TW200935529A - Method of coating fine wires and curable composition therefor - Google Patents

Method of coating fine wires and curable composition therefor Download PDF

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Publication number
TW200935529A
TW200935529A TW097146037A TW97146037A TW200935529A TW 200935529 A TW200935529 A TW 200935529A TW 097146037 A TW097146037 A TW 097146037A TW 97146037 A TW97146037 A TW 97146037A TW 200935529 A TW200935529 A TW 200935529A
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Taiwan
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curable composition
quot
monomer
free
acrylate
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TW097146037A
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Chinese (zh)
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Michael Andrew Kropp
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3M Innovative Properties Co
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    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

A method of reducing wire sweep and shorting during fabrication of a semiconductor device includes spraying a curable composition onto wire bonds, and free-radically B-staging the curable composition, and then thermal curing to a C-stage. A sprayable curable composition is also disclosed.

Description

200935529 九、發明說明： 【先前技術】 線接合係用於半導體互連之低成本及靈活方法，在此項 技術中’半導體晶粒係藉由細導電導線電連接至基板上之 電路。在封裝中使用較多導線及較小導線間隙係積體電路 封裝工業中之趨勢。 為保護半導體及導線免受物理及環境損害，將其共同囊 封於熱固性樹脂，例如環氧樹脂中。常用技術包括圓頂法 ❿ &圍堰填充°在圓項囊封中’將-定體積的囊封劑沈積於 組件頂部上。該材料向下流動，覆蓋該組件。 導線密度之影響正變得越來越明顯，尤其對於囊封處理 期間囊封劑之流型且因此導線偏移（亦即，導線之物理運 動）之量而言。限制此廣泛使用之互連技術之導線密度的 主要因素係導線偏移，其可導致在囊封處理期間短路。 【發明内容】 參在-態樣中，本發明提供在半導體裝置封裝期間保護導 線之方法，該方法包含： 提供可固化組合物，彡包含至少—種環氧單體、至少一 種自由基可聚合單體、用於該自由基可聚合單體之有效量 的光起始劑、用於該至少一種環氧單體之有效量的献固化 劑，其中該可固化組合物不導電且基本上無溶劑； "提供晶片m，其包含半導體晶粒附接至其之基板，該 半導體晶粒由複數根電導線電連接至該基板； 將該可固化組合物噴射於至少該複數根電導線上； 136240.doc 200935529 使該至少一種自由基可聚合單體之至少一部分自由基聚 合以將該可固化組合物轉化為心階段可固化組合物；及 使該至少一種環氧單體之至少一部分熱固化。， 在某些實施例中，該方法進—步包含囊封半導體晶粒。 在某些實施例中，該可固化組合物基本上無粒子。在某些 實施例中，該可固化組合物進一步包含流動添加劑⑼ 如，丙烯酸系聚合物）。在某些實施例中，該至少一種環 ^單體包含單環氧化物及多環氧化物。在某些實施例中， 該至少一種自由基可固化單體包含至少一種（甲基）丙稀酸 醋單體及至少一種N_乙烯基内醯胺。該至少一種（甲基）丙 烯酸醋單體可包含多（曱基）丙烯酸酿單體及單（曱基丙烯 酸酯單體。 在另一態樣中，本發明提供可固化組合物，其包含至少 -種環氧單體、至少一種自由基可聚合(甲基)丙烯酸酯、 至少一種自由基可聚合N_乙烯基内醯胺、包含丙烯酸系聚 φ 合物之流動添加劑、有效量之光起始劑、用於該至少一種 環氧單體之有效量的熱固化劑，其中該可固化組合物具有 小於1000毫帕-秒之黏度，基本上無粒子且基本上無溶 劑。 有利地，本發明可固化組合物幾乎不含溶劑且可噴射。 噴射後，該可固化組合物可處於B-階段以防止流動且為導 線提供保護性絕緣及增加之剛度，此可減少'或消除由導線 偏移引起的短路。且若需要，可使B-階段經固化組合物中 之環氧單體與環氧囊封劑共聚合，由此將導線固定在囊封 136240.doc 200935529 劑中。 【實施方式】 適用於本發明之可固化組合物包含至少一種環氧單體、 用於該（等）環氧單體之有效量的熱固化劑、至少一種自由 .基可聚合單體及用於該自由基可聚合單體之有效量的光起 始劑。 可用環氧單體包括（例如）脂環族及芳香族單環氧化物及 多環氧化物及其組合。 可用單環氧化物之實例包括氧化苯乙烯、烯丙基縮水甘 油驗及腰果酚（cardan〇1)之縮水甘油醚（例如，來自200935529 IX. INSTRUCTIONS: [Prior Art] Wire bonding is a low cost and flexible method for semiconductor interconnects in which the 'semiconductor die is electrically connected to the circuitry on the substrate by thin conductive wires. The use of more wires and smaller wire gaps in the package is a trend in the packaging industry. To protect semiconductors and wires from physical and environmental damage, they are collectively encapsulated in thermosetting resins such as epoxy resins. Common techniques include domed ❿ & 堰 ° filling in a round envelope to deposit a fixed volume of encapsulant on top of the assembly. The material flows down to cover the component. The effect of wire density is becoming more and more apparent, especially in terms of the flow pattern of the encapsulant during the encapsulation process and thus the amount of wire deflection (i.e., the physical motion of the wire). A major factor limiting the wire density of this widely used interconnect technology is wire deflection, which can result in a short circuit during the encapsulation process. SUMMARY OF THE INVENTION In a parametric manner, the present invention provides a method of protecting a wire