JP2014523953A - フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤 - Google Patents
フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤 Download PDFInfo
- Publication number
- JP2014523953A JP2014523953A JP2014522722A JP2014522722A JP2014523953A JP 2014523953 A JP2014523953 A JP 2014523953A JP 2014522722 A JP2014522722 A JP 2014522722A JP 2014522722 A JP2014522722 A JP 2014522722A JP 2014523953 A JP2014523953 A JP 2014523953A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy
- anhydride
- bismaleimide
- benzoxazine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229920003192 poly(bis maleimide) Polymers 0.000 title claims abstract description 49
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 37
- 239000000853 adhesive Substances 0.000 title claims abstract description 34
- 239000002131 composite material Substances 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims abstract description 102
- 239000011347 resin Substances 0.000 claims abstract description 102
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 29
- 239000007787 solid Substances 0.000 claims abstract description 24
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 239000004593 Epoxy Substances 0.000 claims description 50
- 239000000203 mixture Substances 0.000 claims description 42
- 229920003986 novolac Polymers 0.000 claims description 39
- 229920000647 polyepoxide Polymers 0.000 claims description 26
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 22
- 239000003822 epoxy resin Substances 0.000 claims description 21
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 16
- 229920002857 polybutadiene Polymers 0.000 claims description 16
- 239000005062 Polybutadiene Substances 0.000 claims description 14
- 239000000178 monomer Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 8
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 8
- 229930003836 cresol Natural products 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- 150000002978 peroxides Chemical class 0.000 claims description 5
- 239000002952 polymeric resin Substances 0.000 claims description 5
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical group C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 4
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical group O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims description 3
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 claims description 2
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 claims description 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims description 2
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 claims description 2
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 claims description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 2
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 2
- PXNKTSGCFZNXGX-UHFFFAOYSA-N 5-methyl-2-oxaspiro[3.5]nonane-1,3-dione Chemical compound CC1CCCCC11C(=O)OC1=O PXNKTSGCFZNXGX-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- QDZXJOMXPRWGFG-UHFFFAOYSA-N CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 Chemical compound CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 QDZXJOMXPRWGFG-UHFFFAOYSA-N 0.000 claims description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 2
