WO2010055811A1 - 熱硬化性樹脂組成物とそれを用いたプリプレグ - Google Patents
熱硬化性樹脂組成物とそれを用いたプリプレグ Download PDFInfo
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- WO2010055811A1 WO2010055811A1 PCT/JP2009/069009 JP2009069009W WO2010055811A1 WO 2010055811 A1 WO2010055811 A1 WO 2010055811A1 JP 2009069009 W JP2009069009 W JP 2009069009W WO 2010055811 A1 WO2010055811 A1 WO 2010055811A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3855—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur
- C08G18/3863—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur containing groups having sulfur atoms between two carbon atoms, the sulfur atoms being directly linked to carbon atoms or other sulfur atoms
- C08G18/3865—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur containing groups having sulfur atoms between two carbon atoms, the sulfur atoms being directly linked to carbon atoms or other sulfur atoms containing groups having one sulfur atom between two carbon atoms
- C08G18/3872—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur containing groups having sulfur atoms between two carbon atoms, the sulfur atoms being directly linked to carbon atoms or other sulfur atoms containing groups having one sulfur atom between two carbon atoms the sulfur atom belonging to a sulfoxide or sulfone group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
- C08G18/581—Reaction products of epoxy resins with less than equivalent amounts of compounds containing active hydrogen added before or during the reaction with the isocyanate component
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a thermosetting resin composition suitable for molding a composite material excellent in mechanical properties such as high heat and humidity resistance and toughness, and a prepreg using the resin composition as a matrix resin.
- Fiber reinforced plastic is a thermosetting resin such as unsaturated polyester resin, epoxy resin, thermosetting polyimide resin, polyethylene, polypropylene, polyamide, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), etc.
- thermosetting resin such as unsaturated polyester resin, epoxy resin, thermosetting polyimide resin, polyethylene, polypropylene, polyamide, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), etc.
- PPS polyphenylene sulfide
- PEEK polyether ether ketone
- FRP molding is performed by dissolving a matrix resin in a solvent, mixing a curing agent and additives, and impregnating the obtained resin composition into a fiber reinforcement such as cloth, mat, or roving.
- a prepreg as an intermediate substrate is obtained.
- a honeycomb sandwich panel having such a prepreg as a face plate is used as a structural material for aircraft from the viewpoint of weight reduction and strength (for example, Patent Document 1).
- applications other than honeycomb sandwich panel applications have been attempted.
- conventional FRP has a problem that its mechanical properties such as toughness and impact resistance are significantly reduced under high temperature and high humidity conditions. was there. Therefore, it is desired to improve mechanical properties such as toughness and impact resistance while maintaining basic performance such as heat resistance and heat and humidity resistance.
- An object of the present invention is to provide a thermosetting resin composition suitable for molding a composite material having good mechanical properties, particularly excellent impact resistance and toughness, even in a high temperature and high humidity environment, and the thermosetting resin.
- the object is to provide a prepreg using the composition.
- thermosetting resin composition comprising at least a component [A] composed of thermoplastic resin particles and a thermosetting resin [B], wherein the thermoplastic resin particles are at least the following: A thermosetting resin composition comprising a melt blend of components [A-1] and [A-2].
- the thermoplastic resin insoluble in the thermosetting resin [B] means that the thermoplastic resin is put into the thermosetting resin [B] in the form of particles such as pellets, pulverized material, or powder, and is thermosetting. It means a thermoplastic resin in which the particle size hardly changes even when the resin [B] is stirred below the curing temperature.
- the thermoplastic resin soluble in the thermosetting resin [B] means that the thermoplastic resin is put into the thermosetting resin [B] in the form of particles such as pellets, pulverized products, or powders. When stirred below the curing temperature of [B], it means a thermoplastic resin in which particles are at least partially dissolved in [B] and the size of the particles becomes smaller or disappears.
- the content of the component [A] composed of the thermoplastic resin particles is 1 to 50% by weight of the entire thermosetting resin composition. It is a thermosetting resin composition.
- the component [A-1] and the component [A-2] constituting the component [A] made of thermoplastic resin particles are compatibilized in the particles. It is a thermosetting resin composition characterized by being in the state which has not been carried out.
- the state where the component [A-1] and the component [A-2] are not compatibilized in the particles means that the Tg of the mixture of the component [A-1] and the component [A-2] is measured. Means that the Tg based on the component [A-1] and the component [A-2] appears in two separated states.
- the component [A-1] and the component [A-2] constituting the component [A] made of thermoplastic resin particles are compatibilized in the particles. It is a thermosetting resin composition characterized by being in the state which is carrying out.
- the state in which the component [A-1] and the component [A-2] are compatibilized in the particles means that the Tg of the mixture of the component [A-1] and the component [A-2] is measured. This means a state in which one Tg appears mainly without the Tg based on the component [A-1] and the component [A-2] appearing separately.
- the thermosetting resin composition includes a thermoplastic resin other than the component [A], in addition to the component [A] and the thermosetting resin [B]. C] and a curing agent [D].
- thermosetting resin composition according to the first aspect wherein the thermosetting resin [B] contains at least an epoxy resin.
- thermosetting resin composition according to the first aspect wherein the thermosetting resin [B] contains an epoxy resin having at least three functionalities. .
- thermosetting resin composition according to the first aspect, wherein the curing agent [D] contains at least an aromatic amine curing agent.
- the ninth aspect of the present invention is formed from a melt blend of at least the following components [A-1] and [A-2], and the components [A-1] and [A-2] are compatibilized in the particles. It is the thermoplastic resin particle characterized by being in the state which is not carried out.
- Component [A-1] Thermoplastic resin insoluble in thermosetting resin
- Component [A-2] Thermoplastic resin soluble in thermosetting resin
- the tenth aspect of the present invention is formed from a melt blend of at least the following components [A-1] and [A-2], and the components [A-1] and [A-2] are compatibilized in the particles: It is the thermoplastic resin particle characterized by being in the state which is carrying out.
- thermosetting resin composition comprising at least a component [A] composed of thermoplastic resin particles and a thermosetting resin [B], wherein the thermoplastic resin particles are at least the following: A prepreg obtained by impregnating a fiber reinforcing material sheet with a thermosetting resin composition comprising a melt blend of components [A-1] and [A-2].
- Component [A-2] Thermoplastic resin soluble in thermosetting resin [B]
- the component [A-1] and the component [A-2] constituting the component [A] composed of thermoplastic resin particles are compatibilized in the particles. It is the prepreg characterized by being in the state which has not been carried out.