during packaging of a semiconductor device, the method comprising: providing a curable composition comprising at least one epoxy monomer, at least one free radical polymerizable a monomer, an effective amount of a photoinitiator for the free radical polymerizable monomer, an effective amount of a curing agent for the at least one epoxy monomer, wherein the curable composition is non-conductive and substantially free a solvent comprising: a wafer m comprising a substrate to which a semiconductor die is attached, the semiconductor die being electrically connected to the substrate by a plurality of electrical wires; spraying the curable composition onto at least the plurality of electrical wires; 136240.doc 200935529 Free radically polymerizing at least a portion of the at least one free-radically polymerizable monomer to convert the curable composition to a core-stage curable composition; and thermally curing at least a portion of the at least one epoxy monomer . In some embodiments, the method further comprises encapsulating the semiconductor die. In certain embodiments, the curable composition is substantially free of particles. In certain embodiments, the curable composition further comprises a flow additive (9), such as an acrylic polymer. In certain embodiments, the at least one ring monomer comprises a monoepoxide and a polyepoxide. In certain embodiments, the at least one free-radically curable monomer comprises at least one (meth) acrylate monomer and at least one N-vinyl decylamine. The at least one (meth)acrylic acid vinegar monomer may comprise a poly(indenyl)acrylic monomer and a mono(mercaptoacrylate monomer. In another aspect, the invention provides a curable composition comprising at least - an epoxy monomer, at least one free-radically polymerizable (meth) acrylate, at least one free-radically polymerizable N-vinyl decylamine, a flow additive comprising an acrylic poly conjugate, an effective amount of light An initiator, an effective amount of a heat curing agent for the at least one epoxy monomer, wherein the curable composition has a viscosity of less than 1000 mPa-s, is substantially particle free, and is substantially solvent free. Advantageously, The inventive curable composition is virtually solvent free and sprayable. After spraying, the curable composition can be in the B-stage to prevent flow and provide protective insulation and increased stiffness to the wire, which can reduce or eliminate The short circuit caused by the shift, and if necessary, the epoxy monomer in the B-stage cured composition can be copolymerized with the epoxy encapsulant, thereby fixing the wire in the encapsulation 136240.doc 200935529 agent. the way A curable composition suitable for use in the present invention comprises at least one epoxy monomer, an effective amount of a heat curing agent for the (e.g.) epoxy monomer, at least one free-radical polymerizable monomer, and for the freedom An effective amount of a photoinitiator for the polymerizable monomer. Useful epoxy monomers include, for example, alicyclic and aromatic monoepoxides and polyepoxides, and combinations thereof. Examples of useful monoepoxides include Styrene oxide, allyl glycidol, and glycidyl ether of cardanol (cardan〇1) (for example, from

Cardolite公司，Newark，NJ之"CARDOLITE 2513HP")。 可用脂環族多環氧化物之實例包括單體脂環族多環氧化 物、寡聚脂環族多環氧化物及聚合脂環族多環氧化物。可 用於實踐轄明之實例性脂環族多帛氧化物單冑包括環氧 環己烷羧酸酯，例如3,4_環氧環己烷曱酸3,4-環氧環己基 φ 曱自曰（例如，來自Dow Chemical公司，Midland，Ml.之 RL 4221 )及3,4-環氧_2_甲基環己烧甲酸環氧•甲美 環己基甲酯；環己烷二甲醇二縮水甘油醚(例如，心 HeX1〇n Specialty Chemicals，Columbus，0H 之"HEL〇XY 1 〇7 ),及氫化雙酚A二縮水甘油醚（例如，購自恥“时Cardolite, Newark, NJ "CARDOLITE 2513HP"). Examples of useful alicyclic polyepoxides include monomeric alicyclic polyepoxides, oligoaliphatic polyepoxides, and polymeric alicyclic polyepoxides. Exemplary alicyclic polyfluorene oxides which can be used in practice include epoxycyclohexane carboxylates, such as 3,4-epoxycyclohexane decanoic acid 3,4-epoxycyclohexyl φ 曱(e.g., RL 4221 from Dow Chemical Company, Midland, Ml.) and 3,4-epoxy-2-methylcyclohexenesulfonic acid epoxy ketomethylcyclohexyl methyl ester; cyclohexane dimethanol diglycidyl Ether (for example, heart HeX1〇n Specialty Chemicals, Columbus, 0H "HEL〇XY 1 〇7 ), and hydrogenated bisphenol A diglycidyl ether (for example, purchased from Shame)

