DE69509116D1 - Beschichtung mit silber - Google Patents

Beschichtung mit silber

Info

Publication number
DE69509116D1
DE69509116D1 DE69509116T DE69509116T DE69509116D1 DE 69509116 D1 DE69509116 D1 DE 69509116D1 DE 69509116 T DE69509116 T DE 69509116T DE 69509116 T DE69509116 T DE 69509116T DE 69509116 D1 DE69509116 D1 DE 69509116D1
Authority
DE
Germany
Prior art keywords
silver
reexamination
ions
reexaminations
cfr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69509116T
Other languages
English (en)
Other versions
DE69509116T2 (de
Inventor
Andrew Mcintosh Soutar
Peter Thomas Mcgrath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fernox Ltd
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10765790&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69509116(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Application granted granted Critical
Publication of DE69509116D1 publication Critical patent/DE69509116D1/de
Publication of DE69509116T2 publication Critical patent/DE69509116T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
DE69509116T 1994-12-09 1995-12-11 Beschichtung mit silber Expired - Lifetime DE69509116T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9425030.5A GB9425030D0 (en) 1994-12-09 1994-12-09 Silver plating
PCT/GB1995/002876 WO1996017974A1 (en) 1994-12-09 1995-12-11 Silver plating

Publications (2)

Publication Number Publication Date
DE69509116D1 true DE69509116D1 (de) 1999-05-20
DE69509116T2 DE69509116T2 (de) 1999-11-18

Family

ID=10765790

Family Applications (2)

Application Number Title Priority Date Filing Date
DE0795043T Pending DE795043T1 (de) 1994-12-09 1995-12-11 Beschichtung mit silber
DE69509116T Expired - Lifetime DE69509116T2 (de) 1994-12-09 1995-12-11 Beschichtung mit silber

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE0795043T Pending DE795043T1 (de) 1994-12-09 1995-12-11 Beschichtung mit silber

Country Status (14)