- the component [A-1] and the component [A-2] constituting the component [A] made of thermoplastic resin particles are compatibilized in the particles. It is the prepreg characterized by being in the state which is carrying out.
- thermosetting resin composition of the present invention As a matrix resin is laminated and cured, it has high heat resistance and moist heat resistance, and has mechanical properties such as impact resistance (compression strength after impact, CAI) and toughness. A composite material with improved can be obtained.
- thermosetting resin composition of the present invention comprises at least a component [A] (including at least components [A-1] and [A-2]) composed of thermoplastic resin particles and a thermosetting resin [B]. Although it is a thermosetting resin composition, first, a thermoplastic resin [A-1] insoluble in the thermosetting resin [B] and a thermoplastic resin [A-2] soluble in the thermosetting resin [B]. Are melt-blended, pulverized into particles, and the resulting thermoplastic resin particles are mixed with the thermosetting resin [B] as a toughness imparting material.
- thermoplastic resin is soluble or insoluble in the thermosetting resin [B]
- thermosetting resin [B] in the form of particles such as pellets, pulverized material or powder
- thermosetting resin [A-1] insoluble in the thermosetting resin [B] for example, when a polyfunctional epoxy resin having a glycidylamino group is used as the thermosetting resin [B], a polyether ether ketone ( PEK), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), nylon 6, nylon 12, amorphous nylon, amorphous polyimide, and the like.
- thermoplastic resin [A-2] soluble in the thermosetting resin [B] for example, when a polyfunctional epoxy resin having a glycidylamino group is used as the thermosetting resin [B], polyethersulfone ( PES) and polyetherimide (PEI).
- PES polyethersulfone
- PEI polyetherimide
- the specific thermoplastic resin becomes soluble or insoluble depending on the type of the thermosetting resin used. Accordingly, the thermoplastic resins [A-1] and [A-2] in the present invention are selected only by a specific combination with the thermosetting resin [B].
- the form of the thermoplastic resin needs to be particulate in order to be added to the resin composition while maintaining homogeneity and moldability.
- the average particle diameter of the thermoplastic resin particles is preferably in the range of 0.1 to 100 ⁇ m. When the particle size is less than 0.1 ⁇ m, the particles are likely to aggregate, the bulk density of the aggregate is increased, the viscosity of the thermosetting resin composition is significantly increased, or it is difficult to add a sufficient amount There is. On the other hand, when the thermosetting resin composition obtained when it is larger than 100 ⁇ m is formed into a sheet, it may be difficult to obtain a sheet having a uniform thickness. More preferably, the average particle size of the particles is 1 to 50 ⁇ m.
- the content (mixing ratio) of the component [A] composed of thermoplastic resin particles is preferably 1 to 50% by weight, more preferably 5 to 40% by weight, based on the entire thermosetting resin composition.
- the method of mixing is not particularly limited, but it is preferable to mix as uniformly as possible.
- the component [A-1] and the component [A-2] constituting the component [A] composed of thermoplastic resin particles are not in a state of being compatibilized in the particles as a mixture (melt blend). There are cases where there are cases and cases where they are in a compatible state. When both are in a state where they are not compatibilized, a composite material having particularly high interlaminar fracture toughness tends to be obtained. On the other hand, when both are in a state of being compatible, a composite material having a particularly high impact resistance tends to be obtained.
- Tg Tg based on component [A-1] and component [A-2] is one Tg appear.
- Tg appears to be separated into two.
- thermosetting resin used as the component [B] of the present invention examples include thermosetting mainly composed of epoxy resin, bismaleimide resin, oxetane resin, benzoxazine resin, polyester resin, vinyl resin, cyanate ester resin, and the like. Resin.
- An epoxy resin is preferable as the thermosetting resin.
- a conventionally well-known epoxy resin can be used as an epoxy resin, It does not specifically limit.
- N, N, N ′, N′-tetraglycidyldiaminodiphenylmethane for example, jER604 manufactured by Japan Epoxy Resin, Sumiepoxy ELM-434 manufactured by Sumitomo Chemical Co., Ltd., ELM-120 manufactured by Asahi Ciba Co., Ltd.
- Multifunctionals having a glycidylamino group such as Araldite MY9634, MY-720, Etoto YH434 manufactured by Tohto Kasei), N, N, O-triglycidyl-p-aminophenol (for example, Sumiepoxy ELM-100 manufactured by Sumitomo Chemical Co., Ltd.)
- Epoxy resin bisphenol type epoxy resin, alcohol type epoxy resin, hydrophthalic acid type epoxy resin, dimer acid type epoxy resin, alicyclic epoxy
- bifunctional epoxy resin phenol novolac type epoxy resin, cresol novolac type epoxy resin, etc.
- Novolac type Polyfunctional epoxy resins such as epoxy resins.
- various modified epoxy resins such as urethane-modified epoxy resin and rubber-modified epoxy resin can also be used.
- Preferable examples include bisphenol type epoxy resins, alicyclic epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, and urethane-modified bisphenol A epoxy resins in addition to the above-mentioned polyfunctional epoxy resins having a glycidylamino group. Can be mentioned.
- Examples of the bisphenol type epoxy resin include bisphenol A type resin, bisphenol F type resin, bisphenol AD type resin, bisphenol S type resin and the like. More specifically, examples of commercially available resins include jER815, jER828, jER834, jER1001, jER807, jER807, Mitsui Petrochemical's Epomic R-710, Dainippon Ink & Chemicals EXA1514, etc. .
- Examples of the alicyclic epoxy resin include commercially available resins such as Araldite CY-179, CY-178, CY-182 and CY-183 manufactured by Asahi Ciba.
- Examples of the phenol novolac type epoxy resin include jER152 and jER154 manufactured by Japan Epoxy Resin, DEN431 and DEN485 and DEN438 manufactured by Dow Chemical Co., and Epicron N740 manufactured by Dainippon Ink and Chemicals, Inc.
- Examples of the cresol novolac epoxy resin include Araldite ECN1235, ECN1273, ECN1280, Nippon Kayaku EOCN102, EOCN103, and EOCN104 manufactured by Asahi Ciba.
- examples of the urethane-modified bisphenol A epoxy resin include Adeka Resin EPU-6 and EPU-4 manufactured by Asahi Denka.
- the epoxy resin contains at least a trifunctional or higher functional epoxy resin.
- the epoxy resin having three functional groups include ELM-100, ELM-120, and YX-4 manufactured by Sumitomo Chemical Co., Ltd., MY0510 manufactured by Huntsman, EXD506 manufactured by Dainippon Ink, and the like.
- the said epoxy resin can be selected suitably and can be used 1 type or in mixture of 2 or more types.
- the epoxy resin may contain the thermoplastic resin [C] other than the component [A] as described above within a range not impeding the effects of the present invention.
- a thermoplastic resin [C] has an effect of, for example, dissolving in the epoxy resin during the curing process of the epoxy resin, increasing the viscosity of the matrix, and preventing a decrease in the viscosity of the epoxy resin composition.
- these thermoplastic resins can also be used by disperse
- the thermosetting resin composition of the present invention may appropriately contain a curing agent and an accelerator.
- an epoxy resin is usually used with a known curing agent, but the same applies to the present invention.
- the curing agent [D] used in the present invention is not particularly limited as long as it is usually used as a curing agent for epoxy resins, but an aromatic amine curing agent is preferable. Specific examples include diaminodiphenyl sulfone (DDS), diaminodiphenylmethane (DDM), diaminodiphenyl ether (DPE), and phenylenediamine. These may be used singly or as a mixture of two or more, but DDS is preferable in terms of imparting heat resistance.
- what was microencapsulated with the melanin resin etc. can also be used for an aromatic amine type hardening
- an aromatic amine curing agent in the epoxy resin composition of the present invention, high heat resistance can be expressed in the cured product of the epoxy resin composition.
- a resin other than an epoxy resin such as an aromatic bismaleimide or alkenylphenol is used as the thermosetting resin.
- the blending amount of the curing agent can be appropriately used in a desired blending amount in consideration of the presence / absence and addition amount of the curing accelerator, the chemical reaction stoichiometry with the thermosetting resin, the curing rate of the composition, and the like.
- thermosetting resin composition contains a polyisocyanate compound in addition to the component [A] and the thermosetting resin [B].
- the polyisocyanate compound is a compound having two or more isocyanate groups in the molecule, and is not particularly limited as long as it reacts with an epoxy resin and exhibits a thickening effect.
- a polyisocyanate compound can be used after being pre-reacted with the component [B].
- the preliminary reaction is carried out, the hygroscopic property of the resulting thermosetting resin composition is suppressed, and the effect of absorbing the moisture during the production, storage and use of the prepreg and suppressing the performance deterioration is obtained. Moreover, the effect of stabilizing the viscosity of the resulting thermosetting resin composition can be obtained.
- Such a polyisocyanate compound has a role of adjusting the resin flow at the time of molding and curing to improve the moldability.
- the content (mixing ratio) of the component [A] is preferably 1 to 50% by weight, more preferably 5 to 40% by weight of the entire thermosetting resin composition.
- the blending amount of the isocyanate compound can be appropriately selected from the viewpoints of the thermosetting resin composition production, the prepreg production and the composite material production, as long as it does not affect the handleability, and is not particularly limited.
- a preferable range is about 0.1 to 15% by weight with respect to the total weight of the thermosetting resin composition.
- the thickening effect of the thermosetting resin composition expected by addition becomes insufficient, and if it exceeds 15% by weight, tackiness and draping of the prepreg will be reduced, and handling of the prepreg will be reduced. In some cases, the properties may be impaired, foaming may occur during curing, and the toughness of the cured product may be reduced.
- it is 0.5 to 10% by weight, and more preferably 1 to 7% by weight.
- the thermoplastic resin [C] means a thermoplastic resin that is not used as the component [A] in a specific combination, and is represented by, for example, polyethersulfone (PES) and polyetherimide (PEI).
- PES polyethersulfone
- PEI polyetherimide
- thermoplastic polyimide, polyamideimide, polysulfone, polycarbonate, polyetheretherketone, polyamides such as nylon 6, nylon 12, amorphous nylon, aramid, arylate, polyester carbonate, and the like thermoplastic polyimide, polyetherimide (PEI), polyethersulfone (PES), polysulfone, and polyamideimide can be cited as more preferable examples from the viewpoint of heat resistance.
- thermoplastic resin [C] used in the thermosetting resin composition of the present invention includes a rubber component.
- Typical examples of the rubber component include rubber components represented by carboxy-terminated styrene butadiene rubber and carboxy-terminated hydrogenated acrylonitrile butadiene rubber.
- the blending amount of the thermoplastic resin [C] other than the component [A] is preferably 10 to 50% by weight of the entire thermosetting resin composition. If it is less than 10% by weight, the resulting prepreg and composite material will have insufficient impact resistance. If it exceeds 50% by weight, the viscosity of the resin composition becomes high and the moldability and handleability may be inferior.
- the amount is preferably 12 to 45% by weight, more preferably 13 to 40% by weight.
- thermosetting resin composition of the present invention essentially comprises the above-described components [A-1], [A-2] and [B], but is necessary as long as the effects of the present invention are not impaired. Accordingly, various additives such as curing accelerators, reactive diluents, fillers, anti-aging agents, flame retardants, and pigments other than the above-described components may be appropriately contained.
- the curing accelerator include basic curing agents such as acid anhydrides, Lewis acids, dicyandiamides and imidazoles, urea compounds, and organic metal salts. More specifically, examples of the acid anhydride include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, and the like.
- Examples of the Lewis acid include boron trifluoride salts, and more specifically, BF 3 monoethylamine, BF 3 benzylamine, and the like.
- Examples of imidazoles include 2-ethyl-4-methylimidazole, 2-ethylimidazole, 2,4-dimethylimidazole, and 2-phenylimidazole.
- examples include urea compounds such as 3- [3,4-dichlorophenyl] -1,1-dimethylurea and the like, and organometallic salts such as Co [III] acetylacetonate.
- Examples of the reactive diluent include reactive diluents such as polypropylene diglycol / diglycidyl ether and phenyl glycidyl ether.
- the method for producing the thermosetting resin composition of the present invention is not particularly limited, and any conventionally known method may be used.
- the kneading temperature applied during the production of the resin composition can be exemplified by a range of 10 to 160 ° C. If it exceeds 160 ° C., the resin component may be thermally deteriorated or a partial curing reaction may be started, and the storage stability of the resulting thermosetting resin composition and the prepreg using the composition may be lowered. If it is lower than 10 ° C., the viscosity of the resin composition is high, and it may be difficult to knead substantially.
- the temperature is preferably 20 to 130 ° C, more preferably 30 to 110 ° C.
- a conventionally well-known thing can be used as a kneading machine apparatus.
- Specific examples include a roll mill, a planetary mixer, a kneader, an extruder, a Banbury mixer, a mixing container provided with a stirring blade, a horizontal mixing tank, and the like.
- the kneading of each component can be performed in the air or in an inert gas atmosphere.