Specialty Chemicals之"EPONEX 1510")。 可用芳香方矣多環氧化物包括（例如）單體芳香族多環氧化 物、寡聚芳香族多環氧化物及聚合芳香族多環氧化物 例性芳香族多環氧化物包括多元盼之聚縮水甘油峻，例如 I36240.doc 200935529 雙紛A型樹脂及其衍生物；環氧甲盼_線性㈣樹脂；雙 盼_F樹脂及其衍生物；環氧苯紛-線性㈣樹脂；及芳香 族羧酸之縮水甘油酯(例如，鄰苯二曱酸二縮水甘油酯、 間苯二甲酸二縮水甘油酿、偏苯三甲酸三縮水甘油醋及苯 均四I四縮水甘油酯)及其混合物。冑售芳香族多環氧化 物包括（例如）彼等自（例如）Hexi〇n ㈤油仏蹲得 具有商標名”EP0N”（例如，"則N 828"、"Ep〇N _”、Specialty Chemicals"EPONEX 1510"). Useful aromatic sulfonium polyepoxides include, for example, monomeric aromatic polyepoxides, oligomeric aromatic polyepoxides, and polymeric aromatic polyepoxides, exemplary aromatic polyepoxides, including poly-poly Glycidol, such as I36240.doc 200935529 Double A resin and its derivatives; epoxy _ _ linear (four) resin; double _F resin and its derivatives; epoxy benzene - linear (four) resin; and aromatic A glycidyl ester of a carboxylic acid (for example, diglycidyl phthalate, diglycidyl diglycolate, triglycidyl trimellitate, and benzene tetratetrahydroglycidyl ester) and mixtures thereof. Commercially available aromatic polyepoxides include, for example, those derived from, for example, Hexi〇n (five) oil 具有 having the trade name "EP0N" (for example, " then N 828", "Ep〇N _",

EPON 1001F"、"EPON DPL-862”及"EPON HPT_1079")之 ^香族夕環氧化物，以及自（例如）D〇w chemicai公司講得 具有商標名"DER"、"DEN"(例如，"DEN 438"及"DEN 439")及"QUATREX"之芳香族多環氧化物。 基於可固化組合物之總重量，至少一種環氧單體通常以 20至50重量％之量、更通常以3〇至5〇重量％之量且再通常 以35至45重量％之量存在，但此並非必需的。 可固化組合物中包括用於至少一種環氧單體之有效量的 熱固化劑以便將其充分固化至c·階段。因此，術語「有效 量的熱固化劑」係指至少最小量。儘管精確量由於調配物 及固化變量而有必要改變’但基於可固化組合物之總重量 其通常為1 0重量％或更低。 用於該（等）多環氧化物之可用熱固化劑包括酸固化劑及 驗固化劑。可用固化劑之實例包括三氟化硼錯合物，例如 BF3.Et2〇及BF3.H2NC2H4OH;聚胺，例如雙（4·胺基笨基） 艰、雙（4-胺基苯基）醚及2,2-雙（4-胺基苯基）丙烷；脂肪族 及芳香族三級胺，例如二甲基胺基丙胺；蕹二胺；及經修 136240.doc 200935529 飾之胺固化劑’例如彼等以商標名"ancamine"(例如， "ANCAMINE 2337S"、"ANCAMINE 2014"及"ANCAMINE 2441")自 Air Products and Chemicals，Allentown , PA講得 者及以商標名"AJICURE"(例如，"AJICURE PN23,'及 "AJICURE M353")自 Ajinimoto，Japan購得者；咪《•坐，例如 曱基咪唑及2,4-二胺基-6-(2，-甲基咪唑基-(1，))_乙基_s•三嗪 六（咪唑）鎳鄰苯二甲酸鹽；肼，例如脂肪肼 (adipohydrazine);胍’例如四甲基胍及二氰基二醢胺（氰 胍，通常亦稱為DiCy);及其組合。 自由基可聚合單體之實例包括單（曱基）丙烯酸酯單體、 多（甲基）丙烯酸酯單體（亦即，具有複數個丙烯醯基）、苯 乙烯、丁二烯、馬來醯亞胺、馬來酸酐及N_乙烯基醯胺 (包括N-乙烯基内醯胺）。本文所用術語「（甲基）丙烯醯 基」涵蓋曱基丙浠醢基及/或丙缔醢基二者。舉例而言， 多（曱基）丙烯酸酯單體可僅具有丙烯酸酯基團、僅曱基丙 稀酸酿基團或者丙烯酸酯與曱基丙烯酸酯基團之組合。 可用自由基可聚合單（曱基）丙烯酸酯包括（例如）（甲基）丙 烯酸苯氧乙基酯、（曱基）丙烯酸2_羥乙基酯及醇部分中具 有約4至約12個碳原子之非第三醇之（曱基）丙烯酸酯 '及其 組合。此後面類型之（甲基）丙烯酸酯中包括（曱基）丙烯酸 丁酯、（甲基）丙烯酸己酯、（甲基）丙烯酸2_乙基己基酯、 (曱基）丙烯酸辛酯、（曱基）丙烯酸異辛酯、（曱基）丙烯酸癸 酯及（曱基）丙烯酸十二烷基酯。 可用自由基可聚合多（曱基）丙稀酸酯單體包括（例如）1，6- 136240.doc 200935529 己二醇二（甲基）丙烯酸酯、三羥甲基丙烷三（甲基）丙烯酸 酯、1，2-乙二醇二（曱基）丙稀酸酯、異戊四醇四（甲基）丙烯 酸酯及以商標名”EBECRYL”（例如，"EBECRYL 230"、 "EBECRYL 3605"及"EBECRYL 8804")自 UCB Radcure, Smyrna，Ga.購得及以商標名”CN"(例如，”CN 104")自 Sartomer公司，Exton，PA購得之胺基曱酸酯及環氧二（曱 基）丙烯酸酯寡聚物、及其組合。 N-乙烯基醯胺之實例包括N-乙烯基吡咯啶酮、N-乙烯基 己内醯胺及N-乙烯基甲醯胺。 通常，使用一或多種自由基可聚合單體之組合。基於可 固化組合物之總重量，至少一種自由基可聚合單體通常以 30至70重量％之量、更通常以40至65重量％之量且再通常 以50至60重量％之量存在，但此並非必需的。 可固化組合物中包括用於該至少一種自由基可固化單體 之有效量的光起始劑以便當其光聚合時可充分固化成B_階 段（亦即，若加熱將變軟但不熔化之充分固化）可固化組合 物。因此’術語「有效量的光起始劑」係指至少最小量。 精確量由於調配物及固化變量而有必要改變，但基於可固 化組合物之總重量其通常為10重量％或更低。通常，基於 可固化組合物之總重量’較低分子量光起始劑以約〇 〇〇1 至約4重量％之總量使用，同時，基於可固化組合物之總重 量，較高分子量光起始劑以約〇.丨至約8重量％之總量使用。 可用光起始劑包括（例如）經取代的苯乙酮，例如2,2_二 甲氧基-2-苯基苯乙酮；安息香醚，例如安息香甲醚及經取 136240.doc -10- 200935529 代的安息香醚，例如茴香偶姻甲醚；經取代的α- _醇，例 如2-甲基-2_羥基苯丙酮；二苯甲酮及其衍生物；氧化膦； 聚合物光起始劑；及其組合。諸多可用光起始劑可自下述 來源（例如）以商標名"IRGACURE"(例如，"IRGACURE 184"、"IRGACURE 651"、"IRGACURE 369"及"IRGACURE 907")及"DAROCUR"(例如，"DAROCUR 1173"、"DAROCUR MBF"、"DAROCUR TPO"及"DAROCUR 4265")自 Ciba Specialty Chemicals, Tarrytown，NY 賭得及以商標名 "ESCACURE"自 Sartomer公司，Exton，PA購得。 為可用作電絕緣體，可固化組合物不導電。 儘管並非必需，但該等可固化組合物可進一步含有少量 一或多種添加劑，例如表面活性劑、流動添加劑、染料、 顏料、抑制劑及/或偶合劑。 可固化組合物中可包括任一可選流動添加劑（例如）以促 進導線之均勻塗覆。通常，基於可固化組合物之總重量， 任一此流動添加劑以少於3%之量、更通常以少於1%之量 存在。一個實例性可用流動添加劑係以"TEGO ZFS 460"自 Tego Chemie Service GmbH, Essen，Germany購得的呈溶液 形式之丙烯酸系聚合物。 有利地，可固化組合物經調配基本上無溶劑或甚至完全 無溶劑。本文所用術語「基本上無溶劑j意指基於可固化 組合物之總重量含有少於約1%的溶劑總重量。術語「溶 劑」統指出於使組合物之至少一些殘留組份溶劑化之目的 所添加之任何揮發性有機化合物（不與所存在之其他組份 136240.doc 11 200935529 反應）。實例包括甲苯、庚烷、乙酸乙酯、曱基乙基酮、 丙酮及其混合物。 實際上’可固化組合物通常自其組成部分使用習用混合 技術（例如輕微輥壓、輥磨或球磨）來製備。在某些情況 下’將多環氧化物及/或自由基可聚合單體加熱（例如，高 達約80°C )以促進混合可能有用。EPON 1001F", "EPON DPL-862" and "EPON HPT_1079") ^香族夕环oxide, and from (for example) D〇w chemicai company has a trade name "DER","DEN&quot (for example, "DEN 438" and "DEN 439") and "QUATREX" Aromatic Polyepoxide. At least one epoxy monomer is typically 20 to 50 weight based on the total weight of the curable composition. The amount of %, more usually from 3 to 5 % by weight and still usually from 35 to 45% by weight, is not necessary. The curable composition comprises at least one epoxy monomer. An effective amount of a heat curing agent to fully cure it to the c. stage. Thus, the term "effective amount of heat curing agent" means at least a minimum amount. Although the exact amount is necessary to change due to the formulation and the curing variables, it is usually 10% by weight or less based on the total weight of the curable composition. Useful heat curing agents for the (etc.) polyepoxide include acid curing agents and curing agents. Examples of useful curing agents include boron trifluoride complexes such as BF3.Et2〇 and BF3.H2NC2H4OH; polyamines such as bis(4.aminophenyl), bis(4-aminophenyl)ether and 2,2-bis(4-aminophenyl)propane; aliphatic and aromatic tertiary amines, such as dimethylaminopropylamine; guanidine diamine; and modified 136240.doc 200935529 decorated amine curing agent' They are traded under the trade name "ancamine" (for example, "ANCAMINE 2337S", "ANCAMINE 2014"&"ANCAMINE2441" from Air Products and Chemicals, Allentown, PA, and under the trade name "AJICURE" (For example, "AJICURE PN23, 'and "AJICURE M353") purchased from Ajinimoto, Japan; "Sit, such as decyl imidazole and 2,4-diamino-6-(2,-methyl) Imidazolyl-(1,))-ethyl-s-triazine hexa-(imidazolium) nickel phthalate; hydrazine, such as adipohydrazine; 胍' such as tetramethylguanidine and dicyanoquinone Amine (cyanoguanidine, also commonly referred to as DiCy); and combinations thereof. Examples of the radical polymerizable monomer include a mono(indenyl)acrylate monomer, a poly(meth)acrylate monomer (that is, having a plurality of acrylonitrile groups), styrene, butadiene, and maleidene. Imine, maleic anhydride and N-vinylguanamine (including N-vinyl decylamine). The term "(meth)acryloyl) as used herein encompasses both mercaptopropyl and/or propylthio. For example, the poly(fluorenyl) acrylate monomer may have only an acrylate group, a mercapto acrylate-only group, or a combination of an acrylate and a thiol acrylate group. Useful free-radical polymerizable mono(indenyl) acrylates include, for example, phenoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and from about 4 to about 12 carbons in the alcohol moiety. A non-third alcohol (indenyl) acrylate of an atom and combinations thereof. The latter type of (meth) acrylate includes (mercapto) butyl acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl acrylate, (曱) Isooctyl acrylate, decyl acrylate and dodecyl acrylate. The free-radical polymerizable poly(indenyl) acrylate monomer includes, for example, 1,6-136240.doc 200935529 hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylic acid Ester, 1,2-glycol bis(indenyl) acrylate, pentaerythritol tetra (meth) acrylate and under the trade name "EBECRYL" (for example, "EBECRYL 230", "EBECRYL 3605&quot ; &"EBECRYL8804") purchased from UBC Radcure, Smyrna, Ga. and under the trade name "CN" (for example, "CN 104") from Sartomer, Exton, PA. Oxygen bis(indenyl) acrylate oligomers, and combinations thereof. Examples of N-vinylguanamine include N-vinylpyrrolidone, N-vinylcaprolactam, and N-vinylformamide. Typically, a combination of one or more free radical polymerizable monomers is used. The at least one free-radically polymerizable monomer is generally present in an amount of from 30 to 70% by weight, more usually from 40 to 65% by weight and still typically from 50 to 60% by weight, based on the total weight of the curable composition, But this is not required. An effective amount of a photoinitiator for the at least one free-radically curable monomer is included in the curable composition to sufficiently cure to a B-stage when photopolymerized (i.e., if the heat will soften but not melt) Fully cured) curable composition. Thus the term "effective amount of photoinitiator" means at least a minimum amount. The exact amount is necessarily changed due to the formulation and the curing variables, but it is usually 10% by weight or less based on the total weight of the curable composition. Typically, the lower molecular weight photoinitiator is used in a total amount of from about 1 to about 4 weight percent based on the total weight of the curable composition, while the higher molecular weight light is based on the total weight of the curable composition. The starting agent is used in a total amount of from about 〇.丨 to about 8% by weight. Useful photoinitiators include, for example, substituted acetophenones such as 2,2-dimethoxy-2-phenylacetophenone; benzoin ethers such as benzoin methyl ether and 136240.doc -10- 200935529 generation of benzoin ether, such as fennel dimethyl ether; substituted α-alcohol, such as 2-methyl-2-hydroxypropiophenone; benzophenone and its derivatives; phosphine oxide; Agents; and combinations thereof. Many available photoinitiators are available from the following sources (for example) under the trade name "IRGACURE" (for example, "IRGACURE 184", "IRGACURE 651", "IRGACURE 369" and "IRGACURE 907") &"DAROCUR" (for example, "DAROCUR 1173", "DAROCUR MBF", "DAROCUR TPO" and "DAROCUR 4265") from Ciba Specialty Chemicals, Tarrytown, NY, under the trade name "ESCACURE" from Sartomer Company, Exton, PA purchased. To be useful as an electrical insulator, the curable composition is non-conductive. Although not required, the curable compositions may further contain minor amounts of one or more additives such as surfactants, flow additives, dyes, pigments, inhibitors and/or couplers. Any optional flow additive (for example) may be included in the curable composition to promote uniform coating of the wires. Typically, any such flow additive is present in an amount of less than 3%, more typically less than 1%, based on the total weight of the curable composition. An exemplary available flow additive is the acrylic polymer in solution as purchased from "TEGO ZFS 460" from Tego Chemie Service GmbH, Essen, Germany. Advantageously, the curable composition is formulated to be substantially solvent free or even completely solvent free. As used herein, the term "substantially solvent free j" means less than about 1% by weight based on the total weight of the curable composition. The term "solvent" is used to solvate at least some of the residual components of the composition. Any volatile organic compounds added (not reacted with other components present 136240.doc 11 200935529). Examples include toluene, heptane, ethyl acetate, mercaptoethyl ketone, acetone, and mixtures thereof. In fact, the curable composition is typically prepared from its constituent parts using conventional mixing techniques such as light rolling, roller milling or ball milling. It may be useful in certain circumstances to heat the polyepoxide and/or free radical polymerizable monomer (e.g., up to about 80 ° C) to promote mixing.

為促進流動且減少噴嘴堵塞之機會，可固化組合物通常 基本上無（亦即，含有少於可固化組合物總重量的約1重量 %)或甚至完全無粒子，然而此並非必需的。另外，可固化 組合物之黏度通常小於1〇〇〇厘泊（1〇〇〇毫帕秒）、更通常小 於500毫帕秒，但此並非必需的。 晶片總成具有半導體晶粒附接至其之基板。半導體晶粒 通常藉由複數根電導線（通常為金導線，但亦可使用其他 導電金屬及合金）電連接至基板上之接觸塾。此等總成之 實例已為熟悉積體電路封裝技藝者所熟知且(例如)論述於 美國專利第6,750’533 B2號（Yu_p〇等人）第）行第12列至第2 行第34列中。 將可固化組合物藉由喷射施加至導線且視情況施加至基 板及/或半導體晶粒之至少一部分上。可用嘴射技術之實 例包括噴嘴及氣刷噴射。 將了固化組合物施加至晶片總成之後，隨後將其曝露於 光化輕射下（例如，紫外及/或 ㈣I 光).該光化輻射使光起 。劑之至 >、一部分分解並使該 6 , Α ^ 種自由基可聚合單體 自由基to從而產生Β-階段f亦gl7 J. i. 階奴（亦即，若加熱將變軟但並不 136240.doc 200935529 熔化之充分固化）可固化組合物。光化（例如，紫外（uv))輻 射之來源包括（例如）低、中或高壓汞燈、雷射及氙閃光 燈。 ❹ ❹ 視情況，此時可於各種條件（例如，時間及溫度）下將該 B-階段可固化組合物加熱（例如，於爐中）以充分固化環氧 單體來達成C-階段固化（其中可固化材料已變得相對不可 溶解且不可熔化）。在此一情況下，可將囊封劑（例如，環 氧樹脂圓頂）施加至晶片總成來囊封半導體晶粒及導線。 或者，在可固化組合物仍處於B_階段的同時，可將囊封 劑施加至晶片總成且隨後將組合加熱來達^•階段固化。 在此一情況下’可固化組合物通常可以化學方式鍵結至環 :囊封劑，由此降低隨後分層(例如，由於熱循環)之可能 ^應注意’即使在其中於施加環氧囊封劑之前將該&階 二=合物固化至c_階段的前一種情況下，通常亦可 團。 力接枝至環氧囊封劑之一些殘餘環氧化物基 點藉：下列非限制性實例進一步闡釋本發明之目的及優 他=不應將該等實例中所列舉之敎材料 條件及細節理解為對本發明進行不適當限制。、 實例 除非另有·^日日 份數、百否則，實例及說明書其他部分中之所有 白刀比、比率等皆以重量計。 實例1 136240.doc 13 200935529 藉由將下述物質組合來製備組合物A: 42.5份環氧單體 (雙環戊二烯縮合物、苯酚及環氧氣丙烷之聚合物，來自 Huntsman Advanced Materials Americas, Brewster, NY之 "TACTIX 756")、44.2份丙烯酸苯氧乙基酯（來自Ciba Specialty Chemicals, Tarrytown，NY之"AGEFLEX PEA")、 10.8份N-乙烯基己内醯胺、1.2份1-氰基乙基-2-乙基-4-甲 基咪0坐（來自 Shikoku Chemicals公司，Kagawa, Japan 之 "MEZCN”）、0.9份光起始劑（CAS 編號 119313-12-1，來自 Ciba Specialty Chemicals之"IRGACURE 369")及 0.4份呈溶 液形式之丙烯酸系聚合物（流動添加劑）（來自Tego Chemie Service GmbH，Essen, Germany 之"TEGO ZFS 460”）。該組 合物具有小於1 〇〇〇毫帕秒之黏度。 使用噴射器（來自Precision Valve公司’ Yonkers, NY之 "PREVAL SPRAYER")將組合物A之第一部分喷射於第一個 鍍金金屬片上。 如利用第一部分所實施將組合物A之第二部分噴射至第 二個鍍金金屬片上且使用F300S型「Η型」微波供電無電 極燈（自 Fusion UV Systems, Gaithersburg, MD 構得）以 20 ft/min (6.1 m/min)之輸送機速度運作輻照以將該組合物固 化至B-階段。使用能量計（來自EIT，Sterling, VA之"UV POWER PUCK")於 485 mJ/cm2 UV-A及 448 mJ/cm2 UV-B下 量測紫外光劑量。 在兩種情況下’組合物A均浸濕鑛金金屬片，此提供光 滑連續塗層。 136240.doc 200935529 實例2To promote flow and reduce the chance of nozzle clogging, the curable composition is generally substantially free (i.e., contains less than about 1% by weight of the total weight of the curable composition) or even completely free of particles, although this is not required. Additionally, the viscosity of the curable composition is typically less than 1 centipoise (1 milliamps per second), more typically less than 500 millipascal seconds, although this is not required. The wafer assembly has a substrate to which a semiconductor die is attached. The semiconductor die is typically electrically connected to the contact pads on the substrate by a plurality of electrical leads (usually gold wires, but other conductive metals and alloys may also be used). Examples of such assemblies are well known to those skilled in the art of circuit package packaging and are described, for example, in column 12, column 2, row 34, of U.S. Patent No. 6,750 '533 B2 (Yu_p〇 et al). in. The curable composition is applied to the wire by spraying and optionally applied to at least a portion of the substrate and/or semiconductor die. Examples of available nozzle techniques include nozzles and airbrush jets. The cured composition is applied to the wafer assembly and subsequently exposed to actinic light (e.g., ultraviolet and/or (tetra)I light). The actinic radiation causes the light to illuminate. To the agent>, a part of the decomposition and the 6, 自由基 ^ radical polymerizable monomer radicals to produce Β-stage f also gl7 J. i. step slaves (that is, if the heating will become soft but No 136240.doc 200935529 Melted fully cured) curable composition. Sources of actinic (e.g., ultraviolet (uv)) radiation include, for example, low, medium or high pressure mercury lamps, lasers, and xenon flash lamps. ❹ 视 Depending on the situation, the B-stage curable composition can be heated (eg, in a furnace) under various conditions (eg, time and temperature) to fully cure the epoxy monomer to achieve C-stage curing ( Where the curable material has become relatively insoluble and non-meltable). In this case, an encapsulant (e.g., an epoxy dome) can be applied to the wafer assembly to encapsulate the semiconductor die and wires. Alternatively, while the curable composition is still in the B-stage, the encapsulant can be applied to the wafer assembly and then the combination heated to achieve a stage cure. In this case, the 'curable composition can generally be chemically bonded to the ring: encapsulating agent, thereby reducing the likelihood of subsequent delamination (eg, due to thermal cycling). It should be noted that even in the application of the sac. In the former case where the & prior to the sealing agent is cured to the c-stage, it is usually also possible. Force grafting to some residual epoxide base of the epoxy encapsulant. The following non-limiting examples further illustrate the objects and advantages of the present invention. The conditions and details of the materials listed in the examples should not be construed as The invention is not limited at all. Instances Unless otherwise, ^日日份份,百, otherwise, all the white knife ratios, ratios, etc. in the examples and other parts of the manual are by weight. Example 1 136240.doc 13 200935529 Composition A was prepared by combining the following materials: 42.5 parts of epoxy monomer (dicyclopentadiene condensate, polymer of phenol and epoxide, from Huntsman Advanced Materials Americas, Brewster , NY"TACTIX 756"), 44.2 parts of phenoxyethyl acrylate ("AGEFLEX PEA" from Ciba Specialty Chemicals, Tarrytown, NY), 10.8 parts of N-vinylcaprolactam, 1.2 parts 1- Cyanoethyl-2-ethyl-4-methyl oxime 0 (from Shikoku Chemicals, Kagawa, Japan "MEZCN"), 0.9 part photoinitiator (CAS number 119313-12-1, from Ciba Specialty Chemicals "IRGACURE 369") and 0.4 parts of acrylic polymer (flow additive) in solution (from Tego Chemie Service GmbH, Essen, Germany "TEGO ZFS 460"). The composition has a viscosity of less than 1 〇〇〇 millipascal. The first portion of Composition A was sprayed onto the first gold plated metal sheet using an ejector (from Precision Valve Company's Yonkers, NY "PREVAL SPRAYER"). The second portion of Composition A was sprayed onto the second gold plated metal sheet as described in the first section and the F300S type "Η" microwave powered electrodeless lamp (constructed from Fusion UV Systems, Gaithersburg, MD) was used at 20 ft. The conveyor speed of /min (6.1 m/min) is operated to irradiate the composition to the B-stage. The UV dose was measured using an energy meter (from EIT, Sterling, VA "UV POWER PUCK") at 485 mJ/cm2 UV-A and 448 mJ/cm2 UV-B. In both cases 'Composition A wets the gold metal flakes, which provides a smooth, continuous coating. 136240.doc 200935529 Example 2

藉由將下述物質組合來製備組合物A : 38.9份環氧單體 (雙環戊二烯縮合物、苯酚及環氧氯丙烷之聚合物，來自 Huntsman Advanced Materials Americas 之"TACTIX 756")、4·3份環氧單體（環氧化腰果酚稀釋劑，來自 Cardolite 公司，Newark，NJ 之"CARDOLITE 2513HP")、 43.1份丙稀酸苯氧乙基醋（來自Ciba Specialty Chemicals之 ”AGEFLEX PEA")、10.6份N-乙烯基己内醯胺、1.8份1-氰 基乙基-2-乙基-4-甲基咪嗤（來自Shikoku Chemicals公司之 "MEZCN”）、0.9份光起始劑（CAS 編號 119313-12-1，來自 Ciba Specialty Chemicals之"IRGACURE 369”）及 0.4份呈溶 液形式之丙烯酸系聚合物（流動添加劑，來自Tego Chemie Service GmbH之"TEGO ZFS 460")。該組合物具有小於 1000毫帕秒之黏度。 使用喷射器（來自Precision Valve公司之"PREVAL SPRAYER")將組合物B之第一部分喷射至第三個鍍金金屬 片上。 如利用第一部分所實施將組合物B之第二部分喷射至第 四個鍍金金屬片上且如於實例1中一樣輻照。 在兩種情況下，組合物B浸濕鍍金金屬片，此提供光滑 連續塗層。 將自實例1及2所得四個經塗覆鍍金金屬片平行放置於擱 架中以使板自水平傾斜45度以上。然後，將該擱架於設定 為120°C之爐中加熱1小時。將藉由輻照固化至B-階段之塗 136240.doc 15 200935529 層於熱固化期間仍保持其初始塗覆形狀《未藉由輻照固化 至B-階段之試樣在熱固化期間沿著金片流下且自底部滴 落。 彼等熟悉此項技術者可對本發明實施各種更改及變更， 此並不背離本發明之範及精神，且應理解，不應不適當 地將本發明限於本文所闡述之說明性實施例。Composition A was prepared by combining the following materials: 38.9 parts of epoxy monomer (dicyclopentadiene condensate, polymer of phenol and epichlorohydrin, "TACTIX 756" from Huntsman Advanced Materials Americas, 4.3 parts of epoxy monomer (epoxidized cardanol thinner from Cardolite, Newark, NJ "CARDOLITE 2513HP"), 43.1 parts of phenoxyethyl acrylate (from Ciba Specialty Chemicals) AGEFLEX PEA&quot ;), 10.6 parts of N-vinyl caprolactam, 1.8 parts of 1-cyanoethyl-2-ethyl-4-methylimidazole (from "Shikoku Chemicals" "MEZCN"), 0.9 parts light Starting agent (CAS No. 119313-12-1, "IRGACURE 369" from Ciba Specialty Chemicals) and 0.4 parts of acrylic polymer in solution (flow additive, "TEGO ZFS 460" from Tego Chemie Service GmbH) The composition has a viscosity of less than 1000 mPa. The first portion of Composition B is sprayed onto the third gold plated metal sheet using an ejector ("Presence Valve" "PREVAL SPRAYER"). The first part was carried out by spraying a second portion of composition B onto a fourth gold-plated metal sheet and irradiating as in Example 1. In both cases, composition B wetted the gold-plated metal sheet, which provided a smooth continuous coating. The four coated gold-plated metal sheets obtained from Examples 1 and 2 were placed in parallel in the shelf to tilt the plate from the horizontal by more than 45 degrees. Then, the shelf was heated in a furnace set at 120 ° C. Hour. Will be cured by irradiation to the B-stage coating 136240.doc 15 200935529 The layer retains its initial coating shape during thermal curing. "The sample that has not been cured by radiation to the B-stage is along the thermal curing period. The present invention is not limited to the scope of the present invention, and it should be understood that the invention should not be unduly limited to the invention. Illustrative embodiments set forth herein.

〇 136240.doc 16·〇 136240.doc 16·

Claims (1)

200935529 十、申請專利範圍： 1· -種於半導體裝置封裝期間保護導線之方法，該方法包 含： 提供可固化組合物，其包含至少一種環氧單體、至少 -種自由基可聚合單體、用於該自由基可聚合單體之有 * a量的力起始齊j、用於該至少一種環氧單體之有效量的 ·#固化劑，其中該可固化組合物不導電且基本上I溶 劑； ® Μ供晶片總成’其包含具有半導體晶粒附接至其之基 板，該半導體晶粒由複數根電導線電連接至該基板； 將该可固化組合物喷射至至少該複數根電導線上； 使該至少一種自由基可聚合單體之至少一部分自由基聚 合以將該可固化組合物轉化為Β_階段可固化組合物；及 熱固化該至少一種環氧單體之至少一部分。 2. 如請求項1之方法’其中該可固化組合物基本上無粒 子0 ❹ 3. 如請求項1或2之方法’其中該可固化組合物進一步包含 流動添加劑。 ’4.如请求項1或2之方法，其中該至少一種自由基可固化單 體包含至少一種（曱基）丙烯酸酯單體及至少一種Ν乙稀 基内酿胺。 5.如請求項1或2之方法，其中該至少一種（曱基）丙烯酸酿 單體包含多（曱基）丙稀酸酯單體及單（曱基）丙稀酸酯單 體。 136240.doc 200935529 6. 如請求項1或2之方法，其中該至少一種環氧單體包含單 環氧化物及多環氧化物。 7. 如請求項1或2之方法，其進一步包含囊封該半導體晶 粒。200935529 X. Patent Application Range: 1. A method for protecting a wire during packaging of a semiconductor device, the method comprising: providing a curable composition comprising at least one epoxy monomer, at least one radical polymerizable monomer, a force for the radical polymerizable monomer having an amount of *, an effective amount of the curing agent for the at least one epoxy monomer, wherein the curable composition is non-conductive and substantially I solvent; a silicon wafer assembly comprising: a substrate having a semiconductor die attached thereto, the semiconductor die electrically connected to the substrate by a plurality of electrical wires; spraying the curable composition to at least the plurality of On the electrical lead; at least a portion of the at least one free-radically polymerizable monomer is free-radically polymerized to convert the curable composition to a ruthenium-stage curable composition; and to thermally cure at least a portion of the at least one epoxy monomer. 2. The method of claim 1 wherein the curable composition is substantially free of particles 0. 3. The method of claim 1 or 2 wherein the curable composition further comprises a flow additive. The method of claim 1 or 2, wherein the at least one radical curable monomer comprises at least one (mercapto) acrylate monomer and at least one ethylene ethene endoamine. 5. The method of claim 1 or 2, wherein the at least one (fluorenyl) acrylic monomer comprises a poly(indenyl) acrylate monomer and a mono(indenyl) acrylate monomer. 6. The method of claim 1 or 2, wherein the at least one epoxy monomer comprises a monoepoxide and a polyepoxide. 7. The method of claim 1 or 2, further comprising encapsulating the semiconductor crystal. 136240.doc 200935529 七、 指定代表圖： (一) 本案指定代表圖為：（無） (二) 本代表圖之元件符號簡單說明： 八、 本案若有化學式時，請揭示最能顯示發明特徵的化學式： * (無）136240.doc 200935529 VII. Designated representative map: (1) The representative representative of the case is: (none) (2) The symbolic symbol of the representative figure is simple: 8. If there is a chemical formula in this case, please reveal the best indication of the characteristics of the invention. Chemical formula: * (none) 136240.doc136240.doc
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