Country Link
US (3) US5955141A (de)
EP (1) EP0795043B1 (de)
JP (1) JP2902586B2 (de)
KR (1) KR100442405B1 (de)
CN (1) CN1071805C (de)
AT (1) ATE178949T1 (de)
AU (1) AU4122096A (de)
DE (2) DE795043T1 (de)
FI (1) FI972422A (de)
GB (1) GB9425030D0 (de)
HK (1) HK1002868A1 (de)
IN (1) IN185455B (de)
TW (1) TW408189B (de)
WO (1) WO1996017974A1 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
US5733599A (en) * 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
US7267259B2 (en) 1999-02-17 2007-09-11 Ronald Redline Method for enhancing the solderability of a surface
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
JP2000144440A (ja) * 1998-11-18 2000-05-26 Nippon Kojundo Kagaku Kk 電子部品用無電解銀めっき液
JP2000160350A (ja) * 1998-11-26 2000-06-13 Nippon Kojundo Kagaku Kk 電子部品用無電解銀めっき液
JP2000160351A (ja) * 1998-11-26 2000-06-13 Nippon Kojundo Kagaku Kk 電子部品用無電解銀めっき液
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US6258132B1 (en) 1999-04-27 2001-07-10 Eveready Battery Company, Inc. Process for producing in an alkaline cell an in situ silver layer on a cathode container
WO2002016668A1 (fr) * 2000-08-21 2002-02-28 Learonal Japan Inc. Solution de depot d'or par deplacement chimique et additif destine a la preparation d'une telle solution
DE10050862C2 (de) 2000-10-06 2002-08-01 Atotech Deutschland Gmbh Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen
US6656370B1 (en) * 2000-10-13 2003-12-02 Lenora Toscano Method for the manufacture of printed circuit boards
US20030000846A1 (en) * 2001-05-25 2003-01-02 Shipley Company, L.L.C. Plating method
US20060011487A1 (en) * 2001-05-31 2006-01-19 Surfect Technologies, Inc. Submicron and nano size particle encapsulation by electrochemical process and apparatus
US6627546B2 (en) * 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
EP1915040A3 (de) 2001-09-28 2008-04-30 Ibiden Co., Ltd. Gedruckte Leiterplatte und Verfahren zur Herstellung einer gedruckten Leiterplatte
JP2003338682A (ja) * 2002-01-11 2003-11-28 Nec Infrontia Corp はんだ付け方法及びはんだ接合体
DE10226328B3 (de) * 2002-06-11 2004-02-19 Atotech Deutschland Gmbh Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
US20040043159A1 (en) * 2002-08-30 2004-03-04 Shipley Company, L.L.C. Plating method
US6856209B2 (en) * 2002-09-27 2005-02-15 Visteon Global Technologies, Inc. EMI suppression method for powertrain control modules
AU2003298904A1 (en) * 2002-12-05 2004-06-30 Surfect Technologies, Inc. Coated and magnetic particles and applications thereof
JP4140368B2 (ja) * 2002-12-09 2008-08-27 広行 五十嵐 銀鏡皮膜の製造方法
WO2004072331A2 (en) * 2003-02-12 2004-08-26 Surfect Technologies, Inc. Apparatus and method for highly controlled electrodeposition
US20060049038A1 (en) * 2003-02-12 2006-03-09 Surfect Technologies, Inc. Dynamic profile anode
US6773757B1 (en) 2003-04-14 2004-08-10 Ronald Redline Coating for silver plated circuits
US7064065B2 (en) * 2003-10-15 2006-06-20 Applied Materials, Inc. Silver under-layers for electroless cobalt alloys
US20050230260A1 (en) * 2004-02-04 2005-10-20 Surfect Technologies, Inc. Plating apparatus and method
US20050183961A1 (en) * 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
US7767009B2 (en) * 2005-09-14 2010-08-03 OMG Electronic Chemicals, Inc. Solution and process for improving the solderability of a metal surface
CN100362684C (zh) * 2005-11-25 2008-01-16 大连交通大学 用作质子交换膜燃料电池双极板的不锈钢的表面改性工艺
KR100758013B1 (ko) 2006-01-06 2007-09-11 한양대학교 산학협력단 전기접점 및 그 제조방법
JP5188683B2 (ja) * 2006-06-12 2013-04-24 パナソニック株式会社 接点部品または電池部品用材料と、それを用いた電池
KR100773272B1 (ko) 2006-09-22 2007-11-09 와이엠티 주식회사 중금속이온을 포함한 은도금 용액 및 그로부터 제조된인쇄회로기판
HK1093002A2 (en) * 2006-11-16 2007-02-16 Jing Li Fang Alkalescent chemical silver plating solution
US20080176096A1 (en) * 2007-01-22 2008-07-24 Yen-Hang Cheng Solderable layer and a method for manufacturing the same
US7972655B2 (en) 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
JP6204348B2 (ja) 2011-05-04 2017-09-27 リキッド エクス プリンテッド メタルズ インコーポレイテッド 分子インク由来の金属合金
WO2013130450A2 (en) * 2012-02-27 2013-09-06 Liquid X Printed Metals, Inc. Self-reducing metal complex inks soluble in polar protic solvents and improved curing methods
KR101483733B1 (ko) 2012-09-26 2015-01-16 김상호 전도성 분말 및 그 제조방법
CN104419922B (zh) * 2013-08-26 2017-06-06 比亚迪股份有限公司 一种化学置换镀银液和化学置换镀银方法
EP2862959A1 (de) * 2013-10-21 2015-04-22 ATOTECH Deutschland GmbH Verfahren zur selektiven Behandlung von Kupfer in Gegenwart eines weiteren Metalls
KR102159547B1 (ko) * 2014-03-13 2020-09-24 엘지이노텍 주식회사 패키지 기판 및 그의 제조 방법
US10294579B2 (en) * 2016-04-05 2019-05-21 Snap-On Incorporated Portable and modular production electroplating system
US20190029122A1 (en) * 2017-07-19 2019-01-24 Anaren, Inc. Encapsulation of circuit trace
CN108315725A (zh) * 2018-01-11 2018-07-24 广东禾木科技有限公司 一种银键合丝表面的杂质的去除方法
KR102623838B1 (ko) 2018-08-20 2024-01-11 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN109338343B (zh) * 2018-09-26 2020-09-25 长沙理工大学 一种化学镀银液及镀银方法
CN110016663A (zh) * 2019-04-28 2019-07-16 江苏东源电器集团股份有限公司 铜导体表面敷银工艺
CN111663124A (zh) * 2020-06-11 2020-09-15 大连理工大学 一种在碳化硅表面镀银的方法
WO2022097483A1 (ja) * 2020-11-05 2022-05-12 Dic株式会社 セミアディティブ工法用積層体及びそれを用いたプリント配線板
CN113897601A (zh) * 2021-09-29 2022-01-07 深圳市虹喜科技发展有限公司 化学镀银液
CN115595567B (zh) * 2022-08-30 2023-09-22 胜宏科技（惠州）股份有限公司 一种防变色化学镀银液

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB602591A (en) 1945-02-12 1948-05-31 Du Pont Improvements in or relating to the electro-deposition of metals
US2555375A (en) 1948-11-13 1951-06-05 Battelle Development Corp Process of plating bright silver alloy
US2684328A (en) 1949-10-27 1954-07-20 Oneida Ltd Treatment of silver to inhibit tarnishing
US2883288A (en) 1955-08-17 1959-04-21 Lewco Inc Silver plating bath
US2777810A (en) 1956-10-03 1957-01-15 Elechem Corp Bath for electroplating silver
US3130072A (en) 1961-09-22 1964-04-21 Sel Rex Corp Silver-palladium immersion plating composition and process
GB965859A (en) 1962-07-05 1964-08-06 Johnson Matthey Co Ltd Improvements in and relating to the deposition of palladium
US3230098A (en) 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
US3468804A (en) 1964-03-13 1969-09-23 Winfield Brooks Co Inc Silver cleaning composition
US3330672A (en) 1964-06-29 1967-07-11 Hunt Chem Corp Philip A Silver antitarnish compositions
GB1081282A (en) 1964-08-14 1967-08-31 Geigy Uk Ltd Bis-benzotriazoles and compositions containing same
DE1521152A1 (de) 1965-07-16 1969-04-24 Basf Ag Metallisierung von Kunststoffoberflaechen
US3460953A (en) 1966-05-27 1969-08-12 Pennsalt Chemicals Corp Process for depositing brasslike coatings and composition therefor
US3531315A (en) 1967-07-17 1970-09-29 Minnesota Mining & Mfg Mechanical plating
US3522314A (en) 1967-08-03 1970-07-28 Phillips Petroleum Co Mercapto alkyl thioether alkyl ethers
US3622385A (en) 1968-07-19 1971-11-23 Hughes Aircraft Co Method of providing flip-chip devices with solderable connections
US3612963A (en) 1970-03-11 1971-10-12 Union Carbide Corp Multilayer ceramic capacitor and process
AU5019272A (en) 1971-12-20 1974-06-20 Ici Australia Limited Composition and process
US3993845A (en) * 1973-07-30 1976-11-23 Ppg Industries, Inc. Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation
US3984290A (en) * 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
JPS5127819A (en) 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
US4246077A (en) 1975-03-12 1981-01-20 Technic, Inc. Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
US4440805A (en) 1975-10-23 1984-04-03 Nathan Feldstein Stabilized dispersion for electroless plating catalysts using corrosion inhibitors as stabilizers
US4024031A (en) 1975-10-28 1977-05-17 Amp Incorporated Silver plating
US4088549A (en) 1976-04-13 1978-05-09 Oxy Metal Industries Corporation Bright low karat silver gold electroplating
US4067784A (en) * 1976-06-09 1978-01-10 Oxy Metal Industries Corporation Non-cyanide acidic silver electroplating bath and additive therefore
JPS53134759A (en) 1977-04-28 1978-11-24 Fujikura Kasei Kk Production of copmosite metal powder
US4171393A (en) * 1977-06-20 1979-10-16 Eastman Kodak Company Electroless plating method requiring no reducing agent in the plating bath
JPS5439329A (en) 1977-09-02 1979-03-26 Hitachi Ltd Thiocyanic acid system silver plating solution
US4255214A (en) 1977-11-21 1981-03-10 Falconer Plate Glass Corporation Methods of manufacturing and protecting mirrors
US4189510A (en) * 1978-09-05 1980-02-19 The Dow Chemical Company Replacement plating procedure for silver on nickel
JPS5579892A (en) 1978-12-07 1980-06-16 Matsushita Electric Ind Co Ltd Silver plating method
SU829727A1 (ru) 1979-04-17 1981-05-15 Предприятие П/Я Г-4598 Электролит серебрени
JPS55154597A (en) 1979-05-22 1980-12-02 Seiko Epson Corp Gold alloy electroplating bath
US4265715A (en) 1979-07-13 1981-05-05 Oxy Metal Industries Corporation Silver electrodeposition process
US4389431A (en) 1980-05-12 1983-06-21 Minnesota Mining And Manufacturing Company Process for mechanically depositing heavy metallic coatings
US4368223A (en) 1981-06-01 1983-01-11 Asahi Glass Company, Ltd. Process for preparing nickel layer
US4478691A (en) 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
DE3148330A1 (de) * 1981-12-07 1983-06-09 Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen
DE3366599D1 (en) 1982-07-27 1986-11-06 Luc Technologies Ltd Bonding and bonded products
US4666735A (en) 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
US4470883A (en) * 1983-05-02 1984-09-11 General Electric Company Additive printed circuit process
JPS60100679A (ja) * 1983-11-04 1985-06-04 C Uyemura & Co Ltd 金属材料の銀被覆方法
US4615950A (en) 1985-03-15 1986-10-07 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
JPS61287155A (ja) 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
US4755265A (en) 1985-06-28 1988-07-05 Union Oil Company Of California Processes for the deposition or removal of metals
JPH079069B2 (ja) * 1986-03-12 1995-02-01 ブラザー工業株式会社 機械的性質の優れた銅被膜の形成方法
JPS62225573A (ja) 1986-03-28 1987-10-03 Fukuda Metal Foil & Powder Co Ltd 導電性ペ−スト用銅粉
US5119272A (en) 1986-07-21 1992-06-02 Mitsumi Electric Co., Ltd. Circuit board and method of producing circuit board
JPS63114081A (ja) * 1986-07-22 1988-05-18 セイコーインスツルメンツ株式会社 配線パタ−ンの構造
US4800132A (en) 1986-10-22 1989-01-24 Macdermid, Incorporated Mechanical plating with oxidation-prone metals
GB8703664D0 (en) * 1987-02-17 1987-03-25 Green A Electroless silver plating composition
US4750889A (en) 1987-02-27 1988-06-14 Minnesota Mining & Manufacturing Company Through-board electrical component header having integral solder mask
US4846918A (en) 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4873139A (en) 1988-03-29 1989-10-10 Minnesota Mining And Manufacturing Company Corrosion resistant silver and copper surfaces
EP0385142B1 (de) 1989-02-28 1995-09-27 Fujitsu Limited Elektrische Verbindungsvorrichtung
US5049718A (en) 1989-09-08 1991-09-17 Microelectronics And Computer Technology Corporation Method of laser bonding for gold, gold coated and gold alloy coated electrical members
JPH0774475B2 (ja) * 1989-09-20 1995-08-09 株式会社ジャパンエナジー 銀めっきの前処理液
EP0428383A1 (de) 1989-11-13 1991-05-22 Shikoku Chemicals Corporation Verfahren zur Oberflächenbehandlung von Kupfer und Kupferlegierungen
US4968397A (en) 1989-11-27 1990-11-06 Asher Reginald K Non-cyanide electrode cleaning process
US5061566A (en) 1989-12-28 1991-10-29 Chomerics, Inc. Corrosion inhibiting emi/rfi shielding coating and method of its use
US5037482A (en) 1990-02-16 1991-08-06 Macdermid, Incorporated Composition and method for improving adhesion of coatings to copper surfaces
US5583375A (en) 1990-06-11 1996-12-10 Hitachi, Ltd. Semiconductor device with lead structure within the planar area of the device
US5186984A (en) 1990-06-28 1993-02-16 Monsanto Company Silver coatings
JP2832247B2 (ja) 1990-07-24 1998-12-09 三井金属鉱業株式会社 銀被覆銅粉の製造方法
JPH04110474A (ja) 1990-08-30 1992-04-10 Meidensha Corp 銀めっきの後処理方法
US5113580A (en) 1990-11-19 1992-05-19 Schroeder Jon M Automated chip to board process
JPH04208593A (ja) * 1990-12-03 1992-07-30 Nec Corp 厚膜印刷基板
US5219815A (en) 1991-09-23 1993-06-15 Applied Electroless Concepts Inc. Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating
US5212138A (en) 1991-09-23 1993-05-18 Applied Electroless Concepts Inc. Low corrosivity catalyst for activation of copper for electroless nickel plating
CA2083196C (en) * 1991-11-27 1998-02-17 Randal D. King Process for extending the life of a displacement plating bath
US5196053A (en) 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US5256275A (en) 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
US5277790A (en) 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
JPH0681161A (ja) 1992-08-31 1994-03-22 Hitachi Ltd 銅及び銅合金の表面処理剤
US5406120A (en) 1992-10-20 1995-04-11 Jones; Robert M. Hermetically sealed semiconductor ceramic package
US5612512A (en) 1992-11-11 1997-03-18 Murata Manufacturing Co., Ltd. High frequency electronic component having base substrate formed of bismaleimide-triazine resin and resistant film formed on base substrate
US5322553A (en) * 1993-02-22 1994-06-21 Applied Electroless Concepts Electroless silver plating composition
DE69434619T2 (de) 1993-03-18 2006-08-17 Atotech Deutschland Gmbh Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung
TW270944B (de) 1993-05-10 1996-02-21 Shikoku Kakoki Co Ltd
DE4316679C1 (de) 1993-05-13 1994-07-28 Atotech Deutschland Gmbh Verfahren und Bad zur Abscheidung von Palladiumschichten sowie dessen Verwendung
DE4415211A1 (de) 1993-05-13 1994-12-08 Atotech Deutschland Gmbh Verfahren zur Abscheidung von Palladiumschichten
US5480576A (en) 1993-10-14 1996-01-02 Lever Brothers Company, Division Of Conopco, Inc. 1,3-N azole containing detergent compositions
US5468515A (en) 1994-10-14 1995-11-21 Macdermid, Incorporated Composition and method for selective plating
FR2727983B1 (fr) 1994-12-07 1997-01-24 Atotech France Bain de chromatation et procede pour la finition de surfaces de zinc, d'alliage de zinc, ou de cadmium
US6319543B1 (en) 1999-03-31 2001-11-20 Alpha Metals, Inc. Process for silver plating in printed circuit board manufacture
GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
JP3547028B2 (ja) 1996-02-26 2004-07-28 四国化成工業株式会社 銅及び銅合金の表面処理剤
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US5733599A (en) 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
WO1998049367A1 (en) 1997-04-28 1998-11-05 Fry's Metals, Inc. Bismuth coating protection for copper

Also Published As

Publication number Publication date
FI972422A (fi) 1997-08-06
GB9425030D0 (en) 1995-02-08
US5955141A (en) 1999-09-21
KR100442405B1 (ko) 2004-12-09
CN1175284A (zh) 1998-03-04
FI972422A0 (fi) 1997-06-06
DE69509116T2 (de) 1999-11-18
HK1002868A1 (en) 1998-09-25
EP0795043A1 (de) 1997-09-17
JPH08232072A (ja) 1996-09-10
TW408189B (en) 2000-10-11
DE795043T1 (de) 1998-02-19
IN185455B (de) 2001-01-27
AU4122096A (en) 1996-06-26
USRE45175E1 (en) 2014-10-07
EP0795043B1 (de) 1999-04-14
USRE45279E1 (en) 2014-12-09
CN1071805C (zh) 2001-09-26
WO1996017974A1 (en) 1996-06-13
ATE178949T1 (de) 1999-04-15
JP2902586B2 (ja) 1999-06-07

Similar Documents

Publication Publication Date Title
DE69509116D1 (de) Beschichtung mit silber
KR100382056B1 (ko) 인쇄회로기판의제조
EP0797380B1 (de) Verfahren zur Erhöhung der Lötbarkeit einer Oberfläche
US6319543B1 (en) Process for silver plating in printed circuit board manufacture
JP2004510885A (ja) 金属表面上へ銀を無電解めっきするための浴と方法
JP3387507B2 (ja) 無電解ニッケルめっき用前処理液および前処理方法
JP2000212763A (ja) 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法
CA2423066A1 (en) Method for enhancing the solderability of a surface
JPH0828561B2 (ja) プリント配線板の製造法
MY114539A (en) Process for silver plating in printed circuit board manufacture
EP0750549B1 (de) Schutzbeschichtung für kupfer aus bismuth
CA2035578A1 (en) Pretreatment composition and process for tin/lead plating
JP3206629B2 (ja) すず−鉛合金無電解めっき銅系材料の製造方法
TH24999A (th) Silver plating
JPH03188694A (ja) 回路基板の防錆処理方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition