JP6981634B2 - 樹脂組成物、これを含むプリプレグ、これを含む積層板、およびこれを含む樹脂付着金属箔 - Google Patents
樹脂組成物、これを含むプリプレグ、これを含む積層板、およびこれを含む樹脂付着金属箔 Download PDFInfo
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- JP6981634B2 JP6981634B2 JP2020544921A JP2020544921A JP6981634B2 JP 6981634 B2 JP6981634 B2 JP 6981634B2 JP 2020544921 A JP2020544921 A JP 2020544921A JP 2020544921 A JP2020544921 A JP 2020544921A JP 6981634 B2 JP6981634 B2 JP 6981634B2
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Description
また、(メタ)アクリレート基は、アクリレート基およびメタクリレート基の両方ともを含む意味である。
下記表1に記載された組成によってバインダー樹脂、無機フィラーおよび有機無機複合フィラーを混合し、4時間攪拌して実施例および比較例の樹脂組成物を製造した。
−ビスマレイミド系樹脂:BMI−5100、DAIWA社
−シアネートエステル樹脂:ULL−950S、Lonza社
−スチレン−ブタジエンゴム:Ricon181、CrayValley社
**ポリテトラフルオロエチレン、平均粒径3μm、株式会社誠心、TFW−3000FK
次のような方法で実施例および比較例の物性を評価し、その評価結果を下記表2に示した。
実施例および比較例の樹脂組成物をビニルシランで表面処理されたガラス繊維(厚さ15μm、Asahi Kasei社製造1017、L−glass)に含浸させた後、130〜160℃の温度で約3〜10分間乾燥して厚さ30μmのプリプレグを製造した。
IPC−TM−650 2.3.17評価規格によって、プリプレグ状態でカバープレスを用いて樹脂流れ(%)を測定して評価した(170℃および3分乾燥基準)。
IPC TM−650 2.4.13評価規格によってSolder288で積層板をフローティング(Floating)して絶縁層と銅箔、絶縁層と金属コアあるいは絶縁層の間の分離現象が起こる時点までの時間を測定して評価した。
銅箔を除去した積層板を用いて比誘電率測定装置(RF Impedence、Agilent)で周波数1GHzでの比誘電率および誘電損失率を測定して評価した。
銅箔を除去した積層板を用いて熱膨張係数を測定した。具体的に、IPC−TM−650.2.4.24評価規格によってTA社のTMA Q400で熱膨張係数(ppm/℃)を測定して評価した。
Claims (12)
- バインダー樹脂および有機無機複合フィラーを含み、
二重結合を含む官能基を含むシランカップリング剤で表面処理された無機フィラーをさらに含み、
前記有機無機複合フィラーは、二重結合を含む官能基を含むシランカップリング剤で表面処理された無機粒子を含むコーティング層が形成された有機フィラーである、
樹脂組成物。 - 前記バインダー樹脂は、ポリフェニレンエーテル樹脂、シアネートエステル樹脂、ビスマレイミド樹脂、ブタジエン樹脂、フェノキシ樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリスルホン樹脂、ポリエーテルスルホン樹脂、ポリカーボネート樹脂、およびポリエーテルエーテルケトン樹脂からなる群より選択された一つ以上を含む、
請求項1に記載の樹脂組成物。 - 前記有機フィラーは、フッ素元素を含むフッ素系有機フィラーである、
請求項1または2に記載の樹脂組成物。 - 前記バインダー樹脂100重量部に対する前記有機無機複合フィラーの含量は、20〜90重量部である、
請求項1から3の何れか一項に記載の樹脂組成物。 - 前記有機無機複合フィラーで、前記有機フィラー100重量部に対する前記二重結合を含む官能基を含むシランカップリング剤で表面処理された無機粒子の含量は、0.001〜10重量部である、
請求項1から4の何れか一項に記載の樹脂組成物。 - 前記二重結合を含む官能基は、ビニル基または(メタ)アクリレート基である、
請求項1から5の何れか一項に記載の樹脂組成物。 - 前記樹脂組成物は、硬化剤、難燃剤、UV遮蔽剤、レベリング剤、増粘剤、顔料、分散剤、および抗酸化剤からなる群より選択された一つ以上をさらに含む、
請求項1から6の何れか一項に記載の樹脂組成物。 - 繊維基材;および
前記繊維基材に含浸された、請求項1から7の何れか一項に記載の樹脂組成物
を含む、
プリプレグ。 - 前記繊維基材は、二重結合を含む官能基を含むシランカップリング剤で表面処理された、
請求項8に記載のプリプレグ。 - 請求項8または9に記載のプリプレグが少なくとも2層以上積層された、
積層板。 - 前記積層板は、前記プリプレグが少なくとも2層以上積層された状態で加熱加圧された、
請求項10に記載の積層板。 - 金属箔;および
前記金属箔上に位置し、請求項1から7の何れか一項に記載の樹脂組成物が硬化された樹脂層;
を含む、
樹脂付着金属箔。
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KR1020180146306A KR102311641B1 (ko) | 2018-11-23 | 2018-11-23 | 수지 조성물, 이를 포함하는 프리프레그, 이를 포함하는 적층판, 및 이를 포함하는 수지 부착 금속박 |
PCT/KR2019/015458 WO2020105949A1 (ko) | 2018-11-23 | 2019-11-13 | 수지 조성물, 이를 포함하는 프리프레그, 이를 포함하는 적층판, 및 이를 포함하는 수지 부착 금속박 |
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