4710、DIC社)
BMI樹脂:ビスマレイミド系樹脂(BMI−2300、DAIWA社)
シアネートエステル樹脂:ノボラック型シアネート樹脂(PT−30S、Lonza社)
ベンズオキサジン樹脂:フェノールフタレインベンズオキサジン樹脂(XU8282、Hunstman社)
BT樹脂:Nanozine600、Nanokor社
アクリル系ゴムA:SG−P3−PT197(Mw65×104、Tg:12℃)、Nagase Chemtex Coporation
アクリル系ゴムB:SG−P3−MW1(Mw30×104、Tg:12℃)、Nagase Chemtex Coporation
アクリル系ゴムC:SG−P3(Mw85×104、Tg:12℃)、Nagase Chemtex Coporation
Filler A:メタアクリルシラン処理されたスラリータイプのフィラー、平均粒径0.5μm(SC2050MTM、Admantechs社)
Filler B:メタアクリルシラン処理されたスラリータイプのフィラー、平均粒径50nm(YA050C−MJE、Admantechs社)
Filler C:メタアクリルシラン処理されたパウダータイプのフィラー、平均粒径1μm(SFP−130MCMA、Denka社)
Filler D:エポキシシラン処理されたスラリータイプのフィラー、平均粒径0.5μm(SC2050MTE、Admantechs社)
Filler E:メタアクリルシラン処理されたスラリータイプのフィラー、平均粒径100nm(MEK−AC−5140Z、Nissan Chemical社)
Filler F:フェニルシラン処理されたスラリータイプのフィラー、平均粒径0.5μm(SC2050MTI、Admantechs社)
Filler G:フェニルアミノシラン処理されたスラリータイプのフィラー、平均粒径0.5μm(SC2050MTO、Admantechs社)
実施例および比較例で製造した銅箔積層板に対して、次の方法で物性を測定した:
IPC−TM−650(2.3.17)により、プリプレグ状態でカーバープレスを用いてRFを測定した。
銅箔積層板の断面を観察用試験片に作製した。走査型電子顕微鏡によりボイド(void)の有無を調べて成形性を評価した。
銅箔積層板の銅箔層をエッチングして除去した後、DMAとTMAを用いてガラス転移温度を測定した。
銅箔積層板の銅箔層をエッチングして除去した後、DMAを用いて測定した。
銅箔積層板の銅箔層をエッチングして除去した後、TMAを用いて測定した。
銅箔積層板の銅箔層をエッチングして除去した後、TMAを用いて測定した。加熱(heating)→冷却(cooling)区間を経て、寸法(dimetnsion)変化の差を確認した。
デスミア評価で、全体的な工程条件の雰囲気はアルカリ性であり、工程はswelling、permanagement、netralizingの工程の順に進行させた。溶液は市販のAtotech社製溶液を使用した。
Claims (12)
- エポキシ樹脂、ビスマレイミド樹脂、シアネート樹脂、およびベンズオキサジン樹脂を含むバインダー100重量部を基準として、
アクリル系ゴム5〜20重量部および充填剤160〜350重量部を含み、
前記アクリル系ゴムは、重量平均分子量30×104〜65×104、粘度1,000〜6,000mPa.s、ガラス転移温度10℃〜50℃の物性を有し、
前記充填剤は、(メタ)アクリレートシラン化合物が表面に結合されており、
平均粒径が0.2μm〜1μmの第1無機充填剤と、(メタ)アクリレートシラン化合物が表面に結合されており、
平均粒径が20nm〜50nmの第2無機充填剤とを含む1種以上の混合物である、半導体パッケージ用熱硬化性樹脂組成物。 - 前記アクリル系ゴムは、
アクリル酸ブチル由来の繰り返し単位とアクリロニトリル由来の繰り返し単位とが含まれるアクリル酸エステル共重合体;
またはブタジエン由来の繰り返し単位が含まれるアクリル酸エステル共重合体である、請求項1に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 前記アクリル系ゴムは、
炭素数2〜10の直鎖もしくは分枝鎖のアルキル基を有するアクリル酸アルキル由来の繰り返し単位をさらに含む、
請求項1または2に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 前記充填剤は、
平均粒径が0.2μm〜1μmの第1無機充填剤と、
平均粒径20nm〜50nmの第2無機充填剤とを、
全体表面処理された充填剤の総重量を基準として、
10:90〜90:10の重量比で含む、
請求項1から3のいずれか1項に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 前記バインダーは、
エポキシ樹脂20〜60重量%、
ビスマレイミド樹脂20〜70重量%、
シアネート樹脂30〜70重量%、
およびベンズオキサジン樹脂2〜10重量%を含む、
請求項1から4のいずれか1項に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 前記ベンズオキサジン樹脂は、
ビスフェノールA型ベンズオキサジン樹脂、ビスフェノールF型ベンズオキサジン樹脂、フェノールフタレインベンズオキサジン樹脂、およびこれらのベンズオキサジン樹脂と硬化促進剤との混合物からなる群より選択された1種以上である、
請求項1から5のいずれか1項に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 前記無機充填剤は、
シリカアルミニウムトリヒドロキシド、マグネシウムヒドロキシド、モリブデンオキシド、ジンクモリブデート、ジンクボレート、ジンクスタネート、アルミナ、クレー、カオリン、タルク、焼成カオリン、焼成タルク、マイカ、ガラス短繊維、ガラス微細パウダー、および中空ガラスからなる群より選択された1種以上である、
請求項1から6のいずれか1項に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 前記エポキシ樹脂は、
ビスフェノールA型エポキシ樹脂、フェノールノボラックエポキシ樹脂、テトラフェニルエタンエポキシ樹脂、ナフタレン系エポキシ樹脂、ビフェニル系エポキシ樹脂、ジシクロペンタジエンエポキシ樹脂、およびジシクロペンタジエン系エポキシ樹脂とナフタレン系エポキシ樹脂との混合物からなる群より選択された1種以上である、
請求項1に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 溶剤、硬化促進剤、難燃剤、潤滑剤、分散剤、可塑剤、およびシランカップリング剤からなる群より選択された1種以上の添加剤をさらに含む、
請求項1から10のいずれか1項に記載の半導体パッケージ用熱硬化性樹脂組成物。 - 請求項1から11のいずれか1項に記載の半導体パッケージ用熱硬化性樹脂組成物を繊維基材に含浸させて得られた
プリプレグ。
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