- an atmosphere in which temperature and humidity are controlled is preferable.
- a low humidity atmosphere such as a temperature controlled at a constant temperature of 30 ° C. or lower or a relative humidity of 50% RH or lower.
- each component may be performed in a single stage, or may be performed in multiple stages by sequential addition. Moreover, when adding sequentially, it can add in arbitrary orders.
- the polyisocyanate compound can be used after reacting with the component [B] in advance.
- the part or whole quantity can also be provided after making it melt
- the prepreg of the present invention is a prepreg obtained by impregnating a fiber reinforced material sheet with the thermosetting resin composition of the present invention, which is obtained as described above and has excellent wet heat resistance.
- the fiber reinforcing material used in the prepreg of the present invention include carbon fiber, glass fiber, aromatic polyamide fiber, polyimide fiber, polybenzoxazole fiber, wholly aromatic polyester fiber, and the like. These can be used alone or in combination of two or more. Although not particularly limited, in order to improve the mechanical properties of the composite material, it is preferable to use carbon fibers having excellent tensile strength.
- the form of the fiber reinforcing material is preferably a sheet-like material such as a woven fabric, a multiaxial woven fabric, and a unidirectionally aligned product.
- the prepreg of the present invention preferably has a constituent thermosetting resin composition content (RC) of 15 to 70% by weight. If it is less than 15% by weight, voids or the like are generated in the obtained composite material, and the mechanical properties may be deteriorated. If it exceeds 70% by weight, the reinforcing effect by the reinforcing fibers becomes insufficient, and the mechanical properties in comparison with weight may be substantially low.
- the range is preferably 20 to 60% by weight, and more preferably 30 to 50% by weight.
- the thermosetting resin composition content (RC) here is a ratio calculated from a change in weight when the resin of the prepreg is decomposed by sulfuric acid decomposition.
- a prepreg is cut out to 100 mm ⁇ 100 mm to prepare a test piece, its weight is measured, and the resin remaining in the sulfuric acid is immersed or boiled until the resin component is eluted, and the fiber remaining after filtration is washed with water. It is a value obtained by measuring and calculating the mass after washing with, and drying.
- a reinforcing fiber layer composed of a reinforcing fiber and a resin composition impregnated between the reinforcing fibers, and a surface of the reinforcing fiber layer
- examples thereof include a coated resin coating layer having a resin coating layer thickness of 2 to 50 ⁇ m.
- the thickness is less than 2 ⁇ m, tackiness becomes insufficient, and the molding processability of the prepreg may be significantly lowered. If it exceeds 50 ⁇ m, it will be difficult to wind the prepreg into a roll with a uniform thickness, and the molding accuracy may be significantly reduced. More preferably, it is 5 to 45 ⁇ m, and still more preferably 10 to 40 ⁇ m.
- Interlaminar fracture toughness is a technique for evaluating the fracture toughness of a specimen by applying a load to the specimen that has been cracked by a predetermined method and measuring the amount of energy required to generate the crack. Interlaminar fracture toughness is classified into mode I (opening type), mode II (in-plane shear type), and mode III (out-of-plane shear type) depending on the deformation mode. Among them, a particularly important characteristic as an aircraft composite material is mode II interlaminar fracture toughness (GIIc).
- GTIc mode II interlaminar fracture toughness
- thermosetting resin composition of the present invention having the above-described configuration, a cured product having a high GIIc, that is, excellent toughness can be obtained.
- a prepreg in which the composite material obtained by molding and curing has a GIIc of 2400 J / m 2 or more is particularly preferable.
- GIIc here is a value measured according to EN6034.
- CAI post-impact compressive strength
- a prepreg in which the composite material obtained by molding and curing has a compressive strength after impact exceeding 240 MPa is particularly preferable. Particularly preferably, it is 245 MPa or more.
- the post-impact compressive strength here is a value measured according to EN6038.
- the manufacturing method of the prepreg of this invention is not specifically limited, It can manufacture using any conventionally well-known method.
- the above-mentioned thermosetting resin composition of the present invention is applied to a release paper in a thin film shape, and the resin film obtained by peeling is laminated and formed on a sheet-like fiber reinforcing material to be thermosetting.
- examples thereof include a so-called hot melt method in which the resin composition is impregnated and a solvent method in which the thermosetting resin composition is made into a varnish using an appropriate solvent and the fiber reinforced material sheet is impregnated with the varnish.
- the prepreg of the present invention can be particularly preferably produced by a hot melt method which is a conventionally known production method.
- the method for forming the thermosetting resin composition of the present invention into a resin film or sheet is not particularly limited, and any conventionally known method can be used. More specifically, it can be obtained by casting and casting on a support such as release paper or film by die extrusion, applicator, reverse roll coater, comma coater or the like.
- the resin temperature at the time of forming a film or a sheet can be appropriately set according to the resin composition / viscosity, but the same conditions as the kneading temperature in the method for producing the thermosetting resin composition described above are preferably used. it can.
- the fiber reinforcing material sheet in the present invention refers to a form of fiber reinforcing material, and is a sheet-like reinforcing fiber such as a woven fabric or a one-way aligned product.
- the size of these fiber reinforcing material sheets and the resin film or sheet are not particularly limited. However, when manufacturing continuously, the width is preferably 30 cm or more from the viewpoint of productivity.
- the upper limit is not particularly limited, but is substantially 5 m. If it exceeds 5 m, the production stability may decrease. Further, in the case of continuous production, the production speed is not particularly limited, but is 0.1 m / min or more in consideration of productivity, economy and the like. More preferably, it is 1 m / min or more, More preferably, it is 5 m / min or more.
- the impregnation pressurization when the resin sheet is impregnated into the sheet-like fiber reinforcing material sheet may be any pressure in consideration of the viscosity and resin flow of the resin composition.
- the impregnation temperature of the resin sheet into the fiber reinforcement sheet is in the range of 50 to 150 ° C. When the temperature is lower than 50 ° C., the viscosity of the resin sheet is high, and the fiber reinforcing material sheet may not be sufficiently impregnated. When the temperature is 150 ° C. or higher, the curing reaction of the resin composition is started, and the storage stability of the prepreg may be reduced, or the drapeability may be reduced.
- the temperature is preferably 60 to 145 ° C, more preferably 70 to 140 ° C. Further, the impregnation can be performed in multiple stages at an arbitrary pressure and temperature in a plurality of times instead of once.
- a composite material produced by molding and curing such as lamination using a prepreg obtained by such means has high moisture and heat resistance properties, and further has excellent impact resistance and interlaminar fracture toughness. It is suitable for structural material applications.
- Tg of drying conditions (DRY ⁇ Tg)
- a cured product obtained by curing each resin composition at 180 ° C. for 2 hours was cut into a length of 50 mm, a width of 6 mm, and a thickness of 2 mm to prepare a test piece.
- the test piece was conditioned in an atmosphere of 20 ° C. and 50% RH for 40 hours or more, and then heated at 3 ° C./min by three-point bending using a DMA measuring device (Rhegel-E4000 manufactured by UBM). Measurement was performed with a strain of speed and frequency of 1 Hz.
- Tg evaluation was performed based on EN6032 which employ
- GIIc Interlaminar Fracture Toughness
- GIIc test piece X Cut to a length of 110 mm or more to obtain a GIIc test piece.
- a GIIc test was performed using this test piece. That is, the test piece was placed at a position where the crack produced by the release film was 35 ⁇ 1 mm from the fulcrum, and a bending load was applied at a speed of 1 mm / min, and the GIIc test was performed.
- CAI compressive strength after impact
- a prepreg obtained by a predetermined method is cut and laminated to obtain a laminated body of a laminated structure [+ 45/0 / ⁇ 45 / 90] 3S , using a normal autoclave molding method, a pressure of 0.49 MPa, and a temperature of 180 ° C. And molded for 2 hours.
- the obtained molded product was cut into dimensions of 150 mm in the 0 ° direction and 100 mm in the 90 ° direction to obtain test pieces for compressive strength after impact (CAI) test.
- the post-impact compressive strength (CAI) after 30 J impact was measured at room temperature (25 ° C., 50% RH).
- Example 1 Using 5 parts by weight of thermoplastic polyimide Aurum PD450M manufactured by Mitsui Chemicals as component [A-1] and 5 parts by weight of polyetherimide Ultem 1010-1000 manufactured by GE Plastics as component [A-2] A melt blend resin was obtained using a ruder. The Tg of the obtained blend resin was separated into two points, and when observed under a microscope, it had a layer separation structure. The obtained blend resin was pulverized to obtain a powder of 1 to 100 ⁇ m.
- thermosetting resin of component [B] a polyfunctional epoxy resin having a glycidylamino group (jER604 made by Japan Epoxy Resin), bisphenol type epoxy resin (jER828 made by Japan Epoxy Resin), urethane-modified bisphenol A type epoxy resin ( Adeka Resin EPU-6) manufactured by Asahi Denka Co., Ltd. was used at the compounding ratio shown in Table 1. Further, 5 parts by weight of MR100 manufactured by Nippon Polyurethane Industry Co., Ltd. as the polyisocyanate compound, and 4,4′-diaminodiphenylsulfone (4,4′-DDS) manufactured by Wakayama Seika Co., Ltd.
- thermoplastic resin 50 parts by weight and component [C]
- polyethersulfone As a thermoplastic resin of 50 parts by weight and component [C], 30 parts by weight of polyethersulfone (Sumitomo Chemical Sumika Excel PES5003P (average particle diameter 10 ⁇ m)) was used.
- Various raw materials and compositions are shown in Table 1.
- a prepreg was prepared by the following procedure. First, the epoxy resin composition was cast at 60 ° C. with a film coater to prepare a resin film. A prepreg is obtained by impregnating this resin film with carbon fiber manufactured by Toho Tenax Co., Ltd., Tenax (trademark of Toho Tenax Co., Ltd.) HTA-3K (E30), in a unidirectional fiber reinforcement (fiber basis weight 190 ⁇ 10 g / m 2 ). It was. The basis weight (FAW) of the obtained prepreg was 292 g / m 2 and the resin amount (RC) was 35%. Using the obtained prepreg, a composite material (molded plate) was obtained and subjected to various measurements. The results are shown in Table 1.
- Example 2 A melt blended resin was obtained in the same manner as in Example 1 except that the blending ratio shown in Table 1 was used for Component [A-1] and Component [A-2].
- the Tg of the obtained blended resin was separated into two points, and when observed under a microscope, it had a layer separation structure.
- Example 4 only 1 point of Tg appeared, and both resins were compatibilized when observed under a microscope.
- the obtained blend resin was pulverized to obtain a powder of 1 to 100 ⁇ m.
- thermosetting resin of component [B] a polyfunctional epoxy resin having a glycidylamino group (jER604), a bisphenol type epoxy resin (jER828), and a urethane-modified bisphenol A type epoxy resin (Adeka Resin EPU-6) are shown in Table 1, respectively. Used at the indicated blending ratio. Further, 4,4′-diaminodiphenylsulfone (4,4′-DDS) is used as the aromatic amine curing agent [D], and polyethersulfone (Sumika Excel PES5003P (average particle size) is used as the thermoplastic resin of the component [C]. 10 ⁇ m in diameter)) were used at the compounding ratios listed in Table 1. In the same manner as in Example 1, a thermosetting resin composition, a prepreg, and a composite material (molded plate) were obtained, and various measurements were performed. The results are shown in Table 1.
- Example 5 As component [A-1], 45 parts by weight of polyethylene naphthalate (PEN) and Teonex (registered trademark) TN8065S manufactured by Teijin Chemicals Ltd. As component [A-2], 45 parts by weight of polyetherimide Ultem 1010-1000 Using an extruder, a melt blend resin was obtained. Only one point of Tg of the obtained blended resin appeared and both resins were compatibilized when observed under a microscope. The obtained blend resin was pulverized to obtain a powder of 1 to 100 ⁇ m. Others were the same as in Example 1, and a thermosetting resin composition, a prepreg, and a composite material (molded plate) were obtained and subjected to various measurements. The results are shown in Table 1.
- Example 6 A melt blended resin was obtained in the same manner as in Example 1 except that the blending ratio shown in Table 1 was used for Component [A-1] and Component [A-2]. Only one point of Tg of the obtained blended resin appeared and both resins were compatibilized when observed under a microscope. The obtained blend resin was pulverized to obtain a powder of 1 to 100 ⁇ m.
- thermosetting resin of component [B] a polyfunctional epoxy resin having a glycidylamino group (jER604), a bisphenol type epoxy resin (jER828), and a urethane-modified bisphenol A type epoxy resin (Adeka Resin EPU-6) are shown in Table 1, respectively. Used at the indicated blending ratio. Further, 4,4′-diaminodiphenylsulfone (4,4′-DDS) is used as the aromatic amine curing agent [D], and polyethersulfone (Sumika Excel PES5003P (average particle size) is used as the thermoplastic resin of the component [C]. 10 ⁇ m in diameter)) were used at the compounding ratios listed in Table 1. In the same manner as in Example 1, a thermosetting resin composition, a prepreg, and a composite material (molded plate) were obtained, and various measurements were performed. The results are shown in Table 1.
- a melt blend resin is obtained by using 27 parts by weight of thermoplastic polyimide Aurum PD450M as component [A-1] and 3 parts by weight of polyethersulfone (Sumika Excel PES5003P (average particle size 10 ⁇ m)) as component [A-2]. It was. Only one point of Tg of the obtained blended resin appeared and both resins were compatibilized when observed under a microscope. The obtained blend resin was pulverized to obtain a powder of 1 to 100 ⁇ m.
- thermosetting resin of component [B] a polyfunctional epoxy resin having a glycidylamino group (jER604), a bisphenol type epoxy resin (jER828), and a urethane-modified bisphenol A type epoxy resin (Adeka Resin EPU-6) are shown in Table 1, respectively. Used at the indicated blending ratio. Further, 4,4′-diaminodiphenylsulfone (4,4′-DDS) is used as the aromatic amine curing agent [D], and polyethersulfone (Sumika Excel PES5003P (average particle size) is used as the thermoplastic resin of the component [C]. 10 ⁇ m in diameter)) were used at the compounding ratios listed in Table 1. In the same manner as in Example 1, a thermosetting resin composition, a prepreg, and a composite material (molded plate) were obtained, and various measurements were performed. The results are shown in Table 1.
- Example 8 Extruder using 15 parts by weight of polyethylene naphthalate (PEN) and Teonex (registered trademark) TN8065S as component [A-1] and 15 parts by weight of polyetherimide Ultem 1010-1000 as component [A-2] was used to obtain a melt blend resin. Only one point of Tg of the obtained blended resin appeared and both resins were compatibilized when observed under a microscope. The obtained blend resin was pulverized to obtain a powder of 1 to 100 ⁇ m. Others were the same as in Example 1, and a thermosetting resin composition, a prepreg, and a composite material (molded plate) were obtained and subjected to various measurements. The results are shown in Table 1.
- Example 9 Using an extruder with 15 parts by weight of Aurum PD450M as component [A-1] and 15 parts by weight of Sumika Excel PES5003P (average particle size 10 ⁇ m) of polyethersulfone as component [A-2], a melt blend resin Got. Other than that was carried out similarly to Example 1 (however, PES5003P used 35 weight part), obtained the thermosetting resin composition, the prepreg, and the composite material (molded board), and performed various measurements. It was shown to.
- thermosetting resin was the same as in Example 1, except that 150 parts by weight of PEN of component [A-1] and 150 parts by weight of Ultem 1010-1000 of component [A-2] were used as component [A]. Compositions and prepregs were made. However, since the ratio of the thermoplastic resin component [A] was too large, the handleability of the obtained resin composition and prepreg was poor, and a composite material could not be prepared.
- thermosetting resin of component [B] a polyfunctional epoxy resin having a glycidylamino group (jER604), a bisphenol type epoxy resin (jER828), and a urethane-modified bisphenol A type epoxy resin (Adeka Resin EPU-6) are shown in Table 1, respectively. Used at the indicated blending ratio.
- thermoplastic polyimide aurum PD450M is used, and as component [A-2], polyetherimide ultem 1010-1000 is used in the mixing ratio shown in Table 2, and a melt blend resin is obtained in the same manner as in Example 1.
- a melt blend resin is obtained in the same manner as in Example 1.
- thermosetting resin of component [B] 57 parts by weight of 4,4′-bismaleimide diphenylmethane (Matrimid 5292A: manufactured by Huntsman) and O, O′-diallylbisphenol A (Matrimid) as a curing agent [D] 5292B (manufactured by Huntsman) and 43 parts by weight were blended by the following procedure.
- the thermosetting resin [B] and the curing agent [D] were mixed in a kneader at 130 ° C. for 60 minutes.
- component [A] was kneaded well to obtain a bismaleimide resin composition.
- Table 2 shows Tg (° C.) of the drying condition and Tg (° C.) of the moisture absorption condition of the resin composition.
- thermosetting resin composition a thermosetting resin composition, a prepreg and a composite material (molded plate) were prepared in the same manner as in Example 1 to obtain GIIc and CAI test pieces. Using this test piece, tests of GIIc and CAI were performed and the results are shown in Table 2.
- thermosetting resin composition a prepreg, and a composite material (molding) were carried out in the same manner as in Example 1 except that Ultem 1010-1000 and Aurum 450M were used as component [C] instead of component [A] without melt blending. Plate) and GIIc and CAI test pieces were obtained. Using this test piece, tests of GIIc and CAI were performed and the results are shown in Table 2.
- melt-blended thermoplastic resin component [A] has superior interlaminar fracture toughness.
- thermoplastic polyimide aurum PD450M or PEN, Teonex (registered trademark) TN8065S was used as component [A-2]
- polyetherimide ultem 1010-1000 was used in the mixing ratio shown in Table 3. In the same manner as in Example 1, a melt blend resin was obtained.
- thermosetting resin of component [B] 90 parts by weight of N-phenyl-bisphenol A-benzoxazine (manufactured by Shikoku Chemicals Co., Ltd.), 10 parts of jER828, PES5003P as thermoplastic resin [C] Using 25 parts by weight, a thermosetting resin composition, a prepreg, and a composite material (molded plate) were obtained in the same manner as in Example 1. Various measurements were performed and the results are shown in Table 3.
- thermosetting resin composition a prepreg and a composite material (molded plate) were prepared in the same manner as in Example 1 except that the component [A] was not used, and test pieces of GIIc and CAI were obtained. Using this test piece, GIIc and CAI tests were conducted and the results are shown in Table 3.
- melt-blended thermoplastic resin component [A] has superior interlaminar fracture toughness.
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Abstract
Description
また、最近では、航空機用途において、ハニカムサンドウィッチパネル用途以外への適用も試みられている。しかしながら、特に高度の耐熱性や靭性(タフネス)が要求される航空機用材料においては、従来のFRPは、高温高湿度条件において、その靭性や耐衝撃性等の機械物性が顕著に低下するという問題があった。そこで、耐熱性や耐湿熱性等の基本性能を維持しながら、靭性や耐衝撃性等の機械物性の改善をすることが望まれている。
成分[A-1]:熱硬化性樹脂[B]に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂[B]に可溶な熱可塑性樹脂
成分[A-1]:熱硬化性樹脂に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂に可溶な熱可塑性樹脂
成分[A-1]:熱硬化性樹脂に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂に可溶な熱可塑性樹脂
成分[A-1]:熱硬化性樹脂[B]に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂[B]に可溶な熱可塑性樹脂
また、連続製造の場合、生産速度としては、特に限定しないが、生産性や経済性などを考慮すると、0.1m/分以上である。より好ましくは1m/分以上であり、更に好ましくは5m/分以上である。
各樹脂組成物を180℃で2時間硬化させて得られた硬化物を、長さ50mm、幅6mm、厚さ2mmに切り出して試験片を作成した。この試験片を20℃、50%RHの雰囲気中に40時間以上状態調節した後、DMA測定装置(ユービーエム社製Rheogel-E4000)を用いて、3点曲げにて3℃/分の昇温速度、周波数1Hzの歪をかけて測定した。なお、Tg評価は、損失粘弾性(E”)のピークトップを採用するEN6032に準拠して行った。
前記の試験片を、121℃、飽和蒸気圧の雰囲気中に24時間暴露した以外は、前記と同様の方法で測定した。
靭性の指標として、GIIcの評価をEN6034に準拠し測定した。所定の方法により得られたプリプレグをカットし、0°方向に8層積層した積層体を2つ作製した。初期クラックを発生されるための離型フィルムを、2つの積層体の間にはさみ、両者を組み合わせ、積層構成[0]16の厚さ約3mmのプリプレグ積層体を得た。真空オートクレーブ成形法を用い、0.49MPaの圧力下、180℃の条件で2時間成形した。得られた成形物を幅25mm
× 長さ110mm以上の寸法に切断し、GIIcの試験片を得た。この試験片を用いて、GIIc試験を行った。即ち、離型フィルムにより作製したクラックが、支点から35±1mmとなる位置に試験片を配置し、1mm/minの速度で曲げの負荷をかけGIIc試験を実施した。
耐衝撃性の指標として、衝撃後圧縮強度の評価を、EN6038に準拠して測定した。所定の方法により得られたプリプレグをカット、積層し、積層構成[+45/0/-45/90]3Sの積層体を得、通常のオートクレーブ成形法を用い、圧力0.49MPaで、温度180℃で、2時間成形した。得られた成形物を0゜方向が
150mm、90゜方向が100mmの寸法に切断し、衝撃後圧縮強度(CAI)試験の試験片を得た。この試験片を用いて30J衝撃後の衝撃後圧縮強度(CAI)を室温下(25℃、50%RH)で測定した。
成分[A-1]として、三井化学社製熱可塑性ポリイミドのオーラムPD450Mを5重量部、成分[A-2]として、GEプラスチック社製ポリエーテルイミドのウルテム1010-1000を5重量部用いてエクストルーダーを用い、溶融ブレンド樹脂を得た。得られたブレンド樹脂のTgは2点に分離しており、顕微鏡下で観察すると層分離構造になっていた。得られたブレンド樹脂を粉砕し、1~100μmのパウダーを得た。
成分[A-1]と成分[A-2]を表1に記載の配合比に変更した以外は実施例1と同様にして、溶融ブレンド樹脂を得た。実施例2及び3では得られたブレンド樹脂のTgは2点に分離しており、顕微鏡下で観察すると層分離構造になっていた。実施例4ではTgは1点のみ現れており、顕微鏡下で観察すると両樹脂は相溶化していた。得られたブレンド樹脂を粉砕し、1~100μmのパウダーを得た。
成分[A-1]として、帝人化成社製ポリエチレンナフタレート(PEN)、テオネックス(登録商標)TN8065Sを45重量部、成分[A-2]として、ポリエーテルイミドのウルテム1010-1000を45重量部用いてエクストルーダーを用い、溶融ブレンド樹脂を得た。得られたブレンド樹脂のTgは1点のみ現れており、顕微鏡下で観察すると両樹脂は相溶化していた。得られたブレンド樹脂を粉砕し、1~100μmのパウダーを得た。その他は実施例1と同様にして、熱硬化性樹脂組成物、プリプレグ及び複合材料(成形板)を得て各種の測定を行い、その結果を表1に示した。
成分[A-1]と成分[A-2]を表1に記載の配合比に変更した以外は実施例1と同様にして、溶融ブレンド樹脂を得た。得られたブレンド樹脂のTgは1点のみ現れており、顕微鏡下で観察すると両樹脂は相溶化していた。得られたブレンド樹脂を粉砕し、1~100μmのパウダーを得た。
成分[A-1]として熱可塑性ポリイミドのオーラムPD450Mを27重量部、成分[A-2]としてポリエーテルスルホン(スミカエクセルPES5003P(平均粒子径10μm))を3重量部用いて溶融ブレンド樹脂を得た。得られたブレンド樹脂のTgは1点のみ現れており、顕微鏡下で観察すると両樹脂は相溶化していた。得られたブレンド樹脂を粉砕し、1~100μmのパウダーを得た。
成分[A-1]として、ポリエチレンナフタレート(PEN)、テオネックス(登録商標)TN8065Sを15重量部、成分[A-2]として、ポリエーテルイミドのウルテム1010-1000を15重量部用いてエクストルーダーを用い、溶融ブレンド樹脂を得た。得られたブレンド樹脂のTgは1点のみ現れており、顕微鏡下で観察すると両樹脂は相溶化していた。得られたブレンド樹脂を粉砕し、1~100μmのパウダーを得た。その他は実施例1と同様にして、熱硬化性樹脂組成物、プリプレグ及び複合材料(成形板)を得て各種の測定を行い、その結果を表1に示した。
成分[A-1]として、オーラムPD450Mを15重量部、成分[A-2]として、ポリエーテルスルホンのスミカエクセルPES5003P(平均粒子径10μm)を15重量部用いてエクストルーダーを用い、溶融ブレンド樹脂を得た。それ以外は実施例1と同様にして(但し、PES5003Pは35重量部用い)、熱硬化性樹脂組成物、プリプレグ及び複合材料(成形板)を得て各種の測定を行い、その結果を表1に示した。
成分[A-1]として、オーラムPD450Mを150重量部、成分[A-2]として、ポリエーテルスルホンのスミカエクセルPES5003P(平均粒子径10μm)を150重量部用いてエクストルーダーを用い、溶融ブレンド樹脂を得た。それ以外は実施例1と同様にして、熱硬化性樹脂組成物およびプリプレグの作成を行った。しかし、熱可塑性樹脂成分[A]の割合が多すぎたため、得られた樹脂組成物及びプリプレグの取扱い性が悪く、複合材料を作成することはできなかった。
成分[A]として、成分[A-1]のPENを150重量部、成分[A-2]のウルテム1010-1000を150重量部用いた以外は実施例1と同様にして、熱硬化性樹脂組成物およびプリプレグの作成を行った。しかし、熱可塑性樹脂成分[A]の割合が多すぎたため、得られた樹脂組成物及びプリプレグの取扱い性が悪く、複合材料を作成することはできなかった。
