BRPI1005818A2 - adesivo estrutural monocomponente e método de aplicação de adesivo estrutural - Google Patents
adesivo estrutural monocomponente e método de aplicação de adesivo estruturalInfo
- Publication number
- BRPI1005818A2 BRPI1005818A2 BRPI1005818A BRPI1005818A BRPI1005818A2 BR PI1005818 A2 BRPI1005818 A2 BR PI1005818A2 BR PI1005818 A BRPI1005818 A BR PI1005818A BR PI1005818 A BRPI1005818 A BR PI1005818A BR PI1005818 A2 BRPI1005818 A2 BR PI1005818A2
- Authority
- BR
- Brazil
- Prior art keywords
- structural adhesive
- application method
- component
- adhesive application
- component structural
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/18—Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15554209P | 2009-02-26 | 2009-02-26 | |
PCT/US2010/022979 WO2010098950A1 (en) | 2009-02-26 | 2010-02-03 | One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI1005818A2 true BRPI1005818A2 (pt) | 2016-03-08 |
Family
ID=42126027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI1005818A BRPI1005818A2 (pt) | 2009-02-26 | 2010-02-03 | adesivo estrutural monocomponente e método de aplicação de adesivo estrutural |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110297317A1 (pt) |
EP (1) | EP2401339A1 (pt) |
JP (1) | JP2012519220A (pt) |
KR (1) | KR20110132399A (pt) |
CN (1) | CN102333837A (pt) |
BR (1) | BRPI1005818A2 (pt) |
WO (1) | WO2010098950A1 (pt) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112013010668A2 (pt) * | 2010-12-26 | 2021-03-23 | Dow Global Technologies Llc | adesivo estrutural de uma parte e método de aplicação de adesivo estrutural |
JP6049705B2 (ja) * | 2011-05-19 | 2016-12-21 | ダウ グローバル テクノロジーズ エルエルシー | 新規な構造用接着剤及びその使用 |
EP2828860B1 (en) | 2012-03-21 | 2021-02-24 | Dow Global Technologies LLC | Wash-off resistant epoxy adhesive composition and pre-gelled adhesive |
BR112014018129B1 (pt) * | 2012-03-23 | 2021-07-20 | Dow Global Technologies Llc | Adesivo estrutural termocurável e método para unir um membro de alumínio a um segundo membro metálico |
EP2912092A2 (en) * | 2012-10-24 | 2015-09-02 | Dow Global Technologies LLC | Ambient cure weatherable coatings |
DE102012223515A1 (de) * | 2012-12-18 | 2014-06-18 | Hilti Aktiengesellschaft | Dämmschichtbildende Zusammensetzung und deren Verwendung |
JP2015168724A (ja) * | 2014-03-05 | 2015-09-28 | 日東シンコー株式会社 | シール材、及び、ホットメルト接着剤 |
JP6298636B2 (ja) * | 2014-01-10 | 2018-03-20 | 日東シンコー株式会社 | シール材 |
WO2015053289A1 (ja) | 2013-10-11 | 2015-04-16 | 株式会社カネカ | コアシェルポリマー含有エポキシ樹脂組成物、その硬化物、及びその製造方法 |
ES2748241T3 (es) | 2013-10-29 | 2020-03-16 | Kaneka Corp | Composición de resina curable que contiene partículas finas de polímero que tiene estabilidad en almacenamiento mejorada |
WO2016014284A1 (en) | 2014-07-23 | 2016-01-28 | Dow Global Technologies Llc | Structural adhesives having improved wash-off resistance and method for dispensing same |
EP3218433A1 (en) * | 2014-11-11 | 2017-09-20 | Dow Global Technologies LLC | Adhesive composition with glass spheres |
US10760609B2 (en) * | 2016-02-08 | 2020-09-01 | Hamilton Sundstrand Corporation | Sealant articles and method of applying sealant |
US11274236B2 (en) | 2017-02-26 | 2022-03-15 | Ddp Specialty Electronic Materials Us, Llc | One-component toughened epoxy adhesives containing a mixture of latent curing agents |
EP3418312A1 (de) * | 2017-06-22 | 2018-12-26 | Sika Technology Ag | Verfahren zur verbindung von formkörpern durch injektion einer einkomponentigen hitzehärtenden epoxidharzzusammensetzung in hohlräume |
US11739241B2 (en) | 2017-06-23 | 2023-08-29 | Ddp Specialty Electronic Material Us, Llc | High temperature epoxy adhesive formulations |
KR102095540B1 (ko) * | 2018-04-20 | 2020-04-01 | 주식회사 제일화성 | 구조용 에폭시 접착제 |
CN116622297A (zh) | 2018-04-27 | 2023-08-22 | 株式会社钟化 | 使用含聚合物微粒的固化性树脂组合物的粘接方法、及使用该粘接方法得到的层叠体 |
KR102445303B1 (ko) * | 2019-10-31 | 2022-09-20 | 주식회사 엘지화학 | 열 경화성 접착제 조성물과, 접착층을 포함한 구조체 및 이의 제조 방법 |
CN114276777A (zh) * | 2021-12-27 | 2022-04-05 | 烟台德邦科技股份有限公司 | 一种反应型聚氨酯热熔胶及其制备方法 |
WO2023157838A1 (ja) * | 2022-02-17 | 2023-08-24 | 東洋紡株式会社 | 接着剤組成物 |
WO2023240541A1 (en) | 2022-06-16 | 2023-12-21 | Sika Technology Ag | One-component thermosetting epoxy adhesive with improved adhesion |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686359A (en) | 1969-12-19 | 1972-08-22 | Union Carbide Corp | Curable polyepoxide compositions |
CA1259897A (en) | 1985-04-02 | 1989-09-26 | Madan M. Bagga | Bonding process using curable epoxide resin adhesive |
ES2025260B3 (es) | 1987-08-26 | 1992-03-16 | Ciba-Geigy Ag | Resinas epoxidicas modificadas |
US5278257A (en) | 1987-08-26 | 1994-01-11 | Ciba-Geigy Corporation | Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin |
US5202390A (en) | 1988-07-28 | 1993-04-13 | Ciba-Geigy Corporation | Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer |
GB8912952D0 (en) | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
US5232996A (en) | 1992-05-07 | 1993-08-03 | Lord Corporation | Acrylate-terminated polyurethane/epoxy adhesives |
JP3613716B2 (ja) * | 1995-01-31 | 2005-01-26 | 東都化成株式会社 | 缶用粉体塗料組成物 |
US20030192643A1 (en) | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
US6660805B1 (en) | 2002-05-16 | 2003-12-09 | Lord Corporation | Two-part adhesive: part A-monomer, toughener(s), optional adhesion promotor and reducing agent; part B-epoxy resin |
EP1431325A1 (de) | 2002-12-17 | 2004-06-23 | Sika Technology AG | Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit |
US20040229990A1 (en) | 2003-05-16 | 2004-11-18 | Lord Corporation | Acrylic structural adhesive having improved T-peel strength |
EP2258773A1 (en) | 2003-06-09 | 2010-12-08 | Kaneka Corporation | Epoxy resin |
EP2843022B1 (en) | 2003-07-07 | 2020-12-16 | Dow Global Technologies LLC | Adhesive epoxy composition and process for applying it |
EP1498441A1 (de) | 2003-07-16 | 2005-01-19 | Sika Technology AG | Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren |
EP1574537B2 (en) | 2004-03-12 | 2014-12-24 | Dow Global Technologies LLC | Epoxy adhesive composition |
EP1602702B2 (en) | 2004-06-01 | 2020-09-16 | Dow Global Technologies LLC | Epoxy adhesive composition |
DE602005020260D1 (de) | 2005-06-02 | 2010-05-12 | Dow Global Technologies Inc | Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis |
EP1741734A1 (de) | 2005-07-05 | 2007-01-10 | Sika Technology AG | Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen |
EP1916269A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Blockierte Polyurethanprepolymere und hitzehärtende Epoxidharzzusammensetzungen |
WO2008157571A2 (en) * | 2007-06-20 | 2008-12-24 | Dow Global Technologies, Inc. | Crash durable epoxy adhesives with very low sensitivity to temperature variations |
-
2010
- 2010-02-03 EP EP10703751A patent/EP2401339A1/en not_active Withdrawn
- 2010-02-03 US US13/146,198 patent/US20110297317A1/en not_active Abandoned
- 2010-02-03 KR KR1020117022313A patent/KR20110132399A/ko not_active Application Discontinuation
- 2010-02-03 BR BRPI1005818A patent/BRPI1005818A2/pt not_active Application Discontinuation
- 2010-02-03 CN CN2010800094422A patent/CN102333837A/zh active Pending
- 2010-02-03 WO PCT/US2010/022979 patent/WO2010098950A1/en active Application Filing
- 2010-02-03 JP JP2011552055A patent/JP2012519220A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2012519220A (ja) | 2012-08-23 |
KR20110132399A (ko) | 2011-12-07 |
US20110297317A1 (en) | 2011-12-08 |
WO2010098950A1 (en) | 2010-09-02 |
EP2401339A1 (en) | 2012-01-04 |
CN102333837A (zh) | 2012-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired |