JP6989086B6 - 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ - Google Patents
半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ Download PDFInfo
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- JP6989086B6 JP6989086B6 JP2020501831A JP2020501831A JP6989086B6 JP 6989086 B6 JP6989086 B6 JP 6989086B6 JP 2020501831 A JP2020501831 A JP 2020501831A JP 2020501831 A JP2020501831 A JP 2020501831A JP 6989086 B6 JP6989086 B6 JP 6989086B6
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Description
本出願は2018年2月13日付韓国特許出願第10-2018-0018020号および2019年2月8日付韓国特許出願第10-2019-0015097号に基づいた優先権の利益を主張し、該当韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
平均粒径が互いに異なる少なくとも3種の充填剤350重量部以上;を含み、
前記充填剤は、平均粒径0.7μm~1μmの1次充填剤、平均粒径90nm~0.3μmの2次充填剤および平均粒径10nm~50nmの3次充填剤を含み、
前記1次充填剤は、充填剤の総含量中の前記バインダー樹脂100重量部に対して250重量部以上を含む、
半導体パッケージ用熱硬化性樹脂組成物を提供する。
[化学式1]
特に、本発明では既存の一般的な充填剤を使用せず、平均粒径が互いに異なる少なくとも3種の充填剤を特定比率で混合して使用することによって、樹脂組成物の剛性特性を改善することができ、優れた流れ性も確保することができる。
本発明の他の実施形態によれば、前記熱硬化性樹脂組成物を繊維基材に含浸させて製造されたプリプレグが提供される。
本発明のまた他の実施形態によれば、前記プリプレグ;および加熱および加圧によって前記プリプレグと一体化された金属箔;を含む金属張積層板が提供される。
以下の表1および2の組成で成分を混合した後、高速攪拌機で400rpmの速度で混合して実施例1~3および比較例1~9の樹脂組成物(樹脂ワニス)をそれぞれ製造した。
エポキシ樹脂:ナフタレン系エポキシ樹脂(HP6000、DIC社)
BMI樹脂:ビスマレイミド系樹脂(BMI-2300、DAIWA社)
シアネートエステル樹脂(Cynate ester resin):ノボラック型シアネートエステル樹脂(PT-30S、Lonza社)
ベンゾオキサジン樹脂:フェノールフタレイン系ベンゾオキサジン樹脂(XU8282、Hunstman社)
DDS樹脂:ジアミノジフェニルスルホン樹脂(4'4-DDS、Sino Rich chemical社)
フィラー(Filler)A:スラリータイプ充填剤、平均粒径1μm(SC4050MT0、Admatechs社)
フィラーB:スラリータイプ充填剤、平均粒径0.5μm(SC2050MT0、Admatechs社)
フィラーC:スラリータイプ充填剤、平均粒径0.3μm(SX-CM1、Admatechs社)
フィラーD:スラリータイプ充填剤、平均粒径100nm(Optisol-SSKU9、Ranco社)
フィラーE:スラリータイプ充填剤、平均粒径50nm(YA050C-MJE、Admatechs社)
フィラーF:パウダータイプ充填剤、平均粒径1.5μm(SO-C5、Admatechs社)
実施例および比較例で製造した銅張積層板に対して以下の方法で物性を測定し、結果を表3および4に示した。
IPC-TM-650(2.3.17によって、プリプレグ状態でカバープレスを用いてRFを測定した。
銅張積層板の断面を観察用試片に製作した。走査型電子顕微鏡を通じてボイド(void)の有無を調査して成形性を評価した。
銅張積層板の銅箔層をエッチングして除去した後、DMAとTMAを用いてガラス転移温度を測定した。
銅張積層板の銅箔層をエッチングして除去した後、DMAを用いて測定した。
銅張積層板の銅箔層をエッチングして除去した後、TMAを用いて測定した。
Claims (10)