成分[A]を用いない場合の実験を行った。成分[B]の熱硬化性樹脂として、グリシジルアミノ基を有する多官能エポキシ樹脂(jER604)、ビスフェノール型エポキシ樹脂(jER828)、ウレタン変性ビスフェノールA型エポキシ樹脂(アデカレジンEPU-6)をそれぞれ表1に記載の配合比で用いた。また、芳香族アミン系硬化剤[D]として4,4’-ジアミノジフェニルスルホン(4,4’-DDS)を、45重量部、成分[C]の熱可塑性樹脂として、オーラムPD450M、ポリエーテルスルホン(スミカエクセルPES5003P、平均粒子径10μm)、又は非晶性ナイロン(EMS-CHEMIE製グリルアミドTR-55)を表1に示す配合部用いた。それ以外は実施例1と同様にして、熱硬化性樹脂組成物、プリプレグ及び複合材料(成形板)を得て各種の測定を行い、その結果を表1に示した。
成分[A-1]として、熱可塑性ポリイミドオーラムPD450Mを、成分[A-2]として、ポリエーテルイミドウルテム1010-1000を表2記載の配合比で用い、実施例1と同様にして溶融ブレンド樹脂を得た。
5292B:ハンツマン社製)43重量部を用い、以下の手順で配合した。先ず、熱硬化性樹脂[B]と硬化剤[D]を、ニーダー中にて130℃で60分間混合した。得られた混合物中に、成分[A]を良く混練し、ビスマレイミド樹脂組成物を得た。この樹脂組成物の乾燥条件のTg(℃)と、吸湿条件のTg(℃)を表2に示した。
成分[A]の替りに成分[C]としてウルテム1010-1000とオーラム450Mを溶融ブレンドせずに用いた以外は実施例1と同様にして、熱硬化性樹脂組成物、プリプレグ及び複合材料(成形板)を作成し、GIIcとCAIの試験片を得た。この試験片を用いて、GIIcとCAIの試験を行いその結果を表2に示した。
成分[A-1]として、熱可塑性ポリイミドオーラムPD450M又はPEN、テオネックス(登録商標)TN8065Sを、成分[A-2]として、ポリエーテルイミドウルテム1010-1000を表3記載の配合比で用い、実施例1と同様にして溶融ブレンド樹脂を得た。
成分[A]を用いなかった以外は実施例1と同様にして、熱硬化性樹脂組成物、プリプレグ及び複合材料(成形板)作成し、GIIcとCAIの試験片を得た。この試験片を用いて、GIIcとCAIの試験を行いその結果を表3に示した。
Claims (13)
- 少なくとも熱可塑性樹脂粒子からなる成分[A]と熱硬化性樹脂[B]とからなる熱硬化性樹脂組成物であって、該熱可塑性樹脂粒子が、少なくとも下記成分[A-1]と[A-2]の溶融ブレンドからなることを特徴とする熱硬化性樹脂組成物。
成分[A-1]:熱硬化性樹脂[B]に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂[B]に可溶な熱可塑性樹脂 - 熱可塑性樹脂粒子からなる成分[A]の含有率が、熱硬化性樹脂組成物の1~50重量%であることを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 熱可塑性樹脂粒子からなる成分[A]を構成する成分[A-1]と成分[A-2]とが、粒子中で相溶化していない状態にあることを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 熱可塑性樹脂粒子からなる成分[A]を構成する成分[A-1]と成分[A-2]とが、粒子中で相溶化している状態にあることを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 熱硬化性樹脂組成物が、成分[A]と熱硬化性樹脂[B]の他に、成分[A]以外の熱可塑性樹脂[C]と硬化剤[D]を含有することを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 熱硬化性樹脂[B]が、少なくともエポキシ樹脂を含有していることを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 熱硬化性樹脂[B]が、少なくとも3官能以上のエポキシ樹脂を含有していることを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 硬化剤[D]が、少なくとも芳香族アミン系硬化剤を含有していることを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 少なくとも下記成分[A-1]と[A-2]の溶融ブレンドから形成され、成分[A-1]と成分[A-2]とは粒子中で相溶化していない状態にあることを特徴とする熱可塑性樹脂粒子。
成分[A-1]:熱硬化性樹脂に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂に可溶な熱可塑性樹脂 - 少なくとも下記成分[A-1]と[A-2]の溶融ブレンドから形成され、成分[A-1]と成分[A-2]とは粒子中で相溶化している状態にあることを特徴とする熱可塑性樹脂粒子。
成分[A-1]:熱硬化性樹脂に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂に可溶な熱可塑性樹脂 - 少なくとも熱可塑性樹脂粒子からなる成分[A]と熱硬化性樹脂[B]とからなる熱硬化性樹脂組成物であって、該熱可塑性樹脂粒子が、少なくとも下記成分[A-1]と[A-2]の溶融ブレンドからなる熱硬化性樹脂組成物を、繊維強化材シートに含浸させてなるプリプレグ。
成分[A-1]:熱硬化性樹脂[B]に不溶な熱可塑性樹脂
成分[A-2]:熱硬化性樹脂[B]に可溶な熱可塑性樹脂 - 熱可塑性樹脂粒子からなる成分[A]を構成する成分[A-1]と成分[A-2]とが、粒子中で相溶化していない状態にあることを特徴とする請求項11記載のプリプレグ。
- 熱可塑性樹脂粒子からなる成分[A]を構成する成分[A-1]と成分[A-2]とが、粒子中で相溶化している状態にあることを特徴とする請求項11記載のプリプレグ。
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US13/128,559 US20110218272A1 (en) | 2008-11-13 | 2009-11-07 | Thermosetting resin composition and prepreg using the same |
EP09826061A EP2366742A4 (en) | 2008-11-13 | 2009-11-07 | THERMOSETTING RESIN COMPOSITION AND PREPREGATION USING THE SAME |
JP2010537763A JP5469086B2 (ja) | 2008-11-13 | 2009-11-07 | 熱硬化性樹脂組成物とそれを用いたプリプレグ |
CN2009801454935A CN102216394A (zh) | 2008-11-13 | 2009-11-07 | 热固性树脂组合物以及使用该热固性树脂组合物的预浸料坯 |
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US20110218272A1 (en) | 2011-09-08 |
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