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 150000005130 benzoxazines Chemical class 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- WZXNKIQZEIEZEA-UHFFFAOYSA-N ethyl 2-(2-ethoxyethoxy)prop-2-enoate Chemical compound CCOCCOC(=C)C(=O)OCC WZXNKIQZEIEZEA-UHFFFAOYSA-N 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 6
- 229920000459 Nitrile rubber Polymers 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims 4
- 239000003999 initiator Substances 0.000 claims 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims 2
- RPKCLSMBVQLWIN-UHFFFAOYSA-N 2-n-methylbenzene-1,2-diamine Chemical compound CNC1=CC=CC=C1N RPKCLSMBVQLWIN-UHFFFAOYSA-N 0.000 claims 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims 1
- MOSSLXZUUKTULI-UHFFFAOYSA-N 3-[3-(2,5-dioxopyrrol-3-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(C=2C(NC(=O)C=2)=O)C=C1C1=CC(=O)NC1=O MOSSLXZUUKTULI-UHFFFAOYSA-N 0.000 claims 1
- MIIBUHIQXLFJFP-UHFFFAOYSA-N 3-methyl-1-[[3-[(3-methyl-2,5-dioxopyrrol-1-yl)methyl]phenyl]methyl]pyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1CC1=CC=CC(CN2C(C(C)=CC2=O)=O)=C1 MIIBUHIQXLFJFP-UHFFFAOYSA-N 0.000 claims 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims 1
- 239000004342 Benzoyl peroxide Substances 0.000 claims 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 1
- 239000005751 Copper oxide Substances 0.000 claims 1
- WRYCSMQKUKOKBP-UHFFFAOYSA-N Imidazolidine Chemical compound C1CNCN1 WRYCSMQKUKOKBP-UHFFFAOYSA-N 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 229960003328 benzoyl peroxide Drugs 0.000 claims 1
- 235000019400 benzoyl peroxide Nutrition 0.000 claims 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims 1
- 239000000969 carrier Substances 0.000 claims 1
- 229920006026 co-polymeric resin Polymers 0.000 claims 1
- 229910000431 copper oxide Inorganic materials 0.000 claims 1
- 239000011258 core-shell material Substances 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- NWADXBLMWHFGGU-UHFFFAOYSA-N dodecanoic anhydride Chemical compound CCCCCCCCCCCC(=O)OC(=O)CCCCCCCCCCC NWADXBLMWHFGGU-UHFFFAOYSA-N 0.000 claims 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims 1
- 229940119545 isobornyl methacrylate Drugs 0.000 claims 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims 1
- 239000004005 microsphere Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 claims 1
- 229920000768 polyamine Polymers 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims 1
- 239000001294 propane Substances 0.000 claims 1
- BAZXQZYWJSBDRG-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1.O=C1NC(=O)C=C1 BAZXQZYWJSBDRG-UHFFFAOYSA-N 0.000 claims 1
- 229910001923 silver oxide Inorganic materials 0.000 claims 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims 1
- 239000010456 wollastonite Substances 0.000 claims 1
- 229910052882 wollastonite Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 12
- 239000010703 silicon Substances 0.000 abstract description 12
- 229910052710 silicon Inorganic materials 0.000 abstract description 12
- 230000035945 sensitivity Effects 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 239000011342 resin composition Substances 0.000 abstract description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 1
- 238000007792 addition Methods 0.000 description 19
- 239000000047 product Substances 0.000 description 18
- 238000001723 curing Methods 0.000 description 15