- エポキシ樹脂、ビスマレイミド樹脂、ジアミノジフェニルスルホン樹脂およびベンゾオキサジン樹脂を含むバインダー樹脂100重量部;および
平均粒径が互いに異なる少なくとも3種の充填剤350重量部以上;を含み、
前記充填剤は、平均粒径0.7μm~1μmの1次充填剤、平均粒径90nm~0.3μmの2次充填剤および平均粒径10nm~50nmの3次充填剤を含み、
前記1次充填剤は、充填剤の総含量中、前記バインダー樹脂100重量部に対して250重量部以上を含み、
前記ジアミノジフェニルスルホン樹脂の含量は、バインダー樹脂の総重量に対して5~20重量%であり、
前記3種の充填剤は、バインダー樹脂100重量部を基準にして350重量部~550重量部を含む、
半導体パッケージ用熱硬化性樹脂組成物。 - エポキシ樹脂、ビスマレイミド樹脂、ジアミノジフェニルスルホン樹脂およびベンゾオキサジン樹脂を含むバインダー樹脂100重量部;および
平均粒径が互いに異なる少なくとも3種の充填剤350重量部以上;を含み、
前記充填剤は、平均粒径0.7μm~1μmの1次充填剤、平均粒径90nm~0.3μmの2次充填剤および平均粒径10nm~50nmの3次充填剤を含み、
前記1次充填剤は、充填剤の総含量中、前記バインダー樹脂100重量部に対して250重量部以上を含み、
前記ジアミノジフェニルスルホン樹脂の含量は、バインダー樹脂の総重量に対して5~20重量%であり、
前記3種の充填剤は、バインダー樹脂100重量部に対して、
平均粒径0.7μm~1μmの1次充填剤280~400重量部、
平均粒径90nm~0.3μmの2次充填剤30~90重量部および
平均粒径10nm~50nmの3次充填剤35~60重量部を含む、半導体パッケージ用熱硬化性樹脂組成物。 - 前記ジアミノジフェニルスルホン樹脂は、重量平均分子量が100~400である、請求項1または2に記載の半導体パッケージ用熱硬化性樹脂組成物。
- 前記ベンゾオキサジン樹脂の含量は、バインダー樹脂の総重量に対して2~10重量%である、請求項1から3のいずれか一項に記載の半導体パッケージ用熱硬化性樹脂組成物。
- 前記3種の充填剤はそれぞれ独立して、シリカ、アルミニウムトリヒドロキシド、マグネシウムヒドロキシド、モリブデンオキシド、ジンクモリブデート、ジンクボレート、ジンクスタネート、アルミナ、クレー、カオリン、タルク、焼成カオリン、焼成タルク、マイカ、ガラス短繊維、ガラス微細パウダーおよび中空ガラスからなる群より選択された1種以上を含む、請求項1から4のいずれか一項に記載の半導体パッケージ用熱硬化性樹脂組成物。
- 前記エポキシ樹脂は、ビスフェノールA型エポキシ樹脂、フェノールノボラックエポキシ樹脂、テトラフェニルエタンエポキシ樹脂、ナフタレン系エポキシ樹脂、ビフェニル系エポキシ樹脂、ジシクロペンタジエンエポキシ樹脂、およびジシクロペンタジエン系エポキシ樹脂とナフタレン系エポキシ樹脂の混合物からなる群より選択された1種以上である、請求項1から5のいずれか一項に記載の半導体パッケージ用熱硬化性樹脂組成物。
- 溶剤、硬化促進剤、難燃剤、潤滑剤、分散剤、可塑剤およびシランカップリング剤からなる群より選択された1種以上の添加剤をさらに含む、請求項1から7のいずれか一項に記載の半導体パッケージ用熱硬化性樹脂組成物。
- 請求項1から8のいずれか一項に記載の半導体パッケージ用熱硬化性樹脂組成物を繊維基材に含浸させて得られたプリプレグ。
- 請求項9に記載のプリプレグ;および
加熱および加圧によって前記プリプレグと一体化された金属箔
を含む金属張積層板。
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US11193015B2 (en) | 2021-12-07 |
JP2020528471A (ja) | 2020-09-24 |
JP6989086B2 (ja) | 2022-01-05 |
KR20190098062A (ko) | 2019-08-21 |
TWI688644B (zh) | 2020-03-21 |
US20200190313A1 (en) | 2020-06-18 |
TW201936878A (zh) | 2019-09-16 |
WO2019160287A1 (ko) | 2019-08-22 |
KR102136861B1 (ko) | 2020-07-22 |
WO2019160287A8 (ko) | 2022-02-03 |
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