- 230000009477 glass transition Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000003085 diluting agent Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 229920003319 Araldite® Polymers 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 229940106691 bisphenol a Drugs 0.000 description 5
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 238000006845 Michael addition reaction Methods 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- JAMNSIXSLVPNLC-UHFFFAOYSA-N (4-ethenylphenyl) acetate Chemical compound CC(=O)OC1=CC=C(C=C)C=C1 JAMNSIXSLVPNLC-UHFFFAOYSA-N 0.000 description 2
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 description 2
- 239000005770 Eugenol Substances 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 2
- 241000482268 Zea mays subsp. mays Species 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229960002217 eugenol Drugs 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- POSICDHOUBKJKP-UHFFFAOYSA-N prop-2-enoxybenzene Chemical compound C=CCOC1=CC=CC=C1 POSICDHOUBKJKP-UHFFFAOYSA-N 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- PPQRFOFHENJYMN-UHFFFAOYSA-N 3-(2,6-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(C)=C1C1=CC(=O)NC1=O PPQRFOFHENJYMN-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 238000005698 Diels-Alder reaction Methods 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000006742 Retro-Diels-Alder reaction Methods 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- ZIFBQDDDTRMSDJ-UHFFFAOYSA-N furan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CO1 ZIFBQDDDTRMSDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007863 gel particle Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012038 nucleophile Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000013341 scale-up Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09J179/085—Unsaturated polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
【解決手段】本発明は、フレキシブルな無水物付加生成物変性固体ビスマレイミド樹脂および固体ベンズオキサジン樹脂組成物であって、これは高温および高湿度環境で生き延びることができ、優れた接着強度を維持し、ボールグリッドアレイ半田マスク、スマートカードポリエチレンテレフタレート、または銀または銅金属リードフレームである基板とシリコンダイ間の熱的膨張係数の不調和によるストレスを最小化させることができる。
【選択図】なし
Description
固体樹脂
ビスマレイミド
ベンズオキサジン
液体樹脂
エポキシフェノールノボラック樹脂
アクリル樹脂
触媒
ジアミン
酸無水物
イミダゾール
過酸化物
軟化剤
マレイン化ポリブタジエン樹脂
添加剤
シラン
充填剤
シリカまたはアルミナまたはポリマー充填剤または銀
複合接着剤の靭性および柔軟性に対するエポキシ−無水物付加生成物の効果
エポキシ無水物付加生成物の靭性に対する効果を証明するために、2つの組成を準備し、耐湿性と耐高温性を満足させる様々な温度および湿度の条件下でDage社のダイせん断装置シリーズ4000モデルBT−4000を用いてダイせん断強度を測定した。また、東京精密社製の表面質感測定装置モデルSurfcom 120Aを用いて、BGA基板を有する四角形のシリコンダイ(10×4m/m)のシリコンダイ付着BGA基板の反り(warpage)を測定し、柔軟性を評価した。引張弾性率およびガラス転移温度は、動力学分析装置(Perkin Elmer Pyris diamond model)で測定した。固体ジフェニルメタン−4,4’−ビスマレイミドポリマー、4,4’−メチレンジアリニン、およびN−フェニルビスフェノールFベンズオキサジン樹脂類をアクリロイルモルホリンと80℃で1時間溶解させた後、4,4’−ジアミノジフェニルスルホンおよびエポキシフェノールノボラック樹脂を添加した。その次に、エポキシフェノールノボラック樹脂、メチルヘキサヒドロフタル酸無水物、ドデシルコハク酸無水物を混合し、1時間85℃で加熱してエポキシフェノールノボラック無水物付加生成物を作製した。その後、トリメチロールプロパントリアクリレート、マレイン化ポリブタジエン樹脂、および2,4−ジアミノ−6−[2’−メチルイミダゾリ−(1)]−エチル−S−トリアジンイソシアヌル酸付加生成物に対して、脱水イミダゾール、1,1−ジ−(t−アミルペルオキシ)シクロヘキサンペルオキシド、グリシドキシプロピルトリメトキシシランカップリング剤およびシリカ充填剤を添加した。
複合接着剤の靭性および柔軟性に対するエポキシ−無水物付加生成物工程の効果
耐高温性に対するベンズオキサジン樹脂の影響
Claims (16)
- a)室温で固体のビスマレイミド樹脂化合物;
b)室温で固体のベンズオキサジン樹脂化合物;
c)エポキシ、脂環式エポキシ、アクリレート、メタクリレート、エポキシアクリレート、エポキシフェノールノボラック、エポキシクレゾールノボラック、フェノールノボラック、クレゾールノボラック、およびオキセタン樹脂の群から選ばれる1種以上の熱硬化性化合物;
d)条件的に、1種以上の熱硬化性樹脂およびその混合物;並びに
e)エポキシフェノールノボラックと無水物付加生成物、エポキシクレゾールノボラックと無水物付加生成物、エポキシ官能基含有ポリマー樹脂と無水物付加生成物から本質的に構成される、相異なる表面を有する物質を接着させる熱硬化性接着剤組成物。 - 過酸化物、イミダゾール、イミダゾリジン、ジアミノジフェニルスルホン、ジアミノジフェニルメタン、メチルフェニレンジアミン、ジシアンジアミド、無水物、無水物−イミダゾール付加生成物、カルボン酸、カルボン酸−イミダゾール付加生成物、脂肪族ポリアミンよりなる群から選ばれる1種以上の硬化開始剤。
- マレイン化ポリブタジエン樹脂、ポリブタジエン樹脂、エポキシ化ポリブタジエン、アクリル化ポリブタジエン、ブタジエン−スチレン共重合体、ニトリルブタジエンゴム、カルボキシル末端ブタジエンアクリロニトリル樹脂、アミン末端ブタジエン−アクリロニトリル共重合体樹脂、ビニル末端ブタジエンアクリロニトリル樹脂、エポキシ末端ブタジエンアクリロニトリル樹脂、ポリジメチルシルセスキオキサン粉末、シリコーンゴム粉末、全フッ素化炭化水素ポリマー、ポリメチルメタクリレート微小球粉末、炭素ナノチューブ、およびコアシェルゴムナノ微小球よりなる群から選ばれる1種以上を含む、軟化剤。
- シリカ、アルミナ、窒化ホウ素、窒化アルミニウム、炭化シリコン、ダイヤモンド、珪灰石、チタニア、ガラス、硫酸バリウム、銀、銅、アルミニウム、ニッケル、パラジウム、金、銀メッキ銅、ニッケルメッキ銅、銀メッキガラス玉、銀パラジウム、半田粉末、ビスマス−スズ半田粉末、金−スズ合金粉末、カーボンブラック、グラファイト、酸化銀、酸化銅、および酸化鉄を含む、充填剤。
- 前記マレイミドは、N−フェニルマレイミド、N,N’−m−フェニレンジマレイミド、4,4’−ジフェニルメタンビスマレイミド、4,4’−メチレンジアニリンを有するジフェニルメタン−4,4’−ビスマレイミドポリマー、1,3−ビス(3−メチル−2,5−ジオキソ−1H−ピロリニルメチル)ベンゼン、N,N’−(2,2’−ジエチル−6,6’−ジメチレンジフェニレン)ビスマレイミド、2,2’−ビス[4−(4’−マイレイミドジフェノキシ)フェニル]プロパン、N,N’−(4−メチル−m−フェニレン)ビスマレイミド、N,N’−m−フェニレンビスマレイミド、ポリフェニルメタンビスマレイミド、N−フェニルマレイミド、2,6−キシルマレイミド、N−シクロへキシルマレイミド、ビスフェノールAジフェニルエーテルビスマレイミド、3,3’−ジメチル−5,5’−ジエチル−4,4’−ジフェニルメタンビスマレイミド、4−メチル−1,3−フェニレンビスマレイミド、または1,6−ビスマレイミド(2,2,4−トリメチル)ヘキサンである、請求項1に記載の組成物。
- 前記ベンズオキサジンは、N−フェニルビスフェノールFベンズオキサジン、N−フェニルビスフェノールAベンズオキサジン、N−フェニルフェノールフタレインベンズオキサジン、N−フェニルビスフェノール−sベンズオキサジン、またはN−フェニルジシクロペンタジエンベンズオキサジン樹脂である、請求項1に記載の組成物。
- 架橋の際に優れた接着特性を有する、重合可能なビスマレイミドとベンズオキサジン単量体、およびポリマー担体;
架橋の際に優れた接着特性を有する、アクリレート単量体とエポキシフェノールノボラック樹脂担体;並びに
硬化過酸化物、無水物、イミダゾール触媒を含む組成物の硬化した部分によって、第1物品が第2物品に永久に接着されることを含む、組立物。 - 前記エポキシは、ビスフェノールAエポキシ樹脂、ビスフェノールFエポキシ樹脂、脂環式エポキシ樹脂、フェニル含有エポキシ樹脂、およびオキセタン樹脂よりなる群から選ばれる、請求項1に記載の組成物。
- 熱硬化性化合物内の、前記アクリレートおよびメタクリレートは、アクリロイルモルホリン、アリルメタクリレート、1,6−ヘキサンジオールジアクリレート、2−エトキシエトキシエチルアクリレート、テトラヒドロフルフリルアクリレート、2−フェノキシエチルアクリレート、2−フェノキシエチルメタクリレート、トリメチロールプロパントリアクリレート、ジ−トリメチロールプロパンテトラアクリレート、イソボルニルアクリレート、およびイソボルニルメタクリレートよりなる群から選ばれる、請求項1に記載の組成物。
- 前記無水物は、メチルヘキサヒドロフタル酸無水物、ドデシルコハク酸無水物、ヘキサヒドロフタル酸無水物、ヘキサヒドロピロメリット酸無水物、マレイン酸無水物、ラウリン酸無水物、メチルテトラヒドロフタル酸無水物のような脂環式無水物、メチレンドメチレンテトラヒドロフタル酸無水物、テトラヒドロフタル酸無水物、トリアルキルテトラヒドロフタル酸無水物、メチルシクロヘキサンジカルボン酸無水物、またはその混合物である、請求項2に記載の硬化開始剤。
- 前記過酸化物は、メチルエチルケトンペルオキシド、メチルシアノヘキサノンペルオキシド、ジクミルペロキシド、クメンヒドロペルオキシド、D−(4−tert−ブチルシクロヘキシル)ペルオキシジカーボネート、2,5−ジメチル−2,5−ジ(2−エチルヘキサノイルペルオキシ)ヘキサン、またはベンゾイルペロキシドである、請求項2に記載の硬化開始剤。
- 前記イミダゾールは、2−メチルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、1,2−ジメチルイミダゾール、2−フェニルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニル−4メチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、2,4−ジアミノ−6−[2’−メチルイミダゾールイル−(1’)]−エチル−s−トリアジン、または2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]エチル−s−トリアジンイソシアヌル酸付加生成物脱水和物である、請求項2に記載の硬化開始剤。
- 前記固体ビスマレイミド樹脂は70℃〜260℃の溶融点を有し、0.1〜20重量%の範囲の量であり、固体ベンズオキサジン単量体または樹脂は45℃〜150℃の溶融点を有し、脂肪族または芳香族またはその混合物として0.1〜20重量%であり、エポキシ無水物またはエポキシフェノールノボラックまたはエポキシクレゾールノボラック−無水物付加生成物組成物は1〜50%であり、アクリル樹脂単量体またはプレポリマー樹脂は1〜50%である、請求項1に記載の組成物。
- 前記充填剤は0.1ナノミクロンメートル〜100ミクロンメートルの粒子サイズを有し、0.1〜20m2/gの表面積を有する、請求項4に記載の組成物。
- ダイ付着接着剤、電子部品パッケージングにおけるアンダーフィリング剤、電子部品封止剤、複合物質用マトリクス、またはコーティング物または産業用接着剤として用いられる、請求項1に記載の組成物。
- 固体ビスマレイミド樹脂、固体ベンズオキサジン、エポキシアクリレートまたはエポキシメタクリレート、エポキシフェノールノボラックまたはエポキシクレゾールノボラックと無水物付加生成物、カルボキシ末端ブタジエンゴム、およびこれらの組み合わせよりなる群から選ばれる、ダイ付着フィルムとして用いられる、請求項1に記載の組成物。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2011/005545 WO2013015469A1 (en) | 2011-07-28 | 2011-07-28 | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014523953A true JP2014523953A (ja) | 2014-09-18 |
JP5816752B2 JP5816752B2 (ja) | 2015-11-18 |
Family
ID=47601285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014522722A Expired - Fee Related JP5816752B2 (ja) | 2011-07-28 | 2011-07-28 | フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9296928B2 (ja) |
EP (1) | EP2736999B1 (ja) |
JP (1) | JP5816752B2 (ja) |
KR (1) | KR101722208B1 (ja) |
CN (1) | CN103797083B (ja) |
WO (1) | WO2013015469A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016506447A (ja) * | 2012-12-27 | 2016-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | ベンゾオキサジン、及び、酸形成過酸化物触媒、を含む重合性組成物、物品、及び方法 |
WO2016114030A1 (ja) * | 2015-01-16 | 2016-07-21 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
WO2016158828A1 (ja) * | 2015-03-31 | 2016-10-06 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
JP2017193693A (ja) * | 2016-04-18 | 2017-10-26 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
JP2018012776A (ja) * | 2016-07-20 | 2018-01-25 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
JPWO2016158829A1 (ja) * | 2015-03-31 | 2018-01-25 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
JP2019011415A (ja) * | 2017-06-29 | 2019-01-24 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
JP2019099755A (ja) * | 2017-12-07 | 2019-06-24 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
JP2020528471A (ja) * | 2018-02-13 | 2020-09-24 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ |
KR20200118323A (ko) * | 2019-04-05 | 2020-10-15 | 존스미디어 주식회사 | 엠보패턴 점착층을 갖는 양면 점착 필름 |
JP2021084968A (ja) * | 2019-11-28 | 2021-06-03 | 住友ベークライト株式会社 | 基材付き樹脂膜、プリント配線基板および電子装置 |
WO2021149698A1 (ja) * | 2020-01-22 | 2021-07-29 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013161088A1 (en) * | 2012-04-25 | 2013-10-31 | Henkel Ag & Co. Kgaa | Curable resin composition, cured product and method of producing a cured product |
US10224259B2 (en) * | 2013-06-21 | 2019-03-05 | Sumitomo Bakelite Co., Ltd. | Resin composition for sealing semiconductor and semiconductor device |
WO2015046921A1 (ko) * | 2013-09-30 | 2015-04-02 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
TWI651387B (zh) * | 2013-09-30 | 2019-02-21 | 漢高智慧財產控股公司 | 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物 |
JP6301473B2 (ja) * | 2013-09-30 | 2018-03-28 | エルジー・ケム・リミテッド | 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 |
WO2015088932A1 (en) | 2013-12-09 | 2015-06-18 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
KR20170020869A (ko) | 2014-06-20 | 2017-02-24 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 실세스퀴옥산 중합체 코어 및 실세스퀴옥산 중합체 외층을 포함하는 경화성 중합체 및 방법 |
WO2015195355A1 (en) | 2014-06-20 | 2015-12-23 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
US10370564B2 (en) | 2014-06-20 | 2019-08-06 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
WO2016048736A1 (en) | 2014-09-22 | 2016-03-31 | 3M Innovative Properties Company | Curable polymers comprising silsesquioxane polymer core silsesquioxane polymer outer layer, and reactive groups |
US9957416B2 (en) | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable end-capped silsesquioxane polymer comprising reactive groups |
CN105086909A (zh) * | 2014-12-19 | 2015-11-25 | 李立群 | 一种耐高温环氧胶黏剂胶液配比 |
CN107624123B (zh) | 2015-03-19 | 2020-12-15 | 泽费罗斯股份有限公司 | 用于高分子材料的酯化酸 |
AU2016296886B2 (en) * | 2015-07-23 | 2020-04-30 | Huntsman Advanced Materials Americas Llc | Curable benzoxazine compositions |
FR3039560B1 (fr) * | 2015-07-28 | 2019-04-05 | Arkema France | Composition d'additif utilisable dans un adhesif structural |
EP3347399B1 (en) * | 2015-09-09 | 2020-12-09 | Carbon, Inc. | Epoxy dual cure resins for additive manufacturing |
CN105176083A (zh) * | 2015-09-25 | 2015-12-23 | 苏州莱特复合材料有限公司 | 一种汽车外壳用复合材料及其制备方法 |
WO2017105520A1 (en) * | 2015-12-18 | 2017-06-22 | Intel Corporation | Transmissive composite film for application to the backside of a microelectronic device |
US10294341B2 (en) | 2016-01-13 | 2019-05-21 | Lg Chem, Ltd. | Thermosetting resin composition for semiconductor package and prepreg using the same |
CN107033517B (zh) * | 2016-11-25 | 2019-07-12 | 苏州生益科技有限公司 | 一种改性聚丁二烯的预聚物及其制备方法和应用 |
KR102157352B1 (ko) * | 2017-05-02 | 2020-09-17 | 주식회사 엘지화학 | 이액형 접착제 조성물 |
WO2018236993A1 (en) * | 2017-06-21 | 2018-12-27 | Lord Corporation | ALUMINUM COATING |
TWI648347B (zh) | 2017-11-01 | 2019-01-21 | 財團法人工業技術研究院 | 封裝材料與薄膜 |
KR102187162B1 (ko) | 2017-12-14 | 2020-12-04 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체 |
KR20190081987A (ko) * | 2017-12-29 | 2019-07-09 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 열경화성 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
US11935803B2 (en) * | 2018-04-26 | 2024-03-19 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device |
CN108754861B (zh) * | 2018-04-27 | 2021-02-09 | 安徽索亚装饰材料有限公司 | 一种皮雕用无纺布的生产工艺 |
CN108559263B (zh) * | 2018-05-25 | 2020-11-10 | 黑龙江省科学院石油化学研究院 | 一种耐高温双马树脂复合材料表面膜及其制备方法 |
TWI700320B (zh) * | 2018-06-13 | 2020-08-01 | 台燿科技股份有限公司 | 樹脂組合物,以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板 |
KR102173749B1 (ko) * | 2018-09-05 | 2020-11-03 | 주식회사 케이씨씨 | 분체도료 조성물 |
KR102175052B1 (ko) * | 2018-09-05 | 2020-11-05 | 주식회사 케이씨씨 | 분체도료 조성물 |
CN109735291A (zh) * | 2018-12-21 | 2019-05-10 | 东华大学 | 一种yasi有机硅胶及其制备方法 |
CN109735293A (zh) * | 2018-12-21 | 2019-05-10 | 东华大学 | 一种dab联苯四胺型含硅胶粘剂及其制备方法 |
CN109735292A (zh) * | 2018-12-21 | 2019-05-10 | 东华大学 | 一种bdadds型含硅胶粘剂及其制备方法 |
TWI700322B (zh) * | 2019-02-14 | 2020-08-01 | 台光電子材料股份有限公司 | 樹脂組合物及由其製成的物品 |
CN112210210B (zh) * | 2019-07-11 | 2023-04-25 | 台光电子材料(昆山)有限公司 | 一种树脂组合物及其制品 |
CN110451465B (zh) * | 2019-09-09 | 2022-08-16 | 吉林大学 | 一种海胆状氮化硼纳米球-纳米管分级结构及其制备方法 |
CN110776806A (zh) * | 2019-10-21 | 2020-02-11 | 王利玲 | 一种超支化聚合物-SiO2改性环氧树脂绝缘材料及其制法 |
CN113248917B (zh) * | 2020-02-13 | 2023-02-03 | 台光电子材料(昆山)有限公司 | 一种树脂组合物及其制品 |
US20230265287A1 (en) | 2020-06-24 | 2023-08-24 | Arxada Ag | Novel compositions with improved characteristics |
CN111995867B (zh) * | 2020-07-28 | 2021-10-12 | 江南大学 | 第三代半导体器件封装用热固性树脂组合物及其制备方法 |
CN112080237B (zh) * | 2020-09-07 | 2022-05-31 | 江苏矽时代材料科技有限公司 | 一种环氧结构胶及其制备方法和应用 |
US20240010888A1 (en) * | 2020-10-23 | 2024-01-11 | Zephyros, Inc. | Dual-Cure Mechanism Polymeric Adhesives |
CN113861888A (zh) * | 2021-09-28 | 2021-12-31 | 惠州市韵点新材料科技股份有限公司 | 一种高性能树脂基胶黏剂及其制备方法和应用 |
CN116004112B (zh) * | 2021-10-22 | 2023-12-19 | 万华化学集团股份有限公司 | 一种低表面能uv-led固化环保涂覆胶及其制备方法 |
IL312591A (en) | 2021-12-14 | 2024-07-01 | Arxada Ag | Preparations with improved properties |
TWI804280B (zh) * | 2022-04-19 | 2023-06-01 | 台光電子材料股份有限公司 | 樹脂組合物及其製品 |
CN115180949B (zh) * | 2022-06-20 | 2023-03-28 | 沈阳化工大学 | 一种具有双层结构苯并噁嗪/硅橡胶陶瓷微球制备方法 |
TWI845083B (zh) | 2022-12-23 | 2024-06-11 | 財團法人工業技術研究院 | 具有乙烯基的共聚物與樹脂組成物 |
CN117087208B (zh) * | 2023-07-21 | 2024-08-20 | 江门建滔积层板有限公司 | 一种耐热的柔性覆铜板及其制备方法 |
CN117500151B (zh) * | 2023-11-06 | 2024-07-05 | 安能电子有限公司 | 一种高Tg的覆铜板 |
CN117586714B (zh) * | 2023-11-23 | 2024-06-18 | 常州宏巨电子科技有限公司 | 一种具有各向异性的导电胶膜及其制备方法 |
CN117944337B (zh) * | 2024-03-27 | 2024-07-09 | 成都鲲鹏云智科技有限公司 | 一种阻燃隔热复合纤维面料及其制备方法、在防火服中的应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005532678A (ja) * | 2002-06-17 | 2005-10-27 | ヘンケル コーポレイション | 層間誘電体および事前塗布ダイ取り付け用接着性材料 |
WO2007083810A1 (ja) * | 2006-01-23 | 2007-07-26 | Hitachi Chemical Co., Ltd. | 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2770252B2 (ja) * | 1991-12-11 | 1998-06-25 | 日本石油株式会社 | エポキシ樹脂組成物、封止材用エポキシ樹脂組成物、積層板用エポキシ樹脂組成物及びソルダーレジスト用エポキシ樹脂組成物 |
DE69304086T2 (de) * | 1992-01-07 | 1997-04-03 | Hitachi Chemical Co Ltd | Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden |
US5962586A (en) | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
US20030055121A1 (en) * | 1996-09-10 | 2003-03-20 | Dershem Stephen M. | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
US6380336B1 (en) * | 1998-03-24 | 2002-04-30 | Nano-Tex, Llc | Copolymers and oil-and water-repellent compositions containing them |
US7488766B2 (en) * | 2005-10-06 | 2009-02-10 | Sabic Innovative Plastics Ip B.V. | Polymer composition, method, and article |
US20070088134A1 (en) * | 2005-10-13 | 2007-04-19 | Ajinomoto Co. Inc | Thermosetting resin composition containing modified polyimide resin |
JP4986256B2 (ja) * | 2005-12-21 | 2012-07-25 | 味の素株式会社 | 変性ポリイミド樹脂を含有するプリプレグ |
WO2008115711A1 (en) * | 2007-03-16 | 2008-09-25 | 3M Innovative Properties Company | Dicing and die attach adhesive |
-
2011
- 2011-07-28 WO PCT/KR2011/005545 patent/WO2013015469A1/en active Application Filing
- 2011-07-28 CN CN201180072622.XA patent/CN103797083B/zh not_active Expired - Fee Related
- 2011-07-28 EP EP11869779.6A patent/EP2736999B1/en not_active Not-in-force
- 2011-07-28 KR KR1020147002116A patent/KR101722208B1/ko active IP Right Grant
- 2011-07-28 US US14/235,334 patent/US9296928B2/en not_active Expired - Fee Related
- 2011-07-28 JP JP2014522722A patent/JP5816752B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005532678A (ja) * | 2002-06-17 | 2005-10-27 | ヘンケル コーポレイション | 層間誘電体および事前塗布ダイ取り付け用接着性材料 |
WO2007083810A1 (ja) * | 2006-01-23 | 2007-07-26 | Hitachi Chemical Co., Ltd. | 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016506447A (ja) * | 2012-12-27 | 2016-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | ベンゾオキサジン、及び、酸形成過酸化物触媒、を含む重合性組成物、物品、及び方法 |
WO2016114030A1 (ja) * | 2015-01-16 | 2016-07-21 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
JP2016135859A (ja) * | 2015-01-16 | 2016-07-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、接着補助層付き層間絶縁用樹脂フィルム、及びプリント配線板 |
JPWO2016114030A1 (ja) * | 2015-01-16 | 2017-10-26 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
US10544305B2 (en) | 2015-01-16 | 2020-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
US10294324B2 (en) | 2015-03-31 | 2019-05-21 | Namics Corporation | Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device |
WO2016158828A1 (ja) * | 2015-03-31 | 2016-10-06 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
JPWO2016158828A1 (ja) * | 2015-03-31 | 2018-01-25 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
JPWO2016158829A1 (ja) * | 2015-03-31 | 2018-01-25 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
JP2017193693A (ja) * | 2016-04-18 | 2017-10-26 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
JP2018012776A (ja) * | 2016-07-20 | 2018-01-25 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
JP2019011415A (ja) * | 2017-06-29 | 2019-01-24 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
JP2019099755A (ja) * | 2017-12-07 | 2019-06-24 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
JP2020528471A (ja) * | 2018-02-13 | 2020-09-24 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ |
US11193015B2 (en) | 2018-02-13 | 2021-12-07 | Lg Chem, Ltd. | Thermosetting resin composition for semiconductor package and prepreg using the same |
JP6989086B6 (ja) | 2018-02-13 | 2022-02-28 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ |
KR20200118323A (ko) * | 2019-04-05 | 2020-10-15 | 존스미디어 주식회사 | 엠보패턴 점착층을 갖는 양면 점착 필름 |
KR102178366B1 (ko) * | 2019-04-05 | 2020-11-13 | 존스미디어 주식회사 | 엠보패턴 점착층을 갖는 양면 점착 필름 |
JP2021084968A (ja) * | 2019-11-28 | 2021-06-03 | 住友ベークライト株式会社 | 基材付き樹脂膜、プリント配線基板および電子装置 |
WO2021149698A1 (ja) * | 2020-01-22 | 2021-07-29 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ |
Also Published As
Publication number | Publication date |
---|---|
CN103797083B (zh) | 2016-07-27 |
US20140199549A1 (en) | 2014-07-17 |
KR20140037238A (ko) | 2014-03-26 |
US9296928B2 (en) | 2016-03-29 |
KR101722208B1 (ko) | 2017-05-02 |
WO2013015469A1 (en) | 2013-01-31 |
EP2736999A1 (en) | 2014-06-04 |
CN103797083A (zh) | 2014-05-14 |
JP5816752B2 (ja) | 2015-11-18 |
EP2736999A4 (en) | 2015-08-26 |
EP2736999B1 (en) | 2018-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5816752B2 (ja) | フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤 | |
KR101348330B1 (ko) | 영역 실장형 반도체 장치의 제조 방법 | |
JP3736611B2 (ja) | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 | |
TWI229694B (en) | Dual cure B-stageable adhesive for die attach | |
EP3127933B1 (en) | Heat-curable epoxy resin composition | |
EP0502992A1 (en) | Conductive adhesive useful for bonding a semiconductor die to a conductive support base | |
CN104011098A (zh) | 聚合物粉体、固化性树脂组合物及其固化物 | |
JP5428134B2 (ja) | 液状樹脂組成物および該液状樹脂組成物を使用して作製した半導体装置 | |
JP4656269B2 (ja) | 液状エポキシ樹脂組成物及び半導体装置 | |
KR101995601B1 (ko) | 수지 조성물 및 반도체 장치 | |
JP5648617B2 (ja) | 熱伝導性接着剤組成物並びにそれを用いた接着用シート及び熱伝導性ダイシング・ダイアタッチフィルム | |
JP5731064B2 (ja) | B−ステージ化可能でおよびSkip−Cure可能なウエハ裏面コーティング接着剤 | |
WO2010087444A1 (ja) | 電子部品用接着剤 | |
JP2006022195A (ja) | 硬化性樹脂組成物、接着性エポキシ樹脂シート及び回路基板接合体 | |
JP5879675B2 (ja) | 半導体用接着フィルム、半導体搭載用配線基板、半導体装置、および接着剤組成物 | |
KR101301194B1 (ko) | 충전된 스핀 코팅 가능한 물질로 코팅된 반도체 웨이퍼 | |
JP2815408B2 (ja) | 半導体封止用樹脂組成物 | |
JP5971609B2 (ja) | 硬化性樹脂組成物及びこれを硬化した硬化物 | |
JPH093167A (ja) | 樹脂組成物及びこれを用いた樹脂封止型半導体装置 | |
TW200935529A (en) | Method of coating fine wires and curable composition therefor | |
JP2010267721A (ja) | 熱硬化性接着剤組成物および半導体装置 | |
TW202424095A (zh) | 用於具有優異性能的黏晶薄膜且供大型晶粒應用之樹脂組合物 | |
TW202432656A (zh) | 樹脂組成物 | |
JP5625431B2 (ja) | 半導体装置の製造方法 | |
JP2010196006A (ja) | 熱硬化性接着剤組成物および半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20141225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150327 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150915 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150928 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5816